CN109639108A - A kind of production method of high-voltage power module - Google Patents
A kind of production method of high-voltage power module Download PDFInfo
- Publication number
- CN109639108A CN109639108A CN201811487433.9A CN201811487433A CN109639108A CN 109639108 A CN109639108 A CN 109639108A CN 201811487433 A CN201811487433 A CN 201811487433A CN 109639108 A CN109639108 A CN 109639108A
- Authority
- CN
- China
- Prior art keywords
- shell
- circuit board
- power module
- voltage power
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Present invention discloses a kind of production methods of high-voltage power module, comprising the following steps: step 1, the processing for completing high-voltage power module shell and cover board；Step 2, the processing for completing high-voltage power module circuit board；Step 3, shell and cover board cleaning；Step 4, circuit board cleaning；Step 5, shell printing mark；Step 6, according to be pre-designed by component attachment on circuit boards；Step 7, cleaning are stained with the circuit board of component；Transformer is welded on circuit board by step 8；Circuit board is installed in shell and completes Denso by step 9；Encapsulating in step 10, shell, and cover board is installed to the shell after encapsulating.High-voltage power module batch production method of the present invention, it is simple and reliable, it can guarantee product quality, while promoting product, guarantee production efficiency.
Description
Technical field
The present invention relates to power technique fields more particularly to a kind of driving power production technical fields for laser.
Background technique
With the rapid development of laser industry, laser is widely used to the fields such as military, industrial, traffic and medicine.
In the design of laser, driving power is an important component of laser.Since laser has strictly operating condition
Requirement will cause performance under unsuitable work or storage condition and sharply deteriorate, or even failure.So stable driving
Power supply is particularly important for the laser of normal work, thus, as the source of stable pressure in driving power, equally there is very high want
It asks.In the case where that can guarantee normal working condition, in order to which preferably applied to actually, needing to design, one kind is at low cost, structure is simple
High-voltage power module production method single and that output is stable.
Summary of the invention
The technical problem to be solved by the present invention is to realize a kind of simple, efficient, reliable high-voltage power module mass
Production method.
To achieve the goals above, the technical solution adopted by the present invention are as follows: a kind of production method of high-voltage power module, packet
Include following steps:
Step 1, the processing for completing high-voltage power module shell and cover board；
Step 2, the processing for completing high-voltage power module circuit board；
Step 3, shell and cover board cleaning；
Step 4, circuit board cleaning；
Step 5, shell printing mark；
Step 6, according to be pre-designed by component attachment on circuit boards；
Step 7, cleaning are stained with the circuit board of component；
Transformer is welded on circuit board by step 8；
Circuit board is installed in shell and completes Denso by step 9；
Encapsulating in step 10, shell, then cover board is installed on shell.
The step 3 uses following methods: first dip dehydrated alcohol wiping shell and cover board using cotton balls, then by shell and
Cover board, which is put into the container for fill dehydrated alcohol, to be impregnated 5~10 minutes, avoids shell from contacting with cover board in soaking process, finally will
Shell and cover board are dried up after taking out using inert gas.
The step uses following methods: first circuit board entered to fill in the container of dehydrated alcohol and be impregnated 5~10 minutes, then
It is extend into container with brush and scrubs circuit board, circuit board is taken out after the completion of scrub, is finally dried up using inert gas.
The step 5 uses following methods: shell being placed on the objective table of laser marking machine, is positioned and is put using feux rouges
Positive shell placement position adjusts height of table by swinging handle, so that sound acuity reaches highest when laser index carving
Point adjusts the mark parameter of current knob and laser frequency setting laser marking machine, cancels feux rouges and starts marking, marking is completed to close
Laser marking machine is closed, and removes the brand-name shell of print.
The step 6 uses following methods: circuit board being fixed on patch fixture, then patch fixture is placed in dispensing
Under machine microscope, microscope is adjusted later and adjusts dispenser patch parameters, according to the high-voltage power module front being pre-designed
With reverse side trim designs figure, solder(ing) paste is successively coated at board pads, then component is placed on tweezers and is coated with
At the pad of solder(ing) paste, circuit board is removed from paster table be placed on cooling fin later, opens heating platform later, it is to be added
Circuit board is placed on heating platform after reaching 210 ± 5 DEG C and is sintered by hot platform temperature, after circuit board sintering after the completion of from
Heating platform is removed to be placed on cooling fin and is cooled to room temperature.
The step 7 uses following methods: circuit board being placed in the cleaning basket of cleaning machine equipment, cleaning basket is put into gas
In phase rinse bath, cleaning agent of being subject to floods entire printed board, closes cleaning machine equipment cover board, will be electric after cleaning when setting
Road plate, which is put into baking oven, to be toasted.
