CN109639108A - A kind of production method of high-voltage power module - Google Patents

A kind of production method of high-voltage power module Download PDF

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Publication number
CN109639108A
CN109639108A CN201811487433.9A CN201811487433A CN109639108A CN 109639108 A CN109639108 A CN 109639108A CN 201811487433 A CN201811487433 A CN 201811487433A CN 109639108 A CN109639108 A CN 109639108A
Authority
CN
China
Prior art keywords
shell
circuit board
power module
voltage power
production
Prior art date
Application number
CN201811487433.9A
Other languages
Chinese (zh)
Inventor
方航
孟庆贤
周宗明
张庆燕
俞昌忠
余鹏
陈加伐
Original Assignee
安徽华东光电技术研究所有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 安徽华东光电技术研究所有限公司 filed Critical 安徽华东光电技术研究所有限公司
Priority to CN201811487433.9A priority Critical patent/CN109639108A/en
Publication of CN109639108A publication Critical patent/CN109639108A/en

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Classifications

    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00Details of apparatus for conversion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/26Cleaning or polishing of the conductive pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components

Abstract

Present invention discloses a kind of production methods of high-voltage power module, comprising the following steps: step 1, the processing for completing high-voltage power module shell and cover board;Step 2, the processing for completing high-voltage power module circuit board;Step 3, shell and cover board cleaning;Step 4, circuit board cleaning;Step 5, shell printing mark;Step 6, according to be pre-designed by component attachment on circuit boards;Step 7, cleaning are stained with the circuit board of component;Transformer is welded on circuit board by step 8;Circuit board is installed in shell and completes Denso by step 9;Encapsulating in step 10, shell, and cover board is installed to the shell after encapsulating.High-voltage power module batch production method of the present invention, it is simple and reliable, it can guarantee product quality, while promoting product, guarantee production efficiency.

