CN106341125B - Coaxial medium oscillation source processing method - Google Patents

Coaxial medium oscillation source processing method Download PDF

Info

Publication number
CN106341125B
CN106341125B CN201610769391.2A CN201610769391A CN106341125B CN 106341125 B CN106341125 B CN 106341125B CN 201610769391 A CN201610769391 A CN 201610769391A CN 106341125 B CN106341125 B CN 106341125B
Authority
CN
China
Prior art keywords
circuit board
oscillating circuit
cavity
phase lock
mixing phase
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201610769391.2A
Other languages
Chinese (zh)
Other versions
CN106341125A (en
Inventor
汪宁
洪火烽
何宏玉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anhui East China Institute of Optoelectronic Technology
Original Assignee
Anhui Huadong Polytechnic Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anhui Huadong Polytechnic Institute filed Critical Anhui Huadong Polytechnic Institute
Priority to CN201610769391.2A priority Critical patent/CN106341125B/en
Publication of CN106341125A publication Critical patent/CN106341125A/en
Application granted granted Critical
Publication of CN106341125B publication Critical patent/CN106341125B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03LAUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES
    • H03L7/00Automatic control of frequency or phase; Synchronisation
    • H03L7/06Automatic control of frequency or phase; Synchronisation using a reference signal applied to a frequency- or phase-locked loop
    • H03L7/08Details of the phase-locked loop
    • H03L7/099Details of the phase-locked loop concerning mainly the controlled oscillator of the loop
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03DDEMODULATION OR TRANSFERENCE OF MODULATION FROM ONE CARRIER TO ANOTHER
    • H03D7/00Transference of modulation from one carrier to another, e.g. frequency-changing
    • H03D7/16Multiple-frequency-changing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention provides a coaxial medium oscillation source processing method applied to the technical field of radar technology and microwave communication, which comprises the following steps: 1) welding an oscillating electrical appliance element (3) on the oscillating circuit board body, connecting the oscillating circuit board assembly (1) with the cavity (4), and then placing the oscillating circuit board assembly (1) and the cavity (4) on a heating platform for sintering; 2) solder paste is dotted on a pad of the harmonic mixing phase-locked circuit board body, the harmonic electric appliance element (5) is placed at the solder paste, and the harmonic mixing phase-locked circuit board body and the harmonic electric appliance element (5) are placed on a heating platform for sintering; 3) the processing method of the coaxial medium oscillation source is simple in steps, can conveniently and quickly complete the processing of the coaxial medium oscillation source, improves the product percent of pass of the coaxial medium oscillation source, and is suitable for batch production.