The step 8 uses following methods: the two panels core center column of transformer is first polished off one layer with tooth mill, it
A piece of magnetic core cross section is uniformly coated with glue afterwards, is inserted into coil, two windings are drawn from the magnetic core notch respectively, yet another magnetic
Core is inserted into coil, is aligned two panels magnetic core position, the magnetic core of test passes is then put into baking oven with 100 ± 5 DEG C of high-temperature bakings
100-140mi n, later repeated measurement inductance and adjust reach core inductance amount between 270~280 μ H, finally take out adjust
The transformer solder stick that examination is completed will be in transformer manual welding to circuit board.
The step 9 uses following methods: circuit board being face-up placed into shell, passes through shell with five conducting wires
Side wall pierces into shell, respectively corresponds+12V, GND, GND, OUT, REF pin of circuit board, and with solder stick by pin
Bracelet welds together one by one with conducting wire.
The step 10 uses following methods: first colloid trickling from the glue filling opening of circuit board into shell, injects 8- every time
The colloid of 12ml stands a period of time after having infused colloid every time, until filling entire shell, wind is stood after filling glue in shell
It is dry, finally cover board is mounted at shell nozzle, and with the affixed shell of screw and cover board.
High-voltage power module batch production method of the present invention, it is simple and reliable, it can guarantee product quality, promote product
Meanwhile guaranteeing production efficiency.
Specific embodiment
High-voltage power module mainly includes three shell, cover board, circuit board parts, the production method of high-voltage power module,
Include the following steps:
Step 1: according to the shell of high-voltage power module and covering plate structure figure, completing structural member processing.
Step 2: according to board structure of circuit figure, completing the processing of circuit board (printed board).
Step 3: shell and cover board cleaning
1) fingerstall is put on, the shell or cover board completed the process in step 1 is pinched, dips dehydrated alcohol with tweezers clamping cotton balls
Shell or cover board are wiped, is put it into the beaker for filling dehydrated alcohol after the completion of wiping, there are gap among shell and cover board,
Avoiding mutually colliding causes to scratch, and impregnates (5~10) minute；
2) shell and cover board are taken out from beaker with tweezers one by one, with being dried with nitrogen, is put into clean culture dish.
Step 4: printed board cleaning
The printed board completed the process in step 2 is put into the beaker for filling dehydrated alcohol, (5~10) minute is impregnated, is used
Picture drawing pen is scrubbed, and is after the completion taken out printed board from beaker one by one with tweezers, with being dried with nitrogen, is put into clean culture
In ware.
Step 5: mark printing
1) shell for cleaning completion in step 3 is placed on the objective table of laser marking machine, is positioned with feux rouges and rectifies pendulum
Put position；
2) mark parameter is set, height of table is adjusted by swinging handle, so that sound acuity when laser index carving
It peaks, adjusts current knob to 8.0A, adjust laser frequency to 4.500KHz；
3) cancel feux rouges and start marking, marking is completed to close laser marking machine, and removes the brand-name shell of print.
Step 6: the attachment of component
1) dispenser is opened, circuit board is fixed on patch fixture, patch fixture is placed under dispenser microscope,
It observes and adjusts the microscope elevation angle, focal length and amplification factor simultaneously, make to get a clear view convenient for operation；
2) dispenser patch parameters, such as dispensing height, dispensing time and rubber head switching time are adjusted, dispensing height is set as
(150 ± 20) mm, dispensing time are set as (10~30) ms, and rubber head switching time is traditionally arranged to be " SLOW "；
3) according to the high-voltage power module front assembling schematic diagram being pre-designed, scolding tin is successively coated at printed board pad
Then component is placed at the pad coated with solder(ing) paste with tweezers, pays attention to the direction of component by cream；
4) according to the high-voltage power module reverse side assembling schematic diagram being pre-designed, scolding tin is successively coated at printed board pad
Then component is placed at the pad coated with solder(ing) paste with tweezers, pays attention to the direction of component by cream；
5) printed board is slowly removed from paster table with flat mouth tweezers and is placed on cooling fin；
6) heating platform is opened, is that (210 ± 5) DEG C put printed board after temperature reaches by heating platform temperature setting
It sets and is sintered on heating platform, remove printed board after the completion of sintering, be placed on cooling fin, be cooled to room temperature, be stained with
The printed board of component.
Step 7: being stained with the printed board cleaning of component
The printed board for being stained with component is laid flat in the cleaning basket for being placed in cleaning machine equipment, cleaning basket is put into gas phase rinse bath
In, cleaning agent of being subject to floods entire printed board, closes cleaning machine equipment cover board, is arranged scavenging period 15 minutes.Cleaning is completed
Afterwards, the printed board for being stained with component is put into baking oven and is toasted (temperature setting is 70 ± 5 DEG C, 5 minutes time).