Description

A kind of production method of high-voltage power module
Technical field
The present invention relates to power technique fields more particularly to a kind of driving power production technical fields for laser.
Background technique
With the rapid development of laser industry, laser is widely used to the fields such as military, industrial, traffic and medicine. In the design of laser, driving power is an important component of laser.Since laser has strictly operating condition Requirement will cause performance under unsuitable work or storage condition and sharply deteriorate, or even failure.So stable driving Power supply is particularly important for the laser of normal work, thus, as the source of stable pressure in driving power, equally there is very high want It asks.In the case where that can guarantee normal working condition, in order to which preferably applied to actually, needing to design, one kind is at low cost, structure is simple High-voltage power module production method single and that output is stable.
Summary of the invention
The technical problem to be solved by the present invention is to realize a kind of simple, efficient, reliable high-voltage power module mass Production method.
To achieve the goals above, the technical solution adopted by the present invention are as follows: a kind of production method of high-voltage power module, packet Include following steps:
Step 1, the processing for completing high-voltage power module shell and cover board;
Step 2, the processing for completing high-voltage power module circuit board;
Step 3, shell and cover board cleaning;
Step 4, circuit board cleaning;
Step 5, shell printing mark;
Step 6, according to be pre-designed by component attachment on circuit boards;
Step 7, cleaning are stained with the circuit board of component;
Transformer is welded on circuit board by step 8;
Circuit board is installed in shell and completes Denso by step 9;
Encapsulating in step 10, shell, then cover board is installed on shell.
The step 3 uses following methods: first dip dehydrated alcohol wiping shell and cover board using cotton balls, then by shell and Cover board, which is put into the container for fill dehydrated alcohol, to be impregnated 5~10 minutes, avoids shell from contacting with cover board in soaking process, finally will Shell and cover board are dried up after taking out using inert gas.
The step uses following methods: first circuit board entered to fill in the container of dehydrated alcohol and be impregnated 5~10 minutes, then It is extend into container with brush and scrubs circuit board, circuit board is taken out after the completion of scrub, is finally dried up using inert gas.
The step 5 uses following methods: shell being placed on the objective table of laser marking machine, is positioned and is put using feux rouges Positive shell placement position adjusts height of table by swinging handle, so that sound acuity reaches highest when laser index carving Point adjusts the mark parameter of current knob and laser frequency setting laser marking machine, cancels feux rouges and starts marking, marking is completed to close Laser marking machine is closed, and removes the brand-name shell of print.
The step 6 uses following methods: circuit board being fixed on patch fixture, then patch fixture is placed in dispensing Under machine microscope, microscope is adjusted later and adjusts dispenser patch parameters, according to the high-voltage power module front being pre-designed With reverse side trim designs figure, solder(ing) paste is successively coated at board pads, then component is placed on tweezers and is coated with At the pad of solder(ing) paste, circuit board is removed from paster table be placed on cooling fin later, opens heating platform later, it is to be added Circuit board is placed on heating platform after reaching 210 ± 5 DEG C and is sintered by hot platform temperature, after circuit board sintering after the completion of from Heating platform is removed to be placed on cooling fin and is cooled to room temperature.
The step 7 uses following methods: circuit board being placed in the cleaning basket of cleaning machine equipment, cleaning basket is put into gas In phase rinse bath, cleaning agent of being subject to floods entire printed board, closes cleaning machine equipment cover board, will be electric after cleaning when setting Road plate, which is put into baking oven, to be toasted.
The step 8 uses following methods: the two panels core center column of transformer is first polished off one layer with tooth mill, it A piece of magnetic core cross section is uniformly coated with glue afterwards, is inserted into coil, two windings are drawn from the magnetic core notch respectively, yet another magnetic Core is inserted into coil, is aligned two panels magnetic core position, the magnetic core of test passes is then put into baking oven with 100 ± 5 DEG C of high-temperature bakings 100-140mi n, later repeated measurement inductance and adjust reach core inductance amount between 270~280 μ H, finally take out adjust The transformer solder stick that examination is completed will be in transformer manual welding to circuit board.
The step 9 uses following methods: circuit board being face-up placed into shell, passes through shell with five conducting wires Side wall pierces into shell, respectively corresponds+12V, GND, GND, OUT, REF pin of circuit board, and with solder stick by pin Bracelet welds together one by one with conducting wire.
The step 10 uses following methods: first colloid trickling from the glue filling opening of circuit board into shell, injects 8- every time The colloid of 12ml stands a period of time after having infused colloid every time, until filling entire shell, wind is stood after filling glue in shell It is dry, finally cover board is mounted at shell nozzle, and with the affixed shell of screw and cover board.
High-voltage power module batch production method of the present invention, it is simple and reliable, it can guarantee product quality, promote product Meanwhile guaranteeing production efficiency.
Specific embodiment
High-voltage power module mainly includes three shell, cover board, circuit board parts, the production method of high-voltage power module, Include the following steps:
