CN201940720U - Reworking clamp for BGA elements - Google Patents
Reworking clamp for BGA elements Download PDFInfo
- Publication number
- CN201940720U CN201940720U CN2010206211910U CN201020621191U CN201940720U CN 201940720 U CN201940720 U CN 201940720U CN 2010206211910 U CN2010206211910 U CN 2010206211910U CN 201020621191 U CN201020621191 U CN 201020621191U CN 201940720 U CN201940720 U CN 201940720U
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- bga
- pcb board
- reprocess
- bga element
- reprocessed
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Abstract
The utility model discloses a reworking clamp of BGA elements for solving the defects of low reworking efficiency done by the existing reworking clamps including: a chassis and a top cover adapted to one body to package a PCB board, in which, a hollow-out window is set on the cover and is adapted to the BGA element coming out from the window to be rework on the PCB board. The invented rework clamp can realize teardown rework to multiple BGA elements at the same time in a process of one time reflow soldering avoiding that multiple times of reflow soldering will result in hot impact to PCB boards and damage them so as to increase the reworking efficiency greatly and guarantee its quality.
Description
Technical field
The utility model relates to the technical field that a kind of BGA element is reprocessed, particularly a kind of BGA element repair method and reprocess anchor clamps.
Background technology
Existing BGA (Ball Grid Array, BGA) element is reprocessed general employing BGA element and is reprocessed the station BGA element is dismantled and installed.The BGA element reprocess the station generally by temperature curve generation, monitoring temperature, wiring board fix, the automatic contraposition of BGA element, paste solder printing etc. form.Modes such as that the mode of heating of BGA element rework equipments has is infrared, hot blast and laser.
The defective of existing BGA element repair method has:
1, each temperature thermal shock can only be reprocessed single BGA element, and is more to the thermal shock number of times of the assembling wiring board of reprocessing a plurality of BGA elements;
2, the percent of automatization of rework equipments is lower, reprocesses that efficient is lower, to reprocess success rate low;
3, the cost of rework equipments is higher;
4, Flip Chip (flip-chip) the element aligning accuracy of little spacing is relatively poor, and it is low to reprocess success rate.
There is a heater circuit inside of Reflow Soldering, and air or nitrogen are heated to sufficiently high temperature after-blow to the wiring board that posts element, allows the scolder of elements on either side melt back and mainboard bonding.
The advantage of Reflow Soldering is that temperature is easy to control, can also avoid oxidation in the welding process, the also easier control of manufacturing cost.Utilize the element majority of Reflow Soldering welding to be flaky electric capacity, pellet inductor, pasting type transistor and diode etc.
Along with the continuous development of technology, many stages have also been experienced in Reflow Soldering: hot plate conduction Reflow Soldering, infrared radiation Reflow Soldering, infraredly add hot blast (Hotair) Reflow Soldering, fill nitrogen (N2) Reflow Soldering, two-sided Reflow Soldering, through hole Reflow Soldering etc.
In the utility model, to utilize existing reflow soldering process that the BGA element is reprocessed, below analyze the principle of Reflow Soldering from temperature curve: when pcb board enters heating zone (dry section), solvent, gas evaporation in the solder(ing) paste fall, the wetting pad of solder resist in the solder(ing) paste, components and parts termination and pin, solder(ing) paste is softening, slump, covered pad, with pad, components and parts pin and oxygen isolation; When pcb board enters heat preservation zone, make pcb board and components and parts obtain sufficient preheating, heat up too fast and damage pcb board and components and parts in case pcb board enters the weld zone suddenly; When pcb board entered the weld zone, temperature rose rapidly and makes solder(ing) paste reach molten state, and liquid scolding tin is to pad, the components and parts termination of pcb board and pin is wetting, diffusion, cross flow or reflux to mix and form the scolding tin contact; Pcb board enters the cooling zone, and solder joint is solidified, and finishes whole Reflow Soldering.
The utility model content
The purpose of this utility model is to disclose a kind of BGA element to reprocess anchor clamps, reprocesses the lower defective of efficient to solve the existing anchor clamps of reprocessing.
In order to realize above purpose, the utility model discloses a kind of BGA element and reprocess anchor clamps, comprise: reprocess the chassis, reprocess loam cake, reprocess the chassis and reprocess loam cake and can be adapted to one up and down pcb board is encapsulated in it, on reprocessing, cover and be provided with the hollow out window, BGA element to be reprocessed on hollow out window and the pcb board is adaptive, the BGA element from the hollow out window to exposing outside.