Step 8: the debugging and welding of transformer
1) magnetic core is pre-processed to improve the intensity of glue sticking and reduce magnetic permeability, it will be in magnetic core with tooth mill
Stem is gently polished one layer.
2) magnetic core cross section is uniformly coated with glue, is inserted into coil, two windings are drawn from magnetic core notch respectively, by another
Magnetic core is inserted into coil.
3) it is aligned two panels magnetic core position (i.e. gap position alignment), tests primary line group inductance, it is light that magnetic core is pressed to make inductance
Amount reaches between 270~280 μ H.It is put into 100 DEG C of high temperature of baking oven and dries 2h.Because glue is not fully cured, it is put into inductance before baking oven
It can change always, need repeated measurement inductance and adjust.
4) transformer that debugging is completed is taken out, carries out manual welding with 183 DEG C of solder sticks, is welded in step 7 clear
What is washed is stained in the printed board of component, wipes solder joint with alcohol swab, goes to subsequent processing after wiped clean.
Step 9: Denso
1) printed board completed in step 8 is installed in shell, paying attention to will be face-up；
2) it is preset with perforation (entrance hole) on shell, is pierced into shell with five lines by housing sidewall, it is right respectively
Five+12V, GND, GND, OUT, REF pins are answered, carries out manual welding with 183 DEG C of solder sticks, is wiped weld with alcohol swab after the completion
Point goes to subsequent processing after wiped clean.
Step 10: encapsulating
1) colloid is slowly squeezed out, colloid is allowed to trickle from glue feeding opening into shell, control extruding dynamics and colloid trickling speed
Degree, avoids disposably injecting excessive colloid；
2) colloid for injecting about 10ml every time notices that colloid will adequately fill up perfusion part, cannot generate bubble；
3) it after having infused 10ml high every time, stands 1 minute and is perfused next time, until filling entire shell；Entire shell
It after filling, places it at dry and ventilated, natural air drying 30 minutes.
Step 11: installation cover board
The corresponding installation of cover board is completed to take out 4 flat head screws of M2 × 8 on the shell of encapsulating, be packed into shell in step 10
In body and the corresponding pilot hole of cover board, screw is tightened with Phillips screwdriver.
So far, a kind of high-voltage power module completes.
Claims (9)
1. a kind of production method of high-voltage power module, which comprises the following steps:
Step 1, the processing for completing high-voltage power module shell and cover board；
Step 2, the processing for completing high-voltage power module circuit board；
Step 3, shell and cover board cleaning；
Step 4, circuit board cleaning；
Step 5, shell printing mark；
Step 6, according to be pre-designed by component attachment on circuit boards；
Step 7, cleaning are stained with the circuit board of component；
Transformer is welded on circuit board by step 8；
Circuit board is installed in shell and completes Denso by step 9；
Encapsulating in step 10, shell, then cover board is installed on shell.
2. the production method of high-voltage power module according to claim 1, it is characterised in that: the step 3 is using following
Method: dehydrated alcohol wiping shell and cover board first are dipped using cotton balls, then shell and cover board are put into the appearance for filling dehydrated alcohol
It is impregnated 5~10 minutes in device, avoids shell from contacting with cover board in soaking process, use inertia after finally taking out shell and cover board
Gas drying.
3. the production method of high-voltage power module according to claim 1, it is characterised in that: the step is used with lower section
Method: first circuit board is entered to fill in the container of dehydrated alcohol and is impregnated 5~10 minutes, then extend into container with brush and scrub circuit
Plate is taken out circuit board after the completion of scrub, is finally dried up using inert gas.
4. the production method of high-voltage power module according to claim 1, it is characterised in that: the step 5 is using following
Method: shell is placed on the objective table of laser marking machine, shell placement position is ajusted using feux rouges positioning, by shaking hand
Handle adjusts height of table, so that sound acuity peaks when laser index carving, adjusts current knob and laser frequency
The mark parameter of laser marking machine is set, cancels feux rouges and starts marking, marking is completed to close laser marking machine, and removes and be printed on quotient
Target shell.
5. the production method of high-voltage power module according to claim 1, it is characterised in that: the step 6 is using following
Method: circuit board is fixed on patch fixture, then patch fixture is placed under dispenser microscope, adjusts microscope later
And dispenser patch parameters are adjusted, according to the high-voltage power module obverse and reverse trim designs figure being pre-designed, successively in electricity
Solder(ing) paste is coated at the plate pad of road, then component is placed at the pad coated with solder(ing) paste with tweezers, later by circuit
Plate is removed from paster table and is placed on cooling fin, heating platform is opened later, after platform temperature to be heated reaches 210 ± 5 DEG C
Circuit board is placed on heating platform and is sintered, is removed after the completion of circuit board sintering from heating platform and is placed into cooling fin
On be cooled to room temperature.
