CN111681561A - Manufacturing method of LED display module - Google Patents
Manufacturing method of LED display module Download PDFInfo
- Publication number
- CN111681561A CN111681561A CN202010514674.9A CN202010514674A CN111681561A CN 111681561 A CN111681561 A CN 111681561A CN 202010514674 A CN202010514674 A CN 202010514674A CN 111681561 A CN111681561 A CN 111681561A
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- preset
- glue
- lamp
- driving surface
- manufacturing
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 239000003292 glue Substances 0.000 claims abstract description 52
- 238000000034 method Methods 0.000 claims description 10
- 239000011324 bead Substances 0.000 claims description 6
- 239000003973 paint Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 230000005484 gravity Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
Abstract
The invention discloses a manufacturing method of an LED display module, and belongs to the technical field of LED display screen processing. The manufacturing method comprises the following steps: providing a circuit board, wherein the circuit board comprises a driving surface and a lamp surface, and sequentially carrying out surface mounting operation on the driving surface and the lamp surface to obtain an LED lamp panel; dispensing a plurality of preset fixing areas on a driving surface of the LED lamp panel to enable each preset fixing area to be covered with glue with preset capacity; and sequentially placing each structural part to be fixed on the corresponding glue in the preset fixing area and compacting the structural part, and integrally placing the structural part in a preset environment to solidify the glue to obtain the LED display module. This technical scheme, it can realize the quick fixed of structures such as magnet seat on the prerequisite of not upgrading circuit board and structure, and when guaranteeing fixed reliability, greatly improves the module plane degree.
Description
Technical Field
The invention relates to the technical field of LED display screen processing, in particular to a manufacturing method of an LED display module.
Background
The current LED display screen has smaller and smaller requirements on the distance between the lamps and higher requirements on the flatness. And the booth is apart from the front maintenance module and is all fixed on the box through magnetism usually, and structures such as magnet seat are fixed on PCB board drive face through welding mode, and the flatness of structures such as magnet seat after the welding will directly influence the plane degree of LED display screen. However, in actual production, the PCB is attached to the driving surface first and then to the lamp surface, when the lamp surface is attached, the heated soldering tin of the structural members such as the magnet base can be melted, the floating height of the structural members such as the magnet base can be caused under the action of gravity, the floating height of the heavier structural members is more obvious, and the effect of improving the situation through the jig is not obvious.
Disclosure of Invention
The invention mainly aims to provide a manufacturing method of an LED display module, and aims to solve the technical problem that the flatness of the module is influenced by the phenomenon that a structural member is easily floated in the manufacturing process of the conventional LED display screen.
In order to achieve the above object, the present invention provides a method for manufacturing an LED display module, the method comprising the steps of: providing a circuit board, wherein the circuit board comprises a driving surface and a lamp surface, and sequentially carrying out surface mounting operation on the driving surface and the lamp surface to obtain an LED lamp panel; dispensing a plurality of preset fixing areas on the driving surface of the LED lamp panel to enable each preset fixing area to be covered with glue with preset capacity; and sequentially placing each structural part to be fixed on the corresponding glue in the preset fixing area and compacting the structural part, and integrally placing the structural part in a preset environment to solidify the glue to obtain the LED display module.
Optionally, the step of sequentially carrying out the chip mounting operation on the driving surface and the lamp surface to obtain the LED lamp panel specifically includes: carrying out surface mounting operation of the driving surface to drive components, and finishing the fixing work of all the driving components except the structural member on the driving surface; and carrying out surface mounting operation on the lamp surface to complete the fixing work of all the lamp bead components on the lamp surface.
Optionally, the pair of preset fixing areas on the driving surface of the LED lamp panel are subjected to dispensing operation, so that each preset fixing area is covered with glue with a preset volume in the steps that: placing the driving surface of the LED lamp panel in an adhesive dispensing area in an upward mode; and sequentially carrying out dispensing operation on each preset fixed area on the driving surface through a dispenser, so that each preset fixed area is covered with glue with preset capacity.
Optionally, the preset fixing areas corresponding to the same structural member are covered with glue with the same preset volume.
Optionally, the glue is a UV glue.
Optionally, the preset environment is UV lamp irradiation for 10-60 s.
Optionally, the manufacturing method further comprises the following steps: and carrying out three-proofing paint spraying treatment on the back surface of the LED display module.
