CN102806400A - Cooling equipment with scaling powder collector for reflow oven - Google Patents
Cooling equipment with scaling powder collector for reflow oven Download PDFInfo
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- CN102806400A CN102806400A CN2011101452163A CN201110145216A CN102806400A CN 102806400 A CN102806400 A CN 102806400A CN 2011101452163 A CN2011101452163 A CN 2011101452163A CN 201110145216 A CN201110145216 A CN 201110145216A CN 102806400 A CN102806400 A CN 102806400A
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- scaling powder
- air inlet
- collection device
- soldering flux
- flux collection
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Abstract
The invention relates to cooling equipment with a scaling powder collector for a reflow oven. The cooling equipment is arranged between a heating module and a cooling module of the reflow oven and comprises an air inlet pipe, the scaling powder collector and an air outlet pipe. One end of the air inlet pipe is connected with the heating module while the other end of the air inlet pipe is connected with an air inlet of the scaling powder collector, an air outlet of the scaling powder collector is connected with one end of the air outlet pipe, and the other end of the air outlet pipe is connected with the cooling module. An induced draft fan used for sucking scaling powder steam in the heating module into the air inlet pipe is arranged in the air inlet pipe, and an air blower used for blowing cooled scaling powder steam into the cooling module is arranged in the air outlet pipe. Compared with the prior art, the cooling equipment has the advantages of compact structure, small space occupation, capabilities of improving cooling effect to PCB(printed circuit boards) and collecting the scaling powder, and the like.
Description
Technical field
The present invention relates to a kind of reflow soldering parts, especially relate to a kind of cooling device with reflux brazier soldering flux collection device.
Background technology
Reflow soldering is the equipment that is used for the circuit board that is loaded with electronic devices and components is carried out soldering.It is through providing a kind of heating environment, thereby solder(ing) paste being heated melt lets surface-pasted components and parts and circuit board combine reliably through the solder(ing) paste alloy.Except heating module, all there is a refrigerating module to guarantee that metallurgy characteristic plate temperature with reducing in the reflow soldering.In the air reflow soldering, scaling powder steam was directly discharged body of heater before cooling, in refrigerating module, can not stay the scaling powder condensate.
, in most nitrogen protection reflow solderings, in order to reduce the consumption of nitrogen (N2); Internal mix gas will recycle; Scaling powder steam can not directly be discharged body of heater, so scaling powder steam has an opportunity fully to contact with refrigerating module, makes its temperature be lower than 110 ℃; And condensation appears, these scaling powder condensate liquids are known from experience on the backflow orifice plate attached to refrigerating module.When the scaling powder of liquid state is stacked into certain degree, just can form drop, finally drip, and have very big probability to drop onto on the wiring board (PCB), cause the off quality of wiring board even scrap.In order to prevent this type of incident, general way is the scaling powder of regular manual wipping cleaning cooling zone backflow orifice surface in the industry, and maintenance is cleaned in return-flow system inside.The skilled worker that abundant maintenance technology and general knowledge generally need be shut down and arranged to have to this work operates, and also need dismantle correlated parts sometimes, to clear up easily and thoroughly and to safeguard.But increased the time and the work difficulty of maintenance so again, thereby remote-effects are to production efficiency and the output of using the client.
In order to reduce the continuous accumulation of scaling powder in burner hearth; Reduce the scaling powder probability that condensation is piled up in refrigerating module; The lower circuit board of enhanced cooling acquisition simultaneously goes out plate temperature, and reflow soldering should be equipped with soldering flux collection device, and the scaling powder of gasification is collected.To improve the service efficiency and the production efficiency of reflow soldering, be the bigger economic benefit of enterprises implement.
Summary of the invention
The object of the invention is exactly that to provide a kind of compact conformation, institute to take up space in order to overcome the defective that above-mentioned prior art exists little, can improve the cooling effect of pcb board, can collect the cooling device of the band reflux brazier soldering flux collection device of scaling powder simultaneously.
The object of the invention can be realized through following technical scheme: a kind of cooling device with reflux brazier soldering flux collection device; Be arranged between the heating module and refrigerating module of reflow soldering; It is characterized in that; Described cooling device comprises air inlet pipe, soldering flux collection device and escape pipe, and an end of described air inlet pipe is connected with heating module, and the other end is connected with the air inlet of soldering flux collection device; The gas outlet of soldering flux collection device is connected with an end of escape pipe; The other end of escape pipe is connected with refrigerating module, is provided with the induced-draught fan that is used for the scaling powder steam in the heating module is sucked air inlet pipe in the described air inlet pipe, is provided with the hair-dryer that is used for cooled scaling powder steam is blown into refrigerating module in the described escape pipe.
