CN201483122U

CN201483122U - Double-layer cooling structure used for reflow soldering

Info

Publication number: CN201483122U
Application number: CN2009201313949U
Authority: CN
Inventors: 单强; 李辉
Original assignee: SHENZHEN DONGYE AUTOMATION EQUIPMENT CO Ltd
Current assignee: SHENZHEN DONGYE AUTOMATION EQUIPMENT CO Ltd
Priority date: 2009-04-30
Filing date: 2009-04-30
Publication date: 2010-05-26
Anticipated expiration: 2019-04-30

Abstract

The utility model discloses a double-layer cooling structure used for reflow soldering, which comprises a cooling tank; the lower part of the cooling tank is provided with a condenser; hot air passes through the condenser, and then forms cooled air; a motor drives a wind wheel to rotate so as to generate wind power; the cooled air enters a cooled air cavity along a cooled air channel; the cooled air cavity is divided into two parts, namely an upper cooled air cavity and a lower cooled air cavity; the cooled air passes through both of the upper cooled air cavity and the lower cooled air cavity for air cooling of PCBs, thus being capable of rapidly reducing the temperature of the PCBs, and the mode of cooling the upper cavity and lower cavity leads the PCBs to be fully cooled.

Description

The double-deck cooling structure that is used for Reflow Soldering

Technical field

The utility model design circuit plate welding equipment, specifically a kind of in order to the cooling structure in the Reflow Soldering, this structure can fully be cooled off pcb board, has avoided the distortion of pcb board and has cooled off insufficient phenomenon.

Background technology

The components and parts welding processing of circuit board, that usually adopts has Reflow Soldering, a wave-soldering dual mode.Reflow soldering is the scolder of an amount of in PCB welding position (pad) dispensing in advance and appropriate format, and Surface Mount Component, is put in subsides then, utilize external heat source to make solder reflow reach welding requirements and carry out in groups or the pointwise welding procedure.Wave-soldering is meant the solder (terne metal) with fusing, become the solder wave of designing requirement through electrodynamic pump or electromagnetic pump jet flow, also can be by forming to the solder pot nitrogen injection, make the printed board that components and parts are housed in advance by solder wave, realize machinery and the solder that is electrically connected between components and parts weldering end or pin and the printed board pad.Reflow soldering is compared with wave soldering has following characteristics:

1, Reflow Soldering does not need to resemble needs the wave-soldering the components and parts direct impregnation in fusion welding, so the suffered thermal shock of components and parts is little;

2, Reflow Soldering is only discharged scolder on the position of needs, has saved the use of scolder greatly;

3, Reflow Soldering can be controlled the dispensing amount of scolder, avoids generation of defects such as bridge joint;

4, put the position and have when necessarily departing from when components and parts paste, because the capillary effect of fusion welding, as long as scolder dispensing correct position, Reflow Soldering can be corrected this little deviation when welding automatically, and components and parts are fixed on the tram;

5, can adopt the local heat thermal source, thereby can on same substrate, weld with different solder reflow process;

6, generally can not sneak into impurity in the scolder, when using solder(ing) paste to carry out reflow soldering, can correctly keep the composition of scolder.

So at present, the welding of most of pcb board is the mode that adopts Reflow Soldering.After reflow soldering, utilize cooling blower that PCB solder side (upper surface) is cooled off, so only cool off at the PCB upper surface, there is the big temperature difference in the pcb board upper and lower surface, easily produce the pcb board distortion, simultaneously, the stress easy damaged file that the temperature difference produces, it is insufficient also to exist as the PCB cooling, goes out the phenomenon of temperature recovery behind the cooling zone.

The utility model content

Based on this, the utility model provides a kind of double-deck cooling structure that is used for Reflow Soldering, and this cooling structure adopts double-deck up and down type of cooling, and pcb board is fully cooled off.

Another purpose of the present utility model is to provide a kind of double-deck cooling structure that is used for Reflow Soldering, this cooling structure cools off simultaneously at the upper and lower surface of pcb board, cooling to pcb board is abundant, can not produce the temperature recovery phenomenon, has also improved the qualification rate of pcb board simultaneously.

The utility model is achieved in that

A kind of double-deck cooling structure that is used for Reflow Soldering, it includes cooler bin, the bottom of cooler bin is provided with condenser, hot blast is through condenser, form cold wind, motor drives wind wheel and rotates, produce wind-force, cold wind enters the cold wind chamber along cold air duct, discharge through air-cooled outlet housing, it is characterized in that the cold wind chamber has two up and down, be respectively cold wind chamber and following cold wind chamber, last cold wind chamber and following cold wind chamber have air-cooled outlet housing respectively, and the air-cooled outlet housing in following cold wind chamber is arranged at down the top in cold wind chamber, corresponding with the air-cooled outlet housing in last cold wind chamber, go up like this, following cold wind chamber is carried out air-cooled jointly to pcb board, can reduce the temperature of pcb board rapidly, on, the type of cooling on following two sides makes the pcb board cooling fully.

The described double-deck cooling structure that is used for Reflow Soldering is provided with two motors in its cooler bin, and two motors turn to difference, offer upper and lower cold wind chamber to produce enough wind-force.

Above-mentioned cooler bin is provided with two cover motors, a condenser in it, promptly have two motors, a condenser in the cooler bin, and the shared condenser of each motor to produce corresponding cold wind respectively, offers upper and lower cold wind chamber.

Above-mentioned motor and condenser all are arranged at the bottom of cooler bin, do not take space up and down.

The described double-deck cooling structure that is used for Reflow Soldering, its side dividing plate and cooler bin sidewall form cold air duct, and the side dividing plate extends upward from the top of condenser, and the upper end is connected to the fixing fixed head of air-cooled outlet housing.

