CN213519897U

CN213519897U - Semiconductor chip's placer

Info

Publication number: CN213519897U
Application number: CN202021595710.0U
Authority: CN
Inventors: 李登有
Original assignee: Wuxi Xintong Electronic Technology Co ltd
Current assignee: Wuxi Xintong Electronic Technology Co ltd
Priority date: 2020-08-04
Filing date: 2020-08-04
Publication date: 2021-06-22
Anticipated expiration: 2030-08-04

Abstract

The utility model relates to a semiconductor preparation technical field discloses a placer of semiconductor chip, including base and frame, the frame mounting is in the top of base, and the vertical riser that is fixed with in the frame at base top middle part, the vertical mounting panel that is fixed with in the frame rear side on riser right side, the fan is installed to the front side of mounting panel, and the fan is two, the draw-in groove has all been seted up to the both sides surface of riser and the both sides internal surface of frame, and the draw-in groove is a plurality of, and the left draw-in groove of riser is located same height with the inboard draw-in groove of left side frame. The utility model discloses a vertical fixed mounting panel in rear end on frame right side, simultaneously at the front side installation fan of riser, when making semiconductor chip place in the standing groove of placing the board, can make it insert and arrange in the draw-in groove between right side frame and the riser, the fan is bloied and is made its top air flow when placing, can increase semiconductor chip's cooling rate.

Description

Semiconductor chip's placer

Technical Field

The utility model relates to a semiconductor preparation technical field specifically is a semiconductor chip's placer.

Background

Currently, semiconductor chips: etching and wiring are performed on the semiconductor wafer to obtain a semiconductor device capable of realizing a certain function. Not only silicon chips, but also gallium arsenide (gallium arsenide is toxic, so some inferior circuit boards do not decompose it), germanium and other semiconductor materials are commonly included. Semiconductors are also in the trend of automobiles, and the semiconductors are produced by an operation of soldering such as packaging.

After the package is soldered, the semiconductor chip needs to be temporarily placed, and after some semiconductor chips are packaged, the semiconductor chip needs to be cooled for packaging and transportation. Therefore, we propose a placing device for semiconductor chips.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor chip's placer, through the vertical fixed mounting panel in the rear end on frame right side, simultaneously at the front side installation fan of riser, when making semiconductor chip arrange the standing groove of placing the board in and place, can make it insert in the draw-in groove of arranging between right side frame and the riser, the fan is bloied and is made its top air flow when placing, can increase semiconductor chip's cooling rate, has solved the problem that proposes in the background art.

In order to achieve the above object, the utility model provides a following technical scheme: a semiconductor chip placing device comprises a base and a frame, wherein the frame is fixed above the base, and a vertical plate is vertically fixed in the frame in the middle above the base;

the vertical mounting panel that is fixed with in frame rear side on riser right side, the fan is installed to the front side of mounting panel, and the fan is two, the draw-in groove has all been seted up to the both sides surface of riser and the both sides internal surface of frame, and the draw-in groove is a plurality of, and the left draw-in groove of riser is located same height with the inboard draw-in groove of left side frame, and the draw-in groove on riser right side and the inboard draw-in groove of right side frame are located same height, and the bottom plate has been put to the draw-in groove interpolation between left side riser and the frame, and the top of bottom plate is fixed with places the board, and places the board surface and has seted up.

As an optimized embodiment of the present invention, the sponge mat is fixed on the inner surface of the placement groove, and the sponge mat is fixed in the placement groove by means of the attachment.

As a preferred embodiment of the present invention, the placing plate is fixed on the bottom plate surface by means of fitting, and the distance between the vertical plate and the frames on both sides is equal.

As an preferable embodiment of the present invention, the fan is fixed to the front side surface of the vertical plate by gluing.

As a preferred embodiment of the present invention, the fan is electrically connected to the switch through a wire.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a semiconductor chip's placer, through the vertical fixed mounting panel in the rear end on frame right side, simultaneously at the front side installation fan of riser, when making semiconductor chip arrange the standing groove of placing the board in and place, can make it insert and arrange the draw-in groove between right side frame and the riser in, the fan is bloied and is made its top air flow when placing, can increase semiconductor chip's cooling rate.

2. The utility model discloses a semiconductor chip's placer has the foam-rubber cushion through the inside fixed surface who makes the standing groove, and the foam-rubber cushion fixes in the standing groove through the mode of laminating, and when semiconductor chip arranged in the standing groove, the foam-rubber cushion had certain guard action to it.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

fig. 1 is a schematic view of the overall structure of the semiconductor chip placement device of the present invention;

fig. 2 is a schematic view of the placing plate of the placing device for semiconductor chips according to the present invention.

In the figure: 1. a base; 2. a frame; 3. a card slot; 4. a base plate; 5. placing the plate; 6. mounting a plate; 7. a fan; 8. a vertical plate; 9. a switch; 10. a placement groove; 11. a spongy cushion.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected" and "disposed" are to be interpreted broadly, and may be, for example, fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed; the utility model discloses in provide only supply the reference with the model of electrical apparatus. For those skilled in the art, different types of electrical appliances with the same function can be replaced according to actual use conditions, and for those skilled in the art, the specific meaning of the above terms in the present invention can be understood in specific situations.

