CN109273375B - MCM integrated circuit packaging method fusing SMT - Google Patents
MCM integrated circuit packaging method fusing SMT Download PDFInfo
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- CN109273375B CN109273375B CN201811050739.8A CN201811050739A CN109273375B CN 109273375 B CN109273375 B CN 109273375B CN 201811050739 A CN201811050739 A CN 201811050739A CN 109273375 B CN109273375 B CN 109273375B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
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- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
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- H01—ELECTRIC ELEMENTS
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H01L2224/29111—Tin [Sn] as principal constituent
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/29139—Silver [Ag] as principal constituent
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/29147—Copper [Cu] as principal constituent
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to an MCM integrated circuit packaging method fusing SMT, which is characterized in that a production line of the MCM integrated circuit packaging structure fusing SMT is adopted for operation, an active device is welded on a metal lead frame through tin paste, and a chip is pasted on the metal lead frame through silver paste; the utility model provides a fuse MCM integrated circuit packaging structure's of SMT production water line, it includes lead frame loading attachment, steel mesh printing device, first AOI automatic optical detection device, active device installation device, reflow soldering device, the automatic optical detection device of second AOI, chip installation device, first baking equipment, bonding device, plastic envelope device, second baking equipment, marks the mark device, electroplates device, shaping rib cutting device, outward appearance detection packing plant in proper order after the past. The MCM integrated circuit packaging method fusing the SMT has the advantages of improving the production efficiency, reducing the production cost and ensuring the quality of the produced products.
Description
Technical Field
The invention relates to a packaging method of an MCM integrated circuit fused with SMT.
Background
Conventional MCM integrated circuit package structures are typically produced solely in one of a primary or secondary package.
The first-level packaging refers to single-chip packaging or packaging of multiple chips on a metal lead frame, and the chips are mounted on the lead frame through silver paste.
And secondary packaging, namely various components and integrated circuits are welded on the circuit board in an SMT (surface mount technology) mode. SMT is a Surface Mount Technology (Surface Mount Technology) (abbreviation) called Surface Mount or Surface Mount Technology. Is the most popular technology and process in the electronic assembly industry at present. SMT is a circuit assembly technique in which a leadless or short-lead surface-mounted component (SMC/SMD, referred to as a chip component in chinese) is mounted on the surface of a Printed Circuit Board (PCB) or other substrate, and is soldered and assembled by a method such as reflow soldering or dip soldering. The PCB board precision is not enough to accord with moore's law, and the secondary packaging has the defect of difficult heat dissipation.
The packaging of the semiconductor chips on the metal frame adopts a way of mounting silver adhesive and is adhered to the metal frame.
And the secondary packaging adopts solder paste to weld various components, integrated circuits and interfaces on the circuit board.
The silver colloid for mounting the sheet has good processing property and excellent heat dissipation performance of the conductive performance. However, in the case of packaging a plurality of components, when an active device such as a MOS, a passive device such as a resistor capacitor, and a chip of silicon material are packaged in the same package, 0.1mm is used2When the resistance capacitor with the welding size adopts a silver adhesive chip mounting process of a silicon chip with the grade of 1mm, the speed is low, and the precision is low.
Disclosure of Invention
The invention aims to overcome the defects and provide the MCM integrated circuit packaging method integrating the SMT, which improves the production efficiency, reduces the production cost and ensures the quality of the produced products.
The purpose of the invention is realized as follows:
an MCM integrated circuit packaging method fusing SMT is characterized in that a production line of an MCM integrated circuit packaging structure fusing SMT is adopted for operation, active devices are welded on a metal lead frame through solder paste, and chips are pasted on the metal lead frame through silver paste.
The utility model provides a fuse MCM integrated circuit packaging structure's of SMT production water line, it includes lead frame loading attachment, steel mesh printing device, first AOI automatic optical detection device, active device installation device, reflow soldering device, the automatic optical detection device of second AOI, chip installation device, first baking equipment, bonding device, plastic envelope device, second baking equipment, beats mark device, electroplate device, shaping rib cutting device, outward appearance detection packing plant after to in proper order.
