CN106341125B - Coaxial medium oscillation source processing method - Google Patents
Coaxial medium oscillation source processing method Download PDFInfo
- Publication number
- CN106341125B CN106341125B CN201610769391.2A CN201610769391A CN106341125B CN 106341125 B CN106341125 B CN 106341125B CN 201610769391 A CN201610769391 A CN 201610769391A CN 106341125 B CN106341125 B CN 106341125B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- oscillating circuit
- cavity
- phase lock
- mixing phase
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000010355 oscillation Effects 0.000 title claims abstract description 70
- 238000003672 processing method Methods 0.000 title claims abstract description 28
- 238000002156 mixing Methods 0.000 claims abstract description 57
- 238000010438 heat treatment Methods 0.000 claims abstract description 30
- 238000003466 welding Methods 0.000 claims abstract description 7
- 229910000679 solder Inorganic materials 0.000 claims abstract description 5
- 238000005476 soldering Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 14
- 238000002955 isolation Methods 0.000 claims description 11
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 229960000935 dehydrated alcohol Drugs 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000012459 cleaning agent Substances 0.000 claims description 3
- 239000000155 melt Substances 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 230000000712 assembly Effects 0.000 claims 2
- 238000000429 assembly Methods 0.000 claims 2
- 239000012212 insulator Substances 0.000 claims 1
- 238000004891 communication Methods 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000005245 sintering Methods 0.000 abstract description 3
- 238000010923 batch production Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000012797 qualification Methods 0.000 description 5
- 230000005611 electricity Effects 0.000 description 2
- CYNYIHKIEHGYOZ-UHFFFAOYSA-N 1-bromopropane Chemical compound CCCBr CYNYIHKIEHGYOZ-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 208000032365 Electromagnetic interference Diseases 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03L—AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
- H03L7/00—Automatic control of frequency or phase; Synchronisation
- H03L7/06—Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop
- H03L7/08—Details of the phase-locked loop
- H03L7/099—Details of the phase-locked loop concerning mainly the controlled oscillator of the loop
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03D—DEMODULATION OR TRANSFERENCE OF MODULATION FROM ONE CARRIER TO ANOTHER
- H03D7/00—Transference of modulation from one carrier to another, e.g. frequency-changing
- H03D7/16—Multiple-frequency-changing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a coaxial medium oscillation source processing method applied to the technical field of radar technology and microwave communication, which comprises the following steps: 1) welding an oscillating electrical appliance element (3) on the oscillating circuit board body, connecting the oscillating circuit board assembly (1) with the cavity (4), and then placing the oscillating circuit board assembly (1) and the cavity (4) on a heating platform for sintering; 2) solder paste is dotted on a pad of the harmonic mixing phase-locked circuit board body, the harmonic electric appliance element (5) is placed at the solder paste, and the harmonic mixing phase-locked circuit board body and the harmonic electric appliance element (5) are placed on a heating platform for sintering; 3) the processing method of the coaxial medium oscillation source is simple in steps, can conveniently and quickly complete the processing of the coaxial medium oscillation source, improves the product percent of pass of the coaxial medium oscillation source, and is suitable for batch production.
Description
Technical field
The invention belongs to Radar Technology and technical field of micro communication, are to be related to a kind of coaxial dielectric vibration more specifically
Swing source processing method.
Background technique
With the appearance of modern telecommunication systems and modern radar system, in Radar Technology and microwave communication techniques, it is desirable that
Signal source and local vibration source have frequency stability and excellent frequency agility performance, due to coaxial dielectric oscillation source have it is small-sized
The features such as change, Gao Kangzhen, frequency stabilization, can do local oscillator use in communication systems such as radars, be the important of certain model satellite communication system
Component.Coaxial dielectric oscillation source product processing method in the prior art: each circuit function is integrated in whole circuit board, circuit
Plate suqare is big, and when circuit board and cavity are sintered, penetration rate is unqualified, and there are also electromagnetic interferences between each circuit, and frequency stability is poor,
It is unable to satisfy demand.
Summary of the invention
The technical problems to be solved by the present invention are: in view of the deficiencies of the prior art, it is simple to provide a kind of step, cost
It is low, can the processing of convenient and efficient completion coaxial dielectric oscillation source, improve coaxial dielectric oscillation source product qualification rate, be suitable for simultaneously
The coaxial dielectric oscillation source processing method of mass production coaxial dielectric oscillation source.