6. the production method of high-voltage power module according to claim 1, it is characterised in that: the step 7 is using following
Method: circuit board being placed in the cleaning basket of cleaning machine equipment, and cleaning basket is put into gas phase rinse bath, is flooded with cleaning agent whole
Subject to a printed board, cleaning machine equipment cover board is closed, after cleaning when setting, circuit board is put into baking oven and is toasted.
7. the production method of high-voltage power module according to claim 1, it is characterised in that: the step 8 is using following
Method: the two panels core center column of transformer is first polished off one layer with tooth mill, later uniformly applies in a piece of magnetic core cross section
Upper glue is inserted into coil, and two windings are drawn from the magnetic core notch respectively, in yet another magnetic core insertion coil, is aligned two panels magnetic
Then the magnetic core of test passes is put into baking oven 100 ± 5 DEG C of high-temperature baking 100-140min, later repeated measurement by core position
Inductance and adjust reach core inductance amount between 270~280 μ H, finally take out debugging complete transformer with solder stick will
In transformer manual welding to circuit board.
8. the production method of high-voltage power module according to claim 1, it is characterised in that: the step 9 is using following
Method: circuit board is face-up placed into shell, is pierced into shell with five conducting wires by housing sidewall, right respectively
Answer+12V, GND, GND, OUT, REF pin of circuit board, and bracelet welds together one by one by pin and conducting wire with solder stick.
9. the production method of high-voltage power module according to claim 1, it is characterised in that: the step 10 is using following
Method: first trickling into shell from the glue filling opening of circuit board by colloid, inject the colloid of 8-12ml every time, has infused every time quiet after colloid
A period of time is set, until filling entire shell, stands and air-dries after filling glue in shell, cover board is finally mounted on shell nozzle
Place, and with the affixed shell of screw and cover board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811487433.9A CN109639108A (en) | 2018-12-06 | 2018-12-06 | A kind of production method of high-voltage power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811487433.9A CN109639108A (en) | 2018-12-06 | 2018-12-06 | A kind of production method of high-voltage power module |
Publications (1)
| Publication Number | Publication Date |
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| CN109639108A true CN109639108A (en) | 2019-04-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811487433.9A Pending CN109639108A (en) | 2018-12-06 | 2018-12-06 | A kind of production method of high-voltage power module |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110213925A (en) * | 2019-06-04 | 2019-09-06 | 安徽华东光电技术研究所有限公司 | A kind of frequency pressure conversion module production method and its frequency pressure conversion module |
| CN110944463A (en) * | 2019-12-10 | 2020-03-31 | 安徽华东光电技术研究所有限公司 | Manufacturing method of grid-control gun power supply cathode voltage doubling module |
| CN110996550A (en) * | 2019-12-23 | 2020-04-10 | 安徽华东光电技术研究所有限公司 | Manufacturing method of deletion control gun power supply half-bridge circuit module |
| CN111822278A (en) * | 2020-06-03 | 2020-10-27 | 北方夜视技术股份有限公司 | Image intensifier power supply encapsulating device and encapsulating method |
| CN111901981A (en) * | 2020-08-07 | 2020-11-06 | 安徽华东光电技术研究所有限公司 | Manufacturing method of photoelectric conversion module |
| CN113507785A (en) * | 2021-06-08 | 2021-10-15 | 广州致远电子有限公司 | Transformer-based packaging module preparation method |
| CN113507778A (en) * | 2021-07-07 | 2021-10-15 | 广州市爱浦电子科技有限公司 | Paster micropower power module suitable for chip mounter automated production |
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| CN110996550A (en) * | 2019-12-23 | 2020-04-10 | 安徽华东光电技术研究所有限公司 | Manufacturing method of deletion control gun power supply half-bridge circuit module |
| CN111822278A (en) * | 2020-06-03 | 2020-10-27 | 北方夜视技术股份有限公司 | Image intensifier power supply encapsulating device and encapsulating method |
| CN111901981A (en) * | 2020-08-07 | 2020-11-06 | 安徽华东光电技术研究所有限公司 | Manufacturing method of photoelectric conversion module |
| CN113507785A (en) * | 2021-06-08 | 2021-10-15 | 广州致远电子有限公司 | Transformer-based packaging module preparation method |
| CN113507778A (en) * | 2021-07-07 | 2021-10-15 | 广州市爱浦电子科技有限公司 | Paster micropower power module suitable for chip mounter automated production |
| CN113507778B (en) * | 2021-07-07 | 2022-08-16 | 广州市爱浦电子科技有限公司 | Paster micropower power module suitable for chip mounter automated production |
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Application publication date: 20190416 |
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