Description

A kind of coaxial dielectric oscillation source processing method
Technical field
The invention belongs to Radar Technology and technical field of micro communication, are to be related to a kind of coaxial dielectric vibration more specifically Swing source processing method.
Background technique
With the appearance of modern telecommunication systems and modern radar system, in Radar Technology and microwave communication techniques, it is desirable that Signal source and local vibration source have frequency stability and excellent frequency agility performance, due to coaxial dielectric oscillation source have it is small-sized The features such as change, Gao Kangzhen, frequency stabilization, can do local oscillator use in communication systems such as radars, be the important of certain model satellite communication system Component.Coaxial dielectric oscillation source product processing method in the prior art: each circuit function is integrated in whole circuit board, circuit Plate suqare is big, and when circuit board and cavity are sintered, penetration rate is unqualified, and there are also electromagnetic interferences between each circuit, and frequency stability is poor, It is unable to satisfy demand.
Summary of the invention
The technical problems to be solved by the present invention are: in view of the deficiencies of the prior art, it is simple to provide a kind of step, cost It is low, can the processing of convenient and efficient completion coaxial dielectric oscillation source, improve coaxial dielectric oscillation source product qualification rate, be suitable for simultaneously The coaxial dielectric oscillation source processing method of mass production coaxial dielectric oscillation source.
Solve the problems, such as techniques discussed above, the technical scheme adopted by the invention is as follows:
The present invention is a kind of coaxial dielectric oscillation source processing method, and the coaxial dielectric oscillation source includes oscillating circuit board Component, harmonic mixing phase lock circuitry board group part, cavity, oscillating circuit board component include oscillating circuit board ontology, harmonic mixing lock Circuitry phase board group part includes harmonic mixing phase lock circuitry plate ontology, the specific processing of the coaxial dielectric oscillation source processing method Step are as follows:
1) the welding oscillation electric elements on oscillating circuit board ontology, oscillating circuit board ontology and oscillation electric elements are formed Oscillating circuit board component is connect by oscillating circuit board component with cavity, then oscillating circuit board component and cavity are placed on heated flat Platform is sintered;
2) soldering paste on point at the pad of harmonic mixing phase lock circuitry plate ontology, by harmonic wave electric elements (be placed at soldering paste, Harmonic mixing phase lock circuitry plate ontology is placed on heating platform with harmonic wave electric elements to be sintered, harmonic mixing phase lock circuitry plate Ontology and harmonic wave electric elements form harmonic mixing phase lock circuitry board group part, and harmonic mixing phase lock circuitry board group part is mounted on chamber On body;
3) oscillating circuit board component and harmonic mixing phase lock circuitry board group part are connected by connecting wire, completes coaxial dielectric The processing of oscillation source.
The oscillating circuit board component includes oscillating circuit board ontology I and oscillating circuit board ontology II, oscillating circuit board When component is connect with cavity, soldering paste is bitten at II back side of I back side of oscillating circuit board ontology and oscillating circuit board ontology, will be vibrated Circuit board body I and oscillating circuit board ontology II are placed in the cavity, and oscillating circuit board component and cavity are placed on temperature 220 It is sintered on heating platform between DEG C -280 DEG C.
Respectively welding oscillation is electric on the oscillating circuit board ontology I and oscillating circuit board ontology II of the oscillating circuit board component Device element, connecting wire includes multiple RF isolation and multiple power-up needles, when oscillating circuit board component is connect with cavity, first Multiple RF isolation, multiple power-up needles are set on oscillating circuit board component, then again by oscillating circuit board component and cavity Temperature is placed on together to be sintered on the heating platform between 220 DEG C -280 DEG C.
