CN110572561B - Production process of VCM mobile phone camera module - Google Patents
Production process of VCM mobile phone camera module Download PDFInfo
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- CN110572561B CN110572561B CN201911040799.6A CN201911040799A CN110572561B CN 110572561 B CN110572561 B CN 110572561B CN 201911040799 A CN201911040799 A CN 201911040799A CN 110572561 B CN110572561 B CN 110572561B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a production process of a VCM mobile phone camera module, which adopts a VCM mobile phone camera module production line to manufacture the VCM mobile phone camera module, wherein the VCM mobile phone camera module production line comprises a flexible circuit board production device, a first assembly device, a second assembly device, a third assembly device, a fourth assembly device and a fifth assembly device, and the production steps comprise substrate attaching, solder paste printing, SPI detection, part packaging, reflow soldering, AOI inspection, glue coating, curing, electrical testing, substrate segmentation, classified tray loading, appearance inspection, primary assembly, secondary assembly, tertiary assembly, quaternary assembly and quintic assembly. The production process of the VCM mobile phone camera module has the advantages of reducing the soldering tin thickness deviation range of the empty soldering pad, reducing the labor cost, reducing the production difficulty and improving the production efficiency.
Description
Technical Field
The invention relates to a production process of a VCM mobile phone camera module.
Background
As camera phones have advanced to high pixel, they have come to demand autofocus functions. In general, a user wants a camera phone having 200 ten thousand pixels or more to have an auto-focusing function. However, the traditional way is that the focusing function will greatly increase the size of the circuit board and the thickness of the mobile phone, and the pursuit of short, small, light and thin electronic products is more and more demanding in the modern times. Therefore, VCM is the best choice for mobile phone camera modules. VCM (Voice Coil Motor), commonly known as voice Coil motor or voice Coil motor, the effect is the position of adjusting the camera lens, makes the video recording present the most clear state, and it has the circuit board area that occupies little, and the reliability is high, can support powerful advantage, can reduce system cost and volume, is applied to cell-phone camera auto focus in a large number at present. At present, the production technology manpower input cost of the VCM mobile phone camera module is higher, the soldering tin thickness in the conventional SMT production line depends on the steel mesh thickness and the solder paste printing equipment parameters, the soldering tin thickness deviation of an empty welding disc can only be controlled within 40um, and for a flexible circuit board with smaller volume and irregular shape, due to the fact that the shapes of the empty welding discs are not uniform, the flexible circuit board has the defects of large soldering tin thickness deviation range of the empty welding disc, uneven soldering tin thickness, high production difficulty, low production efficiency and the like, and the requirements of special customer groups cannot be met.
Disclosure of Invention
The invention aims to overcome the defects and provide a production process of the VCM mobile phone camera module, which reduces the soldering tin thickness deviation range of the empty soldering pan, reduces the production difficulty, reduces the labor cost and improves the production efficiency.
The purpose of the invention is realized as follows: a production process of a VCM mobile phone camera module comprises the steps of adopting a VCM mobile phone camera module production line to manufacture the VCM mobile phone camera module, wherein the VCM mobile phone camera module comprises a lens, a voice coil motor, a base, an optical filter, an image sensor, a flexible circuit board, a bottom plate and a connector, the lens is arranged in the voice coil motor, the voice coil motor is arranged on the base, the optical filter and the image sensor are arranged between the base and the flexible circuit board, the flexible circuit board is embedded on the bottom plate and comprises a transverse section and a vertical section, the inner side of the transverse section is provided with an inwards concave arc-shaped edge, the front of the transverse section is provided with a reserved area, a plurality of prepared welding pads with different sizes are arranged in the reserved area, the prepared welding pads with different sizes are arranged at intervals along the inner edge of the arc-shaped edge, and the front of the vertical section, a groove is formed in the back of the transverse section corresponding to the reserved area;
the VCM mobile phone camera module production line sequentially comprises a flexible circuit board production device, a first assembly device, a second assembly device, a third assembly device, a fourth assembly device and a fifth assembly device from front to back, wherein the flexible circuit board production device sequentially comprises an attaching device, a steel mesh printing device, an SPI detection device, an article packaging device, a reflow soldering device, an AOI detection device, an adhesive dispensing device, a curing device, an electrical test device, a substrate cutting device, a plate taking device and an appearance detection device from front to back,
the specific production steps are as follows:
firstly, positioning and fixing a substrate by an attaching device;
step two, a steel mesh printing device carries out solder paste printing operation on the surface of the substrate, wherein the thickness of the soldering tin on each prepared bonding pad is 0.06-0.10mm, and the height difference of the soldering tin on the plurality of prepared bonding pads is less than or equal to 0.02 mm;
step three, the SPI detection device carries out solder paste detection operation on the printed substrate;
fourthly, the part packaging device carries out surface mounting operation on the substrate after the solder paste detection, and marks the position number of the defective product of the incoming material;
step five, the reflow soldering device performs reflow soldering operation on the substrate after the chip mounting;
step six, the AOI detection device performs automatic optical detection on the reflowed substrate, and records the unqualified substrate into a database;
seventhly, carrying out glue dispensing operation at the glue dispensing position of the substrate by using a glue dispensing device;
step eight, the curing device carries out heating curing operation on the substrate after dispensing;
step nine, the electrical testing device performs performance testing on the flexible circuit boards on the substrate, and the system records the position numbers of the performance defective products;
step ten, punching and cutting the flexible circuit boards on the substrate into independent products by the substrate cutting device, and sequentially arranging the independent products in the board taking carrier according to the original sequence;
step eleven, the plate taking device places a plurality of independent products in a classified mode;
step twelve, the appearance detection device performs appearance detection on the good products;
step thirteen, the first assembly device assembles the image sensor, the flexible circuit board and the bottom plate into a first assembly;
step fourteen, the second assembly device assembles the base and the optical filter into a second assembly;
a fifteenth step of assembling the lens and the voice coil motor into a third assembly by the third assembly device;
sixthly, assembling the second assembly in the fourteenth and the third assembly in the fifteenth into a fourth assembly by using a fourth assembly device;
seventhly, assembling the fourth component in the sixteenth step and the first component in the thirteenth step into a finished product module by the fifth assembly device.