Step 1: according to the shell of high-voltage power module and covering plate structure figure, completing structural member processing.
Step 2: according to board structure of circuit figure, completing the processing of circuit board (printed board).
Step 3: shell and cover board cleaning
1) fingerstall is put on, the shell or cover board completed the process in step 1 is pinched, dips dehydrated alcohol with tweezers clamping cotton balls Shell or cover board are wiped, is put it into the beaker for filling dehydrated alcohol after the completion of wiping, there are gap among shell and cover board, Avoiding mutually colliding causes to scratch, and impregnates (5~10) minute;
2) shell and cover board are taken out from beaker with tweezers one by one, with being dried with nitrogen, is put into clean culture dish.
Step 4: printed board cleaning
The printed board completed the process in step 2 is put into the beaker for filling dehydrated alcohol, (5~10) minute is impregnated, is used Picture drawing pen is scrubbed, and is after the completion taken out printed board from beaker one by one with tweezers, with being dried with nitrogen, is put into clean culture In ware.
Step 5: mark printing
1) shell for cleaning completion in step 3 is placed on the objective table of laser marking machine, is positioned with feux rouges and rectifies pendulum Put position;
2) mark parameter is set, height of table is adjusted by swinging handle, so that sound acuity when laser index carving It peaks, adjusts current knob to 8.0A, adjust laser frequency to 4.500KHz;
3) cancel feux rouges and start marking, marking is completed to close laser marking machine, and removes the brand-name shell of print.
Step 6: the attachment of component
1) dispenser is opened, circuit board is fixed on patch fixture, patch fixture is placed under dispenser microscope, It observes and adjusts the microscope elevation angle, focal length and amplification factor simultaneously, make to get a clear view convenient for operation;
2) dispenser patch parameters, such as dispensing height, dispensing time and rubber head switching time are adjusted, dispensing height is set as (150 ± 20) mm, dispensing time are set as (10~30) ms, and rubber head switching time is traditionally arranged to be " SLOW ";
3) according to the high-voltage power module front assembling schematic diagram being pre-designed, scolding tin is successively coated at printed board pad Then component is placed at the pad coated with solder(ing) paste with tweezers, pays attention to the direction of component by cream;
4) according to the high-voltage power module reverse side assembling schematic diagram being pre-designed, scolding tin is successively coated at printed board pad Then component is placed at the pad coated with solder(ing) paste with tweezers, pays attention to the direction of component by cream;
5) printed board is slowly removed from paster table with flat mouth tweezers and is placed on cooling fin;
6) heating platform is opened, is that (210 ± 5) DEG C put printed board after temperature reaches by heating platform temperature setting It sets and is sintered on heating platform, remove printed board after the completion of sintering, be placed on cooling fin, be cooled to room temperature, be stained with The printed board of component.
Step 7: being stained with the printed board cleaning of component
The printed board for being stained with component is laid flat in the cleaning basket for being placed in cleaning machine equipment, cleaning basket is put into gas phase rinse bath In, cleaning agent of being subject to floods entire printed board, closes cleaning machine equipment cover board, is arranged scavenging period 15 minutes.Cleaning is completed Afterwards, the printed board for being stained with component is put into baking oven and is toasted (temperature setting is 70 ± 5 DEG C, 5 minutes time).
Step 8: the debugging and welding of transformer
1) magnetic core is pre-processed to improve the intensity of glue sticking and reduce magnetic permeability, it will be in magnetic core with tooth mill Stem is gently polished one layer.
2) magnetic core cross section is uniformly coated with glue, is inserted into coil, two windings are drawn from magnetic core notch respectively, by another Magnetic core is inserted into coil.
3) it is aligned two panels magnetic core position (i.e. gap position alignment), tests primary line group inductance, it is light that magnetic core is pressed to make inductance Amount reaches between 270~280 μ H.It is put into 100 DEG C of high temperature of baking oven and dries 2h.Because glue is not fully cured, it is put into inductance before baking oven It can change always, need repeated measurement inductance and adjust.
4) transformer that debugging is completed is taken out, carries out manual welding with 183 DEG C of solder sticks, is welded in step 7 clear What is washed is stained in the printed board of component, wipes solder joint with alcohol swab, goes to subsequent processing after wiped clean.
Step 9: Denso
1) printed board completed in step 8 is installed in shell, paying attention to will be face-up;
2) it is preset with perforation (entrance hole) on shell, is pierced into shell with five lines by housing sidewall, it is right respectively Five+12V, GND, GND, OUT, REF pins are answered, carries out manual welding with 183 DEG C of solder sticks, is wiped weld with alcohol swab after the completion Point goes to subsequent processing after wiped clean.
Step 10: encapsulating
1) colloid is slowly squeezed out, colloid is allowed to trickle from glue feeding opening into shell, control extruding dynamics and colloid trickling speed Degree, avoids disposably injecting excessive colloid;
2) colloid for injecting about 10ml every time notices that colloid will adequately fill up perfusion part, cannot generate bubble;
3) it after having infused 10ml high every time, stands 1 minute and is perfused next time, until filling entire shell;Entire shell It after filling, places it at dry and ventilated, natural air drying 30 minutes.
Step 11: installation cover board
The corresponding installation of cover board is completed to take out 4 flat head screws of M2 × 8 on the shell of encapsulating, be packed into shell in step 10 In body and the corresponding pilot hole of cover board, screw is tightened with Phillips screwdriver.
So far, a kind of high-voltage power module completes.

