CN201519826U

CN201519826U - Cooling device

Info

Publication number: CN201519826U
Application number: CN2009202667828U
Authority: CN
Inventors: 庄春明
Original assignee: Suzhou Mingfu Automation Equipment Co Ltd
Current assignee: Suzhou Mingfu Automation Equipment Co Ltd
Priority date: 2009-11-17
Filing date: 2009-11-17
Publication date: 2010-07-07
Anticipated expiration: 2019-11-17

Abstract

The utility model discloses a cooling device, which comprises a cooling table (3), a recovery cover (1) and at least two fans, wherein the recovery cover (1) is arranged right above the cooling table (3), one end of the recovery cover (1) is communicated with the outside, the fans are symmetrically arranged on two sides of the recovery cover (1), and the fans are axial-flow fans (2). The cooling device has the advantage of rapidly cooling a PCB board.

Description

Cooling device

Technical field

The utility model relates to a kind of cooling device, particularly designs the cooling device that a kind of reflow machine uses.

Background technology

Surface mounting technology is an electronics package technique of new generation, and it is collapsed into volume with traditional electronic devices and components and has only 1/tens device, thereby realizes the automation of the high density of electronic product assembling, highly reliable, miniaturization, low cost and production.Surface mount is that printed substrate changes the committed step of joining production, and the element on the printed substrate more than 75% is fixing in the circuit board by surface mount, only finishes by artificial assembling less than 25%.

The main flow process that the printed panel element surface mounts is: component side print solder paste, paster, Reflow Soldering.Print solder paste is imprinted on the printed panel component side by screen process press with soldering paste, and the galley of different model has different silk screens, by chip mounter element is attached on the printed substrate, and plays preliminary fixing effect; Reflow Soldering be meant printed substrate with certain speed by the different warm areas in the reflow machine, soldering paste melted and reach being electrically connected between device and the printed circuit pads.

Under the prior art, the cooldown rate of welding position slowly Fou The because the difference of element and substrate heat capacity, to cause temperature distributing disproportionation, and the difference of scolding tin setting time will cause moving of position of components, the difference of coefficient of thermal expansion also will make curved substrate, and then, the part concentrates because of having stress, causing this position De Knot to close intensity reduces, especially in leadless process, temperature is higher, and the problems referred to above will be more obvious, under the prior art, Chang Yinwei Reflow Soldering cooling device can't in time be lowered the temperature and be caused product quality unusual.

Summary of the invention

For solving the problems of the technologies described above, the utility model provides a kind of cooling device that can lower the temperature rapidly.

For achieving the above object, the utility model provides a kind of cooling device, comprise cooling bench, be arranged on directly over the cooling bench, an end with the outside recovery cover that is connected, reclaiming at least 2 fans that have of cover bilateral symmetry setting, fan is an aerofoil fan.

More excellent, the quantity of aerofoil fan is 2.

More excellent, the axis of aerofoil fan and cooling bench angle at 45, the wind that aerofoil fan is blown out is aimed at the center of cooling bench, improves the efficient of cooling.

More excellent, also comprising a bracing frame, bracing frame one end and cooling bench are fixedly connected, and the other end and recovery cover are fixedly connected, and bracing frame is set is used for fixing the recovery cover, and it is more stable that recovery is covered.

The beneficial effect of the utility model cooling device is: 1, be provided with and reclaim cover and fan, the wind that fan blows out reclaims by reclaiming cover, and air-flow is to blowing, strengthen the flowability of air-flow, be convenient to fast pcb board be cooled off, prevented the element displacement, curved substrate guarantees welding quality; 2, used aerofoil fan, the wind-force fed distance of aerofoil fan is short, and scope is big, and suitable the use in the less space of board inside guaranteed cooling effect.

Description of drawings

Fig. 1 is the front view of the utility model cooling device embodiment;

Fig. 2 is the main cutaway view of the utility model cooling device embodiment.

Among the figure

1-reclaims cover, 2-aerofoil fan, 3-cooling bench, 4-bracing frame, 5-PCB plate.

The specific embodiment

Below in conjunction with accompanying drawing preferred embodiment of the present utility model is described in detail, thereby protection domain of the present utility model is made more explicit defining so that advantage of the present utility model and feature can be easier to be it will be appreciated by those skilled in the art that.

As accompanying drawing 1 to shown in the accompanying drawing 2, a kind of cooling device, comprise cooling bench 3, bracing frame 4, reclaim cover 1, aerofoil fan 2, bracing frame 4 one ends and cooling bench 3 are fixedly connected, the other end is fixedly connected with recovery cover 1, reclaim that cover 1 is arranged on directly over the cooling bench 3, an end is connected with the outside, reclaim cover 1 bilateral symmetry setting 2 aerofoil fans 2, the axis of aerofoil fan 2 and cooling bench 3 angles at 45 are arranged.

Principle of the present utility model is as follows.

It is first-class to be cooled that pcb board 5 is placed on cooling bench 3, aerofoil fan 2 starts and air-out vertically, because aerofoil fan 2 and cooling bench 3 angles at 45, so the wind that aerofoil fan 2 blows out can directly arrive the position at pcb board 5 centers, because so aerofoil fan 2 air-out scopes extensively can be blown pcb board 5 ambient airs simultaneously, the wind that aerofoil fan 2 blows out arrives pcb board 5 after pcb board 5 reflections, air flow to the position of reclaiming cover 1, because reclaiming cover 1 one ends is connected with the outside, last air arrives engine body exterior through the recovery of reclaiming cover 1, move in circles, reach the purpose of cooling pcb board 5.

The above; it only is the specific embodiment of the present utility model; but protection domain of the present utility model is not limited thereto; any those of ordinary skill in the art are in the disclosed technical scope of the utility model; variation or the replacement that can expect without creative work all should be encompassed within the protection domain of the present utility model.Therefore, protection domain of the present utility model should be as the criterion with the protection domain that claims were limited.

Claims

1. cooling device, it is characterized in that: comprise cooling bench (3), be arranged on directly over the described cooling bench (3), an end is with the outside recovery cover (1) that is connected, at least 2 fans that have of described recovery cover (1) bilateral symmetry setting that described fan is aerofoil fan (2).

2. cooling device according to claim 1 is characterized in that: the quantity of described aerofoil fan (2) is 2.

3. cooling device according to claim 2 is characterized in that: the axis of described aerofoil fan (2) and described cooling bench (3) angle at 45.

4. according to each described cooling device in the claim 1 to 3, it is characterized in that: also comprise a bracing frame (4), described bracing frame (4) one ends and described cooling bench (3) are fixedly connected, and the other end and described recovery cover (1) are fixedly connected.