Furthermore, in the first step, the attaching device comprises a positioning jig, a support plate and a positioning steel sheet in a zigzag structure, the support plate is arranged on the positioning jig, the support plate adsorbs the positioning steel sheet by utilizing magnetic attraction to position the substrate in the middle of the support plate, the substrate comprises a substrate body, a plurality of flexible circuit boards arranged in a matrix are arranged on the substrate body, the heights of the front surfaces of the flexible circuit boards are lower than that of the substrate body, and a plurality of substrate positioning holes are formed in the substrate body;
the positioning jig comprises a base, positioning blocks are arranged at four corners of the base respectively, and a plurality of vertical positioning columns are arranged on the base;
the carrier plate includes the carrier plate body, a plurality of carrier plate locating holes have been seted up on the carrier plate body, the back of carrier plate body is provided with magnet, the positive middle part of carrier plate body is provided with the end lining steel sheet, be provided with one deck high temperature resistant steel silica gel between end lining steel sheet and the carrier plate body, the front of end lining steel sheet is provided with a plurality of first bosss that are the matrix and arrange, a plurality of first bosss are corresponding with a plurality of flexible circuit board on the base plate respectively, the shape of first boss and the recess shape phase-match at the flexible circuit board back.
Furthermore, the steel mesh printing device in the second step comprises a steel mesh, the back of the steel mesh is provided with a plurality of second bosses arranged in a matrix manner, the shape of each second boss is matched with the outline of the flexible circuit board, the steel mesh is provided with a plurality of soldering tin holes, and the hole diameters of the soldering tin holes are gradually reduced from the front to the back of the steel mesh.
Furthermore, an automatic plate taking system is adopted in the eleventh step, a feeding mechanism is controlled to convey a plate taking carrier into a plate taking device, the plate taking device collects information such as a defective material position and a defective performance position according to system data in a called part product actual installation device and an electrical testing device, then an automatic suction manipulator sucks defective materials from a coming material and transfers the defective materials to a defective material box of the coming material according to the data information, the defective performance is sucked and then transferred to a defective performance placing box, and finally all the remaining defective materials are sucked and sequentially arranged in the defective material placing box.
Furthermore, in the seventh step the adhesive deposite device includes vertical layout's removal seat, be provided with the backup pad on the removal seat, the front side of backup pad is provided with fixed grip slipper, be connected with the fixed plate between fixed grip slipper and the backup pad, the left and right sides of fixed grip slipper all is provided with movable grip slipper, be provided with adjusting part between activity grip slipper and the backup pad, adjusting part is used for carrying out horizontal, vertical and fore-and-aft position control to the activity grip slipper, all be provided with the some packing element in fixed grip slipper and the activity grip slipper.
Furthermore, the adjusting component comprises a first vertical plate, a second vertical plate and a third vertical plate which are connected in sequence from back to front, the first vertical plate is fixedly connected with the supporting plate through a plurality of bolts, the second vertical plate is connected with the first vertical plate in a sliding manner, the second vertical plate can slide vertically along the height direction of the first vertical plate or slide horizontally along the length direction of the first vertical plate, the second vertical plate is connected with the third vertical plate in a sliding manner, the third vertical plate can slide horizontally along the length direction of the second vertical plate or slide vertically along the height direction of the second vertical plate, a first connecting block and a second connecting block are arranged between the third vertical plate and the movable clamping seat, the first connecting block is fixedly connected with the third vertical plate, the second connecting block is fixedly connected with the movable clamping seat, and the first connecting block is connected with the second connecting block in a sliding manner, the second connecting block can slide longitudinally along the width direction of the first connecting block.
Furthermore, a first fixed block is arranged on one side face of the first vertical plate, a first adjusting bolt which is vertically arranged is arranged on the first fixed block, a first ejecting block is arranged below the first adjusting bolt, the first ejecting block is fixedly connected with the side face of the second vertical plate, and the head end of the first adjusting bolt is in contact with the top face of the first ejecting block;
a second fixing block is arranged on the bottom surface of the second vertical plate, a second adjusting bolt which is transversely arranged is arranged on the second fixing block, a second ejecting block is arranged at the head end of the second adjusting bolt, and the second ejecting block is fixedly connected with the bottom surface of a third vertical plate;
one side of first connecting block is provided with the third fixed block, be provided with vertical arrangement's third adjusting bolt on the third fixed block, third adjusting bolt's below is provided with rotates the ejector pad, rotate the ejector pad and set up on the lateral wall of first connecting block through transverse arrangement's bolt axle, the below of rotating the ejector pad is provided with longitudinal arrangement's ejector pin, the one end of ejector pin and the rear side fixed connection of second connecting block, the both ends of rotating the ejector pad contact with third adjusting bolt's head end and the other end of ejector pin respectively.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the first boss is arranged on the carrier plate in the attaching device and the second boss is arranged on the back surface of the steel mesh in the steel mesh printing device, so that the effective area and the waste area on the substrate are respectively compensated from top to bottom, the thickness uniformity of soldering tin on the preparation bonding pads with different sizes is ensured, the production difficulty is reduced, and the height difference of the soldering tin among the preparation bonding pads is ensured to be less than or equal to 0.02 mm.
