CN107612510A - Manufacturing process of pre-stage amplification module of Ku-band 40-watt power amplifier - Google Patents
Manufacturing process of pre-stage amplification module of Ku-band 40-watt power amplifier Download PDFInfo
- Publication number
- CN107612510A CN107612510A CN201710777772.XA CN201710777772A CN107612510A CN 107612510 A CN107612510 A CN 107612510A CN 201710777772 A CN201710777772 A CN 201710777772A CN 107612510 A CN107612510 A CN 107612510A
- Authority
- CN
- China
- Prior art keywords
- power amplifier
- manufacture craft
- watts
- prime amplification
- amplification module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Amplifiers (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a manufacturing process of a pre-stage amplification module of a Ku waveband 40-watt power amplifier, which comprises the following steps: step 1, cleaning a preceding stage amplification module cavity, a cover plate and a circuit board of an amplifier; step 2, tin coating is carried out on the cover plate and the cavity of the amplifier pre-stage amplification module; step 3, sintering the components on the circuit board; step 4, sintering the circuit board and the insulator on a cavity of a pre-stage amplification module of the amplifier; and 5, debugging and testing the sintered assembly. The manufacturing process overcomes the problems that the manufacturing process of the pre-stage amplification module of the Ku waveband 40-watt power amplifier in the prior art is not scientific and simple, the performance index can not meet the requirement of the whole machine, the production efficiency and the qualification rate are low, and the production cost is high.
Description
Technical field
The present invention relates to the preparation method field of power amplifier, in particular it relates to a kind of 40 watts of power amplifications of Ku wave bands
The manufacture craft of device prime amplification module.
Background technology
Ku band power amplifiers refer to power amplifier of the working frequency in the range of 12-18GHz.40 watts of work(of Ku wave bands
Rate amplifier is widely used in satellite communication field, to improve the transmission power of downward signal of satellite, expands satellite-signal and covers
The scope of lid, improve communication quality.It can also be applied in the system such as radar, electronic warfare.Before 40 watts of power amplifiers of Ku wave bands
Level amplification module is the important component for forming Ku 40 watts of continuous wave linear power amplifiers of wave band, and the quality of its index is directly
Affect the parameter of 40 watts of continuous wave linear power amplifiers of Ku wave bands.
The inadequate science of manufacture craft, simplicity of 40 watts of power amplifier prime amplification modules of Ku wave bands of the prior art,
Often there are performance indications and do not reach machine requirement completely, and production efficiency and qualification rate are low, and production cost is high.
Therefore it provides a kind of can effectively improve production efficiency and qualification rate in use, production cost is reduced,
The problem of science, the manufacture craft of easy 40 watts of power amplifier prime amplification modules of Ku wave bands are urgent need to resolve of the present invention.
The content of the invention
For above-mentioned technical problem, the purpose of the present invention is before overcoming 40 watts of power amplifiers of Ku wave bands of the prior art
The inadequate science of manufacture craft, the simplicity of level amplification module, often there are performance indications and do not reach machine requirement completely, and produce
The problem of efficiency and qualification rate are low, and production cost is high, effect is produced so as to provide a kind of can effectively improve in use
Rate and qualification rate, reduce production cost, science, the making work of easy 40 watts of power amplifier prime amplification modules of Ku wave bands
Skill.
To achieve these goals, the invention provides a kind of system of 40 watts of power amplifier prime amplification modules of Ku wave bands
Make technique, the manufacture craft includes：Step 1, amplifier prime amplification module cavity, cover plate and circuit board are cleaned；Step 2,
Cover plate and amplifier prime amplification module cavity are carried out to cover tin, cover plate and amplifier prime amplification module chamber after tin are covered in completion
Body, which is required for moving on to, carries out natural cooling on filter paper；Step 3, component is sintered on circuit board；Respectively by four electric capacity, two
Radio frequency amplifier chip HMC516 and a triode MTVA0600N09 are sintered on circuit board；Step 4, by circuit board and absolutely
Edge is sintered on amplifier prime amplification module cavity；Step 5, the component after the completion of sintering is debugged and tested.
Preferably, it is required for being cleaned after the completion of each step of step 2, step 3 and step 4 and is toasted.
Preferably, cleaned in step 1, step 2, step 3 and step 4 is all to use 60 DEG C of absolute ethyl alcohols.