Wherein, the BGA element is reprocessed anchor clamps and is also comprised the dismounting folder that is used on pcb board dismounting BGA element.
Wherein, the dismounting folder comprises: lift arm, bearing and chuck, chuck are that fulcrum links to each other in the lever mode with lift arm by bearing.
Wherein, chuck comprises intermediate plate, is connected with connecting rod between chuck and the lift arm, and connecting rod realizes being changed into by the reciprocating motion of connecting rod the motion that clamps of intermediate plate by linking to each other with the transmission of intermediate plate.
BGA element of the present utility model is reprocessed anchor clamps, can realize simultaneously in once by the process of Reflow Soldering that the dismounting of a plurality of BGA elements reprocesses, and has avoided repeatedly by Reflow Soldering the thermal shock of pcb board being caused the damage of pcb board; Improve the efficient of reprocessing of BGA element greatly, guaranteed the quality of reprocessing of BGA element.
The invention also discloses the dismounting folder that a kind of BGA of being used for element is reprocessed, be exclusively used in BGA element repair method, comprising: lift arm, bearing and chuck, chuck are that fulcrum links to each other in the lever mode with lift arm by bearing.
Wherein, chuck comprises intermediate plate, is connected with connecting rod between chuck and the lift arm, and connecting rod realizes being changed into by the reciprocating motion of connecting rod the motion that clamps of intermediate plate by linking to each other with the transmission of intermediate plate.
Dismounting that the BGA of being used for element of the present utility model is reprocessed folder, simple in structure, be exclusively used in the reprocessing in the anchor clamps of BGA element, can easily the BGA element that has separated with pcb board be pressed from both sides out, improved the removal efficiency of BGA element, guaranteed the dismounting quality of BGA element.
Description of drawings
Fig. 1 is the front view of the utility model pcb board, and the installation site of BGA element shown in this figure is the BGA installation position;
Fig. 2 is the first assembling schematic diagram that the utility model BGA element is reprocessed anchor clamps, and this illustrates pcb board and is encapsulated in and reprocesses the chassis and reprocess between the loam cake;
Fig. 3 is the second assembling schematic diagram that the utility model BGA element is reprocessed anchor clamps, the not shown pcb board of this figure;
Fig. 4 is the structural representation that the utility model is used for the dismounting folder that the BGA element reprocesses;
Fig. 5 is the chuck structure schematic diagram of Fig. 4;
Fig. 6 is the schematic flow sheet of the utility model BGA element repair method embodiment one;
Fig. 7 is the schematic flow sheet of the utility model BGA element repair method embodiment two.
Mark the following drawings mark thereon in conjunction with the accompanying drawings:
The 1-BGA element, the 2-lift arm, the 3-bearing, 4-reprocesses loam cake, the 5-chuck, the 6-connecting rod, the 7-intermediate plate, 8-reprocesses the chassis, 9-hollow out window, 10-locker screw, 11-BGA installation position.
The specific embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present utility model is described in detail.
Shown in Fig. 1-5, disclose a kind of BGA element and reprocessed anchor clamps, this is reprocessed anchor clamps and comprises: reprocess loam cake 4 and reprocess chassis 8, reprocess loam cake 4 and be provided with hollow out window 9, reprocess loam cake 4 and reprocess chassis 8 and attach together the encapsulation that is integral the pcb board close and firm up and down, BGA element to be reprocessed 1 on the pcb board is adaptive with hollow out window 9, BGA element 1 just from hollow out window 9 to exposing outside, make and reprocess anchor clamps when crossing Reflow Soldering after the encapsulation, Reflow Soldering can separate BGA element 1 and pcb board, is convenient to BGA element 1 and takes off.
Need to prove that the quantity of hollow out window 9 of the present utility model is not limited only among Fig. 2 and Fig. 3, the concrete quantity of hollow out window 9 should be consistent with the quantity of BGA element on the pcb board.
Preferably, this BGA element is reprocessed anchor clamps and also comprised: the dismounting folder is used for dismounting BGA element 1 on the pcb board.The dismounting folder comprises: lift arm 2, bearing 3 and chuck 5, and chuck 5 comprises intermediate plate 7, and chuck 5 links to each other with lift arm 2 by connecting rod 6, and connecting rod 6 links to each other with intermediate plate 7 transmissions, realizes the reciprocating motion of connecting rod 6 is changed into the motion that clamps of intermediate plate 7.