The specific production method comprises the following steps:
firstly, a lead frame is loaded by a lead frame loading device;
secondly, printing on the lead frame through a steel mesh by using a steel mesh printing device;
step three, the first AOI automatic optical detection device detects the metal lead frame after the steel mesh printing;
fourthly, the active device installation device is used for installing an active device on the metal lead frame;
performing reflow soldering on the metal lead frame provided with the active device in the reflow soldering device, wherein the reflow soldering device is kept under nitrogen protection in the process, and the active device is tightly bonded with the metal lead frame through the reflow soldering device under nitrogen protection;
step six, the second AOI automatic optical detection device detects the metal lead frame which is subjected to reflow soldering; recording the unqualified part to a database, and not carrying out subsequent chip mounting operation at the unqualified part;
seventhly, installing the chips on the metal lead frame by the chip installation device, wherein the chip installation device can be provided with a plurality of groups or one group according to the number of the chips;
step eight, baking the metal lead frame adhered with the chip by a first baking device;
step nine, the bonding device performs bonding operation on the intermediate product completed in the step nine;
tenthly, performing plastic packaging operation on the intermediate product completed in the step by using a plastic packaging device;
step eleven, the second baking device performs baking operation on the intermediate product completed in the step;
twelfth, marking the intermediate product completed in the step by a marking device;
thirteen, the electroplating device carries out electroplating operation on the intermediate product completed in the step;
fourteen, the forming and rib cutting device carries out forming and rib cutting operation on the intermediate product completed in the step;
and step fifteen, the appearance detection packaging device carries out appearance detection and packaging operation on the intermediate product finished in the step.
Adopt plastic envelope material loading frame to carry out the material loading of plastic envelope material during plastic envelope device plastic envelope operation, plastic envelope material loading frame includes main body frame and horizontal pole, main body frame's inside is provided with the horizontal pole, main body frame passes through welded connection with the horizontal pole, through welded connection, thereby can improve overall structure's stability, the middle side of horizontal pole is provided with the carriage, the horizontal pole passes through welded connection with the carriage, main body frame's the left and right sides both ends are provided with the blowing round hole, main body frame's lower extreme is provided with the layering, main body frame's right-hand member both ends respectively are provided with a handle, handle can make the convenience take, both sides handle's inside is provided with the handle, the left end of handle is provided with controlling means, controlling means's left end is provided with the connecting.
Main body frame's constitution is including stiff end, material hole, epipleural, transmission and lower plate, and the right-hand member upside of stiff end is provided with the epipleural, and the inside of epipleural is provided with the material hole to can make epipleural and lower plate can move same axle center, the lower extreme of epipleural is provided with the lower plate, and the inside transmission that is provided with of right-hand member of lower plate, main body frame pass through stiff end and horizontal pole fixed connection.
The transmission device comprises a transmission chain, a reset spring, a connecting seat and a transmission rod, wherein the reset spring is arranged at the lower end of the transmission chain and can restore the original state, the connecting seat is arranged at the lower end of the reset spring, the transmission rod is arranged at the lower end of the connecting seat, and the transmission device is fixedly connected with the connecting block through the transmission rod.
The control device comprises a push-pull rod, a fixed seat, a compression spring, a fixed block, a connecting plate and a control rod, wherein the right end of the push-pull rod is provided with the fixed seat, the right end of the fixed seat is provided with the compression spring, so that the push-pull rod can move under the action of the compression spring, the right end of the compression spring is provided with the fixed block, the right end of the fixed block is provided with the connecting plate, the right end of the connecting plate is provided with the control rod, and the control device is fixedly connected.
The control rod comprises a connecting hole, a connecting rod, a fixed clamping block and a transmission supporting rod, the transmission supporting rod is arranged on the right side of the lower end of the fixed clamping block, the connecting rod is arranged at the lower end of the left side of the transmission supporting rod, so that the control rod can rotate better, the connecting hole is formed in the lower end of the connecting rod, and the control rod is fixedly connected with the handle through the transmission supporting rod.
Compared with the prior art, the invention has the beneficial effects that:
1. because the SMT process is adopted for chip mounting, a plurality of lead frames in the range of one steel mesh can be coated with the solder paste at the same time only by one-time printing, and the point-by-point process is not needed.
2. In the silver glue process, the chip mounting speed is inversely proportional to the size of a chip, and the larger the area of the chip is, the slower the chip mounting speed is. As the power consumption of the product increases, the larger the chip area, the slower the mounting speed. The SMT process is adopted at present, the chip mounting speed of an active chip is independent of the area, and the chip mounting speed is greatly improved.
3. The solder paste is composed of tin, silver and copper, the conductivity and the heat dissipation performance after reflow soldering are greatly superior to those of the silver paste, and the heat dissipation performance is twice of that of the silver paste.
