CN107612510B - Manufacturing process of pre-stage amplification module of Ku-band 40-watt power amplifier - Google Patents
Manufacturing process of pre-stage amplification module of Ku-band 40-watt power amplifier Download PDFInfo
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- CN107612510B CN107612510B CN201710777772.XA CN201710777772A CN107612510B CN 107612510 B CN107612510 B CN 107612510B CN 201710777772 A CN201710777772 A CN 201710777772A CN 107612510 B CN107612510 B CN 107612510B
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Abstract
The invention discloses a manufacturing process of a pre-stage amplification module of a Ku waveband 40-watt power amplifier, which comprises the following steps: step 1, cleaning a preceding stage amplification module cavity, a cover plate and a circuit board of an amplifier; step 2, tin coating is carried out on the cover plate and the cavity of the amplifier pre-stage amplification module; step 3, sintering the components on the circuit board; step 4, sintering the circuit board and the insulator on a cavity of a pre-stage amplification module of the amplifier; and 5, debugging and testing the sintered assembly. The manufacturing process overcomes the problems that the manufacturing process of the pre-stage amplification module of the Ku waveband 40-watt power amplifier in the prior art is not scientific and simple, the performance index can not meet the requirement of the whole machine, the production efficiency and the qualification rate are low, and the production cost is high.
Description
Technical Field
The invention relates to the field of manufacturing methods of power amplifiers, in particular to a manufacturing process of a pre-stage amplification module of a Ku waveband 40-watt power amplifier.
Background
The Ku band power amplifier refers to a power amplifier having an operating frequency in the range of 12-18 GHz. The Ku waveband 40-watt power amplifier is widely applied to the field of satellite communication and used for improving the transmitting power of satellite downlink signals, expanding the coverage range of satellite signals and improving the communication quality. The method can also be applied to systems such as radars, electronic warfare and the like. The pre-stage amplification module of the Ku waveband 40-watt power amplifier is an important component for forming the Ku waveband 40-watt continuous wave linear power amplifier, and the quality of indexes directly influences the parameters of the Ku waveband 40-watt continuous wave linear power amplifier.
The manufacturing process of the pre-stage amplification module of the Ku waveband 40-watt power amplifier in the prior art is not scientific, simple and convenient, the performance index can not meet the requirement of the whole machine frequently, the production efficiency and the qualification rate are low, and the production cost is high.
Therefore, the invention provides a scientific, simple and convenient manufacturing process of the pre-stage amplification module of the Ku-band 40-watt power amplifier, which can effectively improve the production efficiency and the yield and reduce the production cost in the using process.
Disclosure of Invention
Aiming at the technical problems, the invention aims to overcome the problems that the manufacturing process of the Ku waveband 40 watt power amplifier pre-stage amplification module in the prior art is not scientific, simple and convenient enough, the performance index can not meet the requirement of the whole machine, the production efficiency and the qualification rate are low, and the production cost is high, thereby providing a scientific, simple and convenient manufacturing process of the Ku waveband 40 watt power amplifier pre-stage amplification module, which can effectively improve the production efficiency and the qualification rate and reduce the production cost in the use process.
In order to achieve the above object, the present invention provides a process for manufacturing a pre-stage amplification module of a Ku-band 40-watt power amplifier, wherein the process comprises: step 1, cleaning a preceding stage amplification module cavity, a cover plate and a circuit board of an amplifier; step 2, tin coating is carried out on the cover plate and the amplifier pre-stage amplification module cavity, and the cover plate and the amplifier pre-stage amplification module cavity after tin coating are moved to filter paper for natural cooling; step 3, sintering the components on the circuit board; four capacitors, two radio frequency amplifier chips HMC516 and a triode MTVA0600N09 are respectively sintered on the circuit board; step 4, sintering the circuit board and the insulator on a cavity of a pre-stage amplification module of the amplifier; and 5, debugging and testing the sintered assembly.
Preferably, each of step 2, step 3 and step 4 is performed after completion of the cleaning and baking.
Preferably, the washing in step 1, step 2, step 3 and step 4 is performed by using 60 ℃ absolute ethanol.
Preferably, the baking temperature is 45-55 ℃, and the baking time is 4-6 min.
Preferably, the workpiece to be processed needs to be naturally cooled to 22-25 ℃ after the baking is finished.
Preferably, the film covering operation in the step 2 is carried out on a heating platform, and the temperature of the heating platform is 125-135 ℃.
Preferably, the sintering in the step 3 is also carried out on a heating platform, and the temperature of the heating platform is 225-235 ℃.
Preferably, the manufacturing process further includes step 6, capping the tested assembly.
