CN106604564A - Surface mounting method for printed circuit board - Google Patents
Surface mounting method for printed circuit board Download PDFInfo
- Publication number
- CN106604564A CN106604564A CN201611089924.9A CN201611089924A CN106604564A CN 106604564 A CN106604564 A CN 106604564A CN 201611089924 A CN201611089924 A CN 201611089924A CN 106604564 A CN106604564 A CN 106604564A
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- Prior art keywords
- face
- big device
- wiring board
- printed wiring
- reflow soldering
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a surface mounting method for a printed circuit board, wherein the printed circuit board is provided with a large device including a large device body and a soldering pin. The method comprises the following steps: (1) obtaining an empty board including a first face and a second face, the first face being provided with a large device mounting area including a bonding pad area and a blank area; (2) a first side printing: printing solder paste in the bonding pad area; (3) gluing and the first face mounting: putting an adhesive in the blank area to form an adhesive layer and then mounting the large device on the large device mounting area; (4) reflow soldering: subjecting the mounted large device to reflow soldering; (5) second face treatment: subjecting the second face to conventional printing, patch mounting and reflow soldering. The method solves the dropping of the large device in the first face, does not need to increase the size of the PCB, reduces the production cost, improves the PCB layout efficiency, and is simple and convenient for industrial application.
Description
Technical field
The present invention relates to printed circuit board technology field, more particularly to printed wiring board and its surface mount method.
Background technology
Printed circuit board assembling refers to the hollow plate of printed circuit board (PCB) through surface mount (SMT) upper part, then through inserting
The whole processing procedure of part encapsulation, abbreviation PCBA.
Solder technology occupies extremely important status in printed circuit board assembling.General welding is divided into Reflow Soldering and crest
Weldering.Wherein, the flow process of Reflow Soldering is：BOT faces precoating tin cream → paster (be divided into manual attachment and machine is mounted automatically) → backflow
Weldering → TOP faces precoating tin cream → paster (be divided into manual attachment and machine is mounted automatically) → Reflow Soldering → inspection and electrical testing；Ripple
Peak weldering flow process be：Element is inserted in corresponding component hole → pre-coated soldering flux → preliminary drying (temperature 90-1000 DEG C, length 1-
The unnecessary plug-in unit pin → inspection of 1.2m) → wave-soldering (220-2400 DEG C) → excision.According to above-mentioned process characteristic, Reflow Soldering is led to
It is usually used in soldering surface mounted element, and wave-soldering is then used to weld pin member.
Compared with pin member, surface mount elements small volume is lightweight, and is easily welded, dismantles, replaced and preserved,
The stability and reliability of the circuit that making is obtained is high.Therefore, the welding manner of Reflow Soldering more meets electronic product compared with wave-soldering
Multifunction, miniaturization, the developing direction of high performance.In addition, wave-soldering is only applicable to hand plate, and require all
Element is heat-resisting, and crossing the surface of crest cannot have the element of once SMT tin creams, and the plank of SMT tin creams may only just cross backflow
Weldering, it is not possible to use wave-soldering.Therefore, compared with Reflow Soldering, the low production efficiency of wave-soldering, range of application is narrow.
Surface mount device (SMD) includes the big device of a class, and it is larger and easy in PCBA second due to weight, volume
Fall the situation of part during secondary Reflow Soldering, affect the production of printed circuit board.
At present, part is fallen in second Reflow Soldering in order to reduce the big devices of SMD, the PCB design of employing and technological process are such as
Under：
(1) first big device layout in TOP during PCB design；
(2) when TOP faces layout not under all big devices when increase PCB design size, until all big devices can be effective
Ground layout is in TOP faces；
(3) other devices are arbitrarily laid out design according to circuit in TOP faces or BOT faces；
(4) processing PCB；
(5) PCBA processing：
The paster processing of a, BOT face：--- paster --- reflow soldering ----AOI is detected for printing；
The paster processing of b, TOP face：--- paster --- reflow soldering ----AOI is detected for printing；
(6) subsequent technique.
In above-mentioned PCB design and technological process, the big devices of SMD are designed in the TOP faces of PCB, and with current PCB design
Become increasingly complex, such as big device can only layout can greatly increase PCB single board size and the number of plies in TOP faces, and then cause cost
Increase, and make complex manufacturing.
The content of the invention
Based on this, it is necessary to provide it is a kind of can effectively solve the problem that the problem that the big devices of SMD fall part during PCBA, while
PCB production costs, the surface mount method of the printed wiring board of simple production process will not be increased.
A kind of surface mount method of printed wiring board, the printed wiring board is provided with big device, and the big device includes
Big device body and leg, comprise the steps：
(1) hollow plate is obtained：The hollow plate includes the first face and the second face, and first face is provided with for mounting the big device
The big device pasting area of part, the big device pasting area includes the welding disking area corresponding with the leg, Yi Jiyu
The corresponding white space of the big device body；
Print in (2) first faces：To carrying out print tin cream at the welding disking area；
(3) dispensing and the first face paster：Dispensing process is carried out in the white space and forms glue-line, then will be described big
Device is mounted on the big device pasting area, and the glue-line is located between the big device body and first face；
(4) Reflow Soldering：Described big device after to attachment carries out Reflow Soldering；
(5) second faces are processed：Conventional printing, paster and Reflow Soldering are carried out to second face, you can.
The surface mount method of above-mentioned printed wiring board, carries out the surface mount of the big devices of SMD by the way of Reflow Soldering,
And creativeness is applied to gluing process in the technological process of Reflow Soldering, for the big devices of SMD in the second face reflow soldering
Easily fall the problem of part, the paster manufacturing procedure for rationally arranging the first face is：First face printing ----dispensing ----the first face patch
Piece --- Reflow Soldering.After the first face printing process is completed, big device of the layout in the first face is carried out a little between its pad
Glue, carries out paster after the completion of dispensing, then when subsequent reflow is welded, the glue-line that dispensing is formed can solidify, and then big device is consolidated
Determine on the first face.Thus, the surface mount in follow-up second face adds man-hour, because big device is glued by glue-line and PCB solidifications
It is connected together, therefore is not in fall part, so as to solve the problems, such as that big device layout falls part in the first face, meanwhile, without the need for increasing
Plus the size of pcb board, production cost is reduced, PCB positioning efficiencies are improved, and method is simple, is easy to commercial Application.
When above-mentioned surface mount method is carried out, can preferentially by big device layout on the second surface, when in the second face
Again big device layout in the first face when cannot complete layout, thus can further simplify some glue process, other devices can basis
Circuit carries out arbitrary placement.
Hollow plate of the present invention refers to that the preparation section making for adopting conventional printed wiring board is obtained, and does not also carry out device
Surface-pasted daughter board.
Big device of the present invention refers to that weight and/or volume are larger, and the device of part is easily fallen when secondary back is welded
Part, specifically may include device shown in table 1.
Table 1
| Classification | Dimensions |
| Alminium electrolytic condenser | It is all |
| Solid capacitor | It is all |
| Inductance | L*W≥5cm |
| Tantalum electric capacity | C-type number, D models |
| Paster nut | It is all |
Wherein in one embodiment, the material of step (3) glue-line is poly- desaturation compound.
Wherein in one embodiment, the material of step (3) glue-line is red glue.The freezing point of red glue is 150 DEG C, face
Color is redness, using the poly- desaturation compound of the freezing point as glue line material, ensure that and is tightly bonded between big device and hollow plate
Gu, prevent it from dropping in the reflow soldering in the second face, and meanwhile, it is capable to using the intensification of wiring board during the first face reflow soldering
Solidification, Simplified flowsheet.
Wherein in one embodiment, the thickness of step (3) glue-line is less than or equal to 0.13mm.
Wherein in one embodiment, the thickness of step (3) glue-line is 0.08～0.13mm.
Wherein in one embodiment, the technique of step (4) reflow soldering includes preheating, insulation and welds.
Wherein in one embodiment, the heating rate≤2.5 DEG C/s of the preheating；The temperature of the insulation be 150～
200 DEG C, the time is 90～150s；Keep during the welding time more than 217 DEG C (melting temperatures of the tin cream) be 45～
55s。
In existing wave-soldering, to make device keep stable when subsequently being impacted by crest, using the weldering of pin member
The longer advantage of pin, it will usually which carrying out dispensing fixes device.And surface mount elements are shorter due to leg, therefore using dispensing work
The characteristics of needing during skill for surface mount elements is rationally controlled to each technological parameter, such as bondline thickness, reflow soldering process parameter
System.
Using the temperature of wiring board when bondline thickness as described above and reflow soldering, glue-line can be enable to enter big device
Row is effectively fixed, and can fully solidify in Reflow Soldering, and then the big device that closely bonds, at the same time it can also be ensured that
The processing quality of Reflow Soldering.
Wherein in one embodiment, the temperature of the insulation is 170～190 DEG C, and the time is 100～120s.
The present invention also provides the printed wiring board that the surface mount method of described printed wiring board is prepared.
Description of the drawings
Fig. 1 for embodiment 1 surface mount method in obtain hollow plate schematic diagram；
Fig. 2 is dispensing in the surface mount method of embodiment 1 and the schematic diagram after the first face paster.
Specific embodiment
Further details of is made to the printed wiring board and its surface mount method of the present invention below in conjunction with specific embodiment
Explanation.
Embodiment 1
A kind of surface mount method of printed wiring board of the present embodiment, the printed wiring board is provided with tantalum electric capacity (D types), bag
Include following steps：
(1) hollow plate is obtained：As shown in figure 1, hollow plate includes the first face 10 and the second face 20, the first face 10 is provided with for mounting
The big device pasting area of tantalum electric capacity, the big device pasting area includes the welding disking area corresponding with the leg of tantalum electric capacity,
And the white space corresponding with tantalum electric capacity body；
(2) PCB layout designs：It is preferential by tantalum capacitor design layout on the second face 20, when cannot be complete on the second face 20
Into during layout again tantalum capacitance arrangement on the first face 10；
Print in (3) first faces：Print tin cream is carried out to welding disking area on the first face 10 according to normal process steps；
(4) dispensing and the first face paster：As shown in Fig. 2 using point gum machine, the centre of the white space on the first face 10
Dispensing process is carried out at position and forms glue-line 40, the material of glue-line 40 is red glue, and thickness is 0.1mm；Then will using chip mounter
Tantalum electric capacity 30 is mounted on big device pasting area, and the leg of tantalum electric capacity 30 is correspondingly arranged in welding disking area, and glue-line 40 is located at tantalum electricity
Hold between 30 body and the first face 10；
(5) reflow soldering：Reflow soldering is carried out to the device (including tantalum electric capacity 30) on the first face 10, technique includes pre-
Heat, insulation and welding, specific process parameter is as follows：
2.5 DEG C/the sec of heating rate of preheating；The temperature of insulation is 180 DEG C, and the time is 110sec；217 are kept during welding
Time more than DEG C is 50sec；In this process, pcb board peak temperature≤245 DEG C, weld zone peak temperature is 240+/- 3
℃；
(6) second faces are processed：Conventional printing, paster and reflow soldering are carried out to the second face 20；Returning in second face 20
When fluid welding connects, the bonding of tantalum electric capacity 30 on the first face 10 is firm, falls part.
Embodiment 2
A kind of surface mount method of printed wiring board of the present embodiment, the printed wiring board is provided with tantalum electric capacity (D types), bag
Include following steps：
(1) hollow plate is obtained：Hollow plate includes the first face and the second face, and the first face is provided with the big device for mounting tantalum electric capacity and pastes
Dress region, the big device pasting area includes the welding disking area corresponding with the leg of tantalum electric capacity, and with tantalum electric capacity body
Corresponding white space；
(2) PCB layout designs：It is preferential by tantalum capacitor design layout on the second surface, when cloth cannot be completed on the second surface
Office when again tantalum capacitance arrangement on the first face；
Print in (3) first faces：Print tin cream is carried out to welding disking area on the first face according to normal process steps；
(4) dispensing and the first face paster：Using point gum machine, the middle position of white space on the first face is carried out a little
Glue process forms glue-line, and the material of glue-line is red glue, and thickness is 0.1mm；Then tantalum electric capacity is mounted on by big device using chip mounter
Part pasting area, the leg of tantalum electric capacity is correspondingly arranged in welding disking area, and glue-line is located between the body of tantalum electric capacity and the first face；
(5) reflow soldering：Reflow soldering is carried out to the device (including inductance) on the first face, technique includes preheating, insulation
And welding, specific process parameter is as follows：
2 DEG C/the sec of heating rate of preheating；The temperature of insulation is 150 DEG C, and the time is 150sec；217 DEG C are kept during welding
Time above is 45sec；In this process, pcb board peak temperature≤245 DEG C, weld zone peak temperature is 240+/- 3 DEG C；
(6) second faces are processed：Conventional printing, paster and reflow soldering are carried out to the second face；In the Reflow Soldering in second face
When connecing, the tantalum electric capacity bonding soundness on the first face is slightly worse compared with embodiment 1, but falls part.
Embodiment 3
A kind of surface mount method of printed wiring board of the present embodiment, the printed wiring board is provided with tantalum electric capacity (D types), bag
Include following steps：
(1) hollow plate is obtained：Hollow plate includes the first face and the second face, and the first face is provided with the big device for mounting tantalum electric capacity and pastes
Dress region, the big device pasting area includes the welding disking area corresponding with the leg of tantalum electric capacity, and with tantalum electric capacity body
Corresponding white space；
(2) PCB layout designs：It is preferential by tantalum capacitor design layout on the second surface, when cloth cannot be completed on the second surface
Office when again tantalum capacitance arrangement on the first face；
Print in (3) first faces：Print tin cream is carried out to welding disking area on the first face according to normal process steps；
(4) dispensing and the first face paster：Using point gum machine, the middle position of white space on the first face is carried out a little
Glue process forms glue-line, and the material of glue-line is red glue, and thickness is 0.1mm；Then tantalum electric capacity is mounted on by big device using chip mounter
Part pasting area, the leg of tantalum electric capacity is correspondingly arranged in welding disking area, and glue-line is located between the body of tantalum electric capacity and the first face；
(5) reflow soldering：Reflow soldering is carried out to the device (including tantalum electric capacity) on the first face, technique includes preheating, protects
Gentle welding, specific process parameter is as follows：
2.5 DEG C/the sec of heating rate of preheating；The temperature of insulation is 200 DEG C, and the time is 90sec；217 DEG C are kept during welding
Time above is 55sec；In this process, pcb board peak temperature≤245 DEG C, weld zone peak temperature is 240+/- 3 DEG C；
(6) second faces are processed：Conventional printing, paster and reflow soldering are carried out to the second face；In the Reflow Soldering in second face
When connecing, the tantalum electric capacity bonding soundness on the first face is slightly worse compared with embodiment 1, but falls part.
Embodiment 4
A kind of surface mount method of printed wiring board of the present embodiment, the printed wiring board be provided with inductance (L*W >=
5cm), comprise the steps：
(1) hollow plate is obtained：Hollow plate includes the first face and the second face, and the first face is provided with the big device for mounting inductance and mounts
Region, the big device pasting area includes the welding disking area corresponding with the leg of inductance, and corresponding with inductance body
White space；
(2) PCB layout designs：It is preferential by inductor design layout on the second surface, when layout cannot be completed on the second surface
When again inductor layout on the first face；
Print in (3) first faces：Print tin cream is carried out to welding disking area on the first face according to normal process steps；
(4) dispensing and the first face paster：Using point gum machine, the middle position of white space on the first face is carried out a little
Glue process forms glue-line, and the material of glue-line is red glue, and thickness is 0.1mm；Then inductance is mounted on by big device using chip mounter
Pasting area, the leg of inductance is correspondingly arranged in welding disking area, and glue-line is located between the body of inductance and the first face；
(5) reflow soldering：Reflow soldering is carried out to the device (including inductance) on the first face, technique includes preheating, insulation
And welding, specific process parameter is as follows：
2.5 DEG C/the sec of heating rate of preheating；The temperature of insulation is 180 DEG C, and the time is 110sec；217 are kept during welding
Time more than DEG C is 50sec；In this process, pcb board peak temperature≤245 DEG C, weld zone peak temperature is 240+/- 3
℃；
(6) second faces are processed：Conventional printing, paster and reflow soldering are carried out to the second face；In the Reflow Soldering in second face
When connecing, the inductance bonding on the first face is firm, falls part.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope of this specification record is all considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more concrete and detailed, but and
Can not therefore be construed as limiting the scope of the patent.It should be pointed out that for one of ordinary skill in the art comes
Say, without departing from the inventive concept of the premise, some deformations and improvement can also be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be defined by claims.
Claims (8)
1. a kind of surface mount method of printed wiring board, the printed wiring board is provided with big device, and the big device includes big
Device body and leg, it is characterised in that comprise the steps：
(1) hollow plate is obtained：The hollow plate includes the first face and the second face, and first face is provided with for mounting the big device
Big device pasting area, the big device pasting area includes the welding disking area corresponding with the leg, and with it is described
The corresponding white space of big device body；
Print in (2) first faces：Print tin cream is carried out in the welding disking area；
(3) dispensing and the first face paster：Dispensing is carried out in the white space and forms glue-line, then mount the big device
In the big device pasting area, the glue-line is located between the big device body and first face；
(4) Reflow Soldering：Described big device after to attachment carries out Reflow Soldering；
(5) second faces are processed：Conventional printing, paster and Reflow Soldering are carried out to second face, you can.
2. the surface mount method of printed wiring board according to claim 1, it is characterised in that step (3) glue-line
Material be poly- desaturation compound.
3. the surface mount method of printed wiring board according to claim 1, it is characterised in that step (3) glue-line
Thickness be less than or equal to 0.13mm.
4. the surface mount method of printed wiring board according to claim 3, it is characterised in that step (3) glue-line
Thickness be 0.08～0.13mm.
5. the surface mount method of the printed wiring board according to any one of claim 1-4, it is characterised in that step (4)
The technique of the Reflow Soldering includes preheating, insulation and welds.
6. the surface mount method of printed wiring board according to claim 5, it is characterised in that the intensification speed of the preheating
Rate≤2.5 DEG C/s；The temperature of the insulation is 150～200 DEG C, and the time is 90～150s；217 DEG C of keeping temperature during the welding
Time above is 45～55s.
7. the surface mount method of printed wiring board according to claim 6, it is characterised in that the temperature of the insulation is
170～190 DEG C, the time is 100～120s.
8. the printed wiring board that the surface mount method of the printed wiring board described in any one of claim 1-7 is prepared.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611089924.9A CN106604564A (en) | 2016-12-01 | 2016-12-01 | Surface mounting method for printed circuit board |
| PCT/CN2017/096271 WO2018099123A1 (en) | 2016-12-01 | 2017-08-07 | Printed circuit board and surface mount method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611089924.9A CN106604564A (en) | 2016-12-01 | 2016-12-01 | Surface mounting method for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106604564A true CN106604564A (en) | 2017-04-26 |
Family
ID=58594660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611089924.9A Pending CN106604564A (en) | 2016-12-01 | 2016-12-01 | Surface mounting method for printed circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106604564A (en) |
| WO (1) | WO2018099123A1 (en) |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103108498A (en) * | 2013-01-10 | 2013-05-15 | 太仓市同维电子有限公司 | Method of placing parts on printed circuit board (PCB) circuit board surfaces |
| CN204168608U (en) * | 2014-10-20 | 2015-02-18 | 深圳市海和电子有限公司 | A kind of circuit board efficient quality guaranteeing printing ladder steel mesh |
| CN106163131A (en) * | 2015-04-14 | 2016-11-23 | 艾默生网络能源有限公司 | The hybrid process technique of surface mount elements and pcb board |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101384136B (en) * | 2008-10-17 | 2014-04-02 | 林克治 | Surface mounting process for flexible circuit board and used magnetic tool and steel mesh |
| CN102065646B (en) * | 2011-01-18 | 2012-07-04 | 武汉正维电子技术有限公司 | Surface mount technology of ratio frequency power amplification mainboard |
| CN106604564A (en) * | 2016-12-01 | 2017-04-26 | 广东威创视讯科技股份有限公司 | Surface mounting method for printed circuit board |
-
2016
- 2016-12-01 CN CN201611089924.9A patent/CN106604564A/en active Pending
-
2017
- 2017-08-07 WO PCT/CN2017/096271 patent/WO2018099123A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103108498A (en) * | 2013-01-10 | 2013-05-15 | 太仓市同维电子有限公司 | Method of placing parts on printed circuit board (PCB) circuit board surfaces |
| CN204168608U (en) * | 2014-10-20 | 2015-02-18 | 深圳市海和电子有限公司 | A kind of circuit board efficient quality guaranteeing printing ladder steel mesh |
| CN106163131A (en) * | 2015-04-14 | 2016-11-23 | 艾默生网络能源有限公司 | The hybrid process technique of surface mount elements and pcb board |
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| WO2018099123A1 (en) * | 2016-12-01 | 2018-06-07 | 威创集团股份有限公司 | Printed circuit board and surface mount method |
| CN107371336A (en) * | 2017-07-13 | 2017-11-21 | 安捷利电子科技（苏州）有限公司 | A kind of method of printed circuit board positive and negative while soldering device |
| CN107612226A (en) * | 2017-10-31 | 2018-01-19 | 珠海格力电器股份有限公司 | Surface mounting structure, surface mounting method, motor and surface mounting chip |
| CN107612226B (en) * | 2017-10-31 | 2024-05-03 | 珠海格力电器股份有限公司 | Surface mounting structure, surface mounting method, motor and surface mounting chip |
| CN110139502A (en) * | 2019-05-31 | 2019-08-16 | 深圳市英创立电子有限公司 | Pcb board surface mount process |
| CN110139503A (en) * | 2019-05-31 | 2019-08-16 | 深圳市英创立电子有限公司 | Printed circuit board surface sticked technique |
| CN110248496A (en) * | 2019-05-31 | 2019-09-17 | 深圳市英创立电子有限公司 | A kind of pcb board attachment process and the Heraeus for applying to the attachment process |
| CN110278666A (en) * | 2019-06-21 | 2019-09-24 | 北京猎户星空科技有限公司 | A kind of method that two-sided welding prevents part |
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| CN113438826A (en) * | 2021-06-29 | 2021-09-24 | 荣成歌尔微电子有限公司 | Underfill packaging method and device |
| CN113543517A (en) * | 2021-06-30 | 2021-10-22 | 青岛歌尔智能传感器有限公司 | Connection method of SIP module and FPC and electronic product |
| CN116782528A (en) * | 2021-11-23 | 2023-09-19 | 刘洋 | Composite aluminum-based LED printed circuit board and preparation process thereof |
| CN114245603B (en) * | 2021-12-20 | 2024-01-30 | 中国电子科技集团公司第二十六研究所 | Radio frequency LC filter manufacturing method based on reflow soldering |
| CN114245603A (en) * | 2021-12-20 | 2022-03-25 | 中国电子科技集团公司第二十六研究所 | Radio frequency LC filter manufacturing method based on reflow soldering |
| CN114760774A (en) * | 2022-03-14 | 2022-07-15 | 深圳市兆兴博拓科技股份有限公司 | Circuit board surface mounting process based on surface optimization and circuit board |
| CN114760774B (en) * | 2022-03-14 | 2024-05-10 | 深圳市兆兴博拓科技股份有限公司 | Circuit board surface mounting technology based on surface optimization and circuit board |
| CN114515881A (en) * | 2022-03-26 | 2022-05-20 | 宁波诚兴道电子科技有限公司 | PCBA circuit board welding equipment and process |
| CN115066108A (en) * | 2022-06-21 | 2022-09-16 | 中国电子科技集团公司第四十三研究所 | Assembling process of input/output pins of microcircuit module |
| CN115066108B (en) * | 2022-06-21 | 2024-03-22 | 中国电子科技集团公司第四十三研究所 | Assembling process for input/output pins of microcircuit module |
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Application publication date: 20170426 |