Solve the problems, such as techniques discussed above, the technical scheme adopted by the invention is as follows:
The present invention is a kind of coaxial dielectric oscillation source processing method, and the coaxial dielectric oscillation source includes oscillating circuit board
Component, harmonic mixing phase lock circuitry board group part, cavity, oscillating circuit board component include oscillating circuit board ontology, harmonic mixing lock
Circuitry phase board group part includes harmonic mixing phase lock circuitry plate ontology, the specific processing of the coaxial dielectric oscillation source processing method
Step are as follows:
1) the welding oscillation electric elements on oscillating circuit board ontology, oscillating circuit board ontology and oscillation electric elements are formed
Oscillating circuit board component is connect by oscillating circuit board component with cavity, then oscillating circuit board component and cavity are placed on heated flat
Platform is sintered;
2) soldering paste on point at the pad of harmonic mixing phase lock circuitry plate ontology, by harmonic wave electric elements (be placed at soldering paste,
Harmonic mixing phase lock circuitry plate ontology is placed on heating platform with harmonic wave electric elements to be sintered, harmonic mixing phase lock circuitry plate
Ontology and harmonic wave electric elements form harmonic mixing phase lock circuitry board group part, and harmonic mixing phase lock circuitry board group part is mounted on chamber
On body;
3) oscillating circuit board component and harmonic mixing phase lock circuitry board group part are connected by connecting wire, completes coaxial dielectric
The processing of oscillation source.
The oscillating circuit board component includes oscillating circuit board ontology I and oscillating circuit board ontology II, oscillating circuit board
When component is connect with cavity, soldering paste is bitten at II back side of I back side of oscillating circuit board ontology and oscillating circuit board ontology, will be vibrated
Circuit board body I and oscillating circuit board ontology II are placed in the cavity, and oscillating circuit board component and cavity are placed on temperature 220
It is sintered on heating platform between DEG C -280 DEG C.
Respectively welding oscillation is electric on the oscillating circuit board ontology I and oscillating circuit board ontology II of the oscillating circuit board component
Device element, connecting wire includes multiple RF isolation and multiple power-up needles, when oscillating circuit board component is connect with cavity, first
Multiple RF isolation, multiple power-up needles are set on oscillating circuit board component, then again by oscillating circuit board component and cavity
Temperature is placed on together to be sintered on the heating platform between 220 DEG C -280 DEG C.
It, will when the harmonic mixing phase lock circuitry plate ontology and harmonic wave electric elements being placed on heating platform being sintered
Harmonic mixing phase lock circuitry plate ontology and harmonic wave electric elements are placed on temperature and burn on the heating platform between 220 DEG C -280 DEG C
Harmonic mixing phase lock circuitry board group part, is then mounted on cavity by knot again.
The oscillating circuit board component and cavity are placed on after heating platform is sintered, by oscillating circuit board component and chamber
Body is placed on temperature brew 5min -15min in the ABZOL CEG CLEANER cleaning agent between 40 DEG C -80 DEG C, then by brew
The oscillating circuit board component crossed is placed in dehydrated alcohol with cavity to be scrubbed, then naturally dry.
Harmonic mixing phase lock circuitry plate ontology and harmonic wave electric elements are formed harmonic mixing phase lock circuitry board group part to be placed on
After heating platform is sintered, harmonic mixing phase lock circuitry board group part is placed in dehydrated alcohol and is scrubbed, then naturally dry.
The oscillating circuit board component that multiple power-up needles are arranged is placed on temperature adding between 220 DEG C -280 DEG C together with cavity
After being sintered on hot platform, power-up needle is placed into the fixation position on cavity, will be arranged by the spot printing soldering paste on the outside of each power-up needle
The oscillating circuit board component of power-up needle is put into temperature and preheats 3-15 minutes on the heating platform between 130 DEG C -180 DEG C, with temperature
The hot-air syringe between 350 DEG C -450 DEG C is spent against being powered at the solder(ing) paste of needle, until melts soldering tin, completion power-up needle is fixed to pacify
Dress.
