CN103682930A - Lead wire connecting method and radio frequency antenna - Google Patents
Lead wire connecting method and radio frequency antenna Download PDFInfo
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- CN103682930A CN103682930A CN201210319919.8A CN201210319919A CN103682930A CN 103682930 A CN103682930 A CN 103682930A CN 201210319919 A CN201210319919 A CN 201210319919A CN 103682930 A CN103682930 A CN 103682930A
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Abstract
The embodiment of the invention discloses a lead wire connecting method and a radio frequency antenna. The method comprises the following steps: stripping a lead wire core from a lead wire; arranging the lead wire on a circuit substrate, and aligning the stripped lead wire core with a circuit connecting point on the circuit substrate; dripping metal colloid on the lead wire core in a dispensing manner to enable the lead wire core to be stuck to the circuit connecting point by virtue of the viscosity of the metal colloid. The method provided by the embodiment of the invention can be applied to any metal circuit owing to the favorable viscosity of the metal colloid (preferably, silver paste) and is wide in application range. Besides, the method provided by the embodiment of the invention is simple to operate, the tools adopted in the method are also very simple and convenient, and the equipment universality is high. According to the method provided by the embodiment of the invention, cold working substitutes for welding hot working to achieve firm connection of the lead wire and a circuit and avoid damage to a product caused by high temperature operation. Moreover, the nontoxic effect is realized during the connection process and the harm to a human body can be avoided.
Description
Technical field
Embodiment of the present invention relates to technical field of electricity, more specifically, relates to a kind of electric wire connection method and radio-frequency antenna.
Background technology
Wire is generally made by copper or aluminium, and also useful silver-colored line made (conduction, hot good), is used for dredging electric current or heat conduction.Wire adopts the mode of soldering accomplished with being connected of circuit conventionally at present.The principle of soldering be by heating flatiron by solid-state solder stick heat fused, relend the effect that helps scaling powder, it is flowed between welded metal, form after cooling solid and reliable pad.In situation, scolder is that leypewter, solder side are copper mostly.Scolder first produces and infiltrates face of weld, be accompanied by the generation of infiltration phenomenon, scolder is gradually to metallic copper diffusion, at the contact-making surface formation adhesion layer of scolder and metallic copper, both are firmly combined, so scolding tin completes by infiltration, diffusion and metallurgical these three physical and chemical processes.
Yet, adopt the mode of welding realize wire with have being connected of circuit technique more complicated, do not go up tin and to shortcomings such as the metal types of circuit surface are selective.For example: if circuit surface is nickel coating, just cannot realize being connected of electric wire and circuit by welding method.
Specifically, the wire of prior art and the connected mode of circuit at least have following shortcoming:
1, the limitation of application.For example oxidized in order to prevent circuit, last layer nickel-plated metal layer adheres in branch of circuit part, and the method for at this moment soldering is also unavailable.Scolder and the tin material of heating, cannot infiltrate nickel dam, thereby cannot complete soldering, and wire also just cannot be realized and being connected with circuit by the method for soldering.
2, soldering technique does not easily cause the phenomenon of tin.There is many reasons, the incorrect incorrect tin phenomenon that all likely do not cause that causes solder horn oxidation, uses impure scolding tin or scaling powder to use of as too high in flatiron temperature, clean method.
3, tin soldering tool, the diversity of selecting as solder horn causes the uncertainty of soldering result.The geomery of solder horn, production method, maintenance method have determined soldering effect.Need to through checking more repeatedly, determine the selection of solder horn, waste time and energy.
4, tin soldering tool solder horn excess Temperature is encountered on circuit, likely can cause surface peeling or deformation of products, and processing risk is higher.
5, scolder contains tin and lead mostly, and itself has certain harm to human body.In the tin material process of soldering, scaling powder easily produces micro-poisonous gas, and human body is also had to certain harm.
Summary of the invention
In view of this, embodiment of the present invention proposes a kind of electric wire connection method, replaces sweating heat processing mode to realize the firm connection of wire and circuit.
Embodiment of the present invention proposes a kind of radio-frequency antenna, replaces sweating heat processing mode to realize the firm connection of wire and antenna traces.