It, will when the harmonic mixing phase lock circuitry plate ontology and harmonic wave electric elements being placed on heating platform being sintered Harmonic mixing phase lock circuitry plate ontology and harmonic wave electric elements are placed on temperature and burn on the heating platform between 220 DEG C -280 DEG C Harmonic mixing phase lock circuitry board group part, is then mounted on cavity by knot again.
The oscillating circuit board component and cavity are placed on after heating platform is sintered, by oscillating circuit board component and chamber Body is placed on temperature brew 5min -15min in the ABZOL CEG CLEANER cleaning agent between 40 DEG C -80 DEG C, then by brew The oscillating circuit board component crossed is placed in dehydrated alcohol with cavity to be scrubbed, then naturally dry.
Harmonic mixing phase lock circuitry plate ontology and harmonic wave electric elements are formed harmonic mixing phase lock circuitry board group part to be placed on After heating platform is sintered, harmonic mixing phase lock circuitry board group part is placed in dehydrated alcohol and is scrubbed, then naturally dry.
The oscillating circuit board component that multiple power-up needles are arranged is placed on temperature adding between 220 DEG C -280 DEG C together with cavity After being sintered on hot platform, power-up needle is placed into the fixation position on cavity, will be arranged by the spot printing soldering paste on the outside of each power-up needle The oscillating circuit board component of power-up needle is put into temperature and preheats 3-15 minutes on the heating platform between 130 DEG C -180 DEG C, with temperature The hot-air syringe between 350 DEG C -450 DEG C is spent against being powered at the solder(ing) paste of needle, until melts soldering tin, completion power-up needle is fixed to pacify Dress.
The circuit board body I of swinging of the oscillating circuit board component is connect by conducting wire with multiple power-up needles, oscillating circuit The circuit board body II of swinging of board group part is connect by conducting wire with multiple power-up needles, and power-up needle and the harmonic wave for swinging circuit board body I are mixed The connection of frequency phase lock circuitry board group part, the power-up needle for swinging circuit board body II is connected to harmonic mixing phase lock circuitry board group part, multiple RF isolation is connect with the circuit board body II of swinging of oscillating circuit board component, swings multiple RF isolations in circuit board body II Son is connect with harmonic mixing phase lock circuitry board group part.
Capping and lower capping are also set up on the cavity of the coaxial dielectric oscillation source, and upper capping is swashed with cavity Lower capping is carried out laser capping with cavity by light capping.
Using technical solution of the present invention, can obtain it is below the utility model has the advantages that
Coaxial dielectric oscillation source processing method of the present invention, passes through simple step, it will be able to conveniently and efficiently complete At coaxial dielectric oscillation product-derived processing, and the accessory needed in coaxial dielectric oscillation source process and auxiliary material Material is reduced, and effectively reduces processing cost while improving processing quality by the above method.At the same time, of the invention The great advantage of coaxial dielectric oscillation source processing method is to can be improved coaxial dielectric oscillation source product qualification rate, be suitable for Mass production coaxial dielectric oscillation source.
Detailed description of the invention
Brief description is made to content expressed by each attached drawing of this specification and the label in figure below:
Fig. 1 is the positive structure schematic of coaxial dielectric oscillation source of the present invention;
Fig. 2 is the structure schematic diagram of coaxial dielectric oscillation source of the present invention;
Attached drawing acceptance of the bid note is respectively as follows: 1, oscillating circuit board component;2, harmonic mixing phase lock circuitry board group part;3, electric appliance is vibrated Element;4, cavity;5, harmonic wave electric elements;6, RF isolation;7, it is powered on needle;8, upper capping;9, lower capping.
Specific embodiment
Below against attached drawing, by the description of the embodiment, to for example related each structure of a specific embodiment of the invention The works such as the shape of part, construction, the mutual alignment between each section and connection relationship, the effect of each section and working principle are further Detailed description:
As shown in attached drawing 1, attached drawing 2, the present invention is a kind of coaxial dielectric oscillation source processing method, the coaxial dielectric vibration Swinging source includes oscillating circuit board component 1, harmonic mixing phase lock circuitry board group part 2, cavity 4, and oscillating circuit board component 1 includes oscillation Circuit board body, harmonic mixing phase lock circuitry board group part 2 include harmonic mixing phase lock circuitry plate ontology, the coaxial dielectric vibration Swing the specific procedure of processing of source processing method are as follows:
1) the welding oscillation electric elements 3 on oscillating circuit board ontology, oscillating circuit board ontology and oscillation 3 shape of electric elements At oscillating circuit board component 1, oscillating circuit board component 1 is connect with cavity 4, then oscillating circuit board component 1 and cavity 4 are placed on Heating platform is sintered;
2) soldering paste on point at the pad of harmonic mixing phase lock circuitry plate ontology, harmonic wave electric elements 5 are placed at soldering paste, Harmonic mixing phase lock circuitry plate ontology is placed on heating platform with harmonic wave electric elements 5 to be sintered, harmonic mixing phase lock circuitry Plate ontology and harmonic wave electric elements 5 form harmonic mixing phase lock circuitry board group part 2, and harmonic mixing phase lock circuitry board group part 2 is pacified On cavity 4;
3) oscillating circuit board component 1 and harmonic mixing phase lock circuitry board group part 2 are connected by connecting wire, completes coaxial be situated between The processing of matter oscillation source.
Coaxial dielectric oscillation source processing method of the present invention, passes through simple step, it will be able to conveniently and efficiently complete At coaxial dielectric oscillation product-derived processing, and the accessory needed in coaxial dielectric oscillation source process and auxiliary material Material is reduced, and effectively reduces processing cost while improving processing quality by the above method.At the same time, of the invention The great advantage of coaxial dielectric oscillation source processing method is to can be improved coaxial dielectric oscillation source product qualification rate, be suitable for Mass production coaxial dielectric oscillation source.
The oscillating circuit board component 1 includes oscillating circuit board ontology I and oscillating circuit board ontology II, oscillating circuit board When component 1 is connect with cavity 4, soldering paste is bitten at II back side of I back side of oscillating circuit board ontology and oscillating circuit board ontology, will be shaken It swings circuit board body I and oscillating circuit board ontology II is placed in cavity 4, oscillating circuit board component 1 and cavity 4 are placed on temperature It is sintered on heating platform between 220 DEG C -280 DEG C.In this way, just simply and reliablely completing oscillating circuit board component 1 and chamber Body assembles.
Respectively welding oscillation is electric on the oscillating circuit board ontology I and oscillating circuit board ontology II of the oscillating circuit board component Device element, connecting wire includes multiple RF isolation 6 and multiple power-up needles 7, when oscillating circuit board component is connect with cavity, First multiple RF isolation 6, multiple power-up needles are set in oscillating circuit board group 1, then again by oscillating circuit board component 1 and chamber Body 4 is placed on temperature together and is sintered on the heating platform between 220 DEG C -280 DEG C.
When the harmonic mixing phase lock circuitry plate ontology and harmonic wave electric elements 5 being placed on heating platform being sintered, Harmonic mixing phase lock circuitry plate ontology and harmonic wave electric elements 5 are placed on temperature on the heating platform between 220 DEG C -280 DEG C Harmonic mixing phase lock circuitry board group part 2, is then mounted on cavity 4 by sintering again.In this way, just completing harmonic mixing locking phase electricity Road board group part 2 is assembled with cavity.