The circuit board body I of swinging of the oscillating circuit board component is connect by conducting wire with multiple power-up needles, oscillating circuit
The circuit board body II of swinging of board group part is connect by conducting wire with multiple power-up needles, and power-up needle and the harmonic wave for swinging circuit board body I are mixed
The connection of frequency phase lock circuitry board group part, the power-up needle for swinging circuit board body II is connected to harmonic mixing phase lock circuitry board group part, multiple
RF isolation is connect with the circuit board body II of swinging of oscillating circuit board component, swings multiple RF isolations in circuit board body II
Son is connect with harmonic mixing phase lock circuitry board group part.
Capping and lower capping are also set up on the cavity of the coaxial dielectric oscillation source, and upper capping is swashed with cavity
Lower capping is carried out laser capping with cavity by light capping.
Using technical solution of the present invention, can obtain it is below the utility model has the advantages that
Coaxial dielectric oscillation source processing method of the present invention, passes through simple step, it will be able to conveniently and efficiently complete
At coaxial dielectric oscillation product-derived processing, and the accessory needed in coaxial dielectric oscillation source process and auxiliary material
Material is reduced, and effectively reduces processing cost while improving processing quality by the above method.At the same time, of the invention
The great advantage of coaxial dielectric oscillation source processing method is to can be improved coaxial dielectric oscillation source product qualification rate, be suitable for
Mass production coaxial dielectric oscillation source.
Detailed description of the invention
Brief description is made to content expressed by each attached drawing of this specification and the label in figure below:
Fig. 1 is the positive structure schematic of coaxial dielectric oscillation source of the present invention;
Fig. 2 is the structure schematic diagram of coaxial dielectric oscillation source of the present invention;
Attached drawing acceptance of the bid note is respectively as follows: 1, oscillating circuit board component;2, harmonic mixing phase lock circuitry board group part;3, electric appliance is vibrated
Element;4, cavity;5, harmonic wave electric elements;6, RF isolation;7, it is powered on needle;8, upper capping;9, lower capping.
Specific embodiment
Below against attached drawing, by the description of the embodiment, to for example related each structure of a specific embodiment of the invention
The works such as the shape of part, construction, the mutual alignment between each section and connection relationship, the effect of each section and working principle are further
Detailed description:
As shown in attached drawing 1, attached drawing 2, the present invention is a kind of coaxial dielectric oscillation source processing method, the coaxial dielectric vibration
Swinging source includes oscillating circuit board component 1, harmonic mixing phase lock circuitry board group part 2, cavity 4, and oscillating circuit board component 1 includes oscillation
Circuit board body, harmonic mixing phase lock circuitry board group part 2 include harmonic mixing phase lock circuitry plate ontology, the coaxial dielectric vibration
Swing the specific procedure of processing of source processing method are as follows:
1) the welding oscillation electric elements 3 on oscillating circuit board ontology, oscillating circuit board ontology and oscillation 3 shape of electric elements
At oscillating circuit board component 1, oscillating circuit board component 1 is connect with cavity 4, then oscillating circuit board component 1 and cavity 4 are placed on
Heating platform is sintered;
2) soldering paste on point at the pad of harmonic mixing phase lock circuitry plate ontology, harmonic wave electric elements 5 are placed at soldering paste,
Harmonic mixing phase lock circuitry plate ontology is placed on heating platform with harmonic wave electric elements 5 to be sintered, harmonic mixing phase lock circuitry
Plate ontology and harmonic wave electric elements 5 form harmonic mixing phase lock circuitry board group part 2, and harmonic mixing phase lock circuitry board group part 2 is pacified
On cavity 4;
3) oscillating circuit board component 1 and harmonic mixing phase lock circuitry board group part 2 are connected by connecting wire, completes coaxial be situated between
The processing of matter oscillation source.
Coaxial dielectric oscillation source processing method of the present invention, passes through simple step, it will be able to conveniently and efficiently complete
At coaxial dielectric oscillation product-derived processing, and the accessory needed in coaxial dielectric oscillation source process and auxiliary material
Material is reduced, and effectively reduces processing cost while improving processing quality by the above method.At the same time, of the invention
The great advantage of coaxial dielectric oscillation source processing method is to can be improved coaxial dielectric oscillation source product qualification rate, be suitable for
Mass production coaxial dielectric oscillation source.
The oscillating circuit board component 1 includes oscillating circuit board ontology I and oscillating circuit board ontology II, oscillating circuit board
When component 1 is connect with cavity 4, soldering paste is bitten at II back side of I back side of oscillating circuit board ontology and oscillating circuit board ontology, will be shaken
It swings circuit board body I and oscillating circuit board ontology II is placed in cavity 4, oscillating circuit board component 1 and cavity 4 are placed on temperature
It is sintered on heating platform between 220 DEG C -280 DEG C.In this way, just simply and reliablely completing oscillating circuit board component 1 and chamber
Body assembles.
