CN215545644U - Recovery device for scaling powder of semiconductor welding furnace - Google Patents
Recovery device for scaling powder of semiconductor welding furnace Download PDFInfo
- Publication number
- CN215545644U CN215545644U CN202121752865.5U CN202121752865U CN215545644U CN 215545644 U CN215545644 U CN 215545644U CN 202121752865 U CN202121752865 U CN 202121752865U CN 215545644 U CN215545644 U CN 215545644U
- Authority
- CN
- China
- Prior art keywords
- cooling
- cooling chamber
- water
- water pipe
- cooling water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a recovery device of scaling powder for a semiconductor welding furnace, which comprises a cooling chamber and a cooling water pipe, wherein the upper part of the cooling chamber is provided with an air inlet, the air inlet is connected with a welding device, the lower part of the cooling chamber is provided with an air outlet, the inside of the cooling chamber is provided with air deflectors, the air deflectors are alternately arranged on two opposite side walls of the cooling chamber, and the cooling water pipe is arranged between two adjacent air deflectors. The cooling water pipe is spiral, the cooling water pipe is provided with a plurality of cooling water pipes, and two adjacent cooling water pipes are arranged in parallel. The soldering flux recovery device provided by the utility model can be used for recovering the soldering flux which forms a steam form in the welding process, so that the soldering flux accumulation formed in the welding furnace is prevented. The soldering flux recovery device provided by the utility model is compact in structure and high in recovery efficiency.
Description
Technical Field
The utility model relates to the technical field of soldering flux, in particular to a recovery device of the soldering flux for a semiconductor welding furnace.
Background
A soldering method of soldering paste is used to carry various electronic elements on circuit board in semiconductor production industry, the soldering paste is formed by mixing metal soldering tin and soldering flux, the soldering flux is formed by mixing rosin, tackifier, active agent and the like with solvent, steam is generated in heating process, when the steam is not recovered in time, the steam drops and adheres to the circuit board to form residue when the concentration of the steam in a reflow soldering furnace exceeds a certain concentration, thereby affecting the quality of the circuit board and possibly causing other parts in equipment such as motor, bearing, sealing gasket, chain and the like to be damaged. The prior soldering flux recovery device has low recovery efficiency.
SUMMERY OF THE UTILITY MODEL
In order to overcome the above disadvantages, the present invention provides an efficient flux recycling device.
In order to achieve the above purposes, the utility model adopts the technical scheme that: the recovery device for the scaling powder of the semiconductor welding furnace comprises a cooling chamber and a cooling water pipe, wherein an air inlet is formed in the upper portion of the cooling chamber and connected with a welding device, an air outlet is formed in the lower portion of the cooling chamber, air deflectors are arranged in the cooling chamber and alternately arranged on two opposite side walls of the cooling chamber, and the cooling water pipe is arranged between two adjacent air deflectors.
Preferably, the cooling water pipe is spiral, the cooling water pipe is provided with a plurality of cooling water pipes, and two adjacent cooling water pipes are arranged in parallel.
Preferably, the cooling chamber further comprises a nitrogen inlet provided on the side wall of the cooling chamber.
Preferably, both ends of the cooling water pipe are respectively connected with a water inlet and a water outlet, and the water inlet and the water outlet are both arranged on the side wall of the cooling chamber.
Preferably, the water inlet divide into first water inlet and second water inlet, keeps away from the condenser tube's of air inlet water inlet is first water inlet, first water inlet and cooling device are connected, the delivery port divide into first delivery port and second delivery port, is close to the condenser tube's of air inlet delivery port is first delivery port, first delivery port and condensing equipment connect.
Preferably, the second water outlet of the cooling water pipe and the second water inlet of the cooling water pipe adjacent to the second water outlet of the cooling water pipe are connected through a pipeline.
Preferably, a liquid recovery tank is arranged at the bottom of the cooling chamber, and a liquid outlet is arranged on the side wall of the liquid recovery tank.
Preferably, the air outlet is connected with the centrifugal fan through a pipeline.
Preferably, the centrifugal fan is connected to the welding device.
Preferably, a filler filter material is disposed within the cooling chamber.
Preferably, the cooling chamber further comprises a handle, and the handle is arranged on the middle upper part of the side wall of the cooling chamber.
Preferably, the cooling device further comprises a fixed base, wherein the fixed base is located at the bottom of the cooling chamber, and a through hole is formed in the fixed base.
The flux recovery device has the beneficial effects that 1) the flux recovery device provided by the utility model recovers the flux which forms a steam form in the welding process, and prevents the flux from dripping and further adhering to a semiconductor circuit board to form residues when the concentration in a welding furnace exceeds a certain concentration, so that the quality of the circuit board is influenced. 2) The scaling powder recovery device provided by the utility model enables hot air to flow in an S route in the cooling chamber through the air deflector, the cooling water pipe is designed to be spiral, and the filtering material is filled in the cooling chamber, so that the contact area of the hot air and the cooling water pipe is increased, the condensation efficiency is improved, and the recovery efficiency of the scaling powder recovery device is improved. 3) Through being provided with the nitrogen gas entry, to passing through nitrogen gas in the cooling chamber, and then reduce the temperature of steam to improve scaling powder recovery unit's recovery efficiency.
