CN207116375U - A kind of semi-automatic impulse welding eutectic machine - Google Patents
A kind of semi-automatic impulse welding eutectic machine Download PDFInfo
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- CN207116375U CN207116375U CN201721130963.9U CN201721130963U CN207116375U CN 207116375 U CN207116375 U CN 207116375U CN 201721130963 U CN201721130963 U CN 201721130963U CN 207116375 U CN207116375 U CN 207116375U
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- substrate
- chip
- disk
- eutectic
- base
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Abstract
It the utility model is related to eutectic machine, more particularly to small-sized semi-automatic impulse welding eutectic machine.Including base, base is provided with eutectic warm table, the lower suction nozzle of chip placement, shooting and lower the detection camera and material carrier platform that correct substrate；Material carrier platform is provided with the rewinding disk of the substrate disk for placing substrate, the chip disk of chip placement and placement finished product, base is provided with substrate suction nozzle, the LD suction nozzles from chip disk absorption chip that substrate is drawn from substrate disk, and nation's head camera of correction, compensation substrate and chip；The mobile device for driving substrate suction nozzle, LD suction nozzles and nation's head camera movement is additionally provided with base；Eutectic warm table is electrically connected with the pulse power for its power supply；Lower suction nozzle and lower detection camera are located between eutectic warm table and material carrier platform.The utility model device is simple to operate, and structure is clean and tidy, is primarily adapted for use in experiment or small lot production.
Description
Technical field
It the utility model is related to eutectic machine technical field, more particularly to small-sized semi-automatic impulse welding eutectic machine.
Background technology
Chip directly placed technology, it is the methods of using bonding agent or automatic tape welding, wire bond, flip chip bonding, by integrated circuit
Chip is directly bound attachment on circuit boards.Semiconductor chip handing-over attachment on a printed-wiring board, chip and substrate it is electric
Connection realizes that the electrical connection of chip and substrate is realized with lead sewing method with lead sewing method, and with resin cover with
Ensure reliability.Technical process is to cover silicon chip nest point in substrate surface heat-conduction epoxy resin first, then that silicon chip is straight
Connect and be placed in substrate surface, be heat-treated to untill silicon chip is securely fixed in substrate, followed in turn by wire bond method in silicon chip and
Electrical connection is directly established between substrate.The eutectic packaging product of chip directly placed technology, perfect heat-dissipating, is greatly improved
The service life of product.
Existing autompulse weldering eutectic machine volume is big, and power consumption is high, and the production and experiment for being not suitable for carrying out small lot use.
Utility model content
The purpose of this utility model is to overcome above-mentioned the deficiencies in the prior art, there is provided a kind of semi-automatic impulse welding eutectic
Machine.
Technical scheme is used by the utility model solves its technical problem：A kind of semi-automatic impulse welding eutectic machine, its
In, including base, the base be provided with eutectic warm table, the lower suction nozzle of chip placement, shooting and the lower detection for correcting substrate
Camera and material carrier platform；The material carrier platform is provided with the substrate disk for placing substrate, the chip disk of chip placement and placement finished product
Rewinding disk, the base is provided with from the substrate disk and draws the substrate suction nozzle of substrate, from the chip disk absorption chip
LD suction nozzles, and correction, the nation's head camera for compensating the substrate and the chip；It is additionally provided with the base and drives the base
The mobile device of bottom suction nozzle, the LD suction nozzles and nation's head camera movement；The eutectic warm table is electrically connected with to be supplied for it
The pulse power of electricity；The lower suction nozzle and the lower detection camera are located between the eutectic warm table and the material carrier platform.
Preferably, the material carrier platform also includes liftable material containing base, and the material containing base is provided with loading plate；It is described
Loading plate is provided with three grooves for placing the substrate disk, the chip disk and the rewinding disk respectively；The loading plate
It is provided with and corresponds the through hole connected with the groove.
Preferably, the mobile device includes the support being arranged on the base, and the installation substrate suction nozzle, described
The mounting blocks of LD suction nozzles and nation's head camera；It is provided with the support and drives the mounting blocks to prolong X, Y-axis operation
XY axis mechanisms.