Respectively welding oscillation is electric on the oscillating circuit board ontology I and oscillating circuit board ontology II of the oscillating circuit board component
Device element, connecting wire includes multiple RF isolation 6 and multiple power-up needles 7, when oscillating circuit board component is connect with cavity,
First multiple RF isolation 6, multiple power-up needles are set in oscillating circuit board group 1, then again by oscillating circuit board component 1 and chamber
Body 4 is placed on temperature together and is sintered on the heating platform between 220 DEG C -280 DEG C.
When the harmonic mixing phase lock circuitry plate ontology and harmonic wave electric elements 5 being placed on heating platform being sintered,
Harmonic mixing phase lock circuitry plate ontology and harmonic wave electric elements 5 are placed on temperature on the heating platform between 220 DEG C -280 DEG C
Harmonic mixing phase lock circuitry board group part 2, is then mounted on cavity 4 by sintering again.In this way, just completing harmonic mixing locking phase electricity
Road board group part 2 is assembled with cavity.
The oscillating circuit board component 1 and cavity 4 are placed on after heating platform is sintered, by oscillating circuit board component 1
ABZOL CEG CLEANER ((n-Propyl Bromide technical grade cleaning agent)) of the temperature between 40 DEG C -80 DEG C is placed on cavity 4 to clean
Brew 5min -15min in agent, then the oscillating circuit board component 1 that brew is crossed is placed in dehydrated alcohol with cavity 4 and is scrubbed, then
Naturally dry.By cleaning and brew, the rosin being stained on oscillating circuit board component 1 and cavity 4 when processing can be cleaned dry
Only, guarantee the quality of product.
Harmonic mixing phase lock circuitry plate ontology and harmonic wave electric elements 5 are formed harmonic mixing phase lock circuitry board group part 2 to put
After heating platform is sintered, harmonic mixing phase lock circuitry board group part 2 is placed in dehydrated alcohol and is scrubbed, is then dried in the air naturally
It is dry.
The oscillating circuit board component 1 that multiple power-up needles 7 are arranged is placed on temperature between 220 DEG C -280 DEG C with cavity 4 together
Heating platform on be sintered after, in each 7 outside spot printing soldering paste of power-up needle, needle 7 will be powered on and be placed into the fixed bit on cavity 4
It sets, the oscillating circuit board component 1 of setting power-up needle 7 is put into temperature and preheats 3- on the heating platform between 130 DEG C -180 DEG C
15 minutes, with hot-air syringe of the temperature between 350 DEG C -450 DEG C against being powered at the solder(ing) paste of needle 7, until melts soldering tin, is completed
Needle 7 is powered on to be fixedly mounted.
The circuit board body I of swinging of the oscillating circuit board component 1 is connect by conducting wire with multiple power-up needles 7, oscillation electricity
The circuit board body II of swinging of road board group part 1 is connect by conducting wire with multiple power-up needles 7, swing the power-up needle 7 of circuit board body I with it is humorous
Wave mixing phase lock circuitry board group part 2 is connected to, and the power-up needle 7 and harmonic mixing phase lock circuitry board group part 2 for swinging circuit board body II connect
Logical, multiple RF isolation 6 are connect with the circuit board body II of swinging of oscillating circuit board component 1, are swung more in circuit board body II
A RF isolation 6 is connect with harmonic mixing phase lock circuitry board group part 2.
Capping 8 and lower capping 9 are also set up on the cavity 4 of the coaxial dielectric oscillation source, by upper capping 8 and cavity 4
Laser capping is carried out, lower capping 9 is subjected to laser capping with cavity 4.The setting of upper capping 8 and lower capping 9, realizes coaxial Jie
The reliable sealing of matter oscillation source, it is ensured that inside cavity part is protected.
Coaxial dielectric oscillation source processing method of the present invention, passes through simple step, it will be able to conveniently and efficiently complete
At coaxial dielectric oscillation product-derived processing, and the accessory needed in coaxial dielectric oscillation source process and auxiliary material
Material is reduced, and effectively reduces processing cost while improving processing quality by the above method.At the same time, of the invention
The great advantage of coaxial dielectric oscillation source processing method is to can be improved coaxial dielectric oscillation source product qualification rate, be suitable for
Mass production coaxial dielectric oscillation source.