The oscillating circuit board component 1 and cavity 4 are placed on after heating platform is sintered, by oscillating circuit board component 1 ABZOL CEG CLEANER ((n-Propyl Bromide technical grade cleaning agent)) of the temperature between 40 DEG C -80 DEG C is placed on cavity 4 to clean Brew 5min -15min in agent, then the oscillating circuit board component 1 that brew is crossed is placed in dehydrated alcohol with cavity 4 and is scrubbed, then Naturally dry.By cleaning and brew, the rosin being stained on oscillating circuit board component 1 and cavity 4 when processing can be cleaned dry Only, guarantee the quality of product.
Harmonic mixing phase lock circuitry plate ontology and harmonic wave electric elements 5 are formed harmonic mixing phase lock circuitry board group part 2 to put After heating platform is sintered, harmonic mixing phase lock circuitry board group part 2 is placed in dehydrated alcohol and is scrubbed, is then dried in the air naturally It is dry.
The oscillating circuit board component 1 that multiple power-up needles 7 are arranged is placed on temperature between 220 DEG C -280 DEG C with cavity 4 together Heating platform on be sintered after, in each 7 outside spot printing soldering paste of power-up needle, needle 7 will be powered on and be placed into the fixed bit on cavity 4 It sets, the oscillating circuit board component 1 of setting power-up needle 7 is put into temperature and preheats 3- on the heating platform between 130 DEG C -180 DEG C 15 minutes, with hot-air syringe of the temperature between 350 DEG C -450 DEG C against being powered at the solder(ing) paste of needle 7, until melts soldering tin, is completed Needle 7 is powered on to be fixedly mounted.
The circuit board body I of swinging of the oscillating circuit board component 1 is connect by conducting wire with multiple power-up needles 7, oscillation electricity The circuit board body II of swinging of road board group part 1 is connect by conducting wire with multiple power-up needles 7, swing the power-up needle 7 of circuit board body I with it is humorous Wave mixing phase lock circuitry board group part 2 is connected to, and the power-up needle 7 and harmonic mixing phase lock circuitry board group part 2 for swinging circuit board body II connect Logical, multiple RF isolation 6 are connect with the circuit board body II of swinging of oscillating circuit board component 1, are swung more in circuit board body II A RF isolation 6 is connect with harmonic mixing phase lock circuitry board group part 2.
Capping 8 and lower capping 9 are also set up on the cavity 4 of the coaxial dielectric oscillation source, by upper capping 8 and cavity 4 Laser capping is carried out, lower capping 9 is subjected to laser capping with cavity 4.The setting of upper capping 8 and lower capping 9, realizes coaxial Jie The reliable sealing of matter oscillation source, it is ensured that inside cavity part is protected.
Coaxial dielectric oscillation source processing method of the present invention, passes through simple step, it will be able to conveniently and efficiently complete At coaxial dielectric oscillation product-derived processing, and the accessory needed in coaxial dielectric oscillation source process and auxiliary material Material is reduced, and effectively reduces processing cost while improving processing quality by the above method.At the same time, of the invention The great advantage of coaxial dielectric oscillation source processing method is to can be improved coaxial dielectric oscillation source product qualification rate, be suitable for Mass production coaxial dielectric oscillation source.
Coaxial dielectric oscillation source processing method of the present invention, the coaxial dielectric oscillation product-derived produced, Ge Xiangji Art performance indicator is all satisfied machine requirement, and this fabrication processing is simple, and equipment investment is small, is applicable in and produces in enormous quantities.With this Meanwhile the production technique of coaxial dielectric oscillation source processing method of the present invention is more scientific practical, product qualification rate It improves, provides powerful guarantee for mass production.
The coaxial dielectric oscillation source that coaxial dielectric oscillation source processing method of the invention processes, each functional circuit separate Change, may make that electromagnetic interference is reduced between each circuit, frequency stability improves.
Above in conjunction with attached drawing, an exemplary description of the invention, it is clear that concrete implementation of the present invention is not by above-mentioned The limitation of mode, as long as using the various improvement that the inventive concept and technical scheme of the present invention carry out, or not improved by this The conception and technical scheme of invention directly apply to other occasions, are within the scope of the invention.

