CN106535497B - A kind of T/R receiving front-end module processing method - Google Patents
A kind of T/R receiving front-end module processing method Download PDFInfo
- Publication number
- CN106535497B CN106535497B CN201610970087.4A CN201610970087A CN106535497B CN 106535497 B CN106535497 B CN 106535497B CN 201610970087 A CN201610970087 A CN 201610970087A CN 106535497 B CN106535497 B CN 106535497B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- radio
- frequency circuit
- plate
- frequency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The present invention provides a kind of T/R receiving front-end module processing method applied to phased array radar system parts technical field, the step of T/R receiving front-end module processing method are as follows: 1) process front radio-frequency circuit board (1), radio frequency circuit board ontology and bottom plate (4) are sintered, are sintered radio frequency electric elements (5) on radio frequency circuit board ontology；2) front-end controlling circuit plate (2) are processed, by control circuit board ontology and control electric elements (6) sintering；3) front radio-frequency circuit board (1) and front-end controlling circuit plate (2) are installed on cavity (7)；4) front radio-frequency circuit board (1), front-end controlling circuit plate (2), radio frequency connector (3) are connected, complete the processing of T/R receiving front-end module, T/R receiving front-end module processing method of the invention, step is simple, it is at low cost, the convenient and efficient completion T/R receiving front-end module processing of energy, improves T/R receiving front-end module product qualification rate, is suitable for mass production T/R receiving front-end module.
Description
Technical field
The invention belongs to phased array radar system parts technical fields, are to be related to a kind of T/R reception more specifically
Front-end module processing method.
Background technique
With the development of microwave technology, phased-array radar is widely used on military equipment, and T/R component is phased-array radar
Core component in system needs dedicated TR component detection instrument to be tested for the property when testing, and T/R receiving front-end module is
Important composition module in TR component special detector, T/R receiving front-end module have bandwidth, detect accurate, output linearly
The characteristics of, it is used in portable TR component special detector, is the important component of the detector.Processing side in the prior art
The T/R receiving front-end module front radio-frequency circuit electromagnetic interference of method processing is big, causes performance unstable, is unable to satisfy phased array thunder
Up to system requirements.
Summary of the invention
The technical problems to be solved by the present invention are: in view of the shortcomings of the prior art, to provide a kind of step simple, it is at low cost,
The convenient and efficient completion T/R receiving front-end module processing of energy, improves T/R receiving front-end module product qualification rate, is suitable for mass
Produce the T/R receiving front-end module processing method of T/R receiving front-end module.
Solve the problems, such as techniques discussed above, the technical scheme adopted by the invention is as follows:
The present invention is a kind of T/R receiving front-end module processing method, and the T/R receiving front-end module includes front radio-frequency
Circuit board, front-end controlling circuit plate, radio frequency connector, the specific steps of the T/R receiving front-end module processing method are as follows:
1) front radio-frequency circuit board is processed, radio frequency circuit board ontology and bottom plate are sintered, burnt on radio frequency circuit board ontology
Radio frequency electric elements are tied, front radio-frequency circuit board is obtained；
2) front-end controlling circuit plate is processed, by control circuit board ontology and control electric elements sintering, obtains front-end control
Circuit board；
3) front radio-frequency circuit board and front-end controlling circuit plate are installed on cavity；
4) front radio-frequency circuit board, front-end controlling circuit plate, radio frequency connector are connected, each of above-mentioned each component can be realized
From function and allomeric function；Complete the processing of T/R receiving front-end module.
When the radio frequency circuit board ontology of the front radio-frequency circuit board and bottom plate are sintered, with silk screen plate by 200 DEG C with
On soldering paste bite at the radio frequency circuit board ontology back side of front radio-frequency circuit board, then bottom plate will be placed on one side with soldering paste
On, front radio-frequency circuit board body is put into temperature together with bottom plate and is sintered on the heating platform between 200 DEG C -260 DEG C, is obtained
To front radio-frequency circuit board.
