CN202147075U - Reflow soldering air cooling system - Google Patents
Reflow soldering air cooling system Download PDFInfo
- Publication number
- CN202147075U CN202147075U CN201120222428U CN201120222428U CN202147075U CN 202147075 U CN202147075 U CN 202147075U CN 201120222428 U CN201120222428 U CN 201120222428U CN 201120222428 U CN201120222428 U CN 201120222428U CN 202147075 U CN202147075 U CN 202147075U
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- CN
- China
- Prior art keywords
- reflow soldering
- heat exchanger
- air
- cooling system
- air cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model discloses a reflow soldering air cooling system which comprises a heat exchanger mounted at a cooling area of a reflow soldering hearth. The reflow soldering air cooling system is characterized by further comprising a high-pressure fan and a supply air duct, and the high-pressure fan is connected with the heat exchanger by the supply air duct. The reflow soldering air cooling system directly inputs air into the heat exchanger by the high-pressure fan, and carries out cold and heat exchange on the cooling area of the furnace by utilizing the heat exchanger to decrease the temperature of the cooling area, thereby realizing a soldering purpose. The system directly adopts the air as a cooling medium to replace a cooling liquid; the pressure does not exist in the system any more; the maintenance is convenient; and the cost is saved.
Description
Technical field
the utility model belongs to the Reflow Soldering field, is specifically related to a kind of Reflow Soldering air cooling system.
Background technology
surface mounting technology (SMT) can carry out full-automatic production scale, can carry out mount components on the two sides of PCB, to realize High Density Packaging; Even the element of minimum dimension can realize that also precision mounts, therefore can produce high-quality PCB assembly.Surface installation technique (SMT) can be divided into two types of Reflow Soldering and wave-solderings according to welding manner.
general surface mount elements all adopts Reflow Soldering to mount.At first, utilize printing machine to scrape solder(ing) paste at the pad on the printed circuit board (PCB); Then, with chip mounter surface mount elements is pressed on the corresponding welding position of printed circuit board (PCB) and fit with solder(ing) paste; At last, the printed circuit board (PCB) that posts element being sent into reflow soldering welds.Reflow soldering adopts the internal-circulation type heating system of a plurality of temperature provinces, because solder(ing) paste adopts multiple alloy material to constitute, different temperatures and time can cause the different variations of tin cream state.Solder(ing) paste is fused into liquid state in the high-temperature region, and surface mount elements is easy and solder(ing) paste is combined; After getting into the cooling zone, solder(ing) paste is frozen into solid-state, and the pin and the printed circuit board (PCB) of surface mount elements is integrally welded firmly.Existing Reflow Soldering all is to use cooling fluid that the burner hearth cooling zone is cooled off, and uses cooling fluid dismounting maintenance more loaded down with trivial details, so cooling system needs pressure because cooling fluid need circulate, pipeline is also had the cooler requirement than higher.
The utility model content
the utility model purpose is: a kind of convenience for washing is provided, has improved the Reflow Soldering air cooling system of heat exchanger effectiveness.
The technical scheme of
the utility model is: a kind of Reflow Soldering air cooling system; Comprise the heat exchanger that is installed on the reflow soldering furnace cooling zone; It is characterized in that; Said Reflow Soldering air cooling system also comprises high pressure positive blower and air supply duct, and said high pressure positive blower links to each other with heat exchanger through air supply duct.
are further; Said heat exchanger is 6; 3 upper ends that are positioned at the reflow soldering furnace cooling zone wherein; Other 3 lower ends that are positioned at the reflow soldering furnace cooling zone, the said air inlet that is positioned at two heat exchangers up and down of porch, reflow soldering furnace cooling zone links to each other with high pressure positive blower, and air outlet links to each other with exhaust duct.
are further, have on the said heat exchanger and can said heat exchanger be fixed by bolts to the flange on the reflow soldering furnace.
are further, and said air supply duct and exhaust duct are resistant to elevated temperatures flexible pipe.
are further, and said heat exchanger is not for the heat exchanger of outer fin.
The utility model has the advantages that:
are 1. directly squeezed into heat exchanger through high pressure positive blower with air, utilize heat exchanger that cold and hot exchange is carried out in the burner hearth cooling zone, reduce the cooling zone temperature, thereby reach the welding purpose.It is that cooling medium substitutes cooling fluid that this system directly adopts air, and internal system no longer includes pressure and exists.
Adopt not with the heat exchanger of outer fin
, has saved the cleaning difficulty greatly, has improved heat exchanger effectiveness, saves service time.
directly adopt air to substitute cooling fluid, have reduced operation cost.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the utility model is further described:
Fig. 1 is the Reflow Soldering air cooling system structure chart of the utility model.
wherein: 1 high pressure positive blower; 2 heat exchangers; 3 flanges; 4 air supply ducts; 5 exhaust ducts; 6 exhaust outlets; 7 heat exchangers.