Claims (9)

1. a kind of production method of high-voltage power module, which comprises the following steps:
Step 1, the processing for completing high-voltage power module shell and cover board;
Step 2, the processing for completing high-voltage power module circuit board;
Step 3, shell and cover board cleaning;
Step 4, circuit board cleaning;
Step 5, shell printing mark;
Step 6, according to be pre-designed by component attachment on circuit boards;
Step 7, cleaning are stained with the circuit board of component;
Transformer is welded on circuit board by step 8;
Circuit board is installed in shell and completes Denso by step 9;
Encapsulating in step 10, shell, then cover board is installed on shell.
2. the production method of high-voltage power module according to claim 1, it is characterised in that: the step 3 is using following Method: dehydrated alcohol wiping shell and cover board first are dipped using cotton balls, then shell and cover board are put into the appearance for filling dehydrated alcohol It is impregnated 5~10 minutes in device, avoids shell from contacting with cover board in soaking process, use inertia after finally taking out shell and cover board Gas drying.
3. the production method of high-voltage power module according to claim 1, it is characterised in that: the step is used with lower section Method: first circuit board is entered to fill in the container of dehydrated alcohol and is impregnated 5~10 minutes, then extend into container with brush and scrub circuit Plate is taken out circuit board after the completion of scrub, is finally dried up using inert gas.
4. the production method of high-voltage power module according to claim 1, it is characterised in that: the step 5 is using following Method: shell is placed on the objective table of laser marking machine, shell placement position is ajusted using feux rouges positioning, by shaking hand Handle adjusts height of table, so that sound acuity peaks when laser index carving, adjusts current knob and laser frequency The mark parameter of laser marking machine is set, cancels feux rouges and starts marking, marking is completed to close laser marking machine, and removes and be printed on quotient Target shell.
5. the production method of high-voltage power module according to claim 1, it is characterised in that: the step 6 is using following Method: circuit board is fixed on patch fixture, then patch fixture is placed under dispenser microscope, adjusts microscope later And dispenser patch parameters are adjusted, according to the high-voltage power module obverse and reverse trim designs figure being pre-designed, successively in electricity Solder(ing) paste is coated at the plate pad of road, then component is placed at the pad coated with solder(ing) paste with tweezers, later by circuit Plate is removed from paster table and is placed on cooling fin, heating platform is opened later, after platform temperature to be heated reaches 210 ± 5 DEG C Circuit board is placed on heating platform and is sintered, is removed after the completion of circuit board sintering from heating platform and is placed into cooling fin On be cooled to room temperature.
6. the production method of high-voltage power module according to claim 1, it is characterised in that: the step 7 is using following Method: circuit board being placed in the cleaning basket of cleaning machine equipment, and cleaning basket is put into gas phase rinse bath, is flooded with cleaning agent whole Subject to a printed board, cleaning machine equipment cover board is closed, after cleaning when setting, circuit board is put into baking oven and is toasted.
7. the production method of high-voltage power module according to claim 1, it is characterised in that: the step 8 is using following Method: the two panels core center column of transformer is first polished off one layer with tooth mill, later uniformly applies in a piece of magnetic core cross section Upper glue is inserted into coil, and two windings are drawn from the magnetic core notch respectively, in yet another magnetic core insertion coil, is aligned two panels magnetic Then the magnetic core of test passes is put into baking oven 100 ± 5 DEG C of high-temperature baking 100-140min, later repeated measurement by core position Inductance and adjust reach core inductance amount between 270~280 μ H, finally take out debugging complete transformer with solder stick will In transformer manual welding to circuit board.
8. the production method of high-voltage power module according to claim 1, it is characterised in that: the step 9 is using following Method: circuit board is face-up placed into shell, is pierced into shell with five conducting wires by housing sidewall, right respectively Answer+12V, GND, GND, OUT, REF pin of circuit board, and bracelet welds together one by one by pin and conducting wire with solder stick.
9. the production method of high-voltage power module according to claim 1, it is characterised in that: the step 10 is using following Method: first trickling into shell from the glue filling opening of circuit board by colloid, inject the colloid of 8-12ml every time, has infused every time quiet after colloid A period of time is set, until filling entire shell, stands and air-dries after filling glue in shell, cover board is finally mounted on shell nozzle Place, and with the affixed shell of screw and cover board.
CN201811487433.9A 2018-12-06 2018-12-06 A kind of production method of high-voltage power module CN109639108A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110213925A (en) * 2019-06-04 2019-09-06 安徽华东光电技术研究所有限公司 A kind of frequency pressure conversion module production method and its frequency pressure conversion module

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CN107612510A (en) * 2017-09-01 2018-01-19 安徽华东光电技术研究所 The manufacture craft of 40 watts of power amplifier prime amplification modules of Ku wave bands
CN108092632A (en) * 2017-12-15 2018-05-29 安徽华东光电技术研究所 A kind of manufacture craft of 3 watts of power amplifiers of X-band
CN108111128A (en) * 2017-12-15 2018-06-01 安徽华东光电技术研究所 A kind of manufacture craft of 60 watts of miniaturization power amplifiers of Ku wave bands
CN108811362A (en) * 2018-06-14 2018-11-13 安徽华东光电技术研究所有限公司 A kind of 9 watts of power amplifiers of Ku wave bands push the manufacture craft of grade amplification module

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Publication number Priority date Publication date Assignee Title
CN102417694A (en) * 2011-11-21 2012-04-18 成都拓利化工实业有限公司 Normal-temperature cured flame-retardant anti-cracking low-halogen epoxy casting glue for ignition coil of automobile
CN102717605A (en) * 2012-05-08 2012-10-10 武汉百一机电工程有限公司 Following management system for laser marking and product quality assurance based on network communication
CN105140019A (en) * 2015-09-11 2015-12-09 珠海科德电子有限公司 Automatic assembling device
CN105458541A (en) * 2015-12-18 2016-04-06 安徽华东光电技术研究所 EMI constant current power supply filter module and preparation method thereof
CN106100587A (en) * 2016-06-23 2016-11-09 安徽华东光电技术研究所 A kind of manufacturing process of varactor doubler
CN107612510A (en) * 2017-09-01 2018-01-19 安徽华东光电技术研究所 The manufacture craft of 40 watts of power amplifier prime amplification modules of Ku wave bands
CN108092632A (en) * 2017-12-15 2018-05-29 安徽华东光电技术研究所 A kind of manufacture craft of 3 watts of power amplifiers of X-band
CN108111128A (en) * 2017-12-15 2018-06-01 安徽华东光电技术研究所 A kind of manufacture craft of 60 watts of miniaturization power amplifiers of Ku wave bands
CN108811362A (en) * 2018-06-14 2018-11-13 安徽华东光电技术研究所有限公司 A kind of 9 watts of power amplifiers of Ku wave bands push the manufacture craft of grade amplification module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110213925A (en) * 2019-06-04 2019-09-06 安徽华东光电技术研究所有限公司 A kind of frequency pressure conversion module production method and its frequency pressure conversion module

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