CN110139502A - Pcb board surface mount process - Google Patents
Pcb board surface mount process Download PDFInfo
- Publication number
- CN110139502A CN110139502A CN201910470535.8A CN201910470535A CN110139502A CN 110139502 A CN110139502 A CN 110139502A CN 201910470535 A CN201910470535 A CN 201910470535A CN 110139502 A CN110139502 A CN 110139502A
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- China
- Prior art keywords
- pcb board
- temperature
- tin cream
- solder paste
- heated
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of pcb board surface mount process, are related to the technical field of pcb board processing, solve the problems, such as that solvent volatilization is insufficient and tin cream is be easy to cause to splash, its key points of the technical solution are that the following steps are included: a. print solder paste；B. facade element mounts；C. reflow ovens are welded；The overturning of d.PCB plate；E. print solder paste；F. back elements mount；G. reflow ovens are welded；H. visual identity inspection；Apply ultrasonic wave by treating welder's part in preheating, so that workpiece to be welded shakes, so that the solvent and moisture in tin cream can be volatilized more quickly from tin cream, reducing the later period the problem of tin cream splashing occurs.
Description
Technical field
The present invention relates to the technical fields of pcb board processing, more specifically, it is related to a kind of pcb board surface mount process.
Background technique
When carrying out pcb board surface mount, element is welded on to the table of pcb board all by way of Reflow Soldering mostly
On face；Scolding tin is precoated on the surface of present pcb board mostly when welding, is then placed on pcb board by element, most
The pcb board for being placed with element is sent in reflow soldering afterwards and carries out Reflow Soldering.
All contain rosin, activating agent, viscosity improver and solvent in tin cream mostly, the effect of solvent is mainly exactly conduct
The carrier of rosin and the storage time for improving tin cream, in solder reflow process, the workpiece to be welded for being coated with tin cream needs
Successively by preheating zone, heat preservation zone, reflow soldering area and cooling zone in reflow soldering, existing preheating zone is mainly exactly to pass through
Heating, forces solvent and moisture in tin cream that can adequately volatilize as far as possible, thus avoid solvent in tin cream and
It volatilizees in reflow process with moisture the case where causing tin cream to splash, but with the increasing of present pad
Greatly, solvent and moisture need longer distance that can escape from from tin cream in tin cream, this, which also has led to reflow soldering, is
It is easy to appear the problem of tin cream splashes.
Summary of the invention
In view of the deficiencies of the prior art, the present invention intends to provide a kind of pcb board surface mount process, lead to
It crosses in preheating and treats welder's part application ultrasonic wave, so that workpiece to be welded shakes, so that solvent and water in tin cream
Dividing more quickly to volatilize from tin cream, and the problem of tin cream splashing occurs in the reduction later period.
To achieve the above object, the present invention provides the following technical scheme that a kind of pcb board surface mount process, including with
Lower step:
A. it print solder paste: needs to guarantee that pcb board is in a horizontal position when print solder paste, prevents the position of print solder paste from occurring
Deviation；
B. facade element mounts: will need in component mounter to pcb board to be mounted；
C. reflow ovens are welded: the pcb board for having mounted element is sent in reflow ovens and carries out Reflow Soldering, carry out Reflow Soldering when
Time is preheated first, and the temperature of reflow ovens is heated to 105 DEG C~110 DEG C, and the time control of the temperature is heated to from room temperature
In 1min~1.5min, passes through ultrasonic wave simultaneously when carrying out anticipation heat and pcb board is shaken；After preheating terminates, make
Reflow ovens are kept for the constant temperature stage, temperature is heated to 170 DEG C~175 DEG C when the constant temperature stage, and keep temperature 1.5min
~2min, the constant temperature stage, which is used as, keeps the temperature pcb board, so that temperature is uniform everywhere in pcb board；Reflux rank is entered later
Section, refluxing stage need to heat temperature and are more than return wire, return wire different from according to the difference of the tin cream used, greatly