2. Because the carrier plate is made of aluminum, if the first boss is directly processed during the carrier plate forming, the first boss can be burred and has poor height consistency, and the like, so that the bottom lining steel sheet is pasted on the surface of the carrier plate, the first boss is processed on the surface of the bottom lining steel sheet, the height consistency of the first boss is ensured, the bottom lining steel sheet can be replaced periodically, the influence on the fit degree of the substrate and the carrier plate caused by the abrasion of the first boss due to long-time use is avoided, meanwhile, the integral durability of the carrier plate is improved, and the production cost is reduced.
3. The traditional glue dispensing device is only provided with one glue dispensing head, the glue drawing path is longer due to the fact that the number of products on a single substrate is large, and the operation efficiency is extremely low.
4. In the prior plate taking process, classification and arrangement are carried out manually, and due to the fact that products are small in size and irregular in appearance, manual taking and arrangement efficiency of personnel is low, and the risk of wrong taking and arrangement exists.
5. The base and the voice coil motor in the VCM mobile phone camera module are connected in a matched mode through the clamping block and the clamping groove, the matching degree between the base and the voice coil motor can be improved, deviation in the direction of X, Y is reduced, the assembling efficiency is improved, and the quality of finished products is improved.
Drawings
Fig. 1 is a schematic structural diagram of a VCM mobile phone camera module.
Fig. 2 is a diagram of a VCM handset camera module assembly after removal of the flexible circuit board.
Fig. 3 is a schematic front view of a flexible circuit board.
Fig. 4 is a schematic diagram of the back side of the flexible circuit board.
Fig. 5 is a schematic view of a VCM mobile phone camera module production line according to the present invention.
Fig. 6 is a schematic view of a flexible circuit board production apparatus.
Fig. 7 is a schematic front view of a positioning fixture in the attaching device.
Fig. 8 is a schematic front view of a carrier board in the attachment device.
FIG. 9 is a schematic front view of a substrate
FIG. 10 is a schematic front view of the positioning steel plate in the attaching device.
Fig. 11 is a schematic view of the back of a steel mesh in a steel mesh printing apparatus.
Fig. 12 is a schematic diagram of the relationship between the lower compensation and the upper compensation of the VCM handset camera module by the carrier plate and the steel mesh.
Fig. 13 is a schematic structural view of the dispensing device.
Fig. 14 is a top view of fig. 13.
Fig. 15 is a side view of fig. 13.
Fig. 16 is a bottom view of fig. 13.
Fig. 17 is a schematic view of a plate removal system.
Fig. 18 is a schematic view of the condition of the inspection station in the part mounting process.
FIG. 19 is a schematic view of an electrical test process inspection station condition.
Fig. 20 is a schematic view of good product arrangement in the good product storage box.
Wherein:
flexible circuit board production apparatus 100
Attaching device 101, positioning jig 101.1, base 101.1.1, positioning block 101.1.2, positioning post 101.1.3, carrier plate 101.2, carrier plate body 101.2.1, carrier plate positioning hole 101.2.2, bottom lining steel sheet 101.2.3, first boss 101.2.4, first notch 101.2.5, positioning steel sheet 101.3, positioning steel sheet positioning hole 101.3.1, second notch 101.3.2
Steel net printing device 102, steel net 102.1, second boss 102.2
The dispensing device 107, the moving seat 107.1, the support plate 107.2, the fixed clamping seat 107.3, the movable clamping seat 107.4, the fixed plate 107.5, the first vertical plate 107.6, the second vertical plate 107.7, the third vertical plate 107.8, the first fixed block 107.9, the first top block 107.10, the first adjusting bolt 107.11, the second fixed block 107.12, the second adjusting bolt 107.13, the second top block 107.14, the first connecting block 107.15, the second connecting block 107.16, the third fixed block 107.17, the third adjusting bolt 107.18, the rotating push block 107.19, the bolt shaft 107.20, the push rod 107.21, the bump 107.22, the first limiting piece 107.23, the first waist-shaped groove 107.24, the first limiting column 107.25, the second limiting piece 107.26, the second waist-shaped groove 107.27, the second limiting column 107.28, the third limiting piece 107.29, the third waist-shaped groove 107.30, the third limiting column 107.31, the movable clamping seat 107.4, the fixed plate 107.5, the second vertical plate 107.14, the
Curing device 108
The VCM mobile phone camera module 200, the lens 201, the voice coil motor 202, the base 203, the optical filter 204, the image sensor 205, the flexible circuit board 206, the transverse section 206.1, the vertical section 206.2, the bevel notch 206.3, the rectangular notch 206.4, the arc-shaped edge 206.5, the prepared welding disc 206.6, the first welding disc 206.7, the second welding disc 206.8, the groove 206.9, the bottom plate 207, the fixture block 208 and the clamping groove 209
First assembling device 400
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 4, a VCM handset camera module 200 according to the present invention includes a lens 201, a voice coil motor 202, a base 203, an optical filter 204, an image sensor 205, a flexible circuit board 206, a bottom plate 207, and a connector, where the lens 201 is disposed in the voice coil motor 202, the voice coil motor 202 is disposed on the base 203, the optical filter 204 and the image sensor 205 are disposed between the base 203 and the flexible circuit board 206, and the flexible circuit board 206 is embedded on the bottom plate 207;