The technical scheme of embodiment of the present invention is as follows:
An electric wire connection method, is characterized in that, the method comprises:
From wire, strip out wire stylet;
By conductor arrangement, on circuit base material, the wire stylet stripping out described in making is aimed at the circuit tie point on this circuit base material;
Utilize some glue mode that metallic colloid is dropped on described wire stylet, make this wire stylet utilize the adhesive bond of metallic colloid at described circuit tie point.
The method further comprises:
Circuit tie point in the described adhesive bond of utilizing metallic colloid is carried out to drying and processing, described wire is firmly connected with circuit base material.
Described metallic colloid is silver slurry.
Described metallic colloid is gold paste, palladium slurry or copper slurry.
Described conductor arrangement is comprised on circuit base material:
On circuit base material, arrange guiding groove;
Described guidewire body is partly arranged in this guiding groove, the described wire stylet stripping out is drawn to described guiding groove.
The method further comprises:
Guiding gutter is set on guiding groove;
Metallic colloid is inducted into this guiding gutter.
Described guiding gutter is cambered surface guiding gutter or domatic guiding gutter.
Described wire is copper conductor, and has copper screen; The method further comprises:
Utilize metallic colloid that the copper screen of described wire is connected with the ground on circuit base material.
Described circuit base material is circuit board, plastics or glass.
A radio-frequency antenna, comprises antenna holder, is positioned at antenna traces and radio frequency wire on antenna holder; Wherein: on antenna holder, have guiding groove, radio frequency wire is arranged in this guiding groove; One end of this radio frequency wire is stripped out wire stylet, the circuit tie point of the adhesive bond that this wire stylet stripping out utilizes metallic colloid in described antenna traces.
From technique scheme, can find out, in embodiment of the present invention, from wire, strip out wire stylet; By conductor arrangement, on circuit base material, the wire stylet stripping out described in making is aimed at the circuit tie point on this circuit base material; Utilize some glue mode that metallic colloid is dropped on described wire stylet, make this wire stylet utilize the adhesive bond of metallic colloid at described circuit tie point.As can be seen here, after application embodiment of the present invention, utilize the excellent adhering of metallic colloid (being preferably silver slurry), can in the circuit of any metal, apply, be widely used.And embodiment of the present invention is simple to operate, the instrument adopting is also very easy, and equipment interoperability is strong.
In addition, embodiment of the present invention replaces sweating heat to process the firm connection that realizes wire and circuit, the injury of having avoided hot operation to bring product with cold working.And implementation procedure is nontoxic, human body is safe from harm.
Accompanying drawing explanation
Fig. 1 is the electric wire connection method flow chart according to embodiment of the present invention;
Fig. 2 is for being connected to the schematic diagram of circuit according to the wire of embodiment of the present invention;
Fig. 3 is according to the schematic diagram of the wire guide structure of embodiment of the present invention;
Fig. 4 is according to the schematic diagram of the cambered surface guiding gutter of embodiment of the present invention;
Fig. 5 is according to the schematic diagram of the domatic guiding gutter of embodiment of the present invention;
Fig. 6 is according to the radio-frequency antenna circuit of embodiment of the present invention and the connection diagram of wire;
Fig. 7 is according to embodiment of the present invention, increases the assembling schematic diagram that groove removes to guide radio frequency wire on antenna holder;
Fig. 8 is according to embodiment of the present invention, increases groove and go to guide the assembling of radio frequency wire to complete schematic diagram on antenna holder;
Fig. 9 is according to embodiment of the present invention, increases the assembling schematic diagram of spherical excision on antenna holder;
Figure 10 is according to embodiment of the present invention, and the assembling that increases spherical excision on antenna holder completes schematic diagram;
Figure 11 is according to embodiment of the present invention, increases the assembling schematic diagram that convex groove coordinates with wire;
Figure 12 is according to embodiment of the present invention, and the assembling that increase convex groove coordinates with wire completes schematic diagram.
Embodiment
For making the object, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing, the present invention is described in further detail.
For wire in prior art and circuit adopt welding manner be connected caused technique more complicated, do not go up tin, to defects such as the metal types of circuit surface are selective.Embodiment of the present invention is intended to realize electric wire and the method for attachment of the circuit of metal material arbitrarily, can avoid the deficiency of a lot of traditional welding method.