Coaxial dielectric oscillation source processing method of the present invention, the coaxial dielectric oscillation product-derived produced, Ge Xiangji
Art performance indicator is all satisfied machine requirement, and this fabrication processing is simple, and equipment investment is small, is applicable in and produces in enormous quantities.With this
Meanwhile the production technique of coaxial dielectric oscillation source processing method of the present invention is more scientific practical, product qualification rate
It improves, provides powerful guarantee for mass production.
The coaxial dielectric oscillation source that coaxial dielectric oscillation source processing method of the invention processes, each functional circuit separate
Change, may make that electromagnetic interference is reduced between each circuit, frequency stability improves.
Above in conjunction with attached drawing, an exemplary description of the invention, it is clear that concrete implementation of the present invention is not by above-mentioned
The limitation of mode, as long as using the various improvement that the inventive concept and technical scheme of the present invention carry out, or not improved by this
The conception and technical scheme of invention directly apply to other occasions, are within the scope of the invention.
Claims (8)
1. a kind of coaxial dielectric oscillation source processing method, it is characterised in that: the coaxial dielectric oscillation source includes oscillating circuit
Board group part (1), harmonic mixing phase lock circuitry board group part (2), cavity (4), oscillating circuit board component (1) include oscillating circuit board sheet
Body, harmonic mixing phase lock circuitry board group part (2) include harmonic mixing phase lock circuitry plate ontology, and the coaxial dielectric oscillation source adds
The specific procedure of processing of work method are as follows:
1) welding oscillation electric elements (3) on oscillating circuit board ontology, oscillating circuit board ontology and oscillation electric elements (3) shape
At oscillating circuit board component (1), oscillating circuit board component (1) is connect with cavity (4), then by oscillating circuit board component (1) with
Cavity (4) is placed on heating platform and is sintered;
2) soldering paste on point at the pad of harmonic mixing phase lock circuitry plate ontology, harmonic wave electric elements (5) are placed at soldering paste, will
Harmonic mixing phase lock circuitry plate ontology is placed on heating platform with harmonic wave electric elements (5) and is sintered, harmonic mixing phase lock circuitry
Plate ontology and harmonic wave electric elements (5) form harmonic mixing phase lock circuitry board group part (2), by harmonic mixing phase lock circuitry board group part
(2) it is mounted on cavity (4);
3) by connecting wire connection oscillating circuit board component (1) and harmonic mixing phase lock circuitry board group part (2), coaxial be situated between is completed
The processing of matter oscillation source;
The oscillating circuit board component (1) includes oscillating circuit board ontology I and oscillating circuit board ontology II, oscillating circuit board group
When part (1) is connect with cavity (4), soldering paste is bitten at II back side of I back side of oscillating circuit board ontology and oscillating circuit board ontology, it will
Oscillating circuit board ontology I and oscillating circuit board ontology II are placed in cavity (4), by oscillating circuit board component (1) and cavity (4)
It is placed on 220 DEG C -280 DEG C of heating platform and is sintered.
2. coaxial dielectric oscillation source processing method according to claim 1, it is characterised in that: the oscillating circuit board group
Respectively welding oscillation electric elements (3), connecting wire include on the oscillating circuit board ontology I and oscillating circuit board ontology II of part (1)
Multiple RF isolations (6) and multiple power-up needles (7) when connecting oscillating circuit board component (1) with cavity (4), are first being vibrated
Multiple RF isolations (6), multiple power-up needles (7) are set on circuit board assemblies (1), then again by oscillating circuit board component (1)
It is placed on 220 DEG C -280 DEG C of heating platform and is sintered together with cavity (4).
3. coaxial dielectric oscillation source processing method according to claim 1, it is characterised in that: lock the harmonic mixing
When circuitry phase plate ontology and harmonic wave electric elements (5) are placed on heating platform and are sintered, by harmonic mixing phase lock circuitry plate ontology
It is placed on 220 DEG C -280 DEG C of heating platform and is sintered with harmonic wave electric elements (5), then again by harmonic mixing phase lock circuitry board group
Part (2) is mounted on cavity (4).