Claims (8)

1. a kind of coaxial dielectric oscillation source processing method, it is characterised in that: the coaxial dielectric oscillation source includes oscillating circuit Board group part (1), harmonic mixing phase lock circuitry board group part (2), cavity (4), oscillating circuit board component (1) include oscillating circuit board sheet Body, harmonic mixing phase lock circuitry board group part (2) include harmonic mixing phase lock circuitry plate ontology, and the coaxial dielectric oscillation source adds The specific procedure of processing of work method are as follows:
1) welding oscillation electric elements (3) on oscillating circuit board ontology, oscillating circuit board ontology and oscillation electric elements (3) shape At oscillating circuit board component (1), oscillating circuit board component (1) is connect with cavity (4), then by oscillating circuit board component (1) with Cavity (4) is placed on heating platform and is sintered;
2) soldering paste on point at the pad of harmonic mixing phase lock circuitry plate ontology, harmonic wave electric elements (5) are placed at soldering paste, will Harmonic mixing phase lock circuitry plate ontology is placed on heating platform with harmonic wave electric elements (5) and is sintered, harmonic mixing phase lock circuitry Plate ontology and harmonic wave electric elements (5) form harmonic mixing phase lock circuitry board group part (2), by harmonic mixing phase lock circuitry board group part (2) it is mounted on cavity (4);
3) by connecting wire connection oscillating circuit board component (1) and harmonic mixing phase lock circuitry board group part (2), coaxial be situated between is completed The processing of matter oscillation source;
The oscillating circuit board component (1) includes oscillating circuit board ontology I and oscillating circuit board ontology II, oscillating circuit board group When part (1) is connect with cavity (4), soldering paste is bitten at II back side of I back side of oscillating circuit board ontology and oscillating circuit board ontology, it will Oscillating circuit board ontology I and oscillating circuit board ontology II are placed in cavity (4), by oscillating circuit board component (1) and cavity (4) It is placed on 220 DEG C -280 DEG C of heating platform and is sintered.
2. coaxial dielectric oscillation source processing method according to claim 1, it is characterised in that: the oscillating circuit board group Respectively welding oscillation electric elements (3), connecting wire include on the oscillating circuit board ontology I and oscillating circuit board ontology II of part (1) Multiple RF isolations (6) and multiple power-up needles (7) when connecting oscillating circuit board component (1) with cavity (4), are first being vibrated Multiple RF isolations (6), multiple power-up needles (7) are set on circuit board assemblies (1), then again by oscillating circuit board component (1) It is placed on 220 DEG C -280 DEG C of heating platform and is sintered together with cavity (4).
3. coaxial dielectric oscillation source processing method according to claim 1, it is characterised in that: lock the harmonic mixing When circuitry phase plate ontology and harmonic wave electric elements (5) are placed on heating platform and are sintered, by harmonic mixing phase lock circuitry plate ontology It is placed on 220 DEG C -280 DEG C of heating platform and is sintered with harmonic wave electric elements (5), then again by harmonic mixing phase lock circuitry board group Part (2) is mounted on cavity (4).
4. coaxial dielectric oscillation source processing method according to claim 1, it is characterised in that: the oscillating circuit board group Part (1) and cavity (4) are placed on after heating platform is sintered, and oscillating circuit board component (1) and cavity (4) is placed on 40 DEG C -80 DEG C ABZOL CEG CLEANER cleaning agent in brew 5min -15min, then oscillating circuit board component (1) that brew is crossed with Cavity (4), which is placed in dehydrated alcohol, to be scrubbed, then naturally dry.
5. coaxial dielectric oscillation source processing method according to claim 1, it is characterised in that: by harmonic mixing phase lock circuitry Plate ontology and harmonic wave electric elements (5) form harmonic mixing phase lock circuitry board group part (2) and are placed on after heating platform is sintered, will Harmonic mixing phase lock circuitry board group part (2), which is placed in dehydrated alcohol, to be scrubbed, then naturally dry.
6. coaxial dielectric oscillation source processing method according to claim 2, it is characterised in that: the multiple power-up needles (7) of setting Oscillating circuit board component (1) and cavity (4) be placed on together on 220 DEG C -280 DEG C of heating platform be sintered after, in each power-up Power-up needle (7) is placed into the fixation position on cavity (4) by spot printing soldering paste on the outside of needle (7), by the oscillation of setting power-up needle (7) Circuit board assemblies (1) are put on the heating platform that temperature is 130 DEG C -180 DEG C and preheat 3-15 minutes, are 350 DEG C -450 with temperature DEG C hot-air syringe against at the solder(ing) paste of power-up needle (7), until melts soldering tin, complete power-up needle (7) and be fixedly mounted.
7. coaxial dielectric oscillation source processing method according to claim 2, it is characterised in that: the oscillating circuit board group The circuit board body I of swinging of part (1) is connect by conducting wire with multiple power-up needles (7), and oscillating circuit board component (1) swings circuit board sheet Body II is connect by conducting wire with multiple power-up needles (7), and the power-up needle (7) and harmonic mixing phase lock circuitry plate of circuit board body I are swung Component (2) connection, the power-up needle (7) for swinging circuit board body II are connected to harmonic mixing phase lock circuitry board group part (2), multiple radio frequencies Insulator (6) is connect with the circuit board body II of swinging of oscillating circuit board component (1), and the multiple radio frequencies swung in circuit board body II are exhausted Edge (6) is connect with harmonic mixing phase lock circuitry board group part (2).
8. coaxial dielectric oscillation source processing method according to claim 1, it is characterised in that: the coaxial dielectric oscillation Also set up capping (8) and lower capping (9) on the cavity (4) in source, upper capping (8) and cavity (4) be subjected to laser capping, will under It covers (9) and cavity (4) and carries out laser capping.
CN201610769391.2A 2016-08-30 2016-08-30 Coaxial medium oscillation source processing method Active CN106341125B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610769391.2A CN106341125B (en) 2016-08-30 2016-08-30 Coaxial medium oscillation source processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610769391.2A CN106341125B (en) 2016-08-30 2016-08-30 Coaxial medium oscillation source processing method