Fig. 1 is the electric wire connection method flow chart according to embodiment of the present invention.
As shown in Figure 1, the method comprises:
Step 101: strip out wire stylet from wire.
Here, wire can be divided into single-core line and split conductor, and split conductor also can be fixed on many single-core lines in an insulating sleeve, and it is metal-cored that wire is generally copper core, aluminium core etc., can from wire, strip out wire stylet by various ways such as wire stripping pliers here, and both can strip out wire stylet by manual type, also can strip out wire stylet by corresponding automatic control mode.
When stripping out wire stylet from wire, generally retain guidewire body part, and from conductor wire end, strip out a part of wire stylet, the wire stylet wherein stripping out partly keeps being connected with guidewire body.
Step 102: on circuit base material, the wire stylet stripping out described in making is aimed at the circuit tie point on this circuit base material by conductor arrangement.
Here, circuit base material is preferably circuit board, plastics or glass, etc.From wire, strip out after wire stylet, the wire stylet stripping out is aimed to the circuit tie point setting in advance on this circuit base material.The wire stylet that wire stripping goes out is generally copper core, wire can be positioned over (can be circuit board, plastics, glass etc.) on circuit base material, copper core is aimed at and need to be connected to the position on circuit.
Step 103: utilize some glue mode that metallic colloid is dropped on described wire stylet, make this wire stylet utilize the adhesive bond of metallic colloid at described circuit tie point.
, utilize some glue mode that metallic colloid is dropped on wire stylet here, make this wire stylet utilize the adhesive bond of metallic colloid at described circuit tie point.
In one embodiment, can use Manual dispenser on electronic product, to put glue, also can use dispensing needle head to complete a glue job.Particularly, the dispensing needle head that can adopt specifically can be divided into bayonet socket syringe needle, stainless steel syringe needle, hairbrush syringe needle, Teflon syringe needle, spiral and mould a syringe needle, multitube syringe needle, overlength stainless steel syringe needle, stainless steel needle tubing, curved mouth syringe needle, TT inclined syringe needle, PP immunity syringe needle, etc.
In embodiment of the present invention, the metallic colloid that specifically can adopt includes, but are not limited to: silver-colored slurry, gold paste, palladium slurry or copper slurry, etc.Embodiment of the present invention is to this and indefinite.
Preferably, embodiment of the present invention can adopt silver slurry as metallic colloid.Silver slurry has very strong viscosity, and has good conductivity, can accomplish firmly to connect and conducting completely between wire and circuit.Can use silver slurry to replace scolder, adopt the mode of some glue, the silver slurry of certain volume be dropped in to the wire stylet (such as copper core) stripping out upper, without hot working, make wire can utilize the adhesive bond of silver slurry at circuit surface.Wherein, if need to be grounded in certain part of wire, can on relevant position, the silver slurry of certain volume be dropped in to this region, realize wire and be connected with earthing position on circuit base material.
The thick slurry of a kind of mechanical mixture that particularly, silver-colored slurry can be comprised of particulate, adhesive, solvent, the auxiliary agent of highly purified (such as 99.9%) argent.It is very strict that conductive silver paste requires its component.The height of its quality, content number, and shape, size are to silver slurry performance close relation all.
The particulate of argent is the Main Ingredients and Appearance of conductive silver paste.The content of argent in slurry is directly relevant with electric conductivity.Say in a sense, the content of silver is high, to the conductivity that improves it, is useful, but when its content is during over critical volume concentration, its conductivity can not improve.General silver content is when 80～90% (weight ratio), and electric conduction quantity has reached peak, when content continues to increase, electrically no longer improves, and resistance value is in rising trend; When content is lower than 60% time, the variation of resistance is unstable.In concrete application, in silver slurry, silver-colored fraction of particle should be considered stable resistance, restricted by the factors such as curing characteristics, adhesive strength, economy, as too high in silver-colored fraction of particle, be bonded the probability that resin wraps low, after film-forming, the bonding force of silver conductor declines, the danger that has silver granuel to come off.So the silver-colored content in silver slurry is generally 60～70%, suitable.