When being sintered RF welding electric elements on the radio frequency circuit board ontology of the front radio-frequency circuit board, in radio frequency
Soldering paste on point is welded at the pad of radio frequency electric elements in circuit board body, radio frequency electric elements is placed at soldering paste, by radio frequency
Circuit board body and radio frequency electric elements are put into temperature and are sintered on the heating platform between 190 DEG C -240 DEG C, complete radio frequency electrical
The welding of device element.
When by the control circuit board ontology of the front-end controlling circuit plate and control electric elements sintering, in control circuit
Control electric elements, are then placed at soldering paste, will control by soldering paste on point at the pad of welding control electric elements on plate ontology
Circuit board body processed and control electric elements are put into temperature and are sintered on the heating platform between 190 DEG C -240 DEG C, complete control
The sintering of electric elements.
After obtaining the front radio-frequency circuit board, front radio-frequency circuit board is placed on to 40 DEG C -80 DEG C of ABZOL CEG
Brew 3min -10min in CLEANER cleaning agent, then the front radio-frequency circuit board that brew is crossed is placed in dehydrated alcohol and is scrubbed,
Then naturally dry completes the processing of front radio-frequency circuit board.
After obtaining the front-end controlling circuit plate, front radio-frequency circuit board is placed on to 40 DEG C -80 DEG C of ABZOL
The front radio-frequency circuit board that brew is crossed is placed in dehydrated alcohol and brushes by brew 3min -10min in CEG CLEANER cleaning agent
It washes, then naturally dry, completes the processing of front-end controlling circuit plate.
When front radio-frequency circuit board is installed on cavity, front radio-frequency circuit board is placed on cavity, in preceding end-fire
Multiple briquettings are placed on frequency circuit plate, by passing through the screw of briquetting and front radio-frequency circuit board for front radio-frequency circuit board and chamber
Body is fixedly connected.
After the front radio-frequency circuit board and front-end controlling circuit plate is installed on cavity, by front radio-frequency circuit board and
It is welded at the pad of front-end controlling circuit plate overlapping with conducting wire, tin silk welding lead is melted by electric iron；It is molten with electric iron
Melt the micro-strip lap-joint on the probe and front-end controlling circuit plate on solder stick welding radio frequency connector, realizes probe and micro-strip
Connection.
After the front radio-frequency circuit board and front-end controlling circuit plate is installed on cavity, punching electricity is installed on cavity
Hold, front-end controlling circuit plate and feedthrough capacitor are welded into connection with conducting wire with electric iron fusion weld tin silk.
After the front radio-frequency circuit board and front-end controlling circuit plate is installed on cavity, upper cover plate is installed on cavity
And lower cover plate, realize the closing of cavity.
Using technical solution of the present invention, can obtain it is below the utility model has the advantages that
T/R receiving front-end module processing method of the present invention, passes through simple step, it will be able to conveniently and efficiently complete
At the processing of T/R receiving front-end module, the accessory and auxiliary material needed in T/R receiving front-end module process subtracts
It is few, processing cost is effectively reduced while improving processing quality by the above method.At the same time, T/R of the invention
Receiving front-end module processing method great advantage is to can be improved T/R receiving front-end module product qualification rate, is suitable for criticizing
Quantization production T/R receiving front-end module.
Detailed description of the invention
Brief description is made to content expressed by each attached drawing of this specification and the label in figure below:
Fig. 1 is the positive structure schematic of T/R receiving front-end module of the present invention；
Fig. 2 is the structure schematic diagram of T/R receiving front-end module of the present invention；
Attached drawing acceptance of the bid note is respectively as follows: 1, front radio-frequency circuit board；2, front-end controlling circuit plate；3, radio frequency connector；4, bottom
Plate；5, radio frequency electric elements；6, electric elements are controlled；7, cavity；8, briquetting；9, feedthrough capacitor；10, upper cover plate；11, lower cover
Plate.