Preferably, baking temperature is 45 DEG C -55 DEG C, baking time 4min-6min.
Preferably, need workpiece to be added naturally cooling to 22 DEG C -25 DEG C after completing baking.
Preferably, in the step 2 overlay film operation carried out on heating platform, and the temperature of heating platform be 125 DEG C-
135℃。
Preferably, sinter in the step 3 and also carried out on heating platform, and the temperature of heating platform is 225 DEG C -235
℃。
Preferably, the manufacture craft also includes step 6, is covered to completing the component after testing.
According to above-mentioned technical proposal, the making work of 40 watts of power amplifier prime amplification modules of Ku wave bands provided by the invention
Skill in operation, first has to clean amplifier prime amplification module cavity, cover plate and circuit board respectively, completes clear
Start that cover plate and amplifier prime amplification module cavity are carried out to cover tin after washing, then component is sintered on circuit board, by circuit
Plate and insulator are sintered on amplifier prime amplification module cavity, and finally the component after the completion of sintering is debugged and surveyed
Examination.The manufacture craft of 40 watts of power amplifier prime amplification modules of Ku wave bands provided by the invention overcomes Ku ripples of the prior art
The inadequate science of manufacture craft, the simplicity of 40 watts of power amplifier prime amplification modules of section, often there are performance indications completely up to not
To machine requirement, and the problem of production efficiency and qualification rate are low, and production cost is high.
Other features and advantages of the present invention will be described in detail in subsequent specific embodiment part.
Brief description of the drawings
Accompanying drawing is for providing a further understanding of the present invention, and a part for constitution instruction, with following tool
Body embodiment is used to explain the present invention together, but is not construed as limiting the invention.In the accompanying drawings：
Fig. 1 is the 40 watts of power amplifier prime amplification moulds of Ku wave bands provided in a kind of preferred embodiment of the present invention
The FB(flow block) of the manufacture craft of block；
Fig. 2 is the 40 watts of power amplifier prime amplification moulds of Ku wave bands provided in a kind of preferred embodiment of the present invention
The structural representation of block.
Embodiment
The embodiment of the present invention is described in detail below in conjunction with accompanying drawing.It should be appreciated that this place is retouched
The embodiment stated is merely to illustrate and explain the present invention, and is not intended to limit the invention.
As depicted in figs. 1 and 2, the invention provides a kind of making of 40 watts of power amplifier prime amplification modules of Ku wave bands
Technique, the manufacture craft include：Step 1, amplifier prime amplification module cavity, cover plate and circuit board are cleaned；Step 2, it is right
Cover plate and amplifier prime amplification module cavity carry out covering tin；Step 3, component is sintered on circuit board；Step 4, by circuit
Plate and insulator are sintered on amplifier prime amplification module cavity；Step 5, the component after the completion of sintering is debugged and surveyed
Examination.
According to above-mentioned technical proposal, the making work of 40 watts of power amplifier prime amplification modules of Ku wave bands provided by the invention
Skill in operation, first has to clean amplifier prime amplification module cavity, cover plate and circuit board respectively, completes clear
Start that cover plate and amplifier prime amplification module cavity are carried out to cover tin after washing, then component is sintered on circuit board, by circuit
Plate and insulator are sintered on amplifier prime amplification module cavity, and finally the component after the completion of sintering is debugged and surveyed
Examination.The manufacture craft of 40 watts of power amplifier prime amplification modules of Ku wave bands provided by the invention overcomes Ku ripples of the prior art
The inadequate science of manufacture craft, the simplicity of 40 watts of power amplifier prime amplification modules of section, often there are performance indications completely up to not
To machine requirement, and the problem of production efficiency and qualification rate are low, and production cost is high.Wherein,
The concrete operations of step 1 are：Amplifier prime amplification module cavity, cover plate and circuit board are placed on and fill 60 respectively
Scrubbed in the culture dish of DEG C absolute ethyl alcohol with fur brush.After cleaning up, by amplifier prime amplification module cavity, lid
Plate and circuit board are placed on baking 4min-6min in 50 DEG C of baking oven, and naturally cool to 22 DEG C -25 DEG C.
