CN107318259A - The preparation method of doubleway output crystal oscillator - Google Patents
The preparation method of doubleway output crystal oscillator Download PDFInfo
- Publication number
- CN107318259A CN107318259A CN201710474154.8A CN201710474154A CN107318259A CN 107318259 A CN107318259 A CN 107318259A CN 201710474154 A CN201710474154 A CN 201710474154A CN 107318259 A CN107318259 A CN 107318259A
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- cavity
- circuit board
- preparation
- welded
- chip
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B1/00—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10075—Non-printed oscillator
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Abstract
The invention discloses a kind of preparation method of doubleway output crystal oscillator, the preparation method includes：1) circuit board (2) with doubleway output circuit is assemblied in cavity (1)；2) on the relevant position that multiple electronic components are each arranged on to circuit board or cavity；3) chip (7) is bonded on the relevant position of the cavity by the first silicon rubber, and first silicon rubber is arranged between the chip and the cavity；4) will each it be electrically connected between multiple electronic components, the chip and the circuit board；5) the second silicon rubber (9) is filled into the cavity；6) by step 5) in covered filled with the cavity of the second silicon rubber, obtained doubleway output crystal oscillator.Realize manufacture craft more science practical, good damping result, with good antivibration feature, can export stable reference signal, and technological process is simple, and equipment investment is small, the effect suitable for production in enormous quantities.
Description
Technical field
The present invention relates to the production preparation field of crystal oscillator, in particular it relates to the system of doubleway output crystal oscillator
Preparation Method.
Background technology
With the appearance of modern telecommunication systems and modern radar system, in Radar Technology and microwave communication techniques, it is desirable to
Signal source and local vibration source have high-quality frequency stability, and a crystal oscillator is required in signal source and local vibration source
As reference signal, therefore, the quality of reference signal directly or indirectly influences signal source and the frequency stability of local vibration source.And
When in the prior art, for providing the crystal oscillator of reference signal with complete machine oscillation, often its reference signal provided is unstable
It is fixed, influence product quality.
Therefore it provides a kind of production technique more science is practical, and good damping result, with good antivibration feature,
Stable reference signal can be exported, and technological process is simple, and equipment investment is small, suitable for producing in enormous quantities, can be batch
The problem of preparation method for the doubleway output crystal oscillator that metaplasia production provides powerful guarantee is urgent need to resolve of the present invention.
The content of the invention
For above-mentioned prior art, it is an object of the invention to overcome to be used for the crystal for providing reference signal in the prior art
When oscillator is with complete machine oscillation, often its reference signal provided is unstable, the problem of influenceing product quality, so as to provide one kind
Production technique more science is practical, good damping result, with good antivibration feature, can export stable reference letter
Number, and technological process is simple, and equipment investment is small, suitable for producing in enormous quantities, can provide powerful guarantee for mass production
The preparation method of doubleway output crystal oscillator.
To achieve these goals, the invention provides a kind of preparation method of doubleway output crystal oscillator, wherein, institute
Stating preparation method includes：
1) circuit board with doubleway output circuit is assembled in cavity；
2) on the relevant position that multiple electronic components are each arranged on to the circuit board or the cavity；
3) chip is bonded on the relevant position of the cavity by the first silicon rubber, and first silicon rubber
It is arranged between the chip and the cavity；
4) will each it be electrically connected between multiple electronic components, the chip and the circuit board；
5) the second silicon rubber is filled into the cavity；
6) by step 5) in covered filled with the cavity of the second silicon rubber, obtained doubleway output crystal oscillation
Device.
Preferably, step 1) in be assembled into and be welded in the circuit board in the cavity by weld tabs.
Preferably, welding process includes：Weld tabs is placed between the circuit board and the cavity, and in the circuit board
Upper placement briquetting, forms junctor to be welded；It is heat-agglomerating under conditions of 240-260 DEG C that above-mentioned junctor to be welded is placed in into temperature.
Preferably, step 2) described in electronic component at least include each being welded on the circuit board or the cavity
Earthing rod, RF isolation, feed-through filter and element on relevant position；And the earthing rod is welded in the cavity,
RF isolation is welded in the cavity, and the feed-through filter is welded in the cavity, and the element is welded in
On the circuit board.
Preferably, welding manner is to be sintered welding by soldering paste, and sintering temperature is 210-230 DEG C.
Preferably, step 2) in be additionally included in welding after cleaned；
Preferably, cleaning process is dried to be placed in absolute ethyl alcohol after scrub.
Preferably, in step 4) in, electrically connected between the circuit board and the feed-through filter by wire, the electricity
Electrically connected between road plate and the chip by wire, by contacting connection between the circuit board and RF isolation；
Preferably, 3 wires have been at least connected between the circuit board and the chip.