BGA element of the present utility model is reprocessed anchor clamps, can realize simultaneously in once by the process of Reflow Soldering that the dismounting of a plurality of BGA elements reprocesses, and has avoided repeatedly by Reflow Soldering the thermal shock of pcb board being caused the damage of pcb board; Improve the efficient of reprocessing of BGA element greatly, guaranteed the quality of reprocessing of BGA element.
Disclose a kind of dismounting folder shown in Fig. 4-5, be used for the BGA element and reprocess, this BGA element is reprocessed anchor clamps and also comprised: the dismounting folder is used for dismounting BGA element 1 on the pcb board.The dismounting folder comprises: lift arm 2, bearing 3 and chuck 5, and chuck 5 comprises intermediate plate 7, and chuck 5 links to each other with lift arm 2 by connecting rod 6, and connecting rod 6 links to each other with intermediate plate 7 transmissions, realizes the reciprocating motion of connecting rod 6 is changed into the motion that clamps of intermediate plate 7.
Dismounting that the BGA of being used for element of the present utility model is reprocessed folder, simple in structure, be exclusively used in the reprocessing in the anchor clamps of BGA element, can easily the BGA element that has separated with pcb board be pressed from both sides out, improved the removal efficiency of BGA element, guaranteed the dismounting quality of BGA element.
As shown in Figure 6, the utility model BGA element repair method embodiment one comprises:
Step S 602: pcb board is placed to reprocess on the chassis also fix;
Step S604: will reprocess loam cake and cover and reprocessing on the chassis and fixing, and make and reprocess loam cake and reprocess the chassis, and make BGA element that the needs on the pcb board reprocess from reprocessing the hollow out window of loam cake to exposing outside with firmly encapsulation closely of pcb board;
Step S606: will encapsulate all-in-one-piece and reprocess loam cake and reprocess the chassis, the BGA element that need reprocess is separated with pcb board by Reflow Soldering;
Step S608: on pcb board, take off the BGA element that to reprocess, will reprocess loam cake and reprocess the chassis and separate, take out pcb board;
Step S610: adopt chip mounter that qualified BGA element is attached on the pcb board, and pcb board is fixed on reprocesses on the chassis;
Step S612: close and reprocess loam cake, make and reprocess loam cake and to reprocess the chassis firmly closely fixing up and down, and make qualified BGA element from the hollow out window to exposing outside;
Step S614: will reprocess loam cake and reprocess the chassis, qualified BGA element is welded on the pcb board by Reflow Soldering;
Step S616: reprocess certainly and take off pcb board on the chassis, the rework process of BGA element finishes.
The BGA element repair method of present embodiment can realize simultaneously in once by the process of Reflow Soldering that the dismounting of a plurality of BGA elements reprocesses, and has avoided repeatedly by Reflow Soldering the thermal shock of pcb board being caused the damage of pcb board; Improve the efficient of reprocessing of BGA element greatly, guaranteed the quality of reprocessing of BGA element.
As shown in Figure 7, the utility model BGA element repair method embodiment two comprises:
Step S702: pcb board placed reprocess on the chassis and fixing;
Step S704: will reprocess loam cake and cover and reprocessing on the chassis and fixing, and make and reprocess loam cake and reprocess the chassis, and make BGA element that the needs on the pcb board reprocess from reprocessing the hollow out window of loam cake to exposing outside with firmly encapsulation closely of pcb board;
Step S706: the chuck that will dismantle folder is installed on the BGA element that need reprocess in advance, and the base clip of dismounting folder is connected on to reprocess and covers;
Step S708: will encapsulate all-in-one-piece and reprocess loam cake and reprocess the chassis, the BGA element that need reprocess is separated with pcb board by Reflow Soldering;
Step S710: press the lift arm of dismounting folder downwards, connecting rod the reciprocating motion of lift arm is changed into chuck intermediate plate clamp motion, the BGA element that will separate with pcb board outwards takes out, and will reprocess loam cake and reprocess the chassis and separate the taking-up pcb board;
Step S712: remove scolding tin unnecessary on the BGA component pads taken off and check the intact degree of the BGA element place pad on the pcb board;
Step S714: the pcb board that will take off the BGA element carries out cooling processing;
Step S716: the pad seal tin cream at the BGA element place on cooled pcb board;
Step S718: the paste solder printing quality of checking BGA element place pad:
Step S720: adopt chip mounter that qualified BGA element is attached on the pcb board, and pcb board is fixed on reprocesses on the chassis;
Step S722: close and reprocess loam cake, make and reprocess loam cake and to reprocess the chassis firmly closely fixing up and down, and make qualified BGA element from the hollow out window to exposing outside;
Step S724: will reprocess loam cake and reprocess the chassis, qualified BGA element is welded on the pcb board by Reflow Soldering;
Step S726: reprocess certainly and take off pcb board on the chassis;
Step S728: pcb board is carried out cooling processing;
Step S730: the BGA that welds is reprocessed quality carry out quality examination, the rework process of BGA element finishes.