About at 180 DEG C~185 DEG C, heating is then proceeded by, until being heated to 210 DEG C~220 DEG C, then temperature starts to fall after rise, drop
Once to reflux temperature, tin cream solidifies at this time；Then it is cooled down；
The overturning of d.PCB plate: will weld and the cooling pcb board terminated turns, and carry out the attachment at the pcb board back side；
E. it print solder paste: needs to guarantee that pcb board is in a horizontal position when print solder paste, prevents the position of print solder paste from occurring
Deviation；
F. back elements mount: will need in component mounter to pcb board to be mounted；
G. reflow ovens are welded: the pcb board for having mounted element is sent in reflow ovens and carries out Reflow Soldering, carry out Reflow Soldering when
Time is preheated first, and the temperature of reflow ovens is heated to 105 DEG C~110 DEG C, and the time control of the temperature is heated to from room temperature
In 1min~1.5min, passes through ultrasonic wave simultaneously when carrying out anticipation heat and pcb board is shaken；After preheating terminates, make
Reflow ovens are kept for the constant temperature stage, temperature is heated to 170 DEG C~175 DEG C when the constant temperature stage, and keep temperature 1.5min
~2min, the constant temperature stage, which is used as, keeps the temperature pcb board, so that temperature is uniform everywhere in pcb board；Reflux rank is entered later
Section, refluxing stage need to heat temperature and are more than return wire, return wire different from according to the difference of the tin cream used, greatly
About at 180 DEG C~185 DEG C, heating is then proceeded by, until being heated to 210 DEG C~220 DEG C, then temperature starts to fall after rise, drop
Once to reflux temperature, tin cream solidifies at this time；Then it is cooled down；
H. visual identity inspection: whether conformed to quality requirements using the pcb board that automated optical detection equipment detection has mounted.
By using above-mentioned technical proposal, in the process preheated, solvent gasifies and steams as the temperature rises
Hair, so that the solvent and moisture in tin cream can be volatilized more quickly from tin cream, there is tin cream in the reduction later period
The problem of splashing.
The present invention is further arranged to: in the step a, before print solder paste, needing to clean pcb board, by PCB
Under impurity and dust cleaning on plate.
It is prevented remaining miscellaneous on pcb board by using above-mentioned technical proposal by under the impurity and dust cleaning on pcb board
Matter and dust impact the welding quality of element.
The present invention is further arranged to: in the step a, when clearing up pcb board, by ultrasonic wave to pcb board into
Then row concussion is blowed by the impurity on pcb board and under dust shakes from pcb board to pcb board, by wind-force by pcb board
On by vibration under dust and impurities dispose.
By using above-mentioned technical proposal, by vibration of ultrasonic wave can preferably by pcb board impurity and dust shake
It falls, so that dust and impurities more thorough can blow down pcb board by wind-force.
The present invention is further arranged to: in the step a and step e, when carrying out paste solder printing, passing through paste solder printing
Machine prints solder paste on pcb board the position for needing to carry out element installation.
By using above-mentioned technical proposal, the effect of printing can be improved by the printing that stencil printer machine carries out tin cream
Rate improves the precision of printing.
The present invention is further arranged to: in the step b and step f, needed when attachment using chip mounter into
The attachment of units.
By using above-mentioned technical proposal, the attachment of element is carried out using chip mounter, can be improved the efficiency of component mounter,
Improve the precision of component mounter.
The present invention is further arranged to: in the step c and step g, being also required to through ultrasonic wave in refluxing stage to PCB
Plate is shaken.
By using above-mentioned technical proposal, in the slave tin cream that the scaling powder to gasify in vibration process can be more easier
It is detached from, reduces the probability for occurring welding cavity in tin cream.
The present invention is further arranged to: in the step c and step g, needing to control the cooling time when cooling, no
Energy is too fast can not be excessively slow, and cooling velocity needs uniformly, and usually control cooling time is in 1.5min~2min.