Preferably, it is to pass through tin welding wire between the wire and the circuit board, the feed-through filter and the chip
It is welded to connect；
Preferably, in welding process, tin welding wire temperature is 180-185 DEG C；
Preferably, step 4) in be additionally included in welding after butt welding point wiped using absolute ethyl alcohol.
Preferably, step 4) in also include sub-miniature A connector is fixed on the lateral wall of the cavity.
Preferably, step 6) in, capping procedure for cover plate is removably covered with the cavity.
According to above-mentioned technical proposal, the present invention first assembles the circuit board with doubleway output circuit in cavity, then
Electronic component is installed, is still later bonded in chip in cavity with the first silicon rubber, and the first silicon rubber is set
The second silicon rubber rear seal-cover is filled in cavity between the chip and the cavity, and in the later stage, so that according to upper
State preparation method and be prepared by order, and bonded by the first silicon rubber, and doubleway output made from the second silicon rubber filling
Crystal oscillator has good effectiveness in vibration suppression, so as to improve the stability of the reference signal of its output, is conducive to it actual to make
With.The preparation method is simple to operate simultaneously, and equipment investment is small, is easy to produce in enormous quantities.Here there is doubleway output circuit
Circuit board can be this area it will be appreciated that type, similarly, the circuit board with doubleway output circuit here is simply meant to
Circuit board has this characteristic of doubleway output circuit, and other kinds of circuit board can also enter to exercise according to actual needs herein
With, the characteristic with doubleway output circuit here merely to being selected the need for preferably meeting at present.
Other features and advantages of the present invention will be described in detail in subsequent embodiment part.
Brief description of the drawings
Accompanying drawing is, for providing a further understanding of the present invention, and to constitute a part for specification, with following tool
Body embodiment is used to explain the present invention together, but is not construed as limiting the invention.In the accompanying drawings：
Fig. 1 is a kind of structural representation for doubleway output crystal oscillator that the present invention is provided.
Description of reference numerals
1- cavity 2- circuit boards
3- earthing rod 4- feed-through filters
The sub- 6-SMA joints of 5- RF isolations
7- chip 8- cover plates
The silicon rubber of 9- second.
Embodiment
The embodiment of the present invention is described in detail below in conjunction with accompanying drawing.It should be appreciated that this place is retouched
The embodiment stated is merely to illustrate and explain the present invention, and is not intended to limit the invention.
In the present invention, in the case where not making opposite explanation, " upper, interior, between " etc. is included in the noun of locality in term
Only represent orientation of the term under normal service condition, or be skilled artisan understands that be commonly called as, and be not construed as pair
The limitation of the term.
The invention provides a kind of preparation method of doubleway output crystal oscillator, wherein, as shown in figure 1, described prepare
Method includes：
1) circuit board 2 with doubleway output circuit is assembled in cavity 1；
2) on the relevant position that multiple electronic components are each arranged on to the circuit board 2 or the cavity 1；
3) chip 7 is bonded on the relevant position of the cavity 1 by the first silicon rubber, and the first silicon rubber
Glue is arranged between the chip 7 and the cavity 1；
4) will each it be electrically connected between multiple electronic components, the chip 7 and the circuit board 2；
5) the second silicon rubber 9 is filled into the cavity 1；
6) by step 5) in covered filled with the cavity 1 of the second silicon rubber 9, obtained doubleway output crystal oscillation
Device.
Above-mentioned design is by first assembling the circuit board 2 with doubleway output circuit in cavity 1, then by electronics member device
Part is installed, and is still later bonded in chip 7 in cavity 1 with the first silicon rubber, and the first silicon rubber is arranged at into the crystalline substance
Between piece 7 and the cavity 1, and the rear seal-cover of the second silicon rubber 9 is filled in cavity 1 in the later stage, so that according to above-mentioned system
Prepared by Preparation Method and order, and bonded by the first silicon rubber, and the second silicon rubber 9 fills obtained doubleway output crystal
Oscillator has good effectiveness in vibration suppression, so as to improve the stability of the reference signal of its output, is conducive to its actual use.Together
When the preparation method it is simple to operate, equipment investment is small, be easy to produce in enormous quantities.
Step 1) in assembling can be operated according to this area usual manner, for example, in a kind of preferred embodiment party
In formula, step 1) in assembling can be for the circuit board 2 be welded in the cavity 1 by weld tabs.
In further preferred embodiment, welding process includes：Placed between the circuit board 2 and the cavity 1
Weld tabs, and briquetting is placed on the circuit board 2, form junctor to be welded；Above-mentioned junctor to be welded is placed in temperature for 240-260 DEG C
Under conditions of heat-agglomerating.Certainly, in order that obtaining welding effect more preferably, weld tabs here can be further selected as and the electricity
The shape identical weld tabs of road plate 2, here with the shape identical weld tabs of circuit board 2 can by cut etc. mode be made,
Those skilled in the art can take suitable mode of operation according to actual conditions.