Publications (2)

Publication Number Publication Date
CN106341125A CN106341125A (en) 2017-01-18
CN106341125B true CN106341125B (en) 2019-03-12

Family

ID=57823354

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610769391.2A Active CN106341125B (en) 2016-08-30 2016-08-30 Coaxial medium oscillation source processing method

Country Status (1)

Country Link
CN (1) CN106341125B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107395197B (en) * 2017-06-21 2020-11-17 安徽华东光电技术研究所 Manufacturing and processing method of phase-locked frequency source
CN107395122A (en) * 2017-06-21 2017-11-24 安徽华东光电技术研究所 The preparation method of phase lock dielectric oscillator module
CN107396546A (en) * 2017-06-22 2017-11-24 中科迪高微波系统有限公司 The preparation method of miniaturization lock same axis medium Microwave Frequency Source
CN108112184B (en) * 2017-11-02 2020-08-04 安徽华东光电技术研究所 Manufacturing method of S-band 100-watt pulse power amplifier
CN108155452B (en) * 2017-11-08 2019-08-20 安徽华东光电技术研究所 A kind of assembling and setting device and method for microwave coaxial medium oscillating circuit

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3858121A (en) * 1972-08-25 1974-12-31 Hitachi Ltd Solid state microwave oscillator with stabilizing resonator and afc loop
CN1119352A (en) * 1994-08-02 1996-03-27 松下电器产业株式会社 Microwave oscilator and making of same
JPH10285027A (en) * 1997-04-03 1998-10-23 Sony Tektronix Corp Pll oscillation circuit
CN101662259A (en) * 2009-09-18 2010-03-03 河北博威集成电路有限公司 Integrated coaxial dielectric voltage controlled oscillator and manufacturing method thereof
CN201789489U (en) * 2010-07-14 2011-04-06 安徽华东光电技术研究所 Ultra-low-phase noise digital phase locking coaxial dielectric oscillator
CN102739243A (en) * 2012-06-29 2012-10-17 安徽华东光电技术研究所 Low phase noise phase-locked medium oscillator

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3858121A (en) * 1972-08-25 1974-12-31 Hitachi Ltd Solid state microwave oscillator with stabilizing resonator and afc loop
CN1119352A (en) * 1994-08-02 1996-03-27 松下电器产业株式会社 Microwave oscilator and making of same
JPH10285027A (en) * 1997-04-03 1998-10-23 Sony Tektronix Corp Pll oscillation circuit
CN101662259A (en) * 2009-09-18 2010-03-03 河北博威集成电路有限公司 Integrated coaxial dielectric voltage controlled oscillator and manufacturing method thereof
CN201789489U (en) * 2010-07-14 2011-04-06 安徽华东光电技术研究所 Ultra-low-phase noise digital phase locking coaxial dielectric oscillator
CN102739243A (en) * 2012-06-29 2012-10-17 安徽华东光电技术研究所 Low phase noise phase-locked medium oscillator

Also Published As

Publication number Publication date
CN106341125A (en) 2017-01-18

Similar Documents

Publication Publication Date Title
CN106341125B (en) Coaxial medium oscillation source processing method
CN103551690B (en) Manufacturing method of amplitude limiter
CN107367713A (en) Manufacturing and processing method of front-end module of K2 waveband receiver
CN106572607A (en) Process manufacturing method of solid-state microwave source
CN106535497B (en) A kind of T/R receiving front-end module processing method
WO2015013880A1 (en) Wireless terminal
CN109688725A (en) The production method of K1 audio range frequency source module
CN109451678A (en) A kind of production method of KU wave band 40W power amplifier module
CN110266279A (en) A kind of manufacture craft of 6 watts of power amplifiers of C-band
US2555443A (en) Radio apparatus employing slot antenna
CN108462491A (en) Local oscillator source module processing method on Ku audio range frequency synthesizers
CN107395197B (en) Manufacturing and processing method of phase-locked frequency source
CN109673104A (en) Pumping signal module processing method on frequency synthesizer
CN109600934A (en) A kind of production method of KU waveband high-gain amplifier
CN204834853U (en) High bandwidth planar antenna
CN204349969U (en) A kind of Ku wave band dielectric oscillator
CN108155452B (en) A kind of assembling and setting device and method for microwave coaxial medium oscillating circuit
CN209183726U (en) Antenna for base station and its oscillator structure
CN208848754U (en) A kind of frequency microwave multilayer ceramic capacitor micro-strip mounting structure
CN102881978A (en) Waveguide filter with welding structure
WO2016165113A1 (en) Slot antenna and mobile terminal
CN107318259A (en) The preparation method of doubleway output crystal oscillator
CN205160486U (en) Thermistor piezoelectric quartz crystal syntonizer
Wen et al. A low-profile and wideband monopolar circular via-loaded patch antenna coupled with via-loaded ring
WO2016019582A1 (en) Antenna device and terminal

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: 241000 No.01 Eshan Road, high tech Development Zone, Yijiang District, Wuhu City, Anhui Province

Patentee after: ANHUI HUADONG PHOTOELECTRIC TECHNOLOGY INSTITUTE Co.,Ltd.

Address before: 241000 Anhui Province, Wuhu city Yijiang District South high tech Development Zone Technology Park mansion

Patentee before: Anhui Huadong Polytechnic Institute