The BGA element repair method of present embodiment uses special-purpose dismounting folder in rework process, can easily the BGA element that has separated with pcb board be pressed from both sides out, has improved the removal efficiency of BGA element, has guaranteed the dismounting quality of BGA element.
In the method embodiment of Fig. 6 and Fig. 7, temperature curve is the key that guarantees welding quality, and the intensification slope and the peak temperature of actual temperature curve and solder(ing) paste temperature curve are answered basically identical.Programming rate before 160 ℃ is controlled at 1 ℃/s～2 ℃/s, if intensification slope speed is too fast, it is too fast on the one hand components and parts and pcb board to be heated, and fragile components and parts easily cause the pcb board distortion; On the other hand, the solvent evaporates speed in the solder(ing) paste is too fast, spills metal ingredient easily, produces solder ball.Peak temperature generally be set in than solder(ing) paste fusion temperature high 20 ℃～about 40 ℃ (for example the fusing point of Sn63/Pb37 solder(ing) paste is 183 ℃, peak temperature should be arranged on about 205 ℃～230 ℃), (again) the stream time of returning is 10s～60s, peak temperature is low or (again) the stream time of returning is short, can make welding insufficient, can cause solder(ing) paste not molten when serious; Peak temperature is too high or (again) the stream time of returning is long, causes the metal dust oxidation, influences welding quality, even damages components and parts and pcb board.
More than disclosed only be several specific embodiment of the present utility model, still, the utility model is not limited thereto, any those skilled in the art can think variation all should fall into protection domain of the present utility model.
Claims (4)
1. a BGA element is reprocessed anchor clamps, it is characterized in that, comprise: reprocess the chassis, reprocess loam cake, described reprocess the chassis and reprocess loam cake can be adapted to one up and down pcb board is encapsulated in it, on described reprocessing, cover and be provided with the hollow out window, BGA element to be reprocessed on described hollow out window and the described pcb board is adaptive, described BGA element from described hollow out window to exposing outside.
2. BGA element according to claim 1 is reprocessed anchor clamps, it is characterized in that, also comprises the dismounting folder that is used for the described BGA element of dismounting on described pcb board.
3. BGA element according to claim 2 is reprocessed anchor clamps, it is characterized in that, described dismounting folder comprises: lift arm, bearing and chuck, described chuck are that fulcrum links to each other in the lever mode with lift arm by bearing.
4. BGA element according to claim 3 is reprocessed anchor clamps, it is characterized in that, described chuck comprises intermediate plate, is connected with connecting rod between described chuck and the lift arm, and described connecting rod realizes being changed into by the reciprocating motion of described connecting rod the motion that clamps of intermediate plate by linking to each other with the transmission of described intermediate plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206211910U CN201940720U (en) | 2010-11-22 | 2010-11-22 | Reworking clamp for BGA elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206211910U CN201940720U (en) | 2010-11-22 | 2010-11-22 | Reworking clamp for BGA elements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201940720U true CN201940720U (en) | 2011-08-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010206211910U Expired - Lifetime CN201940720U (en) | 2010-11-22 | 2010-11-22 | Reworking clamp for BGA elements |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201940720U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102169809A (en) * | 2010-11-22 | 2011-08-31 | 苏剑锋 | BGA (Ball Grid Array) component repairing method and fixture |
| CN107520166A (en) * | 2017-09-12 | 2017-12-29 | 苏州市吴通电子有限公司 | A kind of vertical pcb board cleaning device |
-
2010
- 2010-11-22 CN CN2010206211910U patent/CN201940720U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102169809A (en) * | 2010-11-22 | 2011-08-31 | 苏剑锋 | BGA (Ball Grid Array) component repairing method and fixture |
| CN102169809B (en) * | 2010-11-22 | 2013-04-10 | 苏剑锋 | BGA (Ball Grid Array) component repairing method and fixture |
| CN107520166A (en) * | 2017-09-12 | 2017-12-29 | 苏州市吴通电子有限公司 | A kind of vertical pcb board cleaning device |
| CN107520166B (en) * | 2017-09-12 | 2024-02-23 | 苏州市吴通电子有限公司 | Vertical PCB board belt cleaning device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20110824 Effective date of abandoning: 20130410 |
|
| RGAV | Abandon patent right to avoid regrant |