4. The cost of the silver paste is much higher than that of the tin paste, and is about 10 to 20 times of the price of the tin paste.
Therefore, the MCM integrated circuit packaging structure fusing the SMT has the advantages of improving the production efficiency, reducing the production cost and ensuring the quality of the produced products.
Drawings
FIG. 1 is a schematic view of example 1.
FIG. 2 is a schematic view of example 2.
FIG. 3 is a schematic view of example 3.
FIG. 4 is a schematic diagram of a production line of an SMT integrated circuit package incorporating MCM structure according to the invention.
Fig. 5 is a schematic structural diagram of a plastic package material loading frame.
Fig. 6 is a schematic structural diagram of a main frame of the plastic package material loading frame.
Fig. 7 is a schematic structural view of a transmission device of a plastic package material loading frame.
Fig. 8 is a schematic structural diagram of a control device of the plastic package material loading frame.
Fig. 9 is a schematic view of a control rod structure of the plastic package material loading frame.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention relates to an MCM integrated circuit packaging structure fusing SMT, which comprises a metal lead frame, wherein an active device is welded on the metal lead frame through solder paste, a chip is pasted on the metal lead frame through silver paste, the active device comprises a discrete device and an integrated circuit, and the discrete device comprises a diode, a triode, an MOS (metal oxide semiconductor) tube, a silicon controlled rectifier and the like.
Referring to fig. 4, a production line of an MCM integrated circuit package structure with SMT integration sequentially includes a lead frame feeding device 101, a steel mesh printing device 102, a first AOI automatic optical inspection device 103, an active device mounting device 104, a reflow soldering device 105, a second AOI automatic optical inspection device 106, a chip mounting device 107, a first baking device 108, a bonding device 109, a plastic encapsulation device 110, a second baking device 111, a marking device 112, an electroplating device 113, a molding and rib cutting device 114, and an appearance inspection packaging device 115 from front to back.
Wherein the interior of the reflow apparatus 105 is filled with nitrogen gas when activated.
A method for producing an MCM integrated circuit packaging structure fused with SMT comprises the following steps:
firstly, a lead frame feeding device 101 feeds a lead frame;
step two, the steel mesh printing device 102 prints on the lead frame through steel mesh;
generally, at least two complete metal lead frames are adopted for operation in a production line, so that the corresponding steel mesh area can be simultaneously placed into the two complete metal lead frames, the corresponding position to be provided with a source device is opened (used for applying solder paste), the opening area is completely consistent with the shape and size of the active device, then the solder paste is used for printing, and the surface of the metal lead frame is printed with lead-free solder paste with the thickness of 0.08mm (plus or minus 5 percent) (the thickness of the steel mesh is selected for accurately controlling the thickness of the solder paste);
step three, the first AOI automatic optical detection device 103 detects the metal lead frame after the steel mesh printing; recording the unqualified part to a database, and not carrying out subsequent chip mounting operation at the unqualified part;
fourthly, the active device mounting device 104 mounts the active device on the metal lead frame;
step five, performing reflow soldering on the metal lead frame provided with the active device in the reflow soldering device 105, keeping nitrogen protection in the reflow soldering device 105 in the process, and enabling the active device to be tightly adhered to the metal lead frame through the reflow soldering device protected by nitrogen;
step six, the second AOI automatic optical detection device 106 detects the metal lead frame which is subjected to reflow soldering; recording the unqualified part to a database, and not carrying out subsequent chip mounting operation at the unqualified part;
seventhly, the chip mounting device 107 mounts the chips on the metal lead frame, and the chip mounting device 107 can be provided with a plurality of groups or one group according to the number of the chips;
through a common integrated circuit chip mounting process, conductive silver adhesive or insulating silver adhesive with similar shape and area is dotted on a region needing chip mounting, and a control chip or a storage chip is mounted at a specified position of a metal lead frame;
step eight, the first baking device 108 bakes the metal lead frame pasted with the chip; the baking temperature in the step is 170-180 ℃, and the baking curing time is 90-150 minutes;
step nine, the bonding device 109 performs bonding operation on the intermediate product completed in the step nine;
tenthly, the plastic packaging device 110 performs plastic packaging operation on the intermediate product completed in the step;
referring to fig. 5-9, in the plastic packaging operation of the plastic packaging device 110, a plastic packaging material loading frame is used for loading plastic packaging material, the plastic package material feeding rack comprises a main body frame 5 and a cross rod 4, the cross rod 4 is arranged inside the main body frame 5, the main body frame 5 is connected with the cross rod 4 through welding and is connected through welding, thereby can improve overall structure's stability, the medial side of horizontal pole 4 is provided with the splice frame 3, horizontal pole 4 passes through welded connection with splice frame 3, both ends are provided with blowing round hole 2 about main body frame 5, main body frame 5's lower extreme is provided with layering 1, both ends respectively are provided with a handle 6 about main body frame 5's the right-hand member, handle 6 can be so that conveniently take, the inside of handle 6 is provided with handle 9 in both sides, the left end of handle 9 is provided with controlling means 8, controlling means 8's left end is provided with connecting block 7.