Preferably, the base is provided with the monitoring camera of monitoring whole equipment and the ion wind for whole equipment cooling
Fan.
The beneficial effects of the utility model are：Taken pictures positioning substrate by nation's head camera, substrate suction nozzle draws substrate disk
On substrate, substrate suction nozzle be moved to it is lower detection camera at and correction of taking pictures, nation's head camera positioning chip, LD suction nozzle absorption chips
Chip on disk, LD suction nozzles are placed on chip on lower suction nozzle, and nation's head camera, which is taken pictures, is corrected compensation, and LD suction nozzles draw core
Substrate is placed eutectic warm table by piece, substrate suction nozzle, and nation's head camera is moved to above eutectic warm table rectification building-out of taking pictures, and LD inhales
Mouth is placed on chip in substrate, and the pulse power quickly completes eutectic to eutectic platform fast regulating temperature, and finished product is moved back to receipts by substrate suction nozzle
Charging tray.Eutectic machine is small-sized semi-automatic impulse welding eutectic machine, and structure is clean and tidy, can be quick by shirtsleeve operation, and low
Cost produces a small amount of eutectic packaging product, and overall structure is simple, occupies little space, and manufacturing cost is low, suitable for experiment
Room and small lot production.
Brief description of the drawings
In order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art, below in conjunction with accompanying drawing
And the utility model is described in further detail for embodiment, drawings in the following description are only that part of the present utility model is implemented
Example, for those of ordinary skill in the art, on the premise of not paying creative work, can also be obtained according to these accompanying drawings
Obtain other accompanying drawings：
Fig. 1 is the semi-automatic impulse welding eutectic machine structural representation of the utility model preferred embodiment；
Wherein, 1 be base, 11 be monitoring camera, 12 be eutectic warm table, 13 be lower suction nozzle, 14 be it is lower detection camera, 15
It is substrate disk for material carrier platform, 151,152 be chip disk, 153 be rewinding disk, 16 be ion fan, 2 be mobile device, 21 is peace
Dress block, 211 be substrate suction nozzle, 212 be nation's head camera, 213 be LD suction nozzles.
Embodiment
In order that the purpose, technical scheme and advantage of the utility model embodiment are clearer, below in conjunction with this practicality
Technical scheme in new embodiment carries out clear, complete description, it is clear that described embodiment is portion of the present utility model
Divide embodiment, rather than whole embodiments.Based on embodiment of the present utility model, those of ordinary skill in the art are not paying
The every other embodiment obtained on the premise of creative work, belongs to the scope of protection of the utility model.
The semi-automatic impulse welding eutectic machine of the utility model preferred embodiment is set as shown in figure 1, including base 1 on base 1
There are eutectic warm table 12, the lower suction nozzle 13 of chip placement, lower the detection camera 14 and material carrier platform 15 that shoot and correct substrate；Carry
Expect that platform 15 is provided with the rewinding disk 153 of the substrate disk 151 for placing substrate, the chip disk 152 of chip placement and placement finished product, base
1 is provided with substrate suction nozzle 211, the LD suction nozzles 213 from the absorption chip of chip disk 152 and the school that substrate is drawn from substrate disk 151
Just, nation's head camera 212 of substrate and chip is compensated, is additionally provided with base 1 and drives substrate suction nozzle 211, LD suction nozzles 213 and nation
The mobile device 2 that head camera 212 moves；Eutectic warm table 12 is electrically connected with the pulse power for its power supply；Lower suction nozzle 13 is with
Camera 14 is detected to be located between eutectic warm table 12 and material carrier platform 15.Taken pictures positioning substrate by nation's head camera 212, substrate is inhaled
Mouth 211 draws the substrate on substrate disk 151, and substrate suction nozzle 211 is moved at lower detection camera 14 and correction of taking pictures, nation's head camera
212 positioning chips, the chip on the absorption chip disk 152 of LD suction nozzles 213, LD suction nozzles 213 are placed on chip on lower suction nozzle 13, nation
Head camera 212, which is taken pictures, is corrected compensation, and substrate is placed eutectic heating 12 by the absorption chip of LD suction nozzles 213, substrate suction nozzle 211
Platform, nation's head camera 212 are moved to above eutectic warm table 12 rectification building-out of taking pictures, and LD suction nozzles 213 are placed on chip in substrate, arteries and veins
Rush power supply and quickly complete eutectic to eutectic platform fast regulating temperature, finished product is moved back to rewinding disk 153, overall structure letter by substrate suction nozzle 211
It is single, occupy little space, manufacturing cost is low, is produced suitable for laboratory and small lot.