the base 203 and the voice coil motor 202 are connected in a matching way through a clamping block 208 and a clamping groove 209;
the flexible circuit board 206 is similar to an L-shaped structure, the flexible circuit board 206 includes a transverse section 206.1 and a vertical section 206.2, an outer corner position where the transverse section 206.1 is connected with the vertical section 206.2 is provided with an inclined edge notch 206.3, an inner corner position where the transverse section 206.1 is connected with the vertical section 206.2 is provided with a rectangular notch 206.4, an inner side edge of the transverse section 206.1 is provided with an inward concave arc-shaped edge 206.5, a front surface of the transverse section 206.1 is provided with a reserved area, six prepared pads 206.6 with different sizes are arranged in the reserved area, six prepared pads 206.6 with different sizes are arranged at intervals along the inner edge of the arc-shaped edge 206.5, a front surface of the vertical section 206.2 is provided with a capacitor mounting area and a chip mounting area, two first pads 206.7 are arranged in the capacitor mounting area, a plurality of second pads 206.8 arranged in a matrix manner are arranged in the chip mounting area, a back surface of the transverse section 206.1 is provided with a groove 206.9 corresponding to, the depth of the groove 206.9 is 0.04 mm.
Referring to fig. 4-20, a VCM mobile phone camera module production process adopts a VCM mobile phone camera module production line to produce a VCM mobile phone camera module, the VCM mobile phone camera module production line sequentially includes, from front to back, a flexible circuit board production apparatus 100, a first assembly apparatus 400, a second assembly apparatus 500, a third assembly apparatus 600, a fourth assembly apparatus 700, and a fifth assembly apparatus 800, the flexible circuit board production apparatus 100 is configured to perform operations such as tin-feeding, chip-mounting, glue-dispensing, and detection on a flexible circuit board 206, the first assembly apparatus 400 is configured to assemble an image sensor 205 and a flexible circuit board 206 into a first assembly, the second assembly apparatus 500 is configured to assemble a base 203 and an optical filter 204 into a second assembly, and the third assembly apparatus 600 is configured to assemble a lens 201 and an optical filter 202 into a third assembly, the fourth assembling device 700 is used for assembling the second assembly and the third assembly into a fourth assembly, and the fifth assembling device 800 is used for assembling the fourth assembly and the first assembly into a finished module;
the flexible circuit board production device 100 sequentially comprises an attaching device 101, a steel mesh printing device 102, an SPI detection device 103, an component packaging device 104, a reflow soldering device 105, an AOI detection device 106, a dispensing device 107, a curing device 108, an electrical testing device 109, a substrate dividing device 110, a board taking device 111 and an appearance detection device 112 from front to back;
the specific production method comprises the following steps:
firstly, the attaching device 101 positions and fixes the substrate 300;
in the first step, the attaching device 101 comprises a positioning jig 101.1, a carrier plate 101.2 and a positioning steel sheet 101.3 in a zigzag structure, the carrier plate 101.2 is arranged on the positioning jig 101.1, the carrier plate 101.2 adsorbs the positioning steel sheet 101.3 by utilizing magnetic attraction to position the substrate 300 in the middle of the carrier plate 101.2, the substrate 300 comprises a substrate body 301, a plurality of flexible circuit boards 206 arranged in a matrix are arranged on the substrate body 301, the heights of the front surfaces of the flexible circuit boards 206 are lower than the height of the front surface of the substrate body 301 by 0.04mm, and a plurality of substrate positioning holes 302 are further formed in the substrate body 301;
the positioning jig 101.1 comprises a base 101.1.1, positioning blocks 101.1.2 with an L-shaped structure are respectively arranged at four corners of the base 101.1.1, and a plurality of vertical positioning columns 101.1.3 are arranged on the base 101.1.1;
the carrier plate 101.2 comprises a carrier plate body 101.2.1, a plurality of carrier plate positioning holes 101.2.2 are formed in the carrier plate body 101.2.1, a magnet is arranged on the back of the carrier plate body 101.2.1, a bottom lining steel sheet 101.2.3 is arranged in the middle of the front face of the carrier plate body 101.2.1, a layer of high-temperature-resistant steel silica gel is arranged between the bottom lining steel sheet 101.2.3 and the carrier plate body 101.2.1, a plurality of first bosses 101.2.4 arranged in a matrix are arranged on the front face of the bottom lining steel sheet 101.2.3, the first bosses 101.2.4 correspond to the flexible circuit boards 206 on the substrate 300 respectively, the shape of each first boss 101.2.4 is matched with the shape of a groove 206.9 in the back face of the flexible circuit board 206, and the thickness of each first boss 101.2.4 is 0.04 mm;
a first notch 101.2.5 is formed at one end corner of the bottom lining steel sheet 101.2.3;
two positioning steel sheet positioning holes 101.3.1 are formed in the positioning steel sheet 101.3, and a second notch 101.3.2 corresponding to the first notch is formed in one end angle of the positioning steel sheet 101.3.