Further, main body frame 5's constitution is including stiff end 51, material hole 52, go up side plate 53, transmission 54 and lower side plate 55, the right-hand member upside of stiff end 51 is provided with last side plate 53, the inside of going up side plate 53 is provided with material hole 52 to can make go up side plate 53 and lower side plate 55 can move to same axle center, the lower extreme of going up side plate 53 is provided with lower side plate 55, the inside transmission 54 that is provided with of right-hand member of lower side plate 55, main body frame 5 passes through stiff end 51 and horizontal pole 4 fixed connection.
Further, the transmission device 54 includes a transmission chain 541, a return spring 542, a connecting seat 543 and a transmission rod 544, the lower end of the transmission chain 541 is provided with the return spring 542, the return spring 542 can restore the original state, the lower end of the return spring 542 is provided with the connecting seat 543, the lower end of the connecting seat 543 is provided with the transmission rod 544, and the transmission device 54 is fixedly connected with the connecting block 7 through the transmission rod 544.
Further, the control device 8 comprises a push-pull rod 81, a fixed seat 82, a compression spring 83, a fixed block 84, a connecting plate 85 and a control rod 86, the fixed seat 82 is arranged at the right end of the push-pull rod 81, the compression spring 83 is arranged at the right end of the fixed seat 82, so that the push-pull rod can move under the action of the compression spring 83, the fixed block 84 is arranged at the right end of the compression spring 83, the connecting plate 85 is arranged at the right end of the fixed block 84, the control rod 86 is arranged at the right end of the connecting plate 85, and the control device 8 is fixedly connected with the handle 9.
Further, the control rod 86 comprises a connecting hole 861, a connecting rod 862, a fixing clamping block 863 and a transmission strut 864, the transmission strut 864 is arranged at the right side of the lower end of the fixing clamping block 863, the connecting rod 862 is arranged at the lower end of the left side of the transmission strut 864, so that better rotation can be achieved, the connecting hole 861 is arranged at the lower end of the connecting rod 862, and the control rod 86 is fixedly connected with the handle 9 through the transmission strut 864.
Further, the holding handles 6 are provided with two, and the two holding handles 6 are respectively symmetrically arranged on the right end surface of the main body frame 5 and are connected with the main body frame 5 through welding, so that the work is convenient to carry out, and the inside of the two holding handles 6 is provided with a through groove.
Further, blowing round hole 2 is provided with sixteen altogether, and sixteen blowing round holes 2 are the symmetry respectively and set up both ends about main body frame 5 to can once only place a plurality of materials, thereby can improve work efficiency, both ends respectively are provided with eight and the degree of depth is six centimetres about sixteen blowing round holes 2.
Further, the main body frame 5 has a rectangular structure with a hollow interior so as to support a load applied to an upper portion, and the main body frame 5 has a length of forty centimeters, a width of fifteen centimeters, and a thickness of five centimeters.
The working principle and the use process of the plastic packaging material feeding frame are as follows: the plastic package materials are sequentially placed into the material placing circular holes 2 of the plastic package material feeding frame, sixteen material placing circular holes 2 are symmetrically arranged at the left end and the right end of the main body frame 5 respectively, so that a plurality of materials can be placed at one time, the working efficiency can be improved, then the holding handles 6 are held by hands, the two holding handles 6 are symmetrically arranged on the right end surface of the main body frame 5 respectively and are connected with the main body frame 5 in a welding mode, so that the work is convenient, the plastic package material feeding frame is placed into the interior of the plastic package device die, at the moment, the control rod 86 is pressed down, then the barrier strip moves, eight plastic package materials are directly placed into the plastic package die simultaneously after the die of the plastic package device die is opened, at the moment, the control device 8 only needs to be pressed, so that the compression springs 83 are compressed, the centers of the upper side plates 53 and the lower side plates 55 which correspond to each other one another are coincided, at the moment, the eight plastic package, the working time is saved, eight plastic package materials are manually placed into the feeding frame by utilizing the working process time of the molding press, the plastic package materials fall to the corresponding plastic package material positions in the mold from the material holes, then the control rod 86 automatically bounces, the barrier strips are restored to the positions below the material holes, and the working efficiency of the plastic package device is high.