By using above-mentioned technical proposal, by uniform cooling velocity, tin cream can be prevented because cooling velocity is uneven
It is even and the problem of edge tilting occur.
In conclusion the present invention has the advantages that compared with the prior art
1, by carrying out vibration of ultrasonic wave to pcb board when preheating, solvent gasifies and steams as the temperature rises the present invention
Hair, solvent and moisture can be more quickly detached from tin cream under the action of vibration of ultrasonic wave, to reduce tin cream
The residual of solvent in the middle, to be not easy the problem of tin cream splashing occur；
2, for the present invention by carrying out vibration of ultrasonic wave to pcb board in refluxing stage, the scaling powder to gasify in vibration process can
It is detached from the slave tin cream being more easier, reduces the probability for occurring welding cavity in tin cream.
Specific embodiment
A kind of embodiment one: pcb board surface mount process, comprising the following steps:
The cleaning of a.PCB plate surface: carrying out the impurity needed before pcb board mounts by pcb board surface and dust is cleaned out, into
Pcb board is shaken by ultrasonic wave when row cleaning, by the impurity on pcb board and under dust shakes from pcb board, then
It is blowed to pcb board, will be disposed on pcb board by the dust and impurities under vibration by wind-force；
B. print solder paste: by pcb board just facing towards being printed solder paste on pcb board by stencil printer and need to carry out member
The position of part installation；It needs to guarantee that pcb board is in a horizontal position when print solder paste, prevents the position of print solder paste from occurring inclined
Difference；
C. facade element mounts: will need in component mounter to pcb board to be mounted, and be needed when attachment using chip mounter
Carry out the attachment of element；
D. reflow ovens are welded: the pcb board for having mounted element is sent in reflow ovens and carries out Reflow Soldering, carry out Reflow Soldering when
Time is preheated first, and the temperature of reflow ovens is heated to 105 DEG C, and the time for being heated to the temperature from room temperature controls in 1min,
Pass through ultrasonic wave simultaneously when carrying out anticipation heat to shake pcb board；In the process preheated, solvent is with temperature
The raising of degree and steam raising, solvent and moisture can more quickly take off in tin cream under the action of vibration of ultrasonic wave
From the problem of tin cream splashing occurs in the reduction later period；After preheating terminates, so that reflow ovens are kept for the constant temperature stage, when the constant temperature stage
Temperature is heated to 170 DEG C, and keeps temperature 1.5min, the constant temperature stage, which is used as, keeps the temperature pcb board, so that pcb board
Everywhere in temperature it is uniform；Refluxing stage is entered later, and refluxing stage needs to heat temperature and is more than return wire, return wire root
According to the difference of the tin cream used, different from then proceeds by heating about at 180 DEG C, until being heated to 210 DEG C, so
Temperature starts to fall after rise afterwards, is down to reflux temperature once, and tin cream solidifies at this time；It is also required to through ultrasonic wave in refluxing stage to PCB
Plate is shaken, and is detached from the slave tin cream that the scaling powder to gasify in vibration process can be more easier, and reduces in tin cream
Now weld the probability in cavity；Then cooled down, need to control the cooling time when cooling, cannot it is too fast can not mistake
Slowly, and cooling velocity needs uniformly, and usually control cooling time is in 1.5min；
The overturning of e.PCB plate: will weld and the cooling pcb board terminated turns, and carry out the attachment at the pcb board back side；
F. it print solder paste: by the back side direction of pcb board, is printed solder paste on pcb board by stencil printer and needs to carry out member
The position of part installation；It needs to guarantee that pcb board is in a horizontal position when print solder paste, prevents the position of print solder paste from occurring inclined
Difference；
G. back elements mount: will need in component mounter to pcb board to be mounted, and be needed when attachment using chip mounter