Adhesive claims again bonding agent, is the film forming matter in conductive silver paste.In conductive silver paste, the microparticulate of conductive silver is in adhesive.Before seal is cuted out figure, the adhesive having relied on by dissolution with solvents forms silver slurry has the seal of certain viscosity to expect, the figure completing with screen printing mode shifts; After printing, through solidification process, make between the particulate and particulate of conductive silver paste, form stable combination between particulate and base material.This is the double liability of bonding agent.Bonding agent adopts synthetic resin conventionally, and it is high molecular polymer.Synthetic resin can be divided into heat curing-type and the large class of thermoplastics type two.Thermosetting resin, as phenolic resins, epoxy resin etc.Their feature is at a certain temperature after solidified forming, even if heating is also no longer softening again, is also difficult for being dissolved in solvent.Thermoplastic resin because of its intermolecular relative attraction lower, the after-tack of being heated, returns to normal after cooling.Thermoplastic polymer resin, because interchain easily relatively moves, shows and has pliability.The resin of bonding agent is all generally insulator, and due to adhesive itself non-conductive, if do not solidify at a certain temperature, electrically conductive particles can not form closely and connect.Different resins adds same conductive materials, and after film-forming, its electric conductivity is different, and this is relevant with adhesive resin coherency.The selection of conductive silver paste to bonding agent resin, has many-sided consideration.The viscosity of different bonding agents, coherency, tack, thermal characteristics etc. have larger difference.The producer of conductive silver paste needs to make overall plans for the physicochemical property of the base material of conductive silver paste effect, condition of cure, film forming matter.
Auxiliary agent in conductive silver paste mainly refers to dispersant, the levelling agent of conductive silver paste, antioxidant of metal particle, stabilizer etc.The membership that adds of auxiliary agent exerts an adverse impact to electric conductivity, only in the situation that weighing the advantages and disadvantages aptly, optionally add.Conductive silver paste is different by sintering temperature, is divided into high temperature silver slurry, middle temperature silver slurry and low-temperature silver slurry.Wherein senior middle school's temperature slug type silver slurry is mainly used in the aspects such as solar cell, piezoelectric ceramic.Low-temperature silver slurry is mainly used in thin film switch and above keyboard lines.
In one embodiment, embodiment of the present invention further comprises:
Circuit tie point in the described adhesive bond of utilizing metallic colloid is carried out to drying and processing, described wire is firmly connected with circuit base material.Particularly, the wire of connection and circuit can be placed on to dryer or heat baking lower a period of time of rifle, through drying and processing, wire be firmly connected with circuit.
In one embodiment, can on circuit substrate surface, according to the diameter of wire, arrange guiding groove, then described guidewire body is partly arranged in this guiding groove, the described wire stylet stripping out is drawn to described guiding groove.By arranging such guide structure at circuit substrate surface according to diameter of wire, can make wire be placed on circuit and can not move left and right, play the effect of location.
In one embodiment, wire is specially copper conductor, and has copper screen; The method further comprises: utilize metallic colloid that the copper screen of described wire is connected with the ground on circuit base material.
Based on foregoing detailed description, can utilize metal alternately to connect the line on various circuit.
Such as, Fig. 2 is for being connected to the schematic diagram of circuit according to the wire of embodiment of the present invention.
As shown in Figure 2, the wire stylet stripping out is connected on the concrete tie point of circuit by a glue mode, and there is guiding groove on this circuit substrate surface, and guidewire body is arranged in this guiding groove, and the wire stylet stripping out is drawn described guiding groove and by a glue mode, is connected on the concrete tie point of circuit.
In Fig. 2, wire is specially copper conductor, and has copper screen; And this copper screen utilizes metallic colloid to be connected with the ground on circuit base material, the ground on circuit base material is also made by copper material conventionally.
Further, guiding gutter can be set on guiding groove; Then metallic colloid is inducted into this guiding gutter.
Preferably, guiding gutter is cambered surface guiding gutter or domatic guiding gutter.By making cambered surface guiding gutter or domatic guiding gutter at circuit substrate surface, can make on the one hand unnecessary silver slurry flow into guiding gutter, be unlikely to make silver slurry stacking too high blocked up at wire and circuit surface, can increase on the other hand wire contacts silver slurry area with circuit, thereby strengthen the fastness of connection.