The specific operation method of the attaching device 101 is as follows:
a. placing the carrier 101.2 in the positioning fixture 101.1, so that the positioning post 101.1.3 passes through the carrier positioning hole 101.2.2 to position the carrier 101.2;
b. placing the substrate 300 on the carrier 101.2, so that the corresponding positioning post 101.1.3 passes through the substrate positioning hole 302 to perform the primary positioning on the substrate 300;
c. the positioning steel sheet 101.3 is adsorbed on the carrier plate 101.2, so that the second notch 101.3.2 is overlapped with the first notch 101.2.5, and the corresponding positioning post 101.1.3 passes through the positioning steel sheet positioning hole 101.3.1, thereby fixedly attaching the substrate to the carrier plate 101.2.
Secondly, the steel mesh printing device 102 performs solder paste printing operation on the surface of the substrate 300 through steel meshes and scrapers, wherein the thickness of solder on each prepared pad 206.6 is 0.06-0.10mm, and the height difference of the thickness of the solder on the six prepared pads 206.6 is less than or equal to 0.02 mm;
in the second step, the back surface of the steel mesh 102.1 is provided with a plurality of second bosses 102.2 arranged in a matrix manner, the second bosses 102.2 respectively correspond to the plurality of flexible circuit boards 206 on the substrate 300, the shapes of the second bosses 102.2 are matched with the outline of the flexible circuit boards 206, soldering tin holes are formed in the positions of the steel mesh 102.1 corresponding to the preliminary soldering pad 206.6, the first soldering pad 206.7 and the second soldering pad 206.8, the hole diameters of the soldering tin holes are gradually reduced from the front surface to the back surface of the steel mesh 102.1, and solder paste can be prevented from flowing out of the soldering tin holes and then overflowing to areas outside the soldering pads;
the back of the steel mesh 102.1 is etched to form a plurality of second bosses 102.2, and the thickness of the second bosses 102.2 is 0.04 mm.
The first boss on the front surface of the carrier plate can compensate the height difference between the groove on the back surface of the effective area (flexible circuit board area) of the substrate and other parts on the back surface of the effective area, so that the substrate is tightly matched with the carrier plate, the substrate is attached and positioned on the carrier plate through the positioning steel sheet, the second boss on the back surface of the steel mesh can compensate the height difference between the front surface of the effective area (flexible circuit board area) of the substrate and the front surface of the waste area (substrate body), so that the effective area of the substrate and the steel mesh are completely matched, the lower compensation and the upper compensation of the substrate are respectively realized through the first boss and the second boss, and the consistency of the thickness of the soldering tin is ensured.
Step three, the SPI detection device 103 performs solder paste detection work on the printed substrate 300;
step four, the component mounting device 104 carries out the chip mounting operation on the substrate 300 after the solder paste detection;
the component mounting device 104 marks a mark on a defective position number in the substrate 300 (as shown in fig. 18, a defective incoming product (NG) at a position a 2), the camera in the component mounting device 104 scans the mark on the substrate 300, the NG position is recorded by the system, i.e., a2 NG, and the remaining positions OK, and the capacitor and the chip are mounted on the defective position number at the position OK.
Step five, the reflow soldering device 105 performs reflow soldering operation on the substrate 300 after the chip mounting;
step six, the AOI detection device 106 performs automatic optical detection on the substrate 300 after reflow soldering, and records the unqualified substrate into a database;
seventhly, the glue dispensing device 107 performs glue dispensing operation at the glue dispensing position of the substrate 300;
step eight, the curing device 108 performs heating curing operation on the substrate 300 after the point gluing, so that the glue is coated on the periphery and the bottom of the chip, and the bonding force of the chip is enhanced;
step nine, the electrical testing device 109 performs performance testing on the plurality of flexible circuit boards on the substrate 300;
the electrical testing apparatus 109 tests the plurality of flexible circuit boards on the substrate 300 line by line (i.e., a → B → C → D), a defective product is newly found in the test (i.e., a defective product (NG) at the position C3 shown in fig. 19), and the testing system records the NG position, i.e., C3NG, and the remaining positions OK.
Tenth, the substrate dividing device 110 performs punching and dividing on the plurality of flexible circuit boards on the substrate 300 into independent products, and the independent products are sequentially arranged in the board taking carrier 111.1 according to the original sequence;
eleventh, the plate taking device 111 places a plurality of independent products in a classified manner;
in the eleventh step, an automatic plate taking system is adopted, the feeding mechanism 111.2 is controlled to transmit the plate taking carrier 111.1 to the plate taking device 111, the plate taking device 111 collects information such as the position of A2 and the position of C3 of NG according to the taken system data in the two process devices of the 'component mounting process' and the 'electrical testing process', the defective products at the position of A2 are firstly sucked by the automatic suction manipulator 111.3 according to the data information and then transferred to the defective product incoming material waste material box 111.4, the defective products at the position of C3 are sucked and then transferred to the defective product placement box 111.5 for analyzing reasons by engineering personnel to facilitate subsequent quality improvement, and finally, all the remaining defective products are sucked and sequentially distributed in the defective product placement box 111.6 as shown in FIG. 20.