Carry out the attachment of element；
H. reflow ovens are welded: the pcb board for having mounted element is sent in reflow ovens and carries out Reflow Soldering, carry out Reflow Soldering when
Time is preheated first, and the temperature of reflow ovens is heated to 105 DEG C, and the time for being heated to the temperature from room temperature controls in 1min,
Pass through ultrasonic wave simultaneously when carrying out anticipation heat to shake pcb board；In the process preheated, solvent is with temperature
The raising of degree and steam raising, solvent and moisture can more quickly take off in tin cream under the action of vibration of ultrasonic wave
From the problem of tin cream splashing occurs in the reduction later period；After preheating terminates, so that reflow ovens are kept for the constant temperature stage, when the constant temperature stage
Temperature is heated to 170 DEG C, and keeps temperature 1.5min, the constant temperature stage, which is used as, keeps the temperature pcb board, so that pcb board
Everywhere in temperature it is uniform；Refluxing stage is entered later, and refluxing stage needs to heat temperature and is more than return wire, return wire root
According to the difference of the tin cream used, different from then proceeds by heating about at 180 DEG C, until being heated to 210 DEG C, so
Temperature starts to fall after rise afterwards, is down to reflux temperature once, and tin cream solidifies at this time；It is also required to through ultrasonic wave in refluxing stage to PCB
Plate is shaken, and is detached from the slave tin cream that the scaling powder to gasify in vibration process can be more easier, and reduces in tin cream
Now weld the probability in cavity；Then cooled down, need to control the cooling time when cooling, cannot it is too fast can not mistake
Slowly, and cooling velocity needs uniformly, and usually control cooling time is in 1.5min；
I. visual identity inspection: whether conformed to quality requirements using the pcb board that automated optical detection equipment detection has mounted.
A kind of embodiment two: pcb board surface mount process, comprising the following steps:
The cleaning of a.PCB plate surface: carrying out the impurity needed before pcb board mounts by pcb board surface and dust is cleaned out, into
Pcb board is shaken by ultrasonic wave when row cleaning, by the impurity on pcb board and under dust shakes from pcb board, then
It is blowed to pcb board, will be disposed on pcb board by the dust and impurities under vibration by wind-force；
B. print solder paste: by pcb board just facing towards being printed solder paste on pcb board by stencil printer and need to carry out member
The position of part installation；It needs to guarantee that pcb board is in a horizontal position when print solder paste, prevents the position of print solder paste from occurring inclined
Difference；
C. facade element mounts: will need in component mounter to pcb board to be mounted, and be needed when attachment using chip mounter
Carry out the attachment of element；
D. reflow ovens are welded: the pcb board for having mounted element is sent in reflow ovens and carries out Reflow Soldering, carry out Reflow Soldering when
Time is preheated first, and the temperature of reflow ovens is heated to 107.5 DEG C, and the time control for being heated to the temperature from room temperature exists
1.25min passes through ultrasonic wave simultaneously when carrying out anticipation heat and shakes to pcb board；It is molten in the process preheated
Agent steam raising as the temperature rises, solvent and moisture can be more quickly from tin creams under the action of vibration of ultrasonic wave
It is detached from the middle, the problem of tin cream splashing occurs in the reduction later period；After preheating terminates, so that reflow ovens keep constant temperature stage, constant temperature
Temperature is heated to 172.5 DEG C when the stage, and keeps temperature 1.75min, the constant temperature stage, which is used as, keeps the temperature pcb board,
So that temperature is uniform everywhere in pcb board；Refluxing stage is entered later, and refluxing stage needs to heat temperature and is more than reflux
Line, return wire according to the difference of the tin cream used and different from about at 182.5 DEG C then proceeds by heating, until plus
Heat is to 215 DEG C, and then temperature starts to fall after rise, is down to reflux temperature once, and tin cream solidifies at this time；It is also required to pass through in refluxing stage
Ultrasonic wave shakes pcb board, is detached from, subtracts in the slave tin cream that the scaling powder to gasify in vibration process can be more easier
Occurs the probability in welding cavity in few tin cream；Then it is cooled down, needs to control the cooling time when cooling, it cannot be too fast
Can not be excessively slow, and cooling velocity needs uniformly, and usually control cooling time is in 1.75min；
The overturning of e.PCB plate: will weld and the cooling pcb board terminated turns, and carry out the attachment at the pcb board back side；
F. it print solder paste: by the back side direction of pcb board, is printed solder paste on pcb board by stencil printer and needs to carry out member
The position of part installation；It needs to guarantee that pcb board is in a horizontal position when print solder paste, prevents the position of print solder paste from occurring inclined
Difference；
G. back elements mount: will need in component mounter to pcb board to be mounted, and be needed when attachment using chip mounter
Carry out the attachment of element；
H. reflow ovens are welded: the pcb board for having mounted element is sent in reflow ovens and carries out Reflow Soldering, carry out Reflow Soldering when
Time is preheated first, and the temperature of reflow ovens is heated to 107.5 DEG C, and the time control for being heated to the temperature from room temperature exists
1.75min passes through ultrasonic wave simultaneously when carrying out anticipation heat and shakes to pcb board；It is molten in the process preheated
Agent steam raising as the temperature rises, solvent and moisture can be more quickly from tin creams under the action of vibration of ultrasonic wave
It is detached from the middle, the problem of tin cream splashing occurs in the reduction later period；After preheating terminates, so that reflow ovens keep constant temperature stage, constant temperature
Temperature is heated to 172.5 DEG C when the stage, and keeps temperature 1.75min, the constant temperature stage, which is used as, keeps the temperature pcb board,
So that temperature is uniform everywhere in pcb board；Refluxing stage is entered later, and refluxing stage needs to heat temperature and is more than reflux
Line, return wire according to the difference of the tin cream used and different from about at 182.5 DEG C then proceeds by heating, until plus
Heat is to 215 DEG C, and then temperature starts to fall after rise, is down to reflux temperature once, and tin cream solidifies at this time；It is also required to pass through in refluxing stage
Ultrasonic wave shakes pcb board, is detached from, subtracts in the slave tin cream that the scaling powder to gasify in vibration process can be more easier
Occurs the probability in welding cavity in few tin cream；Then it is cooled down, needs to control the cooling time when cooling, it cannot be too fast
Can not be excessively slow, and cooling velocity needs uniformly, and usually control cooling time is in 1.75min；
I. visual identity inspection: whether conformed to quality requirements using the pcb board that automated optical detection equipment detection has mounted.
A kind of embodiment three: pcb board surface mount process, comprising the following steps:
The cleaning of a.PCB plate surface: carrying out the impurity needed before pcb board mounts by pcb board surface and dust is cleaned out, into
Pcb board is shaken by ultrasonic wave when row cleaning, by the impurity on pcb board and under dust shakes from pcb board, then
It is blowed to pcb board, will be disposed on pcb board by the dust and impurities under vibration by wind-force；
B. print solder paste: by pcb board just facing towards being printed solder paste on pcb board by stencil printer and need to carry out member
The position of part installation；It needs to guarantee that pcb board is in a horizontal position when print solder paste, prevents the position of print solder paste from occurring inclined
Difference；
C. facade element mounts: will need in component mounter to pcb board to be mounted, and be needed when attachment using chip mounter
Carry out the attachment of element；
D. reflow ovens are welded: the pcb board for having mounted element is sent in reflow ovens and carries out Reflow Soldering, carry out Reflow Soldering when
Time is preheated first, and the temperature of reflow ovens is heated to 110 DEG C, and the time control for being heated to the temperature from room temperature exists
1.5min passes through ultrasonic wave simultaneously when carrying out anticipation heat and shakes to pcb board；It is molten in the process preheated
Agent steam raising as the temperature rises, solvent and moisture can be more quickly from tin creams under the action of vibration of ultrasonic wave
It is detached from the middle, the problem of tin cream splashing occurs in the reduction later period；After preheating terminates, so that reflow ovens keep constant temperature stage, constant temperature
Temperature is heated to 175 DEG C when the stage, and keeps temperature 2min, the constant temperature stage, which is used as, keeps the temperature pcb board, so that
Temperature is uniform everywhere in pcb board；Refluxing stage is entered later, and refluxing stage needs to heat temperature and is more than return wire, returns
Streamline according to the difference of the tin cream used and different from about at 185 DEG C then proceeds by heating, until being heated to 220
DEG C, then temperature starts to fall after rise, is down to reflux temperature once, and tin cream solidifies at this time；It is also required to pass through ultrasonic wave in refluxing stage
Pcb board is shaken, is detached from the slave tin cream that the scaling powder to gasify in vibration process can be more easier, tin cream is reduced
The middle probability for welding cavity occur；Then cooled down, need to control the cooling time when cooling, cannot it is too fast can not
It crosses slowly, and cooling velocity needs uniformly, usually control cooling time is in 2min；
The overturning of e.PCB plate: will weld and the cooling pcb board terminated turns, and carry out the attachment at the pcb board back side；
F. it print solder paste: by the back side direction of pcb board, is printed solder paste on pcb board by stencil printer and needs to carry out member
The position of part installation；It needs to guarantee that pcb board is in a horizontal position when print solder paste, prevents the position of print solder paste from occurring inclined
Difference；
G. back elements mount: will need in component mounter to pcb board to be mounted, and be needed when attachment using chip mounter
Carry out the attachment of element；
H. reflow ovens are welded: the pcb board for having mounted element is sent in reflow ovens and carries out Reflow Soldering, carry out Reflow Soldering when
Time is preheated first, and the temperature of reflow ovens is heated to 110 DEG C, and the time control for being heated to the temperature from room temperature exists
1.5min passes through ultrasonic wave simultaneously when carrying out anticipation heat and shakes to pcb board；It is molten in the process preheated
Agent steam raising as the temperature rises, solvent and moisture can be more quickly from tin creams under the action of vibration of ultrasonic wave
It is detached from the middle, the problem of tin cream splashing occurs in the reduction later period；After preheating terminates, so that reflow ovens keep constant temperature stage, constant temperature
Temperature is heated to 175 DEG C when the stage, and keeps temperature 2min, the constant temperature stage, which is used as, keeps the temperature pcb board, so that
Temperature is uniform everywhere in pcb board；Refluxing stage is entered later, and refluxing stage needs to heat temperature and is more than return wire, returns
Streamline according to the difference of the tin cream used and different from about at 185 DEG C then proceeds by heating, until being heated to 220
DEG C, then temperature starts to fall after rise, is down to reflux temperature once, and tin cream solidifies at this time；It is also required to pass through ultrasonic wave in refluxing stage
Pcb board is shaken, is detached from the slave tin cream that the scaling powder to gasify in vibration process can be more easier, tin cream is reduced
The middle probability for welding cavity occur；Then cooled down, need to control the cooling time when cooling, cannot it is too fast can not
It crosses slowly, and cooling velocity needs uniformly, usually control cooling time is in 2min；
I. visual identity inspection: whether conformed to quality requirements using the pcb board that automated optical detection equipment detection has mounted.
The above is only a preferred embodiment of the present invention, protection scope of the present invention is not limited merely to above-mentioned implementation
Example, all technical solutions belonged under thinking of the present invention all belong to the scope of protection of the present invention.It should be pointed out that for the art
Those of ordinary skill for, several improvements and modifications without departing from the principles of the present invention, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (7)
1. a kind of pcb board surface mount process, it is characterised in that: the following steps are included:
A. it print solder paste: needs to guarantee that pcb board is in a horizontal position when print solder paste, prevents the position of print solder paste from occurring
Deviation；
B. facade element mounts: will need in component mounter to pcb board to be mounted；
C. reflow ovens are welded: the pcb board for having mounted element is sent in reflow ovens and carries out Reflow Soldering, carry out Reflow Soldering when
Time is preheated first, and the temperature of reflow ovens is heated to 105 DEG C~110 DEG C, and the time control of the temperature is heated to from room temperature
In 1min~1.5min, passes through ultrasonic wave simultaneously when carrying out anticipation heat and pcb board is shaken；After preheating terminates, make
Reflow ovens are kept for the constant temperature stage, temperature is heated to 170 DEG C~175 DEG C when the constant temperature stage, and keep temperature 1.5min
~2min, the constant temperature stage, which is used as, keeps the temperature pcb board, so that temperature is uniform everywhere in pcb board；Reflux rank is entered later
Section, refluxing stage need to heat temperature and are more than return wire, return wire different from according to the difference of the tin cream used, greatly
About at 180 DEG C~185 DEG C, heating is then proceeded by, until being heated to 210 DEG C~220 DEG C, then temperature starts to fall after rise, drop
Once to reflux temperature, tin cream solidifies at this time；Then it is cooled down；
The overturning of d.PCB plate: will weld and the cooling pcb board terminated turns, and carry out the attachment at the pcb board back side；
E. it print solder paste: needs to guarantee that pcb board is in a horizontal position when print solder paste, prevents the position of print solder paste from occurring
Deviation；
F. back elements mount: will need in component mounter to pcb board to be mounted；
G. reflow ovens are welded: the pcb board for having mounted element is sent in reflow ovens and carries out Reflow Soldering, carry out Reflow Soldering when
Time is preheated first, and the temperature of reflow ovens is heated to 105 DEG C~110 DEG C, and the time control of the temperature is heated to from room temperature
In 1min~1.5min, passes through ultrasonic wave simultaneously when carrying out anticipation heat and pcb board is shaken；After preheating terminates, make
Reflow ovens are kept for the constant temperature stage, temperature is heated to 170 DEG C~175 DEG C when the constant temperature stage, and keep temperature 1.5min
~2min, the constant temperature stage, which is used as, keeps the temperature pcb board, so that temperature is uniform everywhere in pcb board；Reflux rank is entered later
Section, refluxing stage need to heat temperature and are more than return wire, return wire different from according to the difference of the tin cream used, greatly
About at 180 DEG C~185 DEG C, heating is then proceeded by, until being heated to 210 DEG C~220 DEG C, then temperature starts to fall after rise, drop
Once to reflux temperature, tin cream solidifies at this time；Then it is cooled down；
H. visual identity inspection: whether conformed to quality requirements using the pcb board that automated optical detection equipment detection has mounted.
2. pcb board surface mount process according to claim 1, it is characterised in that: in the step a, print solder paste it
Before, it needs to clean pcb board, it will be under the impurity and dust cleaning on pcb board.
3. pcb board surface mount process according to claim 2, it is characterised in that: in the step a, carried out to pcb board
When cleaning, pcb board is shaken by ultrasonic wave, by the impurity on pcb board and under dust shakes from pcb board, then to PCB
Plate is blowed, and will be disposed on pcb board by the dust and impurities under vibration by wind-force.
4. pcb board surface mount process according to claim 1, it is characterised in that: in the step a and step e, carry out
When paste solder printing, the position for needing to carry out element installation is printed solder paste on pcb board by stencil printer.
5. pcb board surface mount process according to claim 1, it is characterised in that: in the step b and step f, carry out
Need to carry out the attachment of element when attachment using chip mounter.
6. pcb board surface mount process according to claim 1, it is characterised in that: in the step c and step g, returning
The stream stage is also required to shake pcb board by ultrasonic wave.
7. pcb board surface mount process according to claim 1, it is characterised in that: cooling in the step c and step g
When need to control the cooling time, cannot it is too fast can not be excessively slow, and cooling velocity needs uniform, usually cools down
Time controls in 1.5min~2min.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112469207A (en) * | 2020-04-23 | 2021-03-09 | 苏州市杰煜电子有限公司 | High-yield SMT (surface mount technology) process for high-quality solder paste printing |
| CN113436980A (en) * | 2021-06-23 | 2021-09-24 | 南昌黑鲨科技有限公司 | Device packaging method and packaging structure packaged by applying packaging method |
| CN113677104A (en) * | 2021-08-27 | 2021-11-19 | 中国电子科技集团公司第二十研究所 | LGA device low-void-rate welding process method |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101274325A (en) * | 2007-03-30 | 2008-10-01 | 富士胶片株式会社 | Method for removing dust of transported substance and device |
| CN101396751A (en) * | 2007-09-27 | 2009-04-01 | 比亚迪股份有限公司 | Solder-reflow soldering method |
| CN105072823A (en) * | 2015-08-10 | 2015-11-18 | 浙江佳明天和缘光伏科技有限公司 | Reflow soldering process of surface-mount electronic component |
| CN106604564A (en) * | 2016-12-01 | 2017-04-26 | 广东威创视讯科技股份有限公司 | Surface mounting method for printed circuit board |
| CN107249260A (en) * | 2017-06-19 | 2017-10-13 | 长兴恒业达电子有限公司 | A kind of processing welding technique of electronic component |
| CN108856177A (en) * | 2018-06-22 | 2018-11-23 | 郑州格瑞塔电子信息技术有限公司 | A kind of electronic product machining high effect dust cleaner |
| CN109362189A (en) * | 2018-11-16 | 2019-02-19 | 漳州市鸿源电子工业有限公司 | A kind of SMT patch packaging technology |
| CN208853386U (en) * | 2018-09-06 | 2019-05-14 | 武汉斯优光电技术有限公司 | A kind of opto-electronic device production raw material supersonic dust removal device |
-
2019
- 2019-05-31 CN CN201910470535.8A patent/CN110139502A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101274325A (en) * | 2007-03-30 | 2008-10-01 | 富士胶片株式会社 | Method for removing dust of transported substance and device |
| CN101396751A (en) * | 2007-09-27 | 2009-04-01 | 比亚迪股份有限公司 | Solder-reflow soldering method |
| CN105072823A (en) * | 2015-08-10 | 2015-11-18 | 浙江佳明天和缘光伏科技有限公司 | Reflow soldering process of surface-mount electronic component |
| CN106604564A (en) * | 2016-12-01 | 2017-04-26 | 广东威创视讯科技股份有限公司 | Surface mounting method for printed circuit board |
| CN107249260A (en) * | 2017-06-19 | 2017-10-13 | 长兴恒业达电子有限公司 | A kind of processing welding technique of electronic component |
| CN108856177A (en) * | 2018-06-22 | 2018-11-23 | 郑州格瑞塔电子信息技术有限公司 | A kind of electronic product machining high effect dust cleaner |
| CN208853386U (en) * | 2018-09-06 | 2019-05-14 | 武汉斯优光电技术有限公司 | A kind of opto-electronic device production raw material supersonic dust removal device |
| CN109362189A (en) * | 2018-11-16 | 2019-02-19 | 漳州市鸿源电子工业有限公司 | A kind of SMT patch packaging technology |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112469207A (en) * | 2020-04-23 | 2021-03-09 | 苏州市杰煜电子有限公司 | High-yield SMT (surface mount technology) process for high-quality solder paste printing |
| CN112469207B (en) * | 2020-04-23 | 2024-06-21 | 苏州市杰煜电子有限公司 | High-yield SMT (surface mounted technology) process for high-quality solder paste printing |
| CN113436980A (en) * | 2021-06-23 | 2021-09-24 | 南昌黑鲨科技有限公司 | Device packaging method and packaging structure packaged by applying packaging method |
| CN113677104A (en) * | 2021-08-27 | 2021-11-19 | 中国电子科技集团公司第二十研究所 | LGA device low-void-rate welding process method |
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Application publication date: 20190816 |