The concrete operations of step 2 are：Heating platform is opened, temperature setting is 135-145 DEG C, will cleaning after temperature stabilization
Cover plate afterwards is lain on heating platform, with electric iron by 120 DEG C of solder stick uniformly overlay on cover plate cover Xi Chu, it is necessary to when add
Fritter rosin is beneficial to cover tin, after the completion of cover plate covers tin, moves on on filter paper cover plate with wide mouth tweezers, is cooled to room temperature；By cavity
Be placed on after being preheated on heating platform, 120 DEG C of solder stick uniformly overlayed at cavity step with horseshoe-shaped electric iron, it is necessary to when
Fritter rosin is added to be beneficial to cover tin.After the completion of cavity covers tin, cavity is moved on on filter paper, natural cooling；Tin cavity and lid will be covered
Plate, it is put into vapour phase cleaning machine and cleans.Tin cavity will be covered and cover plate is put into and fills 60 DEG C of ABZOL CEG CLEANER cleaning agents
Hot brew 19-21min in rinse bath, is placed in the culture dish for filling 60 DEG C of absolute ethyl alcohols after taking-up and is brushed with fur brush
Wash；The cavity after cleaning and cover plate are placed in 50 DEG C of baking oven again and toast 4-6min, then naturally cools to 22 DEG C -25 DEG C.
The concrete operations of step 3 are：At board pads after cleaning, fusing point is coated as 217 with pneumatic point gum machine point
DEG C composition be ALPHA OM338 solder(ing) pastes, and corresponding component is correctly placed at the pad for scribbling solder(ing) paste, first device
Part inventory：C1, C3 are respectively 0402 10nF electric capacity, and C2, C4 are respectively 0402 100pF electric capacity, and IC1, IC3 are respectively radio frequency
Amplifier chip HMC516, IC2 are triode MTVA0600N09.
Heating platform is opened, and temperature setting is 225 DEG C -235 DEG C, the circuit board for putting component well is put after temperature stabilization
Sinter on heating platform, observe under the microscope, the dislocation as component occurs in sintering process, skew, use tweezers in time
Gently set right, it is ensured that welding process is accurate, after the completion of welding, the establishment welded is removed from heating platform, is placed on
Natural cooling on filter paper；The alcohol swab of absolute alcohol is soaked with the gripping of wide mouth tweezers, the circuit board cleaned after sintering will be residual after sintering
The rosin and other spots stayed cleans up, and the component weld scolding tin after cleaning is mellow and full, bright.
Step 4 is specially：Open point gum machine and use continuity point rubber moulding formula, point gum machine pressure is arranged to 45-60psi, respectively
The via inwall of installation insulator and via are close to cavity outside end and insulator on amplifier prime amplification module cavity
It is that 183 DEG C of compositions of point are SN63CR32 solder(ing) pastes that outside spot printing one, which encloses fusing point, and fusing point is in the printing of Rogers back of circuit board
183 DEG C of compositions are SN63CR32 solder(ing) pastes, and the Rogers circuit boards brushed with soldering paste then are arranged on into cavity bottom, then by microwave
Insulator is placed in corresponding via；Heating platform is opened, temperature setting is 195-205 DEG C, by the group to be welded
Part, which is placed on heating platform, carries out burn-back, when solder(ing) paste starts to melt, gently stirs insulator with tweezers, soldering paste is fully flowed
It is dynamic, tried one's best with wide mouth tweezers and push down the both ends of Rogers circuit boards, make Rogers circuit boards sintering fully, penetration rate is good and position
Put correct.After the completion of burn-back, the establishment sintered is removed from heating platform, is placed on natural cooling on filter paper；Reuse
Vapour phase cleaning machine is cleaned, and the component for sintering insulator and Rogers circuit boards is placed on and fills 60 DEG C of ABZOL CEG
Hot brew 19-21min in the rinse bath of CLEANER cleaning agents；It is placed on after taking-up in the culture dish for filling 60 DEG C of absolute ethyl alcohols
Scrubbed, circuit board surface and insulator weld are scrubbed using fur brush, and circuit board surrounding gap uses yellowish pink hard
Hairbrush carries out scrub 4-6min；The component after cleaning is placed in 50 DEG C of baking oven again and toasts 4-6min, naturally cools to 22-
25℃。
In a kind of preferred embodiment of the present invention, the manufacture craft also includes step 6, to completing after testing
Component is covered, and is specially：Heating platform is opened, temperature setting is 125 DEG C -135 DEG C.The component debugged is lain in and added
Preheat on hot platform, after temperature stabilization, be put into cover plate is smooth on cavity step, by sharp mouth electric iron with 120 DEG C of solder stick
Cover plate and cavity soldering is good, cover plate finally is cleaned with alcohol swab, so far a kind of 40 watts of power amplifier prime amplifications of Ku wave bands
Module making is completed.