Eleventh, the second baking device 111 performs baking operation on the intermediate product completed in the above step;
twelfth, the marking device 112 marks the intermediate product completed in the above steps;
thirteen, the electroplating device 113 carries out electroplating operation on the intermediate product completed in the step;
fourteen, the forming and rib cutting device 114 carries out forming and rib cutting operation on the intermediate product completed in the step;
and a fifteenth step of performing appearance detection and packaging operation on the intermediate product completed in the above step by the appearance detection packaging device 115.
The following are data analysis comparisons for three sets of examples and comparative examples for an SMT-fused MCM integrated circuit package structure:
embodiment 1, referring to fig. 1, a lead frame of an MCM integrated circuit package structure incorporating SMT is provided with a transistor and two chips. The triode is welded on the lead frame by adopting solder paste, and the chip is adhered on the lead frame by adopting silver paste.
The above is only a specific application example of the present invention, and the protection scope of the present invention is not limited in any way. All the technical solutions formed by equivalent transformation or equivalent replacement fall within the protection scope of the present invention.
Claims (6)
1. An MCM integrated circuit packaging method fusing SMT is characterized in that a production line of an MCM integrated circuit packaging structure fusing SMT is adopted for operation, an active device is welded on a metal lead frame through solder paste, and a chip is pasted on the metal lead frame through silver paste;
a production line of an MCM integrated circuit packaging structure fusing SMT sequentially comprises a lead frame feeding device (101), a steel mesh printing device (102), a first AOI automatic optical detection device (103), an active device mounting device (104), a reflow soldering device (105), a second AOI automatic optical detection device (106), a chip mounting device (107), a first baking device (108), a bonding device (109), a plastic packaging device (110), a second baking device (111), a marking device (112), an electroplating device (113), a molding and rib cutting device (114) and an appearance detection packaging device (115) from front to back;
the method for packaging the MCM integrated circuit fused with the SMT comprises the following specific steps:
firstly, a lead frame is loaded by a lead frame loading device (101);
secondly, printing on the lead frame through a steel mesh by a steel mesh printing device (102);
step three, the first AOI automatic optical detection device (103) detects the metal lead frame after the steel mesh printing;
fourthly, an active device is installed on the metal lead frame by the active device installation device (104);
performing reflow soldering on the metal lead frame provided with the active device in the reflow soldering device (105), wherein nitrogen protection is kept in the reflow soldering device (105) in the process, and the active device is tightly adhered to the metal lead frame through the reflow soldering device protected by nitrogen;
step six, a second AOI automatic optical detection device (106) detects the metal lead frame which is subjected to reflow soldering; recording the unqualified part to a database, and not carrying out subsequent chip mounting operation at the unqualified part;
seventhly, the chip mounting device (107) mounts the chips on the metal lead frame, and according to the number of the chips, the chip mounting device (107) can be provided with a plurality of groups or one group;
step eight, baking the metal lead frame adhered with the chip by a first baking device (108);
step nine, a bonding device (109) performs bonding operation on the intermediate product completed in the step nine;
tenthly, performing plastic packaging operation on the intermediate product completed in the step by using a plastic packaging device (110);
eleventh, the second baking device (111) performs baking operation on the intermediate product finished in the previous step;
twelfth, marking the intermediate product completed in the above steps by a marking device (112);
thirteen, the electroplating device (113) carries out electroplating operation on the intermediate product finished in the step;
fourteen, a forming and rib cutting device (114) carries out forming and rib cutting operation on the intermediate product completed in the step;
and a fifteenth step of carrying out appearance detection and packaging operation on the intermediate product finished in the step by an appearance detection packaging device (115).