Specific embodiment
Below against attached drawing, by the description of the embodiment, to for example related each structure of a specific embodiment of the invention
The works such as the shape of part, construction, the mutual alignment between each section and connection relationship, the effect of each section and working principle are further
Detailed description:
As shown in attached drawing 1, attached drawing 2, the present invention is a kind of T/R (Transmitter and Receiver, wireless receiving and dispatching system
System) receiving front-end module processing method, the T/R receiving front-end module includes front radio-frequency circuit board 1, front-end controlling circuit
Plate 2, radio frequency connector 3, the specific steps of the T/R receiving front-end module processing method are as follows:
1) front radio-frequency circuit board 1 is processed, radio frequency circuit board ontology and bottom plate 4 are sintered, on radio frequency circuit board ontology
Radio frequency electric elements 5 are sintered, front radio-frequency circuit board 1 is obtained；
2) front-end controlling circuit plate 2 is processed, control circuit board ontology and control electric elements 6 are sintered, obtains front end control
Circuit board 2 processed；
3) front radio-frequency circuit board 1 and front-end controlling circuit plate 2 are installed on cavity 7；
4) front radio-frequency circuit board 1, front-end controlling circuit plate 2, radio frequency connector 3 are connected, T/R receiving front-end module is completed
Processing.
In the specific steps of above-mentioned T/R receiving front-end module processing method, 1), 2) sequencing of two step can change
Become, has no effect on the processing quality and processing efficiency of T/R receiving front-end module.
T/R receiving front-end module processing method of the present invention, passes through simple step, it will be able to conveniently and efficiently complete
At the processing of T/R receiving front-end module, the accessory and auxiliary material needed in T/R receiving front-end module process subtracts
It is few, processing cost is effectively reduced while improving processing quality by the above method.At the same time, T/R of the invention
Receiving front-end module processing method great advantage is to can be improved T/R receiving front-end module product qualification rate, is suitable for criticizing
Quantization production T/R receiving front-end module.
When the radio frequency circuit board ontology of the front radio-frequency circuit board 1 and bottom plate 4 are sintered, with silk screen plate by 200 DEG C
Above soldering paste is bitten at the radio frequency circuit board ontology back side of front radio-frequency circuit board 1, then will be placed on one side bottom with soldering paste
On plate 4, front radio-frequency circuit board body is put into temperature with bottom plate 4 together and is burnt on the heating platform between 200 DEG C -260 DEG C
Knot, obtains front radio-frequency circuit board 1.
When being sintered RF welding electric elements 5 on the radio frequency circuit board ontology of the front radio-frequency circuit board 1,
Soldering paste on point is welded at the pad of radio frequency electric elements 5 on radio frequency circuit board ontology, and radio frequency electric elements 5 are placed at soldering paste,
Radio frequency circuit board ontology and radio frequency electric elements 5 are put into temperature to be sintered on the heating platform between 190 DEG C -240 DEG C, completed
The welding of radio frequency electric elements 5.
When the control circuit board ontology of the front-end controlling circuit plate 2 and control electric elements 6 are sintered, in control electricity
Soldering paste on point at the pad of welding control electric elements 6, is then placed on soldering paste for control electric elements (6) on the plate ontology of road
Control circuit board ontology and control electric elements 6 are put into temperature and are sintered on the heating platform between 190 DEG C -240 DEG C by place,
Complete the sintering of control electric elements 6.
After obtaining the front radio-frequency circuit board 1, front radio-frequency circuit board 1 is placed on to 40 DEG C -80 DEG C of ABZOL
Brew 3min -10min in CEG CLEANER (n-Propyl Bromide technical grade cleaning agent) cleaning agent, then the front radio-frequency that brew is crossed
Circuit board 1, which is placed in dehydrated alcohol, to be scrubbed, then naturally dry, is completed front radio-frequency circuit board 1 and is processed.
After obtaining the front-end controlling circuit plate 2, front radio-frequency circuit board 1 is placed on to 40 DEG C -80 DEG C of ABZOL
The front radio-frequency circuit board 1 that brew is crossed is placed in dehydrated alcohol and brushes by brew 3min -10min in CEG CLEANER cleaning agent
It washes, then naturally dry, completes front-end controlling circuit plate 2 and process.
When front radio-frequency circuit board 1 is installed on cavity 7, front radio-frequency circuit board 1 is placed on cavity 7, preceding
Multiple briquettings 8 are placed on the radio frequency circuit board 1 of end, by passing through the screw of briquetting 8 and front radio-frequency circuit board 1 for front radio-frequency
Circuit board 1 is fixedly connected with cavity 7.