According to the manufacturing method of the LED display module, in the manufacturing process of the LED display module, firstly, the driving surface and the lamp surface of the circuit board are subjected to surface mounting operation in sequence to obtain the LED lamp panel. And then, carrying out glue dispensing operation on a plurality of preset fixing areas on the driving surface of the LED lamp panel, so that each preset fixing area is covered with glue with preset capacity. And finally, sequentially placing each structural part to be fixed on the glue of the corresponding preset fixing area, compacting, and integrally placing the structural part in a preset environment to solidify the glue to obtain the LED display module. Therefore, each structural part needing to be fixed is fastened on the driving surface of the circuit board in a glue curing mode after the lamp surface mounting of the circuit board is completed, and therefore the phenomenon that structural parts such as a magnet base and the like are heated and soldered to melt and are lifted under the action of gravity when the lamp surface is mounted in the manufacturing process of the LED display screen is avoided. It is thus clear that this technical scheme, it can realize the quick fixed of structures such as magnet seat on the prerequisite of not upgrading circuit board and structure, and when guaranteeing fixed reliability, greatly improves the module plane degree.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a flow chart of a method for manufacturing an LED display module according to an embodiment of the invention.
Fig. 2 is a schematic flowchart of step S110 in the manufacturing method shown in fig. 1.
Fig. 3 is a schematic flowchart of step S120 in the manufacturing method shown in fig. 1.
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Example one
As shown in fig. 1, a method for manufacturing an LED display module according to an embodiment of the present invention includes the following steps:
step S110: and providing a circuit board, wherein the circuit board comprises a driving surface and a lamp surface, and sequentially carrying out surface mounting operation on the driving surface and the lamp surface to obtain the LED lamp panel.
Specifically, as shown in fig. 2, the step of "sequentially performing the mounting operation on the driving surface and the lamp surface to obtain the LED lamp panel" is performed in the following specific processes:
step S111: and carrying out surface mounting operation on the driving surface to drive the components, and finishing the fixing work of all the driving components except the structural component on the driving surface.
Step S112: and (5) carrying out surface mounting operation of the lamp bead components on the lamp surface to complete the fixing work of all the lamp bead components on the lamp surface.
The circuit board mentioned above is a printed circuit board, and a driving circuit required for normal work of the LED lamp panel is printed on the printed circuit board, and only corresponding chip mounting operations need to be sequentially performed on the driving surface and the lamp surface, that is, the chip mounting operations of the driving surface and the lamp surface are performed first, so that the fixing operations of all driving components except for the structural member on the driving surface are completed, the chip mounting operations of the lamp bead components are performed on the lamp surface, so that the fixing operations of all the lamp bead components on the lamp surface are completed, and finally, the LED lamp panel is obtained. At this moment, the LED lamp panel has fixed all components and parts that need to be fixed on the circuit board except for the structural member (such as the magnet base) that influences the floating height in the LED display module.
Step S120: glue dispensing operation is carried out on a plurality of preset fixing areas on the driving surface of the LED lamp panel, so that glue with preset capacity covers each preset fixing area.
Specifically, all components needing to be fixed on the circuit board except for structural members (such as magnet bases) influencing the floating height in the LED display module are fixed by the LED lamp panel obtained in the previous step. Therefore, in this step, the fixing operation of the structural member needs to be performed, that is, the dispensing operation is performed on a plurality of preset fixing areas on the driving surface of the LED lamp panel, so that each preset fixing area is covered with glue with a preset volume, as shown in fig. 3, the specific process is as follows:
step S121: the driving surface of the LED lamp panel is upwards arranged in the dispensing area.
Step S122: and sequentially carrying out dispensing operation on each preset fixed area on the driving surface through a dispenser, so that each preset fixed area is covered with glue with a preset volume.
The glue mentioned above is preferably a UV glue. The UV glue can not be solidified under normal conditions, can be quickly solidified under the irradiation of a UV lamp, has good strength after being solidified, and does not reduce the performance under the condition of the use temperature of the display screen (40-70 ℃). In addition, structural glue can be used instead. And setting the glue amount of one-time glue dispensing of the glue dispenser according to the size of the structural part to be fixed. When dispensing, the driving surface of the LED lamp panel needs to be dry and clean (no dust). After dispensing, it is required to ensure that the preset fixing areas corresponding to the same structural member are covered with glue with the same preset volume. The glue dispensing environment has no special requirements, and the glue dispensing environment has normal room temperature (20-26 ℃) and humidity (45-70% RH), is not directly irradiated by the sun and has no irradiation of a UV lamp.