Certainly, electronic component here is the conventional use of type in this area, for example, one kind is preferred embodiment
In, in order to further improve vibration-isolating effect, and improve the using effect of obtained doubleway output crystal oscillator, step 2) in institute
State electronic component at least include each be welded on the relevant position of the circuit board 2 or the cavity 1 earthing rod 3, penetrate
Frequency insulator 5, feed-through filter 4 and element；And the earthing rod 3 is welded in the cavity 1, RF isolation 5 is welded
It is connected in the cavity 1, the feed-through filter 4 is welded in the cavity 1, the element is welded on the circuit board 2.
In further preferred embodiment, welding manner can select to be sintered welding, and sintering by soldering paste
Temperature is 210-230 DEG C.Here sintering welding manner is ditto consistent, and selection is that above-mentioned material to be welded is placed in into temperature to be
Welding is sintered under conditions of 210-230 DEG C, sintering welding manner is by the way of commonly used in the art.
Certainly, in order that welding effect more preferably, step 2) in be additionally may included in welding after cleaned.
In the embodiment being more highly preferred to, cleaning process can select to dry to be placed in absolute ethyl alcohol after scrub.
It is a kind of preferred embodiment in, specifically, in step 4) in, the circuit board 2 and the feed-through filter 4 it
Between electrically connected by wire, electrically connected between the circuit board 2 and the chip 7 by wire, the circuit board 2 is penetrated with described
Connected between frequency insulator 5 by contacting.
Certainly, in the embodiment being more highly preferred to, in order to realize more preferable performance, the circuit board 2 and the crystalline substance
3 wires have been at least connected between piece 7.
Similarly, in order that wire welding effect more preferably, the wire and the circuit board 2, the feed-through filter 4 and
Can be to be welded to connect by tin welding wire between the chip 7.
In further preferred embodiment, in welding process, tin welding wire temperature is 180-185 DEG C.
In order that welding effect more preferably, step 4) in be additionally included in welding after butt welding point wiped using absolute ethyl alcohol.
In order to further improve the performance of the doubleway output crystal oscillator, step 4) in also include sub-miniature A connector 6
On the lateral wall for being fixed in the cavity 1.Here the setting of sub-miniature A connector 6 can be configured according to this area usual manner.
Here it is affixed can using it is detachable it is affixed by the way of, for example, can be carried out by screw affixed.
Certainly, step 5) in filling the second silicon rubber 9 amount can adjust according to actual needs, for example, can be in chip 7
Around the second silicon rubber 9 of filling, make between chip 7 and cavity 2 that all embedding has the second silicon rubber 9.Certainly, the upper surface of chip 7
On be also required to embedding and have the second silicon rubber 9, and the amount of the second silicon rubber 9 can be realized and is just in contact with cover plate 8, and not influenceed
Cover plate 8 is covered.Those skilled in the art can specifically be adjusted according to practical operation.
Step 6) in capping procedure can be operated in a conventional manner, for example, it is a kind of preferred embodiment in, step
It is rapid 6) in, capping procedure be by cover plate 8 removably cover with the cavity 1.Here can detachably use this area
Conventional use of mode, for example, can be to carry out affixed setting by screw.
Here the first silicon rubber and the second silicon rubber 9 can be selected specifically to the silicon rubber of model 703, to cause it
With good adhesion and curing performance etc., further to adapt to the demand of actual use.
The preferred embodiment of the present invention is described in detail above in association with accompanying drawing, still, the present invention is not limited to above-mentioned reality
The detail in mode is applied, in the range of the technology design of the present invention, a variety of letters can be carried out to technical scheme
Monotropic type, these simple variants belong to protection scope of the present invention.
It is further to note that each particular technique feature described in above-mentioned embodiment, in not lance
In the case of shield, can be combined by any suitable means, in order to avoid unnecessary repetition, the present invention to it is various can
The combination of energy no longer separately illustrates.
In addition, various embodiments of the present invention can be combined randomly, as long as it is without prejudice to originally
The thought of invention, it should equally be considered as content disclosed in this invention.
Claims (10)
1. a kind of preparation method of doubleway output crystal oscillator, it is characterised in that the preparation method includes：
1) circuit board (2) with doubleway output circuit is assemblied in cavity (1)；
2) on the relevant position that multiple electronic components are each arranged on to the circuit board (2) or the cavity (1)；
3) chip (7) is bonded on the relevant position of the cavity (1) by the first silicon rubber, and the first silicon rubber
Glue is arranged between the chip (7) and the cavity (1)；
4) will each it be electrically connected between multiple electronic components, the chip (7) and the circuit board (2)；
5) the second silicon rubber of filling (9) into the cavity (1)；
6) by step 5) in covered filled with the cavity (1) of the second silicon rubber (9), obtained doubleway output crystal oscillation
Device.