Fig. 3 is according to the schematic diagram of the wire guide structure of embodiment of the present invention; Fig. 4 is according to the schematic diagram of the cambered surface guiding gutter of embodiment of the present invention; Fig. 5 is according to the schematic diagram of the domatic guiding gutter of embodiment of the present invention.
In sum, in embodiment of the present invention, in embodiment of the present invention, from wire, strip out wire stylet; By conductor arrangement, on circuit base material, the wire stylet stripping out described in making is aimed at the circuit tie point on this circuit base material; Utilize some glue mode that metallic colloid is dropped on described wire stylet, make this wire stylet utilize the adhesive bond of metallic colloid at described circuit tie point.As can be seen here, after application embodiment of the present invention, utilize the excellent adhering of metallic colloid (being preferably silver slurry), can apply at the circuit of any metal, be widely used.And embodiment of the present invention is simple to operate, the instrument adopting is also very easy, and equipment interoperability is strong.
In addition, embodiment of the present invention replaces sweating heat to process the firm connection that realizes wire and circuit, the injury of having avoided hot operation to bring product with cold working.And implementation procedure is nontoxic, human body is safe from harm.
Embodiment of the present invention can be applied in the application scenarios that various wires are connected with circuit.Preferably, embodiment of the present invention is particularly useful in radio-frequency antenna application.
Fig. 6 is according to the radio-frequency antenna circuit of embodiment of the present invention and the connection diagram of wire.
Embodiment of the present invention has also proposed a kind of radio-frequency antenna.This radio-frequency antenna comprises antenna holder (1), is positioned at antenna traces (2) and radio frequency wire (3) on antenna holder (1); Wherein: on antenna holder (1), have guiding groove (4), radio frequency wire (3) is arranged in this guiding groove (4); One end of this radio frequency wire (3) is stripped out wire stylet, this wire stylet stripping out by a glue mode, utilize metallic colloid the circuit tie point of adhesive bond in described antenna traces (1) on.
In embodiment of the present invention, can carry out drying and processing to the circuit tie point in the described adhesive bond of utilizing metallic colloid, described wire is firmly connected with antenna holder.
On guiding groove, can further there is guiding gutter; Metallic colloid can be inducted into this guiding gutter.And guiding gutter is preferably cambered surface guiding gutter or domatic guiding gutter.
In one embodiment, this radio frequency wire is copper conductor, and has copper screen.The copper screen of described wire utilizes metallic colloid to be connected with antenna holder.
Preferably, antenna traces is printed antenna circuit or laser direct forming (LDS) antenna traces.
In embodiment of the present invention, the metallic colloid that specifically can adopt includes, but are not limited to: silver-colored slurry, gold paste, palladium slurry or copper slurry, etc.
Preferably, embodiment of the present invention can adopt silver slurry as metallic colloid.Silver slurry has very strong viscosity, and has good conductivity, can accomplish firmly to connect and conducting completely between wire and circuit.Can use silver slurry to replace scolder, adopt the mode of some glue, the silver slurry of certain volume be dropped in to the wire stylet (such as copper core) stripping out upper, without hot working, make wire can utilize the adhesive bond of silver slurry at circuit surface.
Metallic colloid in some glue process can be inducted in this guiding groove, can make on the one hand unnecessary silver slurry flow into guiding groove, be unlikely to make silver slurry stacking too high blocked up at wire and circuit surface, can increase on the other hand wire contacts silver slurry area with circuit, thus the fastness that reinforcement connects.
Guiding groove is specifically as follows groove.By increase this groove on antenna holder, can guide the position of radio frequency wire, increase the fixed-area of wire simultaneously.Can adopt silver to starch mode fixing cord curing or that scolding tin welds position in the circuit board.
Fig. 7 is according to embodiment of the present invention, increases the assembling schematic diagram that groove removes to guide radio frequency wire on antenna holder; Fig. 8 is according to embodiment of the present invention, increases groove and go to guide the assembling of radio frequency wire to complete schematic diagram on antenna holder; Fig. 9 is according to embodiment of the present invention, increases the assembling schematic diagram of spherical excision on antenna holder; Figure 10 is according to embodiment of the present invention, and the assembling that increases spherical excision on antenna holder completes schematic diagram; Figure 11 is according to embodiment of the present invention, increases the assembling schematic diagram that convex groove coordinates with wire; Figure 12 is according to embodiment of the present invention, and the assembling that increase convex groove coordinates with wire completes schematic diagram.