The preferred embodiment of the present invention is described in detail above in association with accompanying drawing, still, the present invention is not limited to above-mentioned reality
The detail in mode is applied, in the range of the technology design of the present invention, a variety of letters can be carried out to technical scheme
Monotropic type, these simple variants belong to protection scope of the present invention.
It is further to note that each particular technique feature described in above-mentioned embodiment, in not lance
In the case of shield, can be combined by any suitable means, in order to avoid unnecessary repetition, the present invention to it is various can
The combination of energy no longer separately illustrates.
In addition, various embodiments of the present invention can be combined randomly, as long as it is without prejudice to originally
The thought of invention, it should equally be considered as content disclosed in this invention.
Claims (8)
- A kind of 1. manufacture craft of 40 watts of power amplifier prime amplification modules of Ku wave bands, it is characterised in that the manufacture craft Including：Step 1, amplifier prime amplification module cavity, cover plate and circuit board are cleaned；Step 2, to cover plate and amplifier prime amplification module cavity cover tin, complete to cover cover plate and amplifier prime after tin Amplification module cavity, which is required for moving on to, carries out natural cooling on filter paper；Step 3, component is sintered on circuit board；Respectively by four electric capacity, two radio frequency amplifier chip HMC516 and one On individual triode MTVA0600N09 sintering circuit board；Step 4, circuit board and insulator are sintered on amplifier prime amplification module cavity；Step 5, the component after the completion of sintering is debugged and tested.
- 2. the manufacture craft of 40 watts of power amplifier prime amplification modules of Ku wave bands according to claim 1, its feature exist In being required for being cleaned and toasted after the completion of each step of step 2, step 3 and step 4.
- 3. the manufacture craft of 40 watts of power amplifier prime amplification modules of Ku wave bands according to claim 2, its feature exist In it is all to use 60 DEG C of absolute ethyl alcohols to be cleaned in step 1, step 2, step 3 and step 4.
- 4. the manufacture craft of 40 watts of power amplifier prime amplification modules of Ku wave bands according to claim 2, its feature exist In baking temperature is 45 DEG C -55 DEG C, baking time 4min-6min.
- 5. the manufacture craft of 40 watts of power amplifier prime amplification modules of Ku wave bands according to claim 2, its feature exist In completion needs workpiece to be added naturally cooling to 22 DEG C -25 DEG C after toasting.
- 6. the manufacture craft of 40 watts of power amplifier prime amplification modules of Ku wave bands according to claim 1, its feature exist In overlay film operation is carried out on heating platform in the step 2, and the temperature of heating platform is 125 DEG C -135 DEG C.
- 7. the manufacture craft of 40 watts of power amplifier prime amplification modules of Ku wave bands according to claim 6, its feature exist In, sinter in the step 3 and also carried out on heating platform, and the temperature of heating platform be 225 DEG C -235 DEG C.