Step S130: and sequentially placing each structural part to be fixed on the corresponding glue in the preset fixing area and compacting the structural part, and integrally placing the structural part in a preset environment to solidify the glue to obtain the LED display module.
Specifically, after glue dispensing operation is performed through the steps of the method, and glue with a preset volume is coated on each preset fixing area, placing operation of structural members needing to be fixed, such as the magnet base, can be performed, that is, after each structural member needing to be fixed is sequentially placed on the glue in the corresponding preset fixing area and is compressed, the whole body is placed in a preset environment, so that the glue is cured, and the LED display module is obtained. Since the glue in this embodiment is preferably a UV glue, the preset environment in the steps of the method is UV lamp irradiation for 10-60 s. In order to ensure that glue in a preset fixing area corresponding to all structural parts needing to be fixed can be quickly cured, and then the fixing operation of the corresponding structural parts is completed, during irradiation, all the structural parts need to be ensured to be irradiated by UV lamps.
In addition, the manufacturing method of the embodiment of the invention also comprises the following steps: and performing three-proofing paint spraying treatment on the back surface of the LED display module (namely the other side surface of the LED display module opposite to the lamp surface) so as to further improve the protective performance of the LED display module.
In the manufacturing method of the LED display module, in the manufacturing process of the LED display module, firstly, the driving surface and the lamp surface of the circuit board are subjected to surface mounting operation in sequence to obtain the LED lamp panel. And then, carrying out glue dispensing operation on a plurality of preset fixing areas on the driving surface of the LED lamp panel, so that each preset fixing area is covered with glue with preset capacity. And finally, sequentially placing each structural part to be fixed on the glue of the corresponding preset fixing area, compacting, and integrally placing the structural part in a preset environment to solidify the glue to obtain the LED display module. Therefore, each structural part needing to be fixed is fastened on the driving surface of the circuit board in a glue curing mode after the lamp surface mounting of the circuit board is completed, and therefore the phenomenon that structural parts such as a magnet base and the like are heated and soldered to melt and are lifted under the action of gravity when the lamp surface is mounted in the manufacturing process of the LED display screen is avoided. It is thus clear that this technical scheme, it can realize the quick fixed of structures such as magnet seat on the prerequisite of not upgrading circuit board and structure, and when guaranteeing fixed reliability, greatly improves the module plane degree.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, and the scope of protection is still within the scope of the invention.
Claims (7)
1. The manufacturing method of the LED display module is characterized by comprising the following steps:
providing a circuit board, wherein the circuit board comprises a driving surface and a lamp surface, and sequentially carrying out surface mounting operation on the driving surface and the lamp surface to obtain an LED lamp panel;
dispensing a plurality of preset fixing areas on the driving surface of the LED lamp panel to enable each preset fixing area to be covered with glue with preset capacity;
and sequentially placing each structural part to be fixed on the corresponding glue in the preset fixing area and compacting the structural part, and integrally placing the structural part in a preset environment to solidify the glue to obtain the LED display module.
2. The manufacturing method according to claim 1, wherein the step of sequentially performing the surface mounting operation on the driving surface and the lamp surface to obtain the LED lamp panel specifically comprises the following steps:
carrying out surface mounting operation of the driving surface to drive components, and finishing the fixing work of all the driving components except the structural member on the driving surface;
and carrying out surface mounting operation on the lamp surface to complete the fixing work of all the lamp bead components on the lamp surface.
3. The manufacturing method according to claim 1, wherein the step of dispensing a plurality of preset fixing areas on the driving surface of the LED lamp panel to cover each preset fixing area with glue of a preset volume specifically comprises:
placing the driving surface of the LED lamp panel in an adhesive dispensing area in an upward mode;
and sequentially carrying out dispensing operation on each preset fixed area on the driving surface through a dispenser, so that each preset fixed area is covered with glue with preset capacity.
4. The method according to claim 1, wherein the predetermined fixing areas corresponding to the same structural member are covered with glue of the same predetermined volume.