Drawings
FIG. 1 is a perspective view of a flux recycling device according to a preferred embodiment of the present invention;
FIG. 2 is a front view of a flux recycling apparatus according to a preferred embodiment of the present invention;
FIG. 3 is a front view of a cooling chamber with a front housing removed in accordance with a preferred embodiment of the present invention.
In the figure: 1. a cooling chamber; 2. an air inlet; 3. a nitrogen inlet; 4. a liquid outlet; 5. a centrifugal fan; 6. A first water inlet; 61. a second water inlet; 7. a first water outlet; 71. a second water outlet; 8. an air deflector; 9. a cooling water pipe; 10. an air outlet; 11. a base; 12. a handle.
Detailed Description
The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the utility model easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the utility model.
Referring to fig. 1-3, the recycling device for flux of a semiconductor welding furnace in this embodiment includes a cooling chamber 1 and a cooling water pipe 9, an air inlet 2 is disposed at an upper portion of the cooling chamber 1, the air inlet 2 is connected to a welding device, an air outlet 10 is disposed at a lower portion of the cooling chamber 1, air deflectors 8 are disposed inside the cooling chamber 1, the air deflectors 8 are alternately disposed on two opposite side walls of the cooling chamber 1, and the cooling water pipe 9 is disposed between two adjacent air deflectors 8. The cooling water pipe 9 is spiral, the cooling water pipe 9 is provided with a plurality of cooling water pipes, and two adjacent cooling water pipes 9 are arranged in parallel. And a filling filtering material is arranged in the cooling chamber 1. The air deflector 8 enables hot air to flow in an S route in the cooling chamber 1, and the cooling water pipe 9 is spiral, so that the contact area of the hot air and the cooling water pipe is increased, the condensation efficiency is improved, and the recovery efficiency of the soldering flux recovery device is improved.
This embodiment 9 both ends of cooling water pipe are connected with water inlet and delivery port respectively, the water inlet with the delivery port all sets up on the 1 lateral wall of cooling chamber. The water inlet divide into first water inlet 6 and second water inlet 61, keeps away from the condenser tube's of air inlet 2 water inlet is first water inlet 6, first water inlet 6 is connected with cooling device, the delivery port divide into first delivery port 7 and second delivery port 71, is close to the condenser tube's of air inlet 2 delivery port is first delivery port 7, first delivery port 7 and condensing equipment are connected. The second water outlet 71 of the cooling water pipe is connected with the second water inlet 61 of the cooling water pipe adjacent to the second water outlet by a pipeline.
This embodiment 1 bottom in cooling chamber is provided with liquid recovery groove, liquid recovery groove lateral wall is provided with liquid outlet 4. The air outlet 10 is connected with the centrifugal fan 5 through a pipeline. The centrifugal fan 5 is connected with the welding device.
The embodiment further comprises a handle 12, and the handle 12 is arranged at the middle upper part of the side wall of the cooling chamber 1. Still include unable adjustment base 11, unable adjustment base 11 is located 1 bottoms of cooling chamber, the last through-hole that is provided with of unable adjustment base.
The working process is as follows: let in the condensate liquid in the condenser pipe, steam passes through air inlet 2 and gets into in the cooling chamber 1, nitrogen gas passes through in 3 entering cooling chamber 1 of nitrogen gas entry, steam meets nitrogen gas, nitrogen gas has cooled down steam, then steam flows along the S route that air duct 8 formed, when steam meets behind packing material and condenser tube 9, the scaling powder condensation is in the liquid inflow accumulator, steam gets into welding set again under centrifugal fan 5' S effect, the scaling powder is retrieved the back in the liquid accumulator, 1 is outer through the cooling chamber of 4 dischargements of liquid outlet.
The above embodiments are merely illustrative of the technical concept and features of the present invention, and the present invention is not limited thereto, and any equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of the present invention.
Claims (10)
1. The utility model provides a recovery unit for scaling powder of semiconductor welding stove, includes cooling chamber (1) and cooling water pipe (9), cooling chamber (1) upper portion is provided with air inlet (2), air inlet (2) and welding set are connected, cooling chamber (1) lower part is provided with gas outlet (10), its characterized in that, cooling chamber (1) inside is provided with aviation baffle (8), aviation baffle (8) set up in turn on two relative lateral walls of cooling chamber (1), cooling water pipe (9) set up between two adjacent aviation baffle (8).
2. The recycling device of the flux for the semiconductor welding furnace according to claim 1, wherein the cooling water pipe (9) is spiral, a plurality of cooling water pipes (9) are provided, and two adjacent cooling water pipes (9) are arranged in parallel.