2. preparation method according to claim 1, it is characterised in that step 1) in be assembled into the circuit board (2)
It is welded in by weld tabs in the cavity (1).
3. preparation method according to claim 2, it is characterised in that welding process includes：In the circuit board (2) and institute
State and place weld tabs between cavity (1), and briquetting is placed on the circuit board (2), form junctor to be welded；By above-mentioned junctor to be welded
It is heat-agglomerating under conditions of 240-260 DEG C to be placed in temperature.
4. preparation method according to claim 1, it is characterised in that step 2) described in electronic component at least include it is each
From the earthing rod (3), RF isolation (5), feedthrough being welded on the relevant position of the circuit board (2) or the cavity (1)
Wave filter (4) and element；And the earthing rod (3) is welded in the cavity (1), the RF isolation (5) is welded in institute
State in cavity (1), the feed-through filter (4) is welded in the cavity (1), and the element is welded in the circuit board (2)
On.
5. preparation method according to claim 4, it is characterised in that welding manner is to be sintered welding by soldering paste,
And sintering temperature is 210-230 DEG C.
6. preparation method according to claim 5, it is characterised in that step 2) in be additionally included in welding after cleaned；
Preferably, cleaning process is dried to be placed in absolute ethyl alcohol after scrub.
7. preparation method according to claim 4, it is characterised in that in step 4) in, the circuit board (2) and the feedback
Bandpass filter is electrically connected between (4) by wire, is electrically connected between the circuit board (2) and the chip (7) by wire, institute
State between circuit board (2) and the RF isolation (5) by contacting connection；
Preferably, 3 wires have been at least connected between the circuit board (2) and the chip (7).
8. preparation method according to claim 7, it is characterised in that the wire and the circuit board (2), the feedthrough
It is to be welded to connect by tin welding wire between wave filter (4) and the chip (7)；
Preferably, in welding process, tin welding wire temperature is 180-185 DEG C；
It is further preferred that step 4) in be additionally included in welding after butt welding point wiped using absolute ethyl alcohol.
9. preparation method according to claim 1, it is characterised in that step 4) in also include sub-miniature A connector (6) being fixed in
On the lateral wall of the cavity (1).
10. preparation method according to claim 1, it is characterised in that step 6) in, capping procedure is can by cover plate (8)
Releasably cover with the cavity (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710474154.8A CN107318259A (en) | 2017-06-21 | 2017-06-21 | The preparation method of doubleway output crystal oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710474154.8A CN107318259A (en) | 2017-06-21 | 2017-06-21 | The preparation method of doubleway output crystal oscillator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107318259A true CN107318259A (en) | 2017-11-03 |
Family
ID=60181980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710474154.8A Pending CN107318259A (en) | 2017-06-21 | 2017-06-21 | The preparation method of doubleway output crystal oscillator |
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| Country | Link |
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| CN (1) | CN107318259A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102023202461A1 (en) | 2022-03-31 | 2023-10-05 | Continental Automotive Technologies GmbH | Elastic circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006086664A (en) * | 2004-09-15 | 2006-03-30 | Nec Corp | Crystal vibrator, crystal oscillator, and assembling method for them, and mobile communication terminal |
| CN101752275A (en) * | 2009-10-23 | 2010-06-23 | 中外合资江苏稳润光电有限公司 | Packaging method and packaging structure of light emitting diode (LED) module |
| CN104283524A (en) * | 2014-10-22 | 2015-01-14 | 应达利电子(深圳)有限公司 | Piezoelectric quartz-crystal resonator and manufacturing method thereof |
| CN204304952U (en) * | 2015-01-20 | 2015-04-29 | 深圳市深宇峰电子有限公司 | A kind of SMD quartz crystal resonator |
-
2017
- 2017-06-21 CN CN201710474154.8A patent/CN107318259A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006086664A (en) * | 2004-09-15 | 2006-03-30 | Nec Corp | Crystal vibrator, crystal oscillator, and assembling method for them, and mobile communication terminal |
| CN101752275A (en) * | 2009-10-23 | 2010-06-23 | 中外合资江苏稳润光电有限公司 | Packaging method and packaging structure of light emitting diode (LED) module |
| CN104283524A (en) * | 2014-10-22 | 2015-01-14 | 应达利电子(深圳)有限公司 | Piezoelectric quartz-crystal resonator and manufacturing method thereof |
| CN204304952U (en) * | 2015-01-20 | 2015-04-29 | 深圳市深宇峰电子有限公司 | A kind of SMD quartz crystal resonator |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102023202461A1 (en) | 2022-03-31 | 2023-10-05 | Continental Automotive Technologies GmbH | Elastic circuit board |
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Application publication date: 20171103 |