The specific embodiment
embodiment: Reflow Soldering air cooling system as shown in Figure 1 comprises 6 heat exchangers that are installed on the reflow soldering furnace cooling zone; 3 upper ends that are positioned at the reflow soldering furnace cooling zone wherein; Other 3 lower ends that are positioned at the reflow soldering furnace cooling zone; Be positioned at the heat exchanger 2 of porch, reflow soldering furnace cooling zone and the air inlet of heat exchanger 7 and link to each other with high pressure positive blower 1, air outlet links to each other with exhaust duct.Because porch, reflow soldering furnace cooling zone temperature is high, therefore the air themperature by the heat exchanger output that is in porch, reflow soldering furnace cooling zone is also high, and the hot-air of high temperature need be delivered to exhaust outlet 6 discharges through exhaust duct 5 like this.Other heat exchangers can not link to each other with exhaust duct, directly are discharged in the air.Also can arrange the quantity and the heat exchanger of heat exchanger according to the demand of reality is external exhaust duct.Flange 3 is arranged on the heat exchanger, make that heat exchanger can be through being bolted on the reflow soldering furnace maintenance for convenience detach.Air supply duct in the present embodiment and exhaust duct are resistant to elevated temperatures flexible pipe, also are to dismantle maintenance for ease, if adopt other pipelines also can realize the utility model.Heat exchanger in the present embodiment has been saved the cleaning difficulty greatly for not with the heat exchanger of outer fin, has improved heat exchanger effectiveness, saves service time.
above embodiment is merely the utility model a kind of embodiment wherein, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model claim.Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the utility model design, can also make some distortion and improvement, these all belong to the protection domain of the utility model.Therefore, the protection domain of the utility model patent should be as the criterion with accompanying claims.
Claims (5)
1. Reflow Soldering air cooling system; Comprise the heat exchanger that is installed on the reflow soldering furnace cooling zone; It is characterized in that said Reflow Soldering air cooling system also comprises high pressure positive blower and air supply duct, said high pressure positive blower links to each other with heat exchanger through air supply duct.
2. a kind of Reflow Soldering air cooling system according to claim 1; It is characterized in that; Said heat exchanger is 6,3 upper ends that are positioned at the reflow soldering furnace cooling zone wherein, other 3 lower ends that are positioned at the reflow soldering furnace cooling zone; The said air inlet that is positioned at two heat exchangers up and down of porch, reflow soldering furnace cooling zone links to each other with high pressure positive blower, and air outlet links to each other with exhaust duct.
3. a kind of Reflow Soldering air cooling system according to claim 2 is characterized in that, has on the said heat exchanger and can said heat exchanger be fixed by bolts to the flange on the reflow soldering furnace.
4. a kind of Reflow Soldering air cooling system according to claim 2 is characterized in that said air supply duct and exhaust duct are resistant to elevated temperatures flexible pipe.
5. a kind of Reflow Soldering air cooling system according to claim 2 is characterized in that, said heat exchanger is not for the heat exchanger of outer fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120222428U CN202147075U (en) | 2011-06-28 | 2011-06-28 | Reflow soldering air cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120222428U CN202147075U (en) | 2011-06-28 | 2011-06-28 | Reflow soldering air cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202147075U true CN202147075U (en) | 2012-02-22 |
Family
ID=45588150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120222428U Expired - Lifetime CN202147075U (en) | 2011-06-28 | 2011-06-28 | Reflow soldering air cooling system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202147075U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102229015A (en) * | 2011-06-28 | 2011-11-02 | 维多利绍德机械科技（苏州）有限公司 | Reflow soldering air cooling system |
| CN102615373A (en) * | 2012-04-19 | 2012-08-01 | 宁夏小牛自动化设备有限公司 | Series welding equipment with air cooling structure and series welding head with air cooling structure |
| CN103170189A (en) * | 2013-03-07 | 2013-06-26 | 南京熊猫电子制造有限公司 | Gas purifying apparatus for inert gas shielded welding |
| WO2022133694A1 (en) * | 2020-12-22 | 2022-06-30 | 华为数字能源技术有限公司 | Power converter, heat exchangers, heat sinks and photovoltaic power generation system |
-
2011
- 2011-06-28 CN CN201120222428U patent/CN202147075U/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102229015A (en) * | 2011-06-28 | 2011-11-02 | 维多利绍德机械科技（苏州）有限公司 | Reflow soldering air cooling system |
| CN102615373A (en) * | 2012-04-19 | 2012-08-01 | 宁夏小牛自动化设备有限公司 | Series welding equipment with air cooling structure and series welding head with air cooling structure |
| CN102615373B (en) * | 2012-04-19 | 2014-05-14 | 宁夏小牛自动化设备有限公司 | Series welding equipment with air cooling structure and series welding head with air cooling structure |
| CN103170189A (en) * | 2013-03-07 | 2013-06-26 | 南京熊猫电子制造有限公司 | Gas purifying apparatus for inert gas shielded welding |
| CN103170189B (en) * | 2013-03-07 | 2016-01-20 | 南京熊猫电子制造有限公司 | Inert gas-shielded arc welding gas cleaning plant |
| WO2022133694A1 (en) * | 2020-12-22 | 2022-06-30 | 华为数字能源技术有限公司 | Power converter, heat exchangers, heat sinks and photovoltaic power generation system |
| CN115176413A (en) * | 2020-12-22 | 2022-10-11 | 华为数字能源技术有限公司 | Power converter, heat exchanger, radiator and photovoltaic power generation system |
| EP4254782A4 (en) * | 2020-12-22 | 2024-01-17 | Huawei Digital Power Tech Co Ltd | Power converter, heat exchangers, heat sinks and photovoltaic power generation system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20120222 Effective date of abandoning: 20130821 |
|
| RGAV | Abandon patent right to avoid regrant |