- 8. the manufacture craft of 40 watts of power amplifier prime amplification modules of Ku wave bands according to claim 1, its feature exist In the manufacture craft also includes step 6, is covered to completing the component after testing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710777772.XA CN107612510B (en) | 2017-09-01 | 2017-09-01 | Manufacturing process of pre-stage amplification module of Ku-band 40-watt power amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710777772.XA CN107612510B (en) | 2017-09-01 | 2017-09-01 | Manufacturing process of pre-stage amplification module of Ku-band 40-watt power amplifier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107612510A true CN107612510A (en) | 2018-01-19 |
| CN107612510B CN107612510B (en) | 2020-10-23 |
Family
ID=61056917
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710777772.XA Active CN107612510B (en) | 2017-09-01 | 2017-09-01 | Manufacturing process of pre-stage amplification module of Ku-band 40-watt power amplifier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107612510B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109616733A (en) * | 2018-12-06 | 2019-04-12 | 安徽华东光电技术研究所有限公司 | A kind of production method of seven cores filter |
| CN109640543A (en) * | 2018-12-06 | 2019-04-16 | 安徽华东光电技术研究所有限公司 | A kind of production method of five cores filter |
| CN109639108A (en) * | 2018-12-06 | 2019-04-16 | 安徽华东光电技术研究所有限公司 | A kind of production method of high-voltage power module |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106714471A (en) * | 2016-12-23 | 2017-05-24 | 安徽华东光电技术研究所 | Manufacturing process of S-band pulse 3-watt amplifier |
-
2017
- 2017-09-01 CN CN201710777772.XA patent/CN107612510B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106714471A (en) * | 2016-12-23 | 2017-05-24 | 安徽华东光电技术研究所 | Manufacturing process of S-band pulse 3-watt amplifier |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109616733A (en) * | 2018-12-06 | 2019-04-12 | 安徽华东光电技术研究所有限公司 | A kind of production method of seven cores filter |
| CN109640543A (en) * | 2018-12-06 | 2019-04-16 | 安徽华东光电技术研究所有限公司 | A kind of production method of five cores filter |
| CN109639108A (en) * | 2018-12-06 | 2019-04-16 | 安徽华东光电技术研究所有限公司 | A kind of production method of high-voltage power module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107612510B (en) | 2020-10-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107612510A (en) | Manufacturing process of pre-stage amplification module of Ku-band 40-watt power amplifier | |
| CN106714471A (en) | Manufacturing process of S-band pulse 3-watt amplifier | |
| CN107612509A (en) | The processing method of 120 watts of miniaturization high power amplifiers of L-band | |
| CN106572607A (en) | Process manufacturing method of solid-state microwave source | |
| CN107367713A (en) | Manufacturing and processing method of front-end module of K2 waveband receiver | |
| CN108039553A (en) | A kind of Ku wave bands one divide the manufacture craft of three power splitters | |
| CN108768304A (en) | A kind of manufacture craft of 50 watts of power amplifiers of S-band | |
| CN108112184B (en) | Manufacturing method of S-band 100-watt pulse power amplifier | |
| CN108111128A (en) | A kind of manufacture craft of 60 watts of miniaturization power amplifiers of Ku wave bands | |
| CN105099370B (en) | The processing method of preposition frequency mixer | |
| CN105430899A (en) | Rigid-flex PCB with flexible region equipped with solder pad and manufacturing method thereof | |
| CN103551690A (en) | Manufacturing method of amplitude limiter | |
| CN105965120A (en) | Semi-automatic eutectic soldering method of GaAs microwave power amplifier chip and product | |
| CN108811362A (en) | A kind of 9 watts of power amplifiers of Ku wave bands push the manufacture craft of grade amplification module | |
| CN107968632A (en) | A kind of manufacture craft of 40 watts of power amplifiers of Ku wave bands | |
| CN107199381A (en) | A kind of process of SMP connectors welding | |
| CN102686044A (en) | Method for removing residual solder tin from soldering-pan during repair and replacement of ball grid array (BGA) chip | |
| CN103521868A (en) | Microwave antenna component welding technology for preventing tin-lead soldering paste from soaking into antenna standing wave surface | |
| CN111106104A (en) | Manufacturing process of 18-28GHZ T assembly | |
| CN104987101B (en) | Process method for improving quality of T/R assembly of phased array radar | |
| CN108092632A (en) | A kind of manufacture craft of 3 watts of power amplifiers of X-band | |
| CN107645848A (en) | The processing method of microwave power amplifier module | |
| CN108110397A (en) | A kind of Ku wave bands one divide the manufacture craft of eight power splitters | |
| CN107395197A (en) | The making processing method in frequency of phase locking source | |
| CN109104826A (en) | A kind of manufacture craft of multiple-frequency modulation device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 241000 Emshan Road, Yijiang District, Wuhu City, Anhui Province Patentee after: ANHUI HUADONG PHOTOELECTRIC TECHNOLOGY INSTITUTE Co.,Ltd. Address before: 241000 Huaxia science and Technology Park, Wuhu high tech Industrial Development Zone, Anhui Patentee before: Anhui Huadong Polytechnic Institute |