Described soldering flux collection device comprises urceolus, gas heat exchange inner core, scaling powder receiving flask mozzle, scaling powder receiving flask; Described gas heat exchange inner core is arranged in the urceolus; One end of described scaling powder receiving flask mozzle is connected with urceolus, and the other end is connected with the scaling powder receiving flask.
Described soldering flux collection device also comprises ball valve, and this ball valve is arranged between scaling powder receiving flask mozzle and the scaling powder receiving flask.
Compared with prior art, the present invention has the following advantages:
1, combine through refrigerating module and apparatus of the present invention, compact conformation, and economical;
2, gas piping is few, and institute takes up space little, and brazier is whole succinct, the more cooling device of can arranging;
3, pcb board good cooling results;
4, can the synchronous collection scaling powder.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is the shell portion decomposition texture sketch map of soldering flux collection device;
Fig. 3 is the receiving flask part decomposition texture sketch map of soldering flux collection device;
The specific embodiment
Below in conjunction with accompanying drawing and specific embodiment the present invention is elaborated.
Embodiment
Shown in Fig. 1～3, a kind of cooling device with reflux brazier soldering flux collection device is arranged between the heating module and refrigerating module of reflow soldering.Cooling device comprises air inlet pipe 2, soldering flux collection device 1 and escape pipe 3.One end of air inlet pipe 2 is connected with heating module, and the other end is connected with the air inlet of soldering flux collection device 1, and the gas outlet of soldering flux collection device 1 is connected with an end of escape pipe 3, and the other end of escape pipe 3 is connected with refrigerating module.Be provided with the induced-draught fan that is used for the scaling powder steam in the heating module is sucked air inlet pipe 2 in the air inlet pipe 2; Be provided with the hair-dryer that is used for cooled scaling powder steam is blown into refrigerating module in the escape pipe 3.Soldering flux collection device 1 comprises urceolus 11, gas heat exchange inner core 12, scaling powder receiving flask mozzle 22, scaling powder receiving flask 25.Gas heat exchange inner core 12 is arranged in the urceolus 11, and gas heat exchange inner core 12 comprises the heat-exchange corrugated pipe 14 of gas.The left end of soldering flux collection device 1 is provided with sealing ring 13, and right-hand member is connected with base plate 17 with sanitary fitting clip 16 through sealing ring 15.One end of scaling powder receiving flask mozzle 22 is connected with base plate 17 through the first scaling powder collecting pipe joint 21, and the other end is connected with an end of ball valve 24 through the second scaling powder collecting pipe joint 24, and the other end of ball valve 24 is connected with scaling powder receiving flask 25.
The present invention in use, the blast that hair-dryer produces sucks air inlet pipe with the steam that is rich in scaling powder in the burner hearth, delivers in the soldering flux collection device then.The heat-exchange corrugated pipe of gas in steam and the soldering flux collection device carries out heat exchange.Vapor (steam) temperature is lowered, and the scaling powder condensation also is collected in the scaling powder receiving flask of bottom.Like this, after the steam that is rich in scaling powder was cooled and collects, the refrigerating gas that becomes low scaling powder content was blown on the pcb board of getting back in the burner hearth again.Cryogenic gas has been taken away the heat of pcb board, has played the reduction pcb board and has gone out this function of plate temperature.And because compact conformation of the present invention, gas piping is succinct, and many group apparatus of the present invention can be installed on a reflow soldering, collects and cooling effect to reach better scaling powder, to improve the service efficiency and the production efficiency of reflow soldering.
Claims (3)
1. cooling device with reflux brazier soldering flux collection device; Be arranged between the heating module and refrigerating module of reflow soldering; It is characterized in that; Described cooling device comprises air inlet pipe, soldering flux collection device and escape pipe, and an end of described air inlet pipe is connected with heating module, and the other end is connected with the air inlet of soldering flux collection device; The gas outlet of soldering flux collection device is connected with an end of escape pipe; The other end of escape pipe is connected with refrigerating module, is provided with the induced-draught fan that is used for the scaling powder steam in the heating module is sucked air inlet pipe in the described air inlet pipe, is provided with the hair-dryer that is used for cooled scaling powder steam is blown into refrigerating module in the described escape pipe.
2. a kind of cooling device according to claim 1 with reflux brazier soldering flux collection device; It is characterized in that; Described soldering flux collection device comprises urceolus, gas heat exchange inner core, scaling powder receiving flask mozzle, scaling powder receiving flask; Described gas heat exchange inner core is arranged in the urceolus, and an end of described scaling powder receiving flask mozzle is connected with urceolus, and the other end is connected with the scaling powder receiving flask.