4. coaxial dielectric oscillation source processing method according to claim 1, it is characterised in that: the oscillating circuit board group
Part (1) and cavity (4) are placed on after heating platform is sintered, and oscillating circuit board component (1) and cavity (4) is placed on 40 DEG C -80
DEG C ABZOL CEG CLEANER cleaning agent in brew 5min -15min, then oscillating circuit board component (1) that brew is crossed with
Cavity (4), which is placed in dehydrated alcohol, to be scrubbed, then naturally dry.
5. coaxial dielectric oscillation source processing method according to claim 1, it is characterised in that: by harmonic mixing phase lock circuitry
Plate ontology and harmonic wave electric elements (5) form harmonic mixing phase lock circuitry board group part (2) and are placed on after heating platform is sintered, will
Harmonic mixing phase lock circuitry board group part (2), which is placed in dehydrated alcohol, to be scrubbed, then naturally dry.
6. coaxial dielectric oscillation source processing method according to claim 2, it is characterised in that: the multiple power-up needles (7) of setting
Oscillating circuit board component (1) and cavity (4) be placed on together on 220 DEG C -280 DEG C of heating platform be sintered after, in each power-up
Power-up needle (7) is placed into the fixation position on cavity (4) by spot printing soldering paste on the outside of needle (7), by the oscillation of setting power-up needle (7)
Circuit board assemblies (1) are put on the heating platform that temperature is 130 DEG C -180 DEG C and preheat 3-15 minutes, are 350 DEG C -450 with temperature
DEG C hot-air syringe against at the solder(ing) paste of power-up needle (7), until melts soldering tin, complete power-up needle (7) and be fixedly mounted.
7. coaxial dielectric oscillation source processing method according to claim 2, it is characterised in that: the oscillating circuit board group
The circuit board body I of swinging of part (1) is connect by conducting wire with multiple power-up needles (7), and oscillating circuit board component (1) swings circuit board sheet
Body II is connect by conducting wire with multiple power-up needles (7), and the power-up needle (7) and harmonic mixing phase lock circuitry plate of circuit board body I are swung
Component (2) connection, the power-up needle (7) for swinging circuit board body II are connected to harmonic mixing phase lock circuitry board group part (2), multiple radio frequencies
Insulator (6) is connect with the circuit board body II of swinging of oscillating circuit board component (1), and the multiple radio frequencies swung in circuit board body II are exhausted
Edge (6) is connect with harmonic mixing phase lock circuitry board group part (2).
8. coaxial dielectric oscillation source processing method according to claim 1, it is characterised in that: the coaxial dielectric oscillation
Also set up capping (8) and lower capping (9) on the cavity (4) in source, upper capping (8) and cavity (4) be subjected to laser capping, will under
It covers (9) and cavity (4) and carries out laser capping.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610769391.2A CN106341125B (en) | 2016-08-30 | 2016-08-30 | Coaxial medium oscillation source processing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610769391.2A CN106341125B (en) | 2016-08-30 | 2016-08-30 | Coaxial medium oscillation source processing method |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106341125A CN106341125A (en) | 2017-01-18 |
CN106341125B true CN106341125B (en) | 2019-03-12 |
Family
ID=57823354
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610769391.2A Active CN106341125B (en) | 2016-08-30 | 2016-08-30 | Coaxial medium oscillation source processing method |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106341125B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107395197B (en) * | 2017-06-21 | 2020-11-17 | 安徽华东光电技术研究所 | Manufacturing and processing method of phase-locked frequency source |
CN107395122A (en) * | 2017-06-21 | 2017-11-24 | 安徽华东光电技术研究所 | The preparation method of phase lock dielectric oscillator module |
CN107396546A (en) * | 2017-06-22 | 2017-11-24 | 中科迪高微波系统有限公司 | The preparation method of miniaturization lock same axis medium Microwave Frequency Source |
CN108112184B (en) * | 2017-11-02 | 2020-08-04 | 安徽华东光电技术研究所 | Manufacturing method of S-band 100-watt pulse power amplifier |