After the front radio-frequency circuit board 1 and front-end controlling circuit plate 2 is installed on cavity 7, by front radio-frequency circuit
It is welded at the pad that plate 1 and front-end controlling circuit plate 2 are overlapped with conducting wire, tin silk welding lead is melted by electric iron；Electricity consumption
Soldering iron melting scolding tin wire bond meets the micro-strip lap-joint on probe and front-end controlling circuit plate 2 on radio frequency connector 3, realizes and visits
The connection of needle and micro-strip.
After the front radio-frequency circuit board 1 and front-end controlling circuit plate 2 is installed on cavity 7, installed on cavity 7
Front-end controlling circuit plate 2 is welded with feedthrough capacitor 9 with conducting wire with electric iron fusion weld tin silk and is connect by feedthrough capacitor 9.
After the front radio-frequency circuit board 1 and front-end controlling circuit plate 2 is installed on cavity 7, installed on cavity 7
Upper cover plate 10 and lower cover plate 11 realize the closing of cavity 7.
T/R receiving front-end module processing method of the present invention, passes through simple step, it will be able to conveniently and efficiently complete
At the processing of T/R receiving front-end module, the accessory and auxiliary material needed in T/R receiving front-end module process subtracts
It is few, processing cost is effectively reduced while improving processing quality by the above method.At the same time, T/R of the invention
Receiving front-end module processing method great advantage is to can be improved T/R receiving front-end module product qualification rate, is suitable for criticizing
Quantization production T/R receiving front-end module.
T/R receiving front-end module of the invention, which increases briquetting, can reduce electromagnetic interference, keep signal more stable.
Above in conjunction with attached drawing, an exemplary description of the invention, it is clear that concrete implementation of the present invention is not by above-mentioned
The limitation of mode, as long as using the various improvement that the inventive concept and technical scheme of the present invention carry out, or not improved by this
The conception and technical scheme of invention directly apply to other occasions, are within the scope of the invention.
Claims (8)
1. a kind of T/R receiving front-end module processing method, it is characterised in that: the T/R receiving front-end module includes preceding end-fire
Frequency circuit plate (1), front-end controlling circuit plate (2), radio frequency connector (3), the tool of the T/R receiving front-end module processing method
Body step are as follows:
1) front radio-frequency circuit board (1) is processed, radio frequency circuit board ontology and bottom plate (4) is sintered, on radio frequency circuit board ontology
It is sintered radio frequency electric elements (5), obtains front radio-frequency circuit board (1)；
2) front-end controlling circuit plate (2) are processed, by control circuit board ontology and control electric elements (6) sintering, obtains front end control
Circuit board (2) processed；
3) front radio-frequency circuit board (1) and front-end controlling circuit plate (2) are installed on cavity (7)；
4) front radio-frequency circuit board (1), front-end controlling circuit plate (2), radio frequency connector (3) are connected, T/R receiving front-end mould is completed
The processing of block；
When the radio frequency circuit board ontology of the front radio-frequency circuit board (1) and bottom plate (4) are sintered, with silk screen plate by 200 DEG C
Above soldering paste is bitten at the radio frequency circuit board ontology back side of front radio-frequency circuit board (1), then by being placed on one side with soldering paste
On bottom plate (4), front radio-frequency circuit board body and bottom plate (4) are put into heated flat of the temperature between 200 DEG C -260 DEG C together
It is sintered on platform, obtains front radio-frequency circuit board (1)；
When being sintered RF welding electric elements (5) on the radio frequency circuit board ontology of the front radio-frequency circuit board (1), penetrating
Soldering paste on point is welded at the pad of radio frequency electric elements (5) on frequency circuit plate ontology, and radio frequency electric elements (5) are placed on soldering paste
Place, is put into temperature for radio frequency circuit board ontology and radio frequency electric elements (5) and burns on the heating platform between 190 DEG C -240 DEG C
Knot completes the welding of radio frequency electric elements (5).