3. a kind of cooling device with reflux brazier soldering flux collection device according to claim 2 is characterized in that described soldering flux collection device also comprises ball valve, and this ball valve is arranged between scaling powder receiving flask mozzle and the scaling powder receiving flask.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101452163A CN102806400A (en) | 2011-05-31 | 2011-05-31 | Cooling equipment with scaling powder collector for reflow oven |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101452163A CN102806400A (en) | 2011-05-31 | 2011-05-31 | Cooling equipment with scaling powder collector for reflow oven |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102806400A true CN102806400A (en) | 2012-12-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101452163A Pending CN102806400A (en) | 2011-05-31 | 2011-05-31 | Cooling equipment with scaling powder collector for reflow oven |
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| CN (1) | CN102806400A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104801840A (en) * | 2014-01-28 | 2015-07-29 | 上海朗仕电子设备有限公司 | Air cooling type soldering flux gathering device for reflow soldering furnace |
| CN104976866A (en) * | 2015-07-10 | 2015-10-14 | 东莞市科隆威自动化设备有限公司 | Drying oven |
| CN108262543A (en) * | 2016-12-30 | 2018-07-10 | 上海朗仕电子设备有限公司 | A kind of scaling powder for reflow soldering is collected and cooling device |
| CN108723539A (en) * | 2018-06-04 | 2018-11-02 | 武汉倍普科技有限公司 | A kind of removing method of the smog of reflow ovens |
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| US5579981A (en) * | 1994-01-13 | 1996-12-03 | Matsushita Electric Industrial Co., Ltd. | Reflow apparatus |
| JP2003179341A (en) * | 2001-12-11 | 2003-06-27 | Tamura Seisakusho Co Ltd | Cooling device for reflow and reflow device |
| CN1615200A (en) * | 2002-01-18 | 2005-05-11 | 斯皮德莱技术公司 | Flux collection method and system |
| CN1893773A (en) * | 2005-06-30 | 2007-01-10 | 古河电气工业株式会社 | Reflow oven |
| US20070254255A1 (en) * | 2006-03-28 | 2007-11-01 | Neville James E | System, apparatus and methods for board cooling |
| JP4091833B2 (en) * | 2002-12-16 | 2008-05-28 | 株式会社タムラ製作所 | Soldering flux remover |
| CN201183154Y (en) * | 2008-02-19 | 2009-01-21 | 上海朗仕电子设备有限公司 | Reflow soldering furnace scaling powder flux collecting device |
| JP2010109301A (en) * | 2008-10-31 | 2010-05-13 | Green Technologies Corp | Reflow device |
| CN202155627U (en) * | 2011-05-31 | 2012-03-07 | 上海朗仕电子设备有限公司 | Cooling equipment with scaling powder collection device of reflow oven |
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2011
- 2011-05-31 CN CN2011101452163A patent/CN102806400A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5579981A (en) * | 1994-01-13 | 1996-12-03 | Matsushita Electric Industrial Co., Ltd. | Reflow apparatus |
| JP2003179341A (en) * | 2001-12-11 | 2003-06-27 | Tamura Seisakusho Co Ltd | Cooling device for reflow and reflow device |
| CN1615200A (en) * | 2002-01-18 | 2005-05-11 | 斯皮德莱技术公司 | Flux collection method and system |
| JP4091833B2 (en) * | 2002-12-16 | 2008-05-28 | 株式会社タムラ製作所 | Soldering flux remover |
| CN1893773A (en) * | 2005-06-30 | 2007-01-10 | 古河电气工业株式会社 | Reflow oven |
| US20070254255A1 (en) * | 2006-03-28 | 2007-11-01 | Neville James E | System, apparatus and methods for board cooling |
| CN201183154Y (en) * | 2008-02-19 | 2009-01-21 | 上海朗仕电子设备有限公司 | Reflow soldering furnace scaling powder flux collecting device |
| JP2010109301A (en) * | 2008-10-31 | 2010-05-13 | Green Technologies Corp | Reflow device |
| CN202155627U (en) * | 2011-05-31 | 2012-03-07 | 上海朗仕电子设备有限公司 | Cooling equipment with scaling powder collection device of reflow oven |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104801840A (en) * | 2014-01-28 | 2015-07-29 | 上海朗仕电子设备有限公司 | Air cooling type soldering flux gathering device for reflow soldering furnace |
| CN104976866A (en) * | 2015-07-10 | 2015-10-14 | 东莞市科隆威自动化设备有限公司 | Drying oven |
| CN104976866B (en) * | 2015-07-10 | 2017-08-25 | 东莞市科隆威自动化设备有限公司 | A kind of drying oven |
| CN108262543A (en) * | 2016-12-30 | 2018-07-10 | 上海朗仕电子设备有限公司 | A kind of scaling powder for reflow soldering is collected and cooling device |
| CN108723539A (en) * | 2018-06-04 | 2018-11-02 | 武汉倍普科技有限公司 | A kind of removing method of the smog of reflow ovens |
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Application publication date: 20121205 |