5. The method of manufacturing of claim 1, wherein the glue is a UV glue.
6. The method of claim 5, wherein the predetermined environment is UV lamp irradiation for 10-60 s.
7. The method of manufacturing according to any one of claims 1-6, further comprising the steps of: and carrying out three-proofing paint spraying treatment on the back surface of the LED display module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010514674.9A CN111681561A (en) | 2020-06-08 | 2020-06-08 | Manufacturing method of LED display module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010514674.9A CN111681561A (en) | 2020-06-08 | 2020-06-08 | Manufacturing method of LED display module |
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| Publication Number | Publication Date |
|---|---|
| CN111681561A true CN111681561A (en) | 2020-09-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010514674.9A Pending CN111681561A (en) | 2020-06-08 | 2020-06-08 | Manufacturing method of LED display module |
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Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102169658A (en) * | 2011-01-24 | 2011-08-31 | 刘振亮 | Production process for integrated packaged light emitting diode (LED) outdoor display screen |
| CN106604564A (en) * | 2016-12-01 | 2017-04-26 | 广东威创视讯科技股份有限公司 | Surface mounting method for printed circuit board |
| CN107949182A (en) * | 2017-11-06 | 2018-04-20 | 安徽华东光电技术研究所 | Method based on Reflow Soldering of double-clad board |
| CN108230916A (en) * | 2016-12-12 | 2018-06-29 | 深圳市易事达电子有限公司 | LED display and LED display |
| CN108521722A (en) * | 2018-07-12 | 2018-09-11 | 贵州贵安新区众鑫捷创科技有限公司 | A kind of SMT paster techniques |
| CN207852218U (en) * | 2017-12-29 | 2018-09-11 | 浙江宇视科技有限公司 | LED display |
| CN109155118A (en) * | 2018-07-20 | 2019-01-04 | 深圳市雷迪奥视觉技术有限公司 | Show the preparation process and display screen of screen cover |
| CN110310580A (en) * | 2019-07-23 | 2019-10-08 | 深圳市科伦特电子有限公司 | A kind of LED lamp panel and display screen |
| CN110796956A (en) * | 2019-11-15 | 2020-02-14 | 大连集思特科技有限公司 | Flexible transparent display screen and manufacturing method thereof |
| CN210073193U (en) * | 2019-05-22 | 2020-02-14 | 利亚德光电股份有限公司 | LED display assembly |
| CN210244901U (en) * | 2019-07-11 | 2020-04-03 | 广州视源电子科技股份有限公司 | LED display screen |
| CN210691904U (en) * | 2019-08-08 | 2020-06-05 | 深圳市艾比森光电股份有限公司 | Magnetic force coupling assembling and LED display screen |
-
2020
- 2020-06-08 CN CN202010514674.9A patent/CN111681561A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102169658A (en) * | 2011-01-24 | 2011-08-31 | 刘振亮 | Production process for integrated packaged light emitting diode (LED) outdoor display screen |
| CN106604564A (en) * | 2016-12-01 | 2017-04-26 | 广东威创视讯科技股份有限公司 | Surface mounting method for printed circuit board |
| CN108230916A (en) * | 2016-12-12 | 2018-06-29 | 深圳市易事达电子有限公司 | LED display and LED display |
| CN107949182A (en) * | 2017-11-06 | 2018-04-20 | 安徽华东光电技术研究所 | Method based on Reflow Soldering of double-clad board |
| CN207852218U (en) * | 2017-12-29 | 2018-09-11 | 浙江宇视科技有限公司 | LED display |
| CN108521722A (en) * | 2018-07-12 | 2018-09-11 | 贵州贵安新区众鑫捷创科技有限公司 | A kind of SMT paster techniques |
| CN109155118A (en) * | 2018-07-20 | 2019-01-04 | 深圳市雷迪奥视觉技术有限公司 | Show the preparation process and display screen of screen cover |
| CN210073193U (en) * | 2019-05-22 | 2020-02-14 | 利亚德光电股份有限公司 | LED display assembly |
| CN210244901U (en) * | 2019-07-11 | 2020-04-03 | 广州视源电子科技股份有限公司 | LED display screen |
| CN110310580A (en) * | 2019-07-23 | 2019-10-08 | 深圳市科伦特电子有限公司 | A kind of LED lamp panel and display screen |
| CN210691904U (en) * | 2019-08-08 | 2020-06-05 | 深圳市艾比森光电股份有限公司 | Magnetic force coupling assembling and LED display screen |
| CN110796956A (en) * | 2019-11-15 | 2020-02-14 | 大连集思特科技有限公司 | Flexible transparent display screen and manufacturing method thereof |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200918 |
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| RJ01 | Rejection of invention patent application after publication |