According to the technical scheme, in the manufacturing process of the Ku waveband 40-watt power amplifier pre-amplification module, firstly, a cavity of the amplifier pre-amplification module, a cover plate and a circuit board are respectively cleaned, after cleaning, tin coating is carried out on the cover plate and the cavity of the amplifier pre-amplification module, then, a component is sintered on the circuit board, the circuit board and an insulator are sintered on the cavity of the amplifier pre-amplification module, and finally, the sintered component is debugged and tested. The manufacturing process of the Ku waveband 40-watt power amplifier pre-stage amplification module provided by the invention solves the problems that the manufacturing process of the Ku waveband 40-watt power amplifier pre-stage amplification module in the prior art is not scientific, simple and convenient, the performance index can not meet the requirement of a whole machine, the production efficiency and the qualification rate are low, and the production cost is high.
Additional features and advantages of the invention will be set forth in the detailed description which follows.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
fig. 1 is a block flow diagram of a manufacturing process of a pre-amplification module of a Ku-band 40-watt power amplifier provided in a preferred embodiment of the present invention;
fig. 2 is a schematic structural diagram of a pre-amplification module of a Ku-band 40-watt power amplifier provided in a preferred embodiment of the present invention.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
As shown in fig. 1 and fig. 2, the invention provides a manufacturing process of a pre-amplification module of a Ku-band 40-watt power amplifier, wherein the manufacturing process comprises the following steps: step 1, cleaning a preceding stage amplification module cavity, a cover plate and a circuit board of an amplifier; step 2, tin coating is carried out on the cover plate and the cavity of the amplifier pre-stage amplification module; step 3, sintering the components on the circuit board; step 4, sintering the circuit board and the insulator on a cavity of a pre-stage amplification module of the amplifier; and 5, debugging and testing the sintered assembly.
According to the technical scheme, in the manufacturing process of the Ku waveband 40-watt power amplifier pre-amplification module, firstly, a cavity of the amplifier pre-amplification module, a cover plate and a circuit board are respectively cleaned, after cleaning, tin coating is carried out on the cover plate and the cavity of the amplifier pre-amplification module, then, a component is sintered on the circuit board, the circuit board and an insulator are sintered on the cavity of the amplifier pre-amplification module, and finally, the sintered component is debugged and tested. The manufacturing process of the Ku waveband 40-watt power amplifier pre-stage amplification module provided by the invention solves the problems that the manufacturing process of the Ku waveband 40-watt power amplifier pre-stage amplification module in the prior art is not scientific, simple and convenient, the performance index can not meet the requirement of a whole machine, the production efficiency and the qualification rate are low, and the production cost is high. Wherein the content of the first and second substances,
the specific operation of the step 1 is as follows: the amplifier pre-stage amplification module cavity, the cover plate and the circuit board are respectively placed in a culture dish containing absolute ethyl alcohol at the temperature of 60 ℃ and brushed by a soft hair brush. After cleaning, placing the amplification module cavity, the cover plate and the circuit board at the front stage of the amplifier in an oven at 50 ℃ for baking for 4-6min, and naturally cooling to 22-25 ℃.
The specific operation of the step 2 is as follows: opening the heating platform, setting the temperature to be 135-plus-145 ℃, flatly placing the cleaned cover plate on the heating platform after the temperature is stable, uniformly covering the solder wires at 120 ℃ on the tin-covered part of the cover plate by using an electric iron, adding a small piece of rosin to facilitate tin covering when needed, moving the cover plate onto filter paper by using wide-mouth tweezers after the tin covering of the cover plate is finished, and cooling to the room temperature; after the cavity is placed on a heating platform for preheating, soldering tin wires at 120 ℃ are uniformly covered on the step of the cavity by a horseshoe-shaped electric soldering iron, and small rosin blocks are added to facilitate tin covering when needed. After the cavity is coated with tin, moving the cavity onto filter paper, and naturally cooling; and putting the tin-coated cavity and the cover plate into a vapor phase cleaning machine for cleaning. Placing the tin-coated cavity and the cover plate into a cleaning tank containing ABZOL CEG CLEANER cleaning agent at 60 deg.C, soaking for 19-21min, taking out, placing into a culture dish containing anhydrous alcohol at 60 deg.C, and brushing with a soft hair brush; then the cleaned cavity and the cover plate are placed in an oven at 50 ℃ to be baked for 4-6min, and then are naturally cooled to 22-25 ℃.
The specific operation of step 3 is: and (3) coating ALPHA OM338 solder paste with a melting point of 217 ℃ on the cleaned circuit board pad by using a pneumatic dispenser, and correctly placing the corresponding component on the pad coated with the solder paste, wherein the component list comprises: c1 and C3 are respectively 10nF capacitors of 0402, C2 and C4 are respectively 100pF capacitors of 0402, IC1 and IC3 are respectively radio frequency amplifier chips HMC516, and IC2 is a triode MTVA0600N 09.
