CN206435834U - A kind of scaling powder for reflow soldering is collected and cooling device - Google Patents
A kind of scaling powder for reflow soldering is collected and cooling device Download PDFInfo
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- CN206435834U CN206435834U CN201621470335.0U CN201621470335U CN206435834U CN 206435834 U CN206435834 U CN 206435834U CN 201621470335 U CN201621470335 U CN 201621470335U CN 206435834 U CN206435834 U CN 206435834U
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- scaling powder
- water cooling
- cooling module
- shell
- collected
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Abstract
The utility model is related to a kind of scaling powder for reflow soldering and collected and cooling device, the device includes shell, water cooling module and top cover, described water cooling module is placed in shell, described shell is provided with air inlet, gas outlet, first water inlet and the first delivery port, described top cover is connected with shell, described water cooling module uses body structure, described box house is provided with dividing plate, the upper bottom surface of described water cooling module, bottom surface, two sides and dividing plate are welded by rectangular tube, described water cooling module upper bottom surface and the rectangular tube of bottom surface are provided with the second water inlet and the second delivery port, and docked respectively with the first water inlet and the first delivery port on shell, the bottom surface of described water cooling module is provided with scaling powder collection module.Compared with prior art, the utility model has that contact area is larger, heat exchanger effectiveness is higher, easy to clean and low cost and other advantages.
Description
Technical field
The utility model is related to a kind of auxiliary equipment for being used to produce electronic component, is used to flow back more particularly, to one kind
The scaling powder of brazier is collected and cooling device.
Background technology
Solder reflow techniques and equipment is not strange in electronic manufacturing field, and what is used on computer and mobile phone is loaded with electronics member device
Part is required for being welded on circuit board by solder reflow techniques, this kind equipment be by providing a kind of heating environment, by air and
Nitrogen is heated to enough temperature, makes tin cream is heated to melt to allow surface-pasted component and circuit board to be reliably bonded in
Together.
Common reflow soldering is required for a refrigerating module to ensure metallurgy characteristic and reduction electricity in addition to heating module
The die temperature of road plate.In air return brazier, scaling powder steam is expelled directly out body of heater before cooling, in refrigerating module
In do not leave or considerably less scaling powder condensate.But, in most nitrogen protection reflow soldering, the requirement of reduction nitrogen consumption
Have to use internal mix gas circulation, be not expelled directly out body of heater, therefore heated scaling powder steam has an opportunity and cooled down
Module is fully contacted so that at a temperature below 110C, and condensation occurs, and these scaling powder condensed fluids can be attached to cooling
On the backflow orifice plate of module, when the scaling powder of liquid is constantly stacked into certain degree, droplet-like will be formed, and finally
Drop down, and have very big probability low onto circuit board, cause the off quality of circuit board or even scrap.Therefore one
Good scaling powder is collected and cooling device can reduce the service time of machine, various reflow soldering process requirements is met, so that significantly
Ground improves the service efficiency of reflow soldering, produces bigger economic benefit.
Scaling powder is collected and cooling device is typically two kinds of forms of free air cooling and water cooling, cools down what is collected for air
Form, using ambient room temperature gas as cooling source, extracted out inside cooled hearth by heat exchanging pipe with scaling powder
Gas, but air cooling can not be faster take away heat, cooling effectiveness is relatively low；The form collected for water cooling, by cold
Water is cooled down and collected to scaling powder, and efficiency is higher, quickly can reduce gas temperature, so as to allow scaling powder to become liquid analysis
Go out, but need to be equipped with corresponding passway for water on backflow furnace apparatus, the water-cooling apparatus used at present is typically expensive, together
When there is also the risk of sealing leak, application conditions are restricted.
Utility model content
The purpose of this utility model is exactly the defect in order to overcome above-mentioned prior art presence and provides a kind of for flowing back
The scaling powder of brazier is collected and cooling device.
The purpose of this utility model can be achieved through the following technical solutions：
A kind of scaling powder for reflow soldering is collected and cooling device, and the device includes shell, water cooling module and top cover,
Described water cooling module is placed in shell, and described shell is provided with air inlet, gas outlet, the first water inlet and the first water outlet
Mouthful, described top cover is connected with shell, and described water cooling module uses body structure, and described box house is provided with dividing plate, institute
Upper bottom surface, bottom surface, two sides and the dividing plate for the water cooling module stated are welded by rectangular tube, in described water cooling module
The rectangular tube of bottom surface and bottom surface is provided with the second water inlet and the second delivery port, the second described water inlet and the second delivery port point
Do not docked with the first water inlet and the first delivery port on shell, the bottom surface of described water cooling module is collected provided with scaling powder
Module.