2. The method for packaging an MCM integrated circuit integrated with SMT according to claim 1, wherein in the tenth step, a plastic packaging device (110) adopts a plastic packaging material loading frame for plastic packaging material loading during plastic packaging operation, the plastic packaging material loading frame comprises a main body frame (5) and cross rods (4), the cross rods (4) are arranged inside the main body frame (5), the main body frame (5) and the cross rods (4) are connected through welding, so that the stability of the whole structure can be improved, a connecting frame (3) is arranged on the middle side of the cross rods (4), the cross rods (4) and the connecting frame (3) are connected through welding, the left end and the right end of the main body frame (5) are provided with material placing circular holes (2), the lower end of the main body frame (5) is provided with a pressing strip (1), the upper end and the lower end of the right end of the main body frame (5) are respectively provided with a holding handle (6), the inside of both sides handle (6) is provided with handle (9), and the left end of handle (9) is provided with controlling means (8), and the left end of controlling means (8) is provided with connecting block (7).
3. The method for packaging an MCM integrated circuit integrated with SMT according to claim 2, wherein the main frame (5) comprises a fixed end (51), a material hole (52), an upper side plate (53), a transmission device (54) and a lower side plate (55), the upper side plate (53) is arranged on the right end of the fixed end (51), the material hole (52) is arranged inside the upper side plate (53), so that the upper side plate (53) and the lower side plate (55) can move to the same axis, the lower end of the upper side plate (53) is provided with the lower side plate (55), the transmission device (54) is arranged inside the right end of the lower side plate (55), and the main frame (5) is fixedly connected with the cross bar (4) through the fixed end (51).
4. The method for packaging an MCM integrated circuit fusing SMT according to claim 3, wherein the transmission device (54) comprises a transmission chain (541), a return spring (542), a connecting seat (543) and a transmission rod (544), the return spring (542) is arranged at the lower end of the transmission chain (541), the return spring (542) can restore the original state, the connecting seat (543) is arranged at the lower end of the return spring (542), the transmission rod (544) is arranged at the lower end of the connecting seat (543), and the transmission device (54) is fixedly connected with the connecting block (7) through the transmission rod (544).
5. The method for packaging the MCM integrated circuit integrated with the SMT according to claim 2, wherein the control device (8) comprises a push-pull rod (81), a fixed seat (82), a compression spring (83), a fixed block (84), a connecting plate (85) and a control rod (86), the fixed seat (82) is arranged at the right end of the push-pull rod (81), the compression spring (83) is arranged at the right end of the fixed seat (82) and can move under the action of the compression spring (83), the fixed block (84) is arranged at the right end of the compression spring (83), the connecting plate (85) is arranged at the right end of the fixed block (84), the control rod (86) is arranged at the right end of the connecting plate (85), and the control device (8) is fixedly connected with the handle (9) through the control rod (86).
6. The method for packaging an MCM integrated circuit integrated with SMT according to claim 5, wherein the control rod (86) comprises a connecting hole (861), a connecting rod (862), a fixed clamping block (863) and a transmission strut (864), the transmission strut (864) is arranged on the right side of the lower end of the fixed clamping block (863), the connecting rod (862) is arranged on the lower end of the left side of the transmission strut (864), so that the better rotation can be achieved, the connecting hole (861) is arranged on the lower end of the connecting rod (862), and the control rod (86) is fixedly connected with the handle (9) through the transmission strut (864).
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| CN112864041B (en) * | 2019-11-27 | 2024-03-22 | 西安航思半导体有限公司 | Semiconductor device packaging device |
| CN112201585B (en) * | 2020-06-29 | 2022-04-22 | 深圳市伟安特电子有限公司 | MCM integrated circuit packaging method fusing SMT |
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| CN102074559B (en) * | 2010-11-26 | 2012-11-21 | 天水华天科技股份有限公司 | SiP (Session Initiation Protocol) system integrated-level IC (Integrated Circuit) chip packaging part and manufacturing method thereof |
| CN203300632U (en) * | 2013-06-20 | 2013-11-20 | 无锡华润安盛科技有限公司 | Semiconductor double-side packaging structure |
| CN105405830A (en) * | 2015-12-09 | 2016-03-16 | 西安华为技术有限公司 | System-level packaging module and packaging method |
| JP2018047499A (en) * | 2016-09-23 | 2018-03-29 | 住友金属鉱山株式会社 | Bi-BASED SOLDER ALLOY AND METHOD FOR PRODUCING THE SAME, AND ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT-MOUNTED SUBSTRATE COMPRISING THE SOLDER ALLOY |
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