2. T/R receiving front-end module processing method according to claim 1, it is characterised in that: by the front-end control
When the control circuit board ontology of circuit board (2) and control electric elements (6) sintering, the welding control electricity on control circuit board ontology
Control electric elements (6) is then placed at soldering paste, by control circuit board ontology by soldering paste on point at the pad of device element (6)
Temperature is put into control electric elements (6) to be sintered on the heating platform between 190 DEG C -240 DEG C, completes control electric elements
(6) sintering.
3. T/R receiving front-end module processing method according to claim 1, it is characterised in that: obtain the preceding end-fire
After frequency circuit plate (1), front radio-frequency circuit board (1) is placed on to brew in 40 DEG C -80 DEG C of ABZOL CEG CLEANER cleaning agent
3min -10min, then the front radio-frequency circuit board (1) that brew is crossed is placed in dehydrated alcohol and is scrubbed, then naturally dry, is completed
Front radio-frequency circuit board (1) processing.
4. T/R receiving front-end module processing method according to claim 1, it is characterised in that: obtain the front end control
After circuit board (2) processed, front radio-frequency circuit board (1) is placed in 40 DEG C -80 DEG C of ABZOL CEG CLEANER cleaning agent
The front radio-frequency circuit board (1) that brew is crossed is placed in dehydrated alcohol and scrubs, then naturally dry by brew 3min -10min,
Complete front-end controlling circuit plate (2) processing.
5. T/R receiving front-end module processing method according to claim 1, it is characterised in that: by front radio-frequency circuit board
(1) when being installed on cavity (7), front radio-frequency circuit board (1) is placed on cavity (7), on front radio-frequency circuit board (1)
Place multiple briquettings (8), by pass through the screw of briquetting (8) and front radio-frequency circuit board (1) by front radio-frequency circuit board (1) and
Cavity (7) is fixedly connected.
6. T/R receiving front-end module processing method according to claim 2, it is characterised in that: the front radio-frequency electricity
After road plate (1) and front-end controlling circuit plate (2) are installed on cavity (7), by front radio-frequency circuit board (1) and front-end controlling circuit
It is welded at the pad of plate (2) overlapping with conducting wire, tin silk welding lead is melted by electric iron；With electric iron fusion weld tin wire bond
The probe on radio frequency connector (3) and the micro-strip lap-joint on front-end controlling circuit plate (2) are met, realizes the company of probe and micro-strip
It connects.
7. T/R receiving front-end module processing method according to claim 1, it is characterised in that: the front radio-frequency electricity
After road plate (1) and front-end controlling circuit plate (2) are installed on cavity (7), feedthrough capacitor (9) are installed on cavity (7), electricity consumption is ironed
Iron melting solder stick welds front-end controlling circuit plate (2) with feedthrough capacitor (9) with conducting wire to be connect.
8. T/R receiving front-end module processing method according to claim 1, it is characterised in that: the front radio-frequency electricity
After road plate (1) and front-end controlling circuit plate (2) are installed on cavity (7), upper cover plate (10) and lower cover plate are installed on cavity (7)
(11), the closing of cavity (7) is realized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610970087.4A CN106535497B (en) | 2016-11-04 | 2016-11-04 | A kind of T/R receiving front-end module processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610970087.4A CN106535497B (en) | 2016-11-04 | 2016-11-04 | A kind of T/R receiving front-end module processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106535497A CN106535497A (en) | 2017-03-22 |
| CN106535497B true CN106535497B (en) | 2019-04-30 |
Family
ID=58326113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610970087.4A Active CN106535497B (en) | 2016-11-04 | 2016-11-04 | A kind of T/R receiving front-end module processing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106535497B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107271976A (en) * | 2017-06-21 | 2017-10-20 | 安徽华东光电技术研究所 | The preparation method of S-band frequency synthesizer |