Described scaling powder collection module is rectangular-shape scaling powder collection tray.
Described dividing plate and the upper bottom surface and bottom surface slant setting of water cooling module, and water cooling module upper bottom surface, bottom surface
Rectangular tube connected with the rectangular tube of water cooling module bulkhead, two sides.
Described dividing plate is in knife-like, and described dividing plate is divided into handle of a knife and cutter head, and adjacent separator is placed upside down.
One side of described scaling powder collection tray is provided with the neck with engaging at dividing plate handle of a knife.
Described shell and the junction of top cover are provided with seal washer, and described top cover is used with shell to be snapped connection.
Described device is provided with multiple dividing plates.
Two sides of described water cooling module are provided with the notch docked with housing inlet and gas outlet.
Compared with prior art, the utility model has advantages below：
1) cooling effectiveness is high
The device high-temperature gas and the contact area of cold water module are larger, and heat exchanger effectiveness is higher, can be fast during use
The temperature of gas, allows scaling powder to liquefy in the low device of prompt drop；
2) it is simple in construction, it is simple for production, with low cost
The apparatus structure is simple, regular shape, and main sheet metal component and rectangular tube are constituted, and complex parts are less, difficulty of processing
It is relatively low.Have or manufactured goods, without processing, volume procurement can more reduce cost；Equipment facilitates when mounted；
3) clean and maintenance is convenient
Using the scaling powder in removing equipment is needed after a period of time, device cleaning gets up more convenient, and scaling powder collects support
Disk can directly lift down cleaning, and the scaling powder remained in inside device, which is also named, easily to be scraped off, and maintenance process damages the wind of device
Danger is relatively low；
4) adaptability is good
Size and installation site can be changed, to meet under different situations according to production technology and solder reflow device
It is required that.
Brief description of the drawings
Fig. 1 is a kind of scaling powder collection and the structural representation of cooling device for reflow soldering of the utility model；
Fig. 2 is that a kind of scaling powder for reflow soldering of the utility model is collected and the water cooling modular structure of cooling device is shown
It is intended to；
Wherein：
1. shell；2. water cooling module；3. top cover；4. scaling powder collection tray；5. seal washer；6. enter air outlet adapter；7.
Jointing.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is a part of embodiment of the present utility model, rather than all implement
Example.Based on the embodiment in the utility model, those of ordinary skill in the art institute on the premise of creative work is not made
The every other embodiment obtained, should all belong to the scope of the utility model protection.
Embodiment：
A kind of scaling powder for reflow soldering of the utility model is collected and cooling device, as shown in figure 1, the device includes
Shell 1, water cooling module 2, scaling powder collection tray 4 and top cover 3, described water cooling module 2 are placed in shell 1, described water cooling
Module is to be set as needed to some dividing plates in body structure, water cooling module, and described scaling powder collection tray 4 is placed in water cooled mo(u)ld
On block bottom surface, described top cover and the junction of shell are provided with seal washer 5, and top cover 3 is fixed by buckle and shell 1 to be connected
Connect.Air inlet, gas outlet, the first water inlet and the first delivery port are provided with described shell 1.
The described concrete structure of water cooling module 2 is as shown in Fig. 2 described water cooling module 2 is provided with upper bottom surface, bottom surface front side
Face and trailing flank, upper bottom surface, bottom surface leading flank and the trailing flank of water cooling module 2 are formed by welding by rectangular tube (not to be drawn in figure
Go out), Cooling Water circulates in rectangular tube, circulated gases on the outside of rectangular tube.It is in one that the inside of water cooling module 2, which is provided with upper and lower bottom surface,
Determine the inclined dividing plate of angle, depending on described dividing plate number is according to actual cooling requirement, described dividing plate is in knife-like, adjacent separator
Handle of a knife and cutter head position it is reverse.As shown in figure 1, described scaling powder collection tray is rectangular parallelepiped structure, one side of pallet is set
Fluted, groove at the handle of a knife of dividing plate with engaging.Described water cooling module bottom surface rectangular tube is provided with the second water inlet and outside
The first water inlet on shell connects, and described water cooling module upper bottom surface rectangular tube is provided with the second delivery port and first on shell
Delivery port connects.
The first water inlet and the first delivery port on described shell are respectively equipped with water-in and water-out joint 6, it is described into and out of
Water swivel 6 is connected with the first water inlet and the first delivery port on shell respectively by jointing 7.
The gas for being mixed with scaling powder extracted from reflow soldering burner hearth is connected to logical in the middle of the device, water cooling module and shell
Circulate cold water in gas, device water cooling module water inlet access cold water, the water cooling module welded by rectangular tube, is taken away by cold water
Heat, makes gas temperature comparatively fast lower, and is reduced to the condensing temperature of scaling powder, most of after scaling powder liquefaction to flow to lower section
Collection tray in.