Opening the heating platform, setting the temperature to be 225-235 ℃, sintering the circuit board with the components on the heating platform after the temperature is stable, observing under a microscope, if the components are dislocated and deviated in the sintering process, slightly correcting the components in time by using tweezers to ensure the accuracy of the welding process, taking the welded assembly off the heating platform after the welding is finished, and placing the assembly on filter paper for natural cooling; and clamping alcohol cotton soaked with pure alcohol by using wide-mouth tweezers, cleaning the sintered circuit board, cleaning residual rosin and other stains after sintering, and enabling the soldering tin at the welding position of the cleaned component to be smooth and bright.
The step 4 specifically comprises the following steps: opening a dispenser and adopting a continuous dispensing mode, setting the pressure of the dispenser to be 45-60psi, respectively dispensing a circle of SN63CR32 solder paste with the melting point of 183 ℃ on the inner wall of a through hole of an insulator, one end of the through hole close to the outer side of a cavity and the outer side of the insulator on a cavity of a preceding stage amplification module of an amplifier, printing SN63CR32 solder paste with the melting point of 183 ℃ on the back surface of a Rogers circuit board, then installing the Rogers circuit board with the solder paste on the bottom of the cavity, and then placing a microwave insulator in the corresponding through hole; and opening the heating platform, setting the temperature to be 195-. After sintering, taking the sintered assembly off the heating platform, and placing the assembly on filter paper for natural cooling; cleaning with a vapor phase cleaning machine, placing the sintered insulator and Rogers circuit board assembly in a cleaning tank containing ABZOL CEGCLEANER cleaning agent at 60 deg.C, and soaking for 19-21 min; taking out, placing in a culture dish containing 60 deg.C anhydrous alcohol, brushing the surface of circuit board and the insulator welding position with soft hair brush, and brushing the gaps around the circuit board with flesh-colored hard hair brush for 4-6 min; and then placing the cleaned assembly in an oven at 50 ℃ for baking for 4-6min, and naturally cooling to 22-25 ℃.
In a preferred embodiment of the present invention, the manufacturing process further includes step 6, capping the tested assembly, specifically: the heating platform is opened, and the temperature is set to be 125-135 ℃. And flatly placing the debugged assembly on a heating platform for preheating, flatly placing the cover plate on a cavity step after the temperature is stable, carrying out soldering on the cover plate and the cavity by a soldering tin wire with the temperature of 120 ℃ by taking a sharp-mouth electric soldering iron, and finally cleaning the cover plate by alcohol cotton to finish manufacturing the pre-stage amplification module of the Ku-waveband 40-watt power amplifier.
The preferred embodiments of the present invention have been described in detail with reference to the accompanying drawings, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications can be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.
Claims (1)
1. A manufacturing process of a pre-stage amplification module of a Ku waveband 40-watt power amplifier is characterized by comprising the following steps:
step 1, cleaning a preceding stage amplification module cavity, a cover plate and a circuit board of an amplifier;
step 2, tin coating is carried out on the cover plate and the amplifier pre-stage amplification module cavity, and the cover plate and the amplifier pre-stage amplification module cavity after tin coating are moved to filter paper for natural cooling;
step 3, sintering the components on the circuit board; four capacitors, two radio frequency amplifier chips HMC516 and a triode MTVA0600N09 are respectively sintered on the circuit board;
step 4, sintering the circuit board and the insulator on a cavity of a pre-stage amplification module of the amplifier;
step 5, debugging and testing the sintered assembly;
after each step of the step 2, the step 3 and the step 4 is finished, cleaning and baking are required;
in the steps 1, 2, 3 and 4, absolute ethyl alcohol with the temperature of 60 ℃ is used for cleaning;
the baking temperature is 45-55 ℃, and the baking time is 4-6 min;
after baking is finished, naturally cooling the workpiece to be processed to 22-25 ℃;
the film covering operation in the step 2 is carried out on a heating platform, and the temperature of the heating platform is 125-135 ℃;
the sintering in the step 3 is also carried out on a heating platform, and the temperature of the heating platform is 225-235 ℃;
the manufacturing process also comprises a step 6 of capping the tested assembly.
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| CN109616733A (en) * | 2018-12-06 | 2019-04-12 | 安徽华东光电技术研究所有限公司 | A kind of production method of seven cores filter |
| CN109640543A (en) * | 2018-12-06 | 2019-04-16 | 安徽华东光电技术研究所有限公司 | A kind of production method of five cores filter |
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| CN106714471A (en) * | 2016-12-23 | 2017-05-24 | 安徽华东光电技术研究所 | Manufacturing process of S-band pulse 3-watt amplifier |
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Address after: 241000 Emshan Road, Yijiang District, Wuhu City, Anhui Province Patentee after: ANHUI HUADONG PHOTOELECTRIC TECHNOLOGY INSTITUTE Co.,Ltd. Address before: 241000 Huaxia science and Technology Park, Wuhu high tech Industrial Development Zone, Anhui Patentee before: Anhui Huadong Polytechnic Institute |