Twelfth, the appearance detection device 112 performs appearance detection on the good products;
step thirteen, the first assembly device 400 assembles the image sensor 205, the flexible circuit board 206 and the base plate 207 into a first assembly;
step fourteen, the second assembly device 500 assembles the base 203 and the optical filter 204 into a second assembly;
step fifteen, the third assembly device 600 assembles the lens 201 and the voice coil motor 202 into a third assembly;
sixthly, the fourth assembly device 700 assembles the fourth assembly from the second assembly in the fourteenth step and the third assembly in the fifteenth step, and the fixture block 208 on the top surface of the base 203 is matched and connected with the fixture groove 209 on the bottom surface of the voice coil motor 202, so that the base 203 and the voice coil motor 202 are precisely matched, and the deviation in the direction of X, Y is reduced;
seventeenth, the fifth assembly device 800 assembles the fourth component in the sixteenth step and the first component in the thirteenth step into a finished module.
Referring to fig. 13 to 16, in the seventh step, the dispensing device 107 includes a vertically arranged moving seat 107.1, a horizontally arranged supporting plate 107.2 is disposed on a front side of the moving seat 107.1, a fixed clamping seat 107.3 is disposed on a front side of the supporting plate 107.2, a fixing plate 107.5 is connected between the fixed clamping seat 107.3 and the middle of the supporting plate 107.2, movable clamping seats 107.4 are disposed on left and right sides of the fixed clamping seat 107.3, an adjusting assembly is disposed between the movable clamping seat 107.4 and the supporting plate 107.2, and is used for adjusting positions of the movable clamping seat 107.4 in the horizontal direction, the vertical direction and the longitudinal direction, so that the movable clamping seat 107.4 and the fixed clamping seat 107.3 are located on the same straight line, and dispensing cartridges are disposed in the fixed clamping seat 107.3 and the movable clamping seat 107.4;
the adjusting component comprises a first vertical plate 107.6, a second vertical plate 107.7 and a third vertical plate 107.8 which are connected in sequence from back to front, the first vertical plate 107.6 is fixedly connected with a supporting plate 107.2 through a plurality of bolts, the rear side of the second vertical plate 107.7 is in sliding connection with the front side of the first vertical plate 107.6, the second vertical plate 107.7 can vertically slide along the height direction of the first vertical plate 107.6 or transversely slide along the length direction of the first vertical plate 107.6, the front side of the second vertical plate 107.7 is in sliding connection with the rear side of the third vertical plate 107.8, the third vertical plate 107.8 can transversely slide along the length direction of the second vertical plate 107.7 or vertically slide along the height direction of the second vertical plate 107.7, a first connecting block 107.15 and a second connecting block 107.16 are arranged between the third vertical plate 107.8 and a movable clamping seat 107.4, the rear side of the first connecting block 107.15 is fixedly connected with the front side of the third vertical plate 107.8, the front side surface of the second connecting block 107.16 is fixedly connected with the rear side surface of the movable clamping seat 107.4, the first connecting block 107.15 is connected with the second connecting block 107.16 in a sliding manner, and the second connecting block 107.16 can slide longitudinally along the width direction of the first connecting block 107.15;
preferably, a first fixing block 107.9 is arranged on one side surface of the first vertical plate 107.6, a first adjusting bolt 107.11 arranged vertically is arranged on the first fixing block 107.9, a first top block 107.10 is arranged below the first adjusting bolt 107.11, the first top block 107.10 is fixedly connected with the side surface of the second vertical plate 107.7, the head end of the first adjusting bolt 107.11 is in contact with the top surface of the first top block 107.10, and the second vertical plate 107.7 can be controlled to slide vertically along the height direction of the first vertical plate 107.6 by the cooperation of the first adjusting bolt 107.11 and the first top block 107.10;
a first limiting piece 107.23 is arranged on the side surface of the first vertical plate 107.6, a first kidney-shaped groove 107.24 which is vertically arranged is formed in the first limiting piece 107.23, a first limiting column 107.25 is arranged in the first kidney-shaped groove 107.24, the inner end of the first limiting column 107.25 is fixedly connected with the side surface of the second vertical plate 107.7, and the position of the second vertical plate 107.7 is limited by the matching of the first limiting column 107.25 and the first limiting piece 107.23;
a second fixing block 107.12 is arranged on the bottom surface of the second vertical plate 107.7, a second adjusting bolt 107.13 arranged transversely is arranged on the second fixing block 107.12, a second top block 107.14 is arranged at the head end of the second adjusting bolt 107.13, the second top block 107.14 is fixedly connected with the bottom surface of the third vertical plate 107.8, and the third vertical plate 107.8 can be controlled to slide transversely along the length direction of the second vertical plate 107.7 by the cooperation of the second adjusting bolt 107.13 and the second top block 107.14;
a second limiting piece 107.26 is arranged on the top surface of the second vertical plate 107.7, a second waist-shaped groove 107.27 arranged transversely is arranged on the second limiting piece 107.26, a second limiting column 107.28 is arranged in the second waist-shaped groove 107.27, the bottom end of the second limiting column 107.28 is fixedly connected with the top surface of the third vertical plate 107.8, and the position of the third vertical plate 107.8 is limited by the cooperation of the second limiting column 107.28 and the second limiting piece 107.26;
a third fixing block 107.17 is arranged at one side of the first connecting block 107.15, the third fixing block 107.17 is provided with a third adjusting bolt 107.18 which is vertically arranged, a rotary pushing block 107.19 with a V-shaped structure is arranged below the third adjusting bolt 107.18, the rotary push block 107.19 is provided on the side wall of the first link block 107.15 by means of a laterally arranged latch shaft 107.20, a top rod 107.21 which is arranged longitudinally is arranged below the rotary push block 107.19, the front end of the top rod 107.21 is fixedly connected with the rear side of the second connecting block 107.16, the rotating push block 107.19 comprises two rotating arms connected at the inner ends, the two rotating arms are respectively contacted with the head end of the third adjusting bolt 107.18 and the rear end of the top rod 107.21 through arranging a lug 107.22, the third adjusting bolt 107.18 is matched with the rotary push block 107.19 and the top rod 107.21 to control the second connecting block 107.16 to slide longitudinally along the width direction of the first connecting block 107.15;