| CN107708400A (en) * | 2017-09-01 | 2018-02-16 | 安徽华东光电技术研究所 | Power connects the processing method of pulse amplifier in X-band |
| CN108112184B (en) * | 2017-11-02 | 2020-08-04 | 安徽华东光电技术研究所 | Manufacturing method of S-band 100-watt pulse power amplifier |
| CN109343014B (en) * | 2018-11-23 | 2022-03-18 | 四川九洲电器集团有限责任公司 | Apparatus and method for testing T/R component of phased array radar |
| CN109688725B (en) * | 2018-12-10 | 2021-08-24 | 安徽华东光电技术研究所有限公司 | Manufacturing method of K1 waveband frequency source module |
| CN109451678A (en) * | 2018-12-11 | 2019-03-08 | 安徽华东光电技术研究所有限公司 | A kind of production method of KU wave band 40W power amplifier module |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1069639B1 (en) * | 1999-06-29 | 2006-04-26 | Mitsubishi Denki Kabushiki Kaisha | Radio-frequency circuit module |
| JP4639512B2 (en) * | 2001-04-06 | 2011-02-23 | パナソニック株式会社 | Wireless communication module |
| US8847617B2 (en) * | 2011-04-22 | 2014-09-30 | Apple Inc. | Non-contact test system for determining whether electronic device structures contain manufacturing faults |
| CN103824816B (en) * | 2014-02-24 | 2016-08-24 | 中国兵器工业集团第二一四研究所苏州研发中心 | A kind of T/R assembly integration air-tight packaging structure of resistant to overload |
| CN205105201U (en) * | 2015-11-18 | 2016-03-23 | 成都雷电微力科技有限公司 | Miniaturized superintegration TR modular structure |
| CN105530017B (en) * | 2015-11-27 | 2018-07-03 | 安徽华东光电技术研究所 | Method for manufacturing receiving front end of broadband receiving and transmitting system |
-
2016
- 2016-11-04 CN CN201610970087.4A patent/CN106535497B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN106535497A (en) | 2017-03-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106535497B (en) | A kind of T/R receiving front-end module processing method | |
| CN107367713A (en) | Manufacturing and processing method of front-end module of K2 waveband receiver | |
| CN204516832U (en) | The multi-functional sampling terminal structure of battery pack | |
| CN201698781U (en) | Transition piece for medium-voltage reactive power compensation equipment | |
| CN106341125B (en) | Coaxial medium oscillation source processing method | |
| CN101750541A (en) | Radio frequency identification electronic label antenna complex impedance test device and method | |
| CN109688725B (en) | Manufacturing method of K1 waveband frequency source module | |
| CN205428913U (en) | Power semiconductor module | |
| CN105880819B (en) | Hot pressing electric resistance welding micro welding contact welding machine | |
| CN205122762U (en) | Antenna and communication equipment | |
| CN102305812B (en) | Method for detecting dispersion effect of lithium ion battery slurry on line | |
| CN104923880B (en) | CA cable assembly automation welding control system device | |
| CN103281144A (en) | Method for testing wireless performance of wireless product | |
| CN104384647A (en) | Consistent welding method for ultra-small Schottky diode and quartz substrate film circuit | |
| CN205629688U (en) | Resistance welds device with ultrasonic wave composite forming | |
| CN204882626U (en) | Semiconductor component's test centre gripping frock | |
| CN203288763U (en) | Broadband GPS combined antenna | |
| CN103682930A (en) | Lead wire connecting method and radio frequency antenna | |
| CN203076746U (en) | Reflow soldering machine and temperature measurement system thereof | |
| CN107369872B (en) | Processing method of improved ceramic coupler | |
| CN202662828U (en) | Welded type connector | |
| CN208208951U (en) | A kind of X-band high-isolation coupler | |
| CN207265238U (en) | Connection structure | |
| CN204747708U (en) | Cable subassembly automatic weld controlling means | |
| CN202903364U (en) | Temperature measurement insulating plug |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190419 Address after: 241000 Emshan Road, Yijiang District, Wuhu City, Anhui Province Patentee after: Anhui Huadong Photoelectric Technology Research Institute Co., Ltd. Address before: 241000 Two High-tech Industrial Development Zones in Yijiang District, Wuhu City, Anhui Province Patentee before: Anhui Huadong Photoelectric Industry Research Institute Co., Ltd. |
|
| TR01 | Transfer of patent right |