The contact area of device internal gas and water cooling module is larger, is conducive to heat exchange abundant and scaling powder liquefaction,
Collect and compared with cooling system with original corrugated stainless steel tubing scaling powder, the device inner space is larger, and heat exchanger effectiveness is more
Scaling powder collection tray capacity in height, device is larger, it is not necessary to the scaling powder in frequent maintenance remove device.According to the reality of equipment
Border service condition, periodically opens top cover and the scaling powder in device is cleared up.
It is described above, embodiment only of the present utility model, but protection domain of the present utility model do not limit to
In this, any one skilled in the art can readily occur in various in the technical scope that the utility model is disclosed
Equivalent modifications or substitutions, these modifications or substitutions should all cover within protection domain of the present utility model.Therefore, this practicality
New protection domain should be defined by scope of the claims.
Claims (8)
1. a kind of scaling powder for reflow soldering is collected and cooling device, the device includes shell, water cooling module and top cover, institute
The water cooling module stated is placed in shell, and described shell is provided with air inlet, gas outlet, the first water inlet and the first delivery port,
Described top cover is connected with shell, it is characterised in that described water cooling module uses body structure, and described box house is provided with
Dividing plate, upper bottom surface, bottom surface, two sides and the dividing plate of described water cooling module are welded by rectangular tube, described water
The rectangular tube of chill block upper bottom surface and bottom surface is provided with the second water inlet and the second delivery port, the second described water inlet and second
Delivery port is docked with the first water inlet and the first delivery port on shell respectively, and the bottom surface of described water cooling module, which is provided with, to be helped
Collecting flux module.
2. a kind of scaling powder for reflow soldering according to claim 1 is collected and cooling device, it is characterised in that institute
The scaling powder collection module stated is rectangular-shape scaling powder collection tray.
3. a kind of scaling powder for reflow soldering according to claim 1 is collected and cooling device, it is characterised in that institute
The dividing plate stated and the upper bottom surface and bottom surface slant setting of water cooling module, and water cooling module upper bottom surface, the rectangular tube of bottom surface with
Water cooling module bulkhead, the rectangular tube of two sides are connected.
4. a kind of scaling powder for reflow soldering according to claim 2 is collected and cooling device, it is characterised in that institute
The dividing plate stated is in knife-like, and described dividing plate is divided into handle of a knife and cutter head, and adjacent separator is placed upside down.
5. a kind of scaling powder for reflow soldering according to claim 4 is collected and cooling device, it is characterised in that institute
The one side for the scaling powder collection tray stated is provided with the neck with engaging at dividing plate handle of a knife.
6. a kind of scaling powder for reflow soldering according to claim 1 is collected and cooling device, it is characterised in that institute
The shell stated and the junction of top cover are provided with seal washer, and described top cover is used with shell to be snapped connection.
7. a kind of scaling powder for reflow soldering according to claim 1 is collected and cooling device, it is characterised in that institute
The device stated is provided with multiple dividing plates.
8. a kind of scaling powder for reflow soldering according to claim 1 is collected and cooling device, it is characterised in that institute
Two sides of the water cooling module stated are provided with the notch docked with housing inlet and gas outlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621470335.0U CN206435834U (en) | 2016-12-30 | 2016-12-30 | A kind of scaling powder for reflow soldering is collected and cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621470335.0U CN206435834U (en) | 2016-12-30 | 2016-12-30 | A kind of scaling powder for reflow soldering is collected and cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206435834U true CN206435834U (en) | 2017-08-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621470335.0U Active CN206435834U (en) | 2016-12-30 | 2016-12-30 | A kind of scaling powder for reflow soldering is collected and cooling device |
Country Status (1)
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| CN (1) | CN206435834U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108262543A (en) * | 2016-12-30 | 2018-07-10 | 上海朗仕电子设备有限公司 | A kind of scaling powder for reflow soldering is collected and cooling device |
| CN108723539A (en) * | 2018-06-04 | 2018-11-02 | 武汉倍普科技有限公司 | A kind of removing method of the smog of reflow ovens |
-
2016
- 2016-12-30 CN CN201621470335.0U patent/CN206435834U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108262543A (en) * | 2016-12-30 | 2018-07-10 | 上海朗仕电子设备有限公司 | A kind of scaling powder for reflow soldering is collected and cooling device |
| CN108723539A (en) * | 2018-06-04 | 2018-11-02 | 武汉倍普科技有限公司 | A kind of removing method of the smog of reflow ovens |
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