3. The recycling device of flux for semiconductor soldering furnaces according to claim 2, characterized by further comprising a nitrogen inlet (3), the nitrogen inlet (3) being provided on the side wall of the cooling chamber (1).
4. The recycling device of the flux for the semiconductor welding furnace according to claim 3, wherein the two ends of the cooling water pipe (9) are respectively connected with a water inlet and a water outlet, and the water inlet and the water outlet are both arranged on the side wall of the cooling chamber (1).
5. The recycling device of the scaling powder for the semiconductor welding furnace according to claim 4, wherein the water inlets are divided into a first water inlet (6) and a second water inlet (61), the water inlet of the cooling water pipe (9) far away from the air inlet (2) is the first water inlet (6), the first water inlet (6) is connected with the cooling device, the water outlet is divided into a first water outlet (7) and a second water outlet (71), the water outlet of the cooling water pipe (9) close to the air inlet (2) is the first water outlet (7), and the first water outlet (7) is connected with the condensing device.
6. The recycling device of the flux for the semiconductor soldering furnace according to claim 5, wherein the second water outlet (71) of the cooling water pipe (9) and the second water inlet (61) of the cooling water pipe (9) adjacent thereto are connected by a pipe.
7. The recycling device of the flux for the semiconductor welding furnace according to claim 6, wherein the bottom of the cooling chamber (1) is provided with a liquid recycling groove, and the side wall of the liquid recycling groove is provided with a liquid outlet (4).
8. The recycling device of the flux for the semiconductor soldering furnace according to claim 7, further comprising a centrifugal fan (5), wherein the air outlet (10) is connected with the centrifugal fan (5) through a pipeline, and the centrifugal fan (5) is connected with the soldering device.
9. A flux recycling device for a semiconductor soldering furnace according to claim 2, wherein a filler material is provided in the cooling chamber (1).
10. The recycling device of the flux for the semiconductor soldering furnace according to any one of claims 1 to 9, further comprising a fixing base (11), wherein the fixing base (11) is located at the bottom of the cooling chamber (1), and the fixing base is provided with a through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121752865.5U CN215545644U (en) | 2021-07-29 | 2021-07-29 | Recovery device for scaling powder of semiconductor welding furnace |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121752865.5U CN215545644U (en) | 2021-07-29 | 2021-07-29 | Recovery device for scaling powder of semiconductor welding furnace |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215545644U true CN215545644U (en) | 2022-01-18 |
Family
ID=79829917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121752865.5U Active CN215545644U (en) | 2021-07-29 | 2021-07-29 | Recovery device for scaling powder of semiconductor welding furnace |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215545644U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115070158A (en) * | 2022-07-12 | 2022-09-20 | 东莞市洲际技术有限公司 | Soldering flux recovery device and recovery method |
-
2021
- 2021-07-29 CN CN202121752865.5U patent/CN215545644U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115070158A (en) * | 2022-07-12 | 2022-09-20 | 东莞市洲际技术有限公司 | Soldering flux recovery device and recovery method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN215545644U (en) | Recovery device for scaling powder of semiconductor welding furnace | |
| US10393441B2 (en) | Cooling tower drift eliminator | |
| TW202019549A (en) | An exhaust gas purification device | |
| CN101612506B (en) | Nitrogen filtering recovery system of reflow oven | |
| CN101551203A (en) | Cooler | |
| CN105345196B (en) | A kind of vacuum brazing equipment and its filter | |
| CN102806400A (en) | Cooling equipment with scaling powder collector for reflow oven | |
| CN101513687B (en) | Reflux brazier soldering flux collection device and using method thereof | |
| CN206435834U (en) | A kind of scaling powder for reflow soldering is collected and cooling device | |
| CN219425886U (en) | Recovery unit and welding equipment of scaling powder | |
| CN201279647Y (en) | Soldering fluid cooling and recovering device | |
| CN203900685U (en) | Cooling module group for reflow soldering furnace | |
| CN206335219U (en) | A kind of monoblock type extractor fan | |
| CN217163759U (en) | Ferromanganese smelting electric furnace flue gas recovery equipment | |
| CN112222069A (en) | Condensation recovery unit and online PCBA cleaning machine of PCBA cleaning machine | |
| CN206724734U (en) | A kind of efficient quick condenser | |
| CN217585430U (en) | Heat exchange system | |
| CN206604341U (en) | Diesel-driven generator exhaust outlet drain oil recovery equipment | |
| CN218961805U (en) | Cooling separator | |
| CN102794524A (en) | Device for collecting gas heat exchange cooling soldering flux | |
| CN205043311U (en) | Waste gas recovery device of backward flow welding machine | |
| CN110180295A (en) | A kind of energy-saving clarifying smoke method and device thereof | |
| CN202137485U (en) | Device for collecting condensed soldering flux for gas heat exchange | |
| CN216011901U (en) | Papermaking waste water heat sink | |
| CN207828404U (en) | A kind of dehumidification device for vacuum aluminum-plating machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |