CN105530017B - Method for manufacturing receiving front end of broadband receiving and transmitting system - Google Patents
Method for manufacturing receiving front end of broadband receiving and transmitting system Download PDFInfo
- Publication number
- CN105530017B CN105530017B CN201510852579.9A CN201510852579A CN105530017B CN 105530017 B CN105530017 B CN 105530017B CN 201510852579 A CN201510852579 A CN 201510852579A CN 105530017 B CN105530017 B CN 105530017B
- Authority
- CN
- China
- Prior art keywords
- radio frequency
- circuit board
- frequency circuit
- cover plate
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/06—Receivers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
A manufacturing method of a receiving front end of a broadband transceiving system comprises a back power panel, a front radio frequency circuit board, a connector, a carrier, a shell, an upper inner cover plate, a lower inner cover plate and an outer cover plate, and is characterized in that: the method comprises the following steps: manufacturing a back power panel; sintering the front radio frequency circuit board, the carrier and the shell; sintering a surface-mounted component; cementing; the back power panel and the connector are assembled; bonding with gold wires; testing; and (7) sealing the cover. According to the invention, the soldering lug is adopted for sintering in the manufacturing process of the front radio frequency circuit board, and the soldering lug can be sintered only by being cut into a circuit shape and being placed in the cavity of the shell, so that the cost is saved and the penetration rate is greatly improved; in addition, the cone core inductor used in the manufacturing process of the invention adopts a conductive adhesive cementing method, and cleaning is not needed after cementing, thereby overcoming the phenomenon that the insulating paint is easy to fall off due to cleaning after soldering tin of the cone inductor in the prior art.
Description
Technical field
The present invention relates to a kind of production methods of broadband receive-transmit system receiving front-end, belong to microwave circuit communication technique field
And Micro-package technique field.
Background technology
The sintering of receiving front-end RF receiving circuit and housing at present is generally put into shell using radio frequency circuit board Printing Paste
Reflow Soldering sintering is carried out in body cavity body, although cavity is bigger after the easy sintering of the method comparison, penetration rate is difficult that satisfaction will
It asks, and often does a kind of new product and be required for doing a screen printing net plate, cost of idleness again.The starting point of the present invention is in front
Radio frequency circuit board is sintered in making using weld tabs, it is only necessary to which weld tabs is cut into circuitry shapes, and the intracavitary for being put into housing can
To be sintered, that is, cost is saved and has substantially increased penetration rate again；In addition, the tap web used in manufacturing process of the present invention
Inductance using the method that conducting resinl is cementing, does not have to cleaning after cementing, overcomes to clean after previous taper inductance soldering and be easy to cause
Insulated paint the phenomenon that coming off.
Invention content
According to above-mentioned requirements, the object of the present invention is to provide a kind of production method of broadband receive-transmit system receiving front-end, sheets
Invention can significantly improve front radio frequency circuit board and the penetration rate of shell cavity sintering, overcome taper inductance soldering
Insulated paint obscission caused by cleaning afterwards.
To achieve the above object, the present invention is realized by following technological means：
A kind of production method of broadband receive-transmit system receiving front-end, including back side power panel, front radio frequency circuit board, connection
Device, carrier, housing, upper and lower inner cover plate, outer cover plate, it is characterised in that：Include the following steps：
1）Back side power panel makes；
2）The sintering of front radio frequency circuit board, carrier and housing；
3）Surface Mount component is sintered；
4）It is cementing；
5）Back side power panel, connector device are matched, and back side power panel, connector are packed into the cavity of housing according to design requirement
In corresponding position, and make to be screwed, then complete the welding of conducting wire, connector；
6）Gold wire bonding completes the welding of spun gold, gold ribbon according to design requirement；
7）Test completes step 6 according to the design requirement of product）The test and debugging of products obtained therefrom；
8）Upper and lower inner cover plate after the completion of production debugging test, is fixed on using screw on housing by capping first, next
Prepare outer cover plate, using Laser seal welding outer cover plate together with case weld.
Further：
The step 1）Including：Component according to needed for design drawing requirement gets out back side power panel, utilizes silk
For wire mark brush by Solder-Paste Printing on pad, control assembling drawing mounts component onto back side power panel, checks errorless pass through
The stove heat that flows back carries out reflow soldering, and solder(ing) paste type selecting fusing point is 183 DEG C.
The step 2）Including：
21）One layer of high temperature gummed tape of the positive face paste of radio frequency circuit board in front, and trim Protection glue band along board edge；
22 place the face down of front radio frequency circuit board, and carrier is sequentially placed into radio frequency by control assembling drawing from the back side
In the corresponding hole of circuit board and it is sticked on Protection glue band；
23）Weld tabs is sheared according to the shape of front radio frequency circuit board, spraying last layer liquid helps weldering on the two sides of weld tabs
Agent after scaling powder dries, is put into the cavity of housing, and front radio frequency circuit board is also correspondingly placed into the cavity of housing,
Check it is errorless after, load onto heating tooling, be placed on heating platform and carry out Reflow Soldering, heating platen temperature set 230-240 DEG C, observation
Sintering situation when weld tabs starts melting, applies pressure to front radio frequency circuit board by tooling, increases front radio frequency circuit board
Penetration rate, treat that the sintering of front radio frequency circuit board and housing is completed, from thermal station lower product up, tooling taken out after cooling.
The step 3）Including：Control assembling drawing puts soldering paste on the corresponding pad of front radio frequency circuit board,
Component is mounted on sintered front radio frequency circuit board, reflow soldering is carried out using 140 DEG C of soldering paste in reflow ovens.
The step 4）Including：The bottom of taper inductance, bare chip is fixed on corresponding position using fixing glue, so
It carries out again afterwards cementing；It is cementing after the completion of check it is errorless, be put into baking oven carry out baking and curing, oven temperature set 120 DEG C, curing 1
Hour.
The step 8）Including：After the completion of production debugging test, upper and lower inner cover plate is fixed on shell using screw first
On body, next matches outer cover plate, using Laser seal welding outer cover plate together with case weld.
The outer cover plate material is aluminium alloy 4A11.
The case material is aluminium alloy 6061.
The beneficial effects of the invention are as follows：First, the present invention improves product penetration rate using weld tabs sintering, uses simultaneously
Weld tabs sintering, which does not have to making screen printing net plate, reduces manufacture cost, especially to the research and development product of small lot；Secondly, present invention system
The taper inductance used during making using the method that conducting resinl is cementing, does not have to cleaning after cementing, overcomes previous taper
The phenomenon that insulated paint be easy to causeing comes off is cleaned after inductance soldering.
Specific embodiment
A kind of production method of broadband receive-transmit system receiving front-end, including back side power panel, front radio frequency circuit board, connection
Device, carrier, housing, upper and lower inner cover plate, outer cover plate, it is characterised in that：Include the following steps：
1）Back side power panel makes；
2）The sintering of front radio frequency circuit board, carrier and housing；
3）Surface Mount component is sintered；
4）It is cementing；
5）Back side power panel, connector device are matched, and back side power panel, connector are packed into the cavity of housing according to design requirement
In corresponding position, and make to be screwed, then complete the welding of conducting wire, connector；
6）Gold wire bonding completes the welding of spun gold, gold ribbon according to design requirement；
7）Test completes step 6 according to the design requirement of product）The test and debugging of products obtained therefrom；
8）Upper and lower inner cover plate after the completion of production debugging test, is fixed on using screw on housing by capping first, next
Prepare outer cover plate, using Laser seal welding outer cover plate together with case weld.
Further：
The step 1）Including：Component according to needed for design drawing requirement gets out back side power panel, mainly has
1K, 56K, 5.6 Ω, 10K resistance, 1uf, 4.7uf capacitance, -5 V voltage-stablizers, HMC920 etc. are several, using silk-screen printing by soldering paste
Be printed on pad, control assembling drawing will component attachment on the power panel of the back side, check it is errorless by flow back stove heat into
Row reflow soldering, solder(ing) paste type selecting fusing point are 183 DEG C.
The step 2）Including：
21）One layer of high temperature gummed tape of the positive face paste of radio frequency circuit board in front, and trim Protection glue band along board edge；
22 place the face down of front radio frequency circuit board, and carrier is sequentially placed into radio frequency by control assembling drawing from the back side
In the corresponding hole of circuit board and it is sticked on Protection glue band；
23）Weld tabs is sheared according to the shape of front radio frequency circuit board, spraying last layer liquid helps weldering on the two sides of weld tabs
Agent after scaling powder dries, is put into the cavity of housing, and front radio frequency circuit board is also correspondingly placed into the cavity of housing,
Check it is errorless after, load onto heating tooling, be placed on heating platform and carry out Reflow Soldering, heating platen temperature set 230-240 DEG C, observation
Sintering situation when weld tabs starts melting, applies pressure to front radio frequency circuit board by tooling, increases front radio frequency circuit board
Penetration rate, treat that the sintering of front radio frequency circuit board and housing is completed, from thermal station lower product up, tooling taken out after cooling.
The step 3）Including：Control assembling drawing puts soldering paste on the corresponding pad of front radio frequency circuit board,
Component is mounted on sintered front radio frequency circuit board, main components are 1K resistance, 100PF capacitances etc., in reflow ovens
Reflow soldering is carried out using 140 DEG C of soldering paste.
The step 4）Including：The bottom of taper inductance, bare chip is fixed on corresponding position using fixing glue, so
It carries out again afterwards cementing；It is cementing after the completion of check it is errorless, be put into baking oven carry out baking and curing, oven temperature set 120 DEG C, curing 1
Hour.
The step 8）Including：After the completion of production debugging test, upper and lower inner cover plate is fixed on shell using screw first
On body, next matches outer cover plate, using Laser seal welding outer cover plate together with case weld.
The outer cover plate material is aluminium alloy 4A11.
The case material is aluminium alloy 6061.
Basic principle, the main features and advantages of the present invention have been shown and described above.The technical staff of the industry should
Understand, the design is not restricted to the described embodiments, and the above embodiments and description only describe the originals of the design
Reason, under the premise of the design spirit and scope are not departed from, the design also has various changes and modifications, these changes and improvements
It both falls in the range of claimed the design.Range is claimed by appended claims and its equivalent circle in the design
It is fixed.
Claims (5)
1. a kind of production method of broadband receive-transmit system receiving front-end, this kind of broadband receive-transmit system receiving front-end includes back side power supply
Plate, front radio frequency circuit board, connector, carrier, housing, upper and lower inner cover plate, outer cover board member, it is characterised in that：Including following
Step：
1）Back side power panel makes；
2）The sintering of front radio frequency circuit board, carrier and housing；
3）Surface Mount component is sintered；
4）It is cementing；
5）Back side power panel, connector device are matched, and back side power panel, connector are fitted into the cavity of housing according to design requirement
Corresponding position, and make to be screwed, then complete the welding of conducting wire, connector；
6）Gold wire bonding completes the welding of spun gold, gold ribbon according to design requirement；
7）Test completes step 6 according to the design requirement of product）The test and debugging of products obtained therefrom；
8）Upper and lower inner cover plate after the completion of production debugging test, is fixed on using screw on housing, next is matched by capping first
Outer cover plate, using Laser seal welding outer cover plate together with case weld；
The step 2）Including：
21）One layer of high temperature gummed tape of the positive face paste of radio frequency circuit board in front, and trim high temperature gummed tape along board edge；
22）The face down of front radio frequency circuit board is placed, carrier is sequentially placed into front from the back side and penetrated by control assembling drawing
In the corresponding hole of frequency circuit plate and it is sticked on high temperature gummed tape；
23）Weld tabs is sheared according to the shape of front radio frequency circuit board, last layer liquid scaling powder is sprayed on the two sides of weld tabs, is helping
It after solder flux dries, is put into the cavity of housing, and front radio frequency circuit board is also correspondingly placed into the cavity of housing, check errorless
Afterwards, heating tooling is loaded onto, is placed on heating platform and carries out Reflow Soldering, heating platform temperature sets 230-240 DEG C, observation sintering feelings
Condition when weld tabs starts melting, applies pressure to front radio frequency circuit board by heating tooling, increases front radio frequency circuit board
Penetration rate treats that the sintering of front radio frequency circuit board and housing is completed, and from heating platform lower product up, heater is taken out after cooling
Dress；
The step 4）Including：The bottom of taper inductance, bare chip is fixed on front radio frequency circuit board phase using fixing glue
Then the position answered carries out cementing again；It is cementing after the completion of check it is errorless, be put into baking oven carry out baking and curing, oven temperature setting
120 DEG C, cure 1 hour.
2. a kind of production method of broadband receive-transmit system receiving front-end as described in claim 1, it is characterised in that：The step
Rapid 1）Including：Component according to needed for design drawing requirement gets out back side power panel, is printed solder(ing) paste using silk-screen printing
For brush on pad, control assembling drawing mounts component onto back side power panel, and inspection is errorless to be carried out by the stove heat that flows back
Reflow soldering, solder(ing) paste type selecting fusing point are 183 DEG C.
3. a kind of production method of broadband receive-transmit system receiving front-end as described in claim 1, it is characterised in that：The step
Rapid 3）Including：Control assembling drawing puts soldering paste, front radio frequency after sintering on the corresponding pad of front radio frequency circuit board
Component is mounted on circuit board, reflow soldering is carried out using 140 DEG C of soldering paste in reflow ovens.
4. a kind of production method of broadband receive-transmit system receiving front-end as described in claim 1, it is characterised in that：The outer cover
Plate material is aluminium alloy 4A11.
5. a kind of production method of broadband receive-transmit system receiving front-end as described in claim 1, it is characterised in that：The housing
Material is aluminium alloy 6061.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510852579.9A CN105530017B (en) | 2015-11-27 | 2015-11-27 | Method for manufacturing receiving front end of broadband receiving and transmitting system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510852579.9A CN105530017B (en) | 2015-11-27 | 2015-11-27 | Method for manufacturing receiving front end of broadband receiving and transmitting system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105530017A CN105530017A (en) | 2016-04-27 |
| CN105530017B true CN105530017B (en) | 2018-07-03 |
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| CN201510852579.9A Active CN105530017B (en) | 2015-11-27 | 2015-11-27 | Method for manufacturing receiving front end of broadband receiving and transmitting system |
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|---|---|---|---|---|
| CN105764266A (en) * | 2015-12-18 | 2016-07-13 | 安徽华东光电技术研究所 | Wideband receiving and transmitting system receiving front end making method |
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| CN107708400A (en) * | 2017-09-01 | 2018-02-16 | 安徽华东光电技术研究所 | Power connects the processing method of pulse amplifier in X-band |
| CN108161264B (en) * | 2017-12-01 | 2020-10-23 | 安徽华东光电技术研究所 | Manufacturing method of X-band transceiving component |
| CN108462491A (en) * | 2017-12-01 | 2018-08-28 | 安徽华东光电技术研究所 | Local oscillator source module processing method on Ku audio range frequency synthesizers |
| CN109688725B (en) * | 2018-12-10 | 2021-08-24 | 安徽华东光电技术研究所有限公司 | Manufacturing method of K1 waveband frequency source module |
| CN110102848A (en) * | 2019-06-13 | 2019-08-09 | 中国电子科技集团公司第三十八研究所 | A kind of method for welding |
| CN110856373A (en) * | 2019-11-22 | 2020-02-28 | 安徽华东光电技术研究所有限公司 | Excitation signal module processing method |
| CN111106104A (en) * | 2019-12-10 | 2020-05-05 | 安徽华东光电技术研究所有限公司 | Manufacturing process of 18-28GHZ T assembly |
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| CN103551690A (en) * | 2013-11-01 | 2014-02-05 | 安徽华东光电技术研究所 | Manufacturing method of amplitude limiter |
| CN105099370A (en) * | 2015-08-12 | 2015-11-25 | 安徽华东光电技术研究所 | Pre-frequency mixer processing method |
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|---|---|---|---|---|
| CN102186312A (en) * | 2011-04-29 | 2011-09-14 | 摩比天线技术（深圳）有限公司 | Through-hole reflow soldering method and formwork for printing circuit board |
| CN102761311A (en) * | 2012-07-20 | 2012-10-31 | 深圳市通创通信有限公司 | Micro assembly process for millimeter-wave circuit |
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| CN105530017A (en) | 2016-04-27 |
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Address after: 241002 Huaxia science and Technology Park, high tech Development Zone, gejiang District, Wuhu City, Anhui Province Patentee after: ANHUI HUADONG PHOTOELECTRIC TECHNOLOGY INSTITUTE Co.,Ltd. Address before: 241002 Huaxia science and Technology Park, high tech Development Zone, gejiang District, Wuhu City, Anhui Province Patentee before: Anhui Huadong Polytechnic Institute |