As shown in figure 1, material carrier platform 15 also includes liftable material containing base, material containing base is provided with loading plate；Loading plate
It is provided with three grooves for placing substrate disk 151, chip disk 152 and rewinding disk 153 respectively；Loading plate is provided with and groove one
The through hole of one corresponding connection；It is easy to that substrate disk 151, chip disk 152 and rewinding disk 153 are placed and taken.
As shown in figure 1, mobile device 2 includes the support being arranged on base 1, and mounting substrate suction nozzle 211, LD suction nozzles
213 and the mounting blocks 21 of nation's head camera 212；It is provided with support and drives mounting blocks 21 to prolong X, the XY axis mechanisms of Y-axis operation；Just
In being processed to material for semi-automation.
As shown in figure 1, base 1 is provided with the monitoring camera 11 of monitoring whole equipment and the ion wind for whole equipment cooling
Fan 16；It is easy to be monitored whole equipment record, and equipment is cooled.
It should be appreciated that for those of ordinary skills, can according to the above description be improved or converted,
And all these modifications and variations should all belong to the protection domain of the appended claims for the utility model.
Claims (4)
1. a kind of semi-automatic impulse welding eutectic machine, it is characterised in that including base, the base is provided with eutectic warm table, put
Put lower suction nozzle, shooting and lower the detection camera and material carrier platform that correct substrate of chip；The material carrier platform, which is provided with, places substrate
The rewinding disk of substrate disk, the chip disk of chip placement and placement finished product, the base are provided with from the substrate disk and draw base
The substrate suction nozzle at bottom, the LD suction nozzles from the chip disk absorption chip, and correction, the nation for compensating the substrate and the chip
Head camera；The shifting for driving the substrate suction nozzle, the LD suction nozzles and nation's head camera movement is additionally provided with the base
Dynamic device；The eutectic warm table is electrically connected with the pulse power for its power supply；The lower suction nozzle and the lower detection camera are equal
Between the eutectic warm table and the material carrier platform.
2. semi-automatic impulse welding eutectic machine as claimed in claim 1, it is characterised in that the material carrier platform also includes liftable
Material containing base, the material containing base are provided with loading plate；The loading plate places the substrate disk, described respectively provided with three
The groove of chip disk and the rewinding disk；The loading plate is provided with corresponds the through hole connected with the groove.
3. semi-automatic impulse welding eutectic machine as claimed in claim 1, it is characterised in that the mobile device includes being arranged on institute
State the support on base, and the mounting blocks of the installation substrate suction nozzle, the LD suction nozzles and nation's head camera；It is described
It is provided with support and drives the mounting blocks to prolong X, the XY axis mechanisms of Y-axis operation.
4. semi-automatic impulse welding eutectic machine as claimed in claim 1, it is characterised in that the base is provided with monitoring and entirely set
Standby monitoring camera and the ion fan for whole equipment cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721130963.9U CN207116375U (en) | 2017-09-05 | 2017-09-05 | A kind of semi-automatic impulse welding eutectic machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721130963.9U CN207116375U (en) | 2017-09-05 | 2017-09-05 | A kind of semi-automatic impulse welding eutectic machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207116375U true CN207116375U (en) | 2018-03-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721130963.9U Active CN207116375U (en) | 2017-09-05 | 2017-09-05 | A kind of semi-automatic impulse welding eutectic machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207116375U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300797A (en) * | 2018-11-21 | 2019-02-01 | 山东农业工程学院 | A kind of depth chamber leadless chip eutectic welder and method |
-
2017
- 2017-09-05 CN CN201721130963.9U patent/CN207116375U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300797A (en) * | 2018-11-21 | 2019-02-01 | 山东农业工程学院 | A kind of depth chamber leadless chip eutectic welder and method |
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