By above-mentioned diagram, can be shown, by increase groove on antenna holder, go to guide the position of radio frequency wire, increase the fixed-area of wire simultaneously, can adopt silver to starch mode fixing cord curing or that scolding tin welds position in the circuit board.And, can on antenna holder, increase spherical excision at the contact position place of wire and circuit, the guiding by spherical excision face as silver slurry or tin cream, prevents overflowing of tin cream.And pass goes out region online increases convex groove and coordinates with wire, the position of lead wire and enhancing bonding strength.
The above, be only preferred embodiment of the present invention, is not intended to limit protection scope of the present invention.Within the spirit and principles in the present invention all, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (10)
1. an electric wire connection method, is characterized in that, the method comprises:
From wire, strip out wire stylet;
By conductor arrangement, on circuit base material, the wire stylet stripping out described in making is aimed at the circuit tie point on this circuit base material;
Utilize some glue mode that metallic colloid is dropped on described wire stylet, make this wire stylet utilize the adhesive bond of metallic colloid at described circuit tie point.
2. according to claim a kind of electric wire connection method, is characterized in that, the method further comprises:
Circuit tie point in the described adhesive bond of utilizing metallic colloid is carried out to drying and processing, described wire is firmly connected with circuit base material.
3. electric wire connection method according to claim 1, is characterized in that, described metallic colloid is silver slurry.
4. electric wire connection method according to claim 1, is characterized in that, described metallic colloid is gold paste, palladium slurry or copper slurry.
5. electric wire connection method according to claim 1, is characterized in that, described conductor arrangement is comprised on circuit base material:
On circuit base material, arrange guiding groove;
Described guidewire body is partly arranged in this guiding groove, the described wire stylet stripping out is drawn to described guiding groove.
6. electric wire connection method according to claim 1, is characterized in that, the method further comprises:
Guiding gutter is set on guiding groove;
Metallic colloid is inducted into this guiding gutter.
7. electric wire connection method according to claim 6, is characterized in that, described guiding gutter is cambered surface guiding gutter or domatic guiding gutter.
8. electric wire connection method according to claim 1, is characterized in that, described wire is copper conductor, and has copper screen; The method further comprises:
Utilize metallic colloid that the copper screen of described wire is connected with the ground on circuit base material.
9. a radio-frequency antenna, is characterized in that, comprises antenna holder, is positioned at antenna traces and radio frequency wire on antenna holder; Wherein: on antenna holder, have guiding groove, radio frequency wire is arranged in this guiding groove; One end of this radio frequency wire is stripped out wire stylet, the circuit tie point of the adhesive bond that this wire stylet stripping out utilizes metallic colloid in described antenna traces.
10. radio-frequency antenna according to claim 9, is characterized in that, described metallic colloid is silver slurry; Described antenna traces is printed antenna circuit or laser direct forming (LDS) antenna traces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210319919.8A CN103682930A (en) | 2012-09-03 | 2012-09-03 | Lead wire connecting method and radio frequency antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210319919.8A CN103682930A (en) | 2012-09-03 | 2012-09-03 | Lead wire connecting method and radio frequency antenna |
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| CN103682930A true CN103682930A (en) | 2014-03-26 |
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| CN201210319919.8A Pending CN103682930A (en) | 2012-09-03 | 2012-09-03 | Lead wire connecting method and radio frequency antenna |
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| CN106099398A (en) * | 2016-05-30 | 2016-11-09 | 西安金波科技有限责任公司 | A kind of radio frequency coaxial semi-rigid cable assembly and attachment method thereof |
| CN106329191A (en) * | 2016-08-22 | 2017-01-11 | 广东小天才科技有限公司 | Connection method of three-dimensional circuit and metal part, and LDS (Laser-Direct-Structuring) antenna |
| CN111054587A (en) * | 2019-12-26 | 2020-04-24 | 北京航天控制仪器研究所 | Cambered surface glue dispensing device and method |
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| CN111054587B (en) * | 2019-12-26 | 2021-07-13 | 北京航天控制仪器研究所 | Cambered surface glue dispensing device and method |
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Application publication date: 20140326 |