CN108155452B (en) * | 2017-11-08 | 2019-08-20 | 安徽华东光电技术研究所 | A kind of assembling and setting device and method for microwave coaxial medium oscillating circuit |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3858121A (en) * | 1972-08-25 | 1974-12-31 | Hitachi Ltd | Solid state microwave oscillator with stabilizing resonator and afc loop |
CN1119352A (en) * | 1994-08-02 | 1996-03-27 | 松下电器产业株式会社 | Microwave oscilator and making of same |
JPH10285027A (en) * | 1997-04-03 | 1998-10-23 | Sony Tektronix Corp | Pll oscillation circuit |
CN101662259A (en) * | 2009-09-18 | 2010-03-03 | 河北博威集成电路有限公司 | Integrated coaxial dielectric voltage controlled oscillator and manufacturing method thereof |
CN201789489U (en) * | 2010-07-14 | 2011-04-06 | 安徽华东光电技术研究所 | Ultra-low-phase noise digital phase locking coaxial dielectric oscillator |
CN102739243A (en) * | 2012-06-29 | 2012-10-17 | 安徽华东光电技术研究所 | Low phase noise phase-locked medium oscillator |
-
2016
- 2016-08-30 CN CN201610769391.2A patent/CN106341125B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3858121A (en) * | 1972-08-25 | 1974-12-31 | Hitachi Ltd | Solid state microwave oscillator with stabilizing resonator and afc loop |
CN1119352A (en) * | 1994-08-02 | 1996-03-27 | 松下电器产业株式会社 | Microwave oscilator and making of same |
JPH10285027A (en) * | 1997-04-03 | 1998-10-23 | Sony Tektronix Corp | Pll oscillation circuit |
CN101662259A (en) * | 2009-09-18 | 2010-03-03 | 河北博威集成电路有限公司 | Integrated coaxial dielectric voltage controlled oscillator and manufacturing method thereof |
CN201789489U (en) * | 2010-07-14 | 2011-04-06 | 安徽华东光电技术研究所 | Ultra-low-phase noise digital phase locking coaxial dielectric oscillator |
CN102739243A (en) * | 2012-06-29 | 2012-10-17 | 安徽华东光电技术研究所 | Low phase noise phase-locked medium oscillator |
Also Published As
Publication number | Publication date |
---|---|
CN106341125A (en) | 2017-01-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106341125B (en) | Coaxial medium oscillation source processing method | |
CN103551690B (en) | Manufacturing method of amplitude limiter | |
CN107367713A (en) | Manufacturing and processing method of front-end module of K2 waveband receiver | |
CN106572607A (en) | Process manufacturing method of solid-state microwave source | |
CN106535497B (en) | A kind of T/R receiving front-end module processing method | |
WO2015013880A1 (en) | Wireless terminal | |
CN109688725A (en) | The production method of K1 audio range frequency source module | |
CN109451678A (en) | A kind of production method of KU wave band 40W power amplifier module | |
CN110266279A (en) | A kind of manufacture craft of 6 watts of power amplifiers of C-band | |
US2555443A (en) | Radio apparatus employing slot antenna | |
CN108462491A (en) | Local oscillator source module processing method on Ku audio range frequency synthesizers | |
CN107395197B (en) | Manufacturing and processing method of phase-locked frequency source | |
CN109673104A (en) | Pumping signal module processing method on frequency synthesizer | |
CN109600934A (en) | A kind of production method of KU waveband high-gain amplifier | |
CN204834853U (en) | High bandwidth planar antenna | |
CN204349969U (en) | A kind of Ku wave band dielectric oscillator | |
CN108155452B (en) | A kind of assembling and setting device and method for microwave coaxial medium oscillating circuit | |
CN209183726U (en) | Antenna for base station and its oscillator structure | |
CN208848754U (en) | A kind of frequency microwave multilayer ceramic capacitor micro-strip mounting structure | |
CN102881978A (en) | Waveguide filter with welding structure | |
WO2016165113A1 (en) | Slot antenna and mobile terminal | |
CN107318259A (en) | The preparation method of doubleway output crystal oscillator | |
CN205160486U (en) | Thermistor piezoelectric quartz crystal syntonizer | |
Wen et al. | A low-profile and wideband monopolar circular via-loaded patch antenna coupled with via-loaded ring | |
WO2016019582A1 (en) | Antenna device and terminal |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 241000 No.01 Eshan Road, high tech Development Zone, Yijiang District, Wuhu City, Anhui Province Patentee after: ANHUI HUADONG PHOTOELECTRIC TECHNOLOGY INSTITUTE Co.,Ltd. Address before: 241000 Anhui Province, Wuhu city Yijiang District South high tech Development Zone Technology Park mansion Patentee before: Anhui Huadong Polytechnic Institute |