Described cold wind chamber down, it is made of following air-cooled outlet housing and lower clapboard, and lower clapboard is a U type structure, its underpart opening, to enter cold wind, both upper ends thereof is fixed on the bottom plate that air-cooled outlet housing is set down.

The utility model adopts the mode of double-deck cooling, and the pcb board of welding is lowered the temperature from upper and lower surfaces, can improve production efficiency rapidly to the pcb board cooling, can make the cooling of pcb board abundant again, the phenomenon of temperature recovery can not occur.

Simultaneously, this cooling type of cooling has reduced the generation of pcb board cooling strain, and the element on the pcb board is not produced stress, has avoided being welded in damage of elements on the pcb board.

Description of drawings

Fig. 1 is a structural representation of the present utility model,

Fig. 2 is the cutaway view of A-A part shown in Figure 1.

The specific embodiment

Below in conjunction with accompanying drawing, enforcement of the present utility model is elaborated.

Shown in Figure 1, the double-deck cooling structure of the Reflow Soldering that the utility model is implemented, all be arranged in the cooler bin 1, wherein motor 1, motor 24 are positioned at cooler bin 1 back side lower part, and be fixed on the outer wall of cooler bin 1, the top of cooler bin 1 is connected with the air-cooled cover 7 of going up by sealing strip 2,5, and a side of cooler bin 1 has external interface 6.

In conjunction with shown in Figure 2, the utlity model has two cooling chambers, the one, last cooling chamber 8, one is a hot-air channel 10 around the following cold wind chamber 11, these two cold wind chambeies;

Motor 24 is fixed on the outside, bottom of cooler bin 1, and with 13 companies of wind wheel, on the horizontal direction of wind wheel 13, cooler bin 1 inside is provided with condenser 14, has screen pack 15 and adjusting screw(rod) 16 on the condenser 14;

The top of condenser 14, lower clapboard 18 and down air-cooled outlet housing 25 form cold wind chamber 11 down, and wherein lower clapboard 18 is the U-shaped structure, and its underpart has opening, so that cold wind can enter into down in the cold wind chamber 11; The top of bottom plate 18 has air-cooled outlet housing 25 down, discharges cold wind thus, so that pcb board is lowered the temperature;

Side dividing plate 17 extends upward from the top of condenser 14, is fixed on the upper mounted plate 22, and the outer wall of cooler bin 1 and side dividing plate 17 form goes up cold air duct 9; Upper spacer 19 and the air-cooled cover 7 of going up form and go up cold wind chamber 8 (the air-cooled cover 7 of going up can be supported and open by the air-cooled cover strut 12 of going up, so that last air-cooled outlet housing is cleared up), the bottom in last cold wind chamber 8 is the last air-cooled outlet housings 25 that are fixed on the upper mounted plate 22, from then on down air-cooled outlet housing 25 is discharged cold wind, and pcb board is lowered the temperature;

The wind that wind wheel produces is supplied with by form cold wind behind condenser 14, the rotation direction of motor 1 and motor 24 is opposite, make cold wind be split into two parts, a part enters into cold wind chamber 8 along last cold air duct 9, above pcb board, pcb board is lowered the temperature, another part then enters into down cold wind chamber 11, below pcb board pcb board is lowered the temperature.

Like this, lower the temperature from the upper and lower surface of pcb board, can reduce the temperature of pcb board fast, the composition of lowering the temperature simultaneously can not produce the temperature recovery phenomenon that the single face cooling is had, and can avoid pcb board because the distortion that the single face cooling brings yet.

Bottom, side at cooler bin also has baffle plate 20, and baffle plate 20 is cleared up the screen pack 15 of condenser 14 in order to open cooler bin, and baffle plate 20 can be by pressing tongs 21 compactings fast, to fix when not using.

Claims

1. double-deck cooling structure that is used for Reflow Soldering, it includes cooler bin, the bottom of cooling cylinder is provided with condenser, motor drives wind wheel and rotates, produce wind-force, wind-force is through condenser, form cold wind, cold wind enters condensation chamber along condensation channel, discharge through air-cooled outlet housing, it is characterized in that condensation chamber has two up and down, be respectively condensation chamber and following condensation chamber, last condensation chamber and following condensation chamber have air-cooled outlet housing respectively, and the air-cooled outlet housing of following condensation chamber is arranged at down the top of condensation chamber, and is corresponding with the air-cooled outlet housing of last condensation chamber.

2. the double-deck cooling structure that is used for Reflow Soldering as claimed in claim 1 is characterized in that being provided with in the cooler bin two motors, and two motors turn to difference, offer upper and lower condensation chamber to produce enough wind-force.

3. the double-deck cooling structure that is used for Reflow Soldering as claimed in claim 2, it is characterized in that above-mentioned cooler bin, be provided with two cover motors, condenser in it, be to have two motors, two condensers in the cooler bin, each motor is all corresponding with a condenser, to produce corresponding cold wind respectively, offer upper and lower condensation chamber.

4. the double-deck cooling structure that is used for Reflow Soldering as claimed in claim 3 is characterized in that above-mentioned motor and condenser, all is arranged at the bottom of cooler bin.

5. the double-deck cooling structure that is used for Reflow Soldering as claimed in claim 1, it is characterized in that having the side dividing plate in the cooler bin, side dividing plate and cooler bin sidewall form condensation channel, and the side dividing plate extends upward from the top of condenser, and the upper end is connected to the fixing fixed head of air-cooled outlet housing.

6. the double-deck cooling structure that is used for Reflow Soldering as claimed in claim 1, it is characterized in that described condensation chamber down, it is by air-cooled outlet housing and lower clapboard constitute down, lower clapboard is a U type structure, its underpart opening, to enter cold wind, both upper ends thereof is fixed on the bottom plate that air-cooled outlet housing is set down.