the top surface of the first connecting block 107.15 is provided with a third limiting piece 107.29, a third kidney-shaped groove 107.30 longitudinally arranged is formed in the third limiting piece 107.29, a third limiting column 107.31 is arranged in the third kidney-shaped groove 107.30, the bottom end of the third limiting column 107.31 is fixedly connected with the top surface of the second connecting block 107.16, and the position of the second connecting block 107.16 is limited by the cooperation of the third limiting column 107.31 and the third limiting piece 107.29.
The above is only a specific application example of the present invention, and the protection scope of the present invention is not limited in any way. All the technical solutions formed by equivalent transformation or equivalent replacement fall within the protection scope of the present invention.
Claims (7)
1. A production process of a VCM mobile phone camera module is characterized by comprising the following steps: the VCM mobile phone camera module is manufactured by adopting a VCM mobile phone camera module production line and comprises a lens, a voice coil motor, a base, an optical filter, an image sensor, a flexible circuit board, a bottom plate and a connector, the lens is arranged in the voice coil motor, the voice coil motor is arranged on the base, the optical filter and the image sensor are arranged between the base and the flexible circuit board, the flexible circuit board is embedded on the bottom plate and comprises a transverse section and a vertical section, the inner side edge of the transverse section is provided with an inward concave arc-shaped edge, the front surface of the transverse section is provided with a reserved area, a plurality of prepared welding discs with different sizes are arranged in the reserved area at intervals along the inner edge of the arc-shaped edge, the front surface of the vertical section is provided with a capacitor mounting area and a chip mounting area, and the back surface of the transverse section is provided with a groove corresponding to the reserved area;
the VCM mobile phone camera module production line sequentially comprises a flexible circuit board production device, a first assembly device, a second assembly device, a third assembly device, a fourth assembly device and a fifth assembly device from front to back, wherein the flexible circuit board production device sequentially comprises an attaching device, a steel mesh printing device, an SPI detection device, an article packaging device, a reflow soldering device, an AOI detection device, an adhesive dispensing device, a curing device, an electrical test device, a substrate cutting device, a plate taking device and an appearance detection device from front to back,
the specific production steps are as follows:
firstly, positioning and fixing a substrate by an attaching device;
the attaching device comprises a positioning jig, a carrier plate and a positioning steel sheet, wherein the carrier plate is arranged on the positioning jig, the substrate is positioned on the carrier plate through the positioning steel sheet, the carrier plate comprises a carrier plate body, the front surface of the carrier plate body is provided with a plurality of first bosses which are arranged in a matrix manner, and the first bosses can compensate the height difference between the back surface groove of the effective area of the substrate and other parts on the back surface of the effective area;
secondly, the steel mesh printing device carries out solder paste printing operation on the surface of the substrate;
the steel mesh printing device comprises a steel mesh, wherein a plurality of second bosses which are arranged in a matrix manner are arranged on the back surface of the steel mesh, the second bosses can compensate the height difference between the front surface of the effective part and the front surface of the waste part of the substrate, and the effective area and the waste area on the substrate are compensated downwards and upwards respectively through the first bosses and the second bosses, so that the thickness of soldering tin on each preparation bonding pad is 0.06-0.10mm, and the height difference of the thickness of the soldering tin on the preparation bonding pads is less than or equal to 0.02 mm;
step three, the SPI detection device carries out solder paste detection operation on the printed substrate;
fourthly, the part packaging device carries out surface mounting operation on the substrate after the solder paste detection, and marks the position number of the defective product of the incoming material;
step five, the reflow soldering device performs reflow soldering operation on the substrate after the chip mounting;
step six, the AOI detection device performs automatic optical detection on the reflowed substrate, and records the unqualified substrate into a database;
seventhly, carrying out glue dispensing operation at the glue dispensing position of the substrate by using a glue dispensing device;
step eight, the curing device carries out heating curing operation on the substrate after dispensing;
step nine, the electrical testing device performs performance testing on the flexible circuit boards on the substrate, and the system records the position numbers of the performance defective products;
step ten, punching and cutting the flexible circuit boards on the substrate into independent products by the substrate cutting device, and sequentially arranging the independent products in the board taking carrier according to the original sequence;
step eleven, the plate taking device places a plurality of independent products in a classified mode;
step twelve, the appearance detection device performs appearance detection on the good products;
step thirteen, the first assembly device assembles the image sensor, the flexible circuit board and the bottom plate into a first assembly;
step fourteen, the second assembly device assembles the base and the optical filter into a second assembly;
a fifteenth step of assembling the lens and the voice coil motor into a third assembly by the third assembly device;
sixthly, assembling the second assembly in the fourteenth and the third assembly in the fifteenth into a fourth assembly by using a fourth assembly device;
seventhly, assembling the fourth component in the sixteenth step and the first component in the thirteenth step into a finished product module by the fifth assembly device.