Referring to fig. 1-2, the present invention provides a technical solution: a semiconductor chip placing device comprises a base 1 and a frame 2, wherein the frame 2 is fixed above the base 1, and a vertical plate 8 is vertically fixed in the frame 2 in the middle part above the base 1;

the utility model discloses a fan mounting structure, including riser 8, frame 2, draw-in groove 3, bottom plate 4, place board 5, and place board 5 surface and seted up standing groove 10, and every is provided with both sides standing groove 10 on placing board 5, the right side fixed surface of frame 2 has switch 9, and fan 7 is installed to the front side of mounting panel 6, and fan 7 is two, draw-in groove 3 has all been seted up on the both sides surface of riser 8 and the both sides internal surface of frame 2, and draw-in groove 3 is a plurality of, and draw-in groove 3 and the inboard draw-in groove 3 of left side frame 2 on 8 left sides of riser are located same height, and draw-in groove 3 and the inboard draw-in groove 3 of right side frame 2 on 8 right sides of riser are located same height.

In this embodiment (see fig. 1 and 2), the mounting plate 6 is vertically fixed at the rear end of the right side of the frame 2, and the fan 7 is mounted at the front side of the vertical plate 8, so that when the semiconductor chip is placed in the placing groove 10 of the placing plate 5, the semiconductor chip can be inserted into the clamping groove 3 between the right side frame 2 and the vertical plate 8, and when the semiconductor chip is placed, the fan blows air to flow air above the semiconductor chip, so that the cooling speed of the semiconductor chip can be increased.

Wherein, the sponge mat 11 is fixed on the inner surface of the placing groove 10, and the sponge mat 11 is fixed in the placing groove 10 by means of fitting.

In this embodiment (see fig. 2), the sponge pad 11 is fixed on the inner surface of the placing groove 10, and the sponge pad 11 is fixed in the placing groove 10 by means of fitting, so that the sponge pad 11 has a certain protection effect when the semiconductor chip is placed in the placing groove 10.

Wherein, place board 5 and fix on bottom plate 4 surface through the mode of laminating, the distance between riser 8 and the both sides frame 2 is equal.

Wherein, the fan 7 is fixed on the front side surface of the vertical plate 8 through glue.

Wherein, the fan 7 is electrically connected with the switch 9 through a lead.

It should be noted that the present invention is a semiconductor chip placing device, which comprises a base 1, a frame 2, a slot 3, a bottom plate 4, a placing plate 5, a mounting plate 6, a fan 7, a vertical plate 8, a switch 9, a placing slot 10, and a sponge pad 11, wherein the components are all universal standard components or known by those skilled in the art, the structure and principle of the components are known by those skilled in the art through a technical manual or a conventional experimental method, at the idle position of the device, all the electric devices in the above are connected through wires, referring to a power element, an electric device, and a monitoring computer adapted to the power device, and a power source, and the specific connection means should refer to the following working principle that the electric devices complete electric connection in sequence, and the detailed connection means is known in the art, and the following main description of the working principle and process is omitted for describing the electric control, the during operation, take bottom plate 4 out and place board 5 in follow draw-in groove 3, make the semiconductor chip that the encapsulation welding was accomplished arrange in the standing groove 10 of placing board 5 top, then make bottom plate 4 insert arrange in draw-in groove 3 between riser 8 and frame 2 again, when needing to increase semiconductor chip cooling rate, make bottom plate 4 drive place board 5 insert arrange between frame 2 and the riser 8 on right side, make switch 9 be connected to the power and start fan 7 through switch 9, blow forward, increase the top air flow, can make the cooling that the semiconductor chip after the encapsulation welding can be quick.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A semiconductor chip placement device comprises a base (1) and a frame (2), and is characterized in that: the frame (2) is fixed above the base (1), and a vertical plate (8) is vertically fixed in the frame (2) at the middle part above the base (1);

the rear side of the frame (2) on the right side of the vertical plate (8) is vertically fixed with a mounting plate (6), the front side of the mounting plate (6) is provided with two fans (7), the two side surfaces of the vertical plate (8) and the two side inner surfaces of the frame (2) are respectively provided with a plurality of clamping grooves (3), the clamping grooves (3) on the left side of the vertical plate (8) and the clamping grooves (3) on the inner side of the left side frame (2) are positioned at the same height, the clamping grooves (3) on the right side of the vertical plate (8) and the clamping grooves (3) on the inner side of the right side frame (2) are positioned at the same height, a bottom plate (4) is inserted in the clamping grooves (3) between the left side vertical plate (8) and the frame (2), a placing plate (5) is fixed above the bottom plate (4), the surface of the placing plate (5) is provided with a placing groove (10), and each placing, a switch (9) is fixed on the right side surface of the frame (2).

2. The placing device of semiconductor chip as claimed in claim 1, wherein: the sponge mat (11) is fixed on the inner surface of the placing groove (10), and the sponge mat (11) is fixed in the placing groove (10) in a fitting mode.

3. The placing device of semiconductor chip as claimed in claim 1, wherein: the placing plate (5) is fixed on the surface of the bottom plate (4) in a fitting mode, and the distance between the vertical plate (8) and the frames (2) on the two sides is equal.

4. The placing device of semiconductor chip as claimed in claim 1, wherein: the fan (7) is fixed on the front side surface of the vertical plate (8) through glue.

5. The placing device of semiconductor chip as claimed in claim 1, wherein: the fan (7) is electrically connected with the switch (9) through a lead.