2. The process for producing a VCM handset camera module according to claim 1, wherein: in the first step, the carrier plate utilizes magnetic attraction to adsorb the positioning steel sheet to position the substrate in the middle of the carrier plate, the substrate comprises a substrate body, a plurality of flexible circuit boards arranged in a matrix manner are arranged on the substrate body, the heights of the front surfaces of the flexible circuit boards are lower than that of the substrate body, and a plurality of substrate positioning holes are formed in the substrate body;
the positioning jig comprises a base, positioning blocks are arranged at four corners of the base respectively, and a plurality of vertical positioning columns are arranged on the base;
the carrier plate includes the carrier plate body, a plurality of carrier plate locating holes have been seted up on the carrier plate body, the back of carrier plate body is provided with magnet, the positive middle part of carrier plate body is provided with the end lining steel sheet, be provided with one deck high temperature resistant steel silica gel between end lining steel sheet and the carrier plate body, the front of end lining steel sheet is provided with a plurality of first bosss that are the matrix and arrange, the shape of first boss and the recess shape phase-match at the flexible circuit board back.
3. The process for producing a VCM handset camera module according to claim 1, wherein: in the second step, the shape of the second boss is matched with the outline of the flexible circuit board, a plurality of soldering tin holes are formed in the steel mesh, and the hole diameter of each soldering tin hole is gradually reduced from the front face to the back face of the steel mesh.
4. The process for producing a VCM handset camera module according to claim 1, wherein: and step eleven, an automatic plate taking system is adopted, a feeding mechanism is controlled to convey a plate taking carrier into a plate taking device, the plate taking device collects information such as a defective material position and a defective performance position according to system data in a called part product actual installation device and an electrical testing device, then an automatic suction manipulator sucks defective materials from the coming materials according to the system data and transfers the defective materials to a defective material box of the coming materials, the defective performance products are sucked and then transferred to a defective performance product placing box, and finally all the remaining defective materials are sucked and sequentially distributed in the defective product placing box.
5. The process for producing a VCM handset camera module according to claim 1, wherein: the dispensing device comprises a vertically-arranged moving seat, a supporting plate is arranged on the moving seat, a fixed clamping seat is arranged on the front side of the supporting plate, a fixed plate is connected between the fixed clamping seat and the supporting plate, movable clamping seats are arranged on the left side and the right side of the fixed clamping seat respectively, an adjusting assembly is arranged between the movable clamping seat and the supporting plate and used for adjusting the horizontal, vertical and longitudinal positions of the movable clamping seat, and dispensing barrels are arranged in the fixed clamping seat and the movable clamping seat respectively.
6. The process for producing a VCM handset camera module according to claim 5, wherein: the adjusting component comprises a first vertical plate, a second vertical plate and a third vertical plate which are connected in sequence from back to front, the first vertical plate is fixedly connected with the supporting plate through a plurality of bolts, the second vertical plate is connected with the first vertical plate in a sliding way, the second vertical plate can slide vertically along the height direction of the first vertical plate or slide transversely along the length direction of the first vertical plate, the second vertical plate is connected with a third vertical plate in a sliding way, the third vertical plate can slide transversely along the length direction of the second vertical plate or vertically along the height direction of the second vertical plate, a first connecting block and a second connecting block are arranged between the third vertical plate and the movable clamping seat, the first connecting block is fixedly connected with the third vertical plate, the second connecting block is fixedly connected with the movable clamping seat, the first connecting block is connected with the second connecting block in a sliding mode, and the second connecting block can longitudinally slide along the width direction of the first connecting block.
7. The process for producing a VCM handset camera module according to claim 6, wherein: a first fixing block is arranged on one side face of the first vertical plate, a first adjusting bolt which is vertically arranged is arranged on the first fixing block, a first ejecting block is arranged below the first adjusting bolt, the first ejecting block is fixedly connected with the side face of the second vertical plate, and the head end of the first adjusting bolt is in contact with the top face of the first ejecting block;
a second fixing block is arranged on the bottom surface of the second vertical plate, a second adjusting bolt which is transversely arranged is arranged on the second fixing block, a second ejecting block is arranged at the head end of the second adjusting bolt, and the second ejecting block is fixedly connected with the bottom surface of a third vertical plate;
one side of first connecting block is provided with the third fixed block, be provided with vertical arrangement's third adjusting bolt on the third fixed block, third adjusting bolt's below is provided with rotates the ejector pad, rotate the ejector pad and set up on the lateral wall of first connecting block through transverse arrangement's bolt axle, the below of rotating the ejector pad is provided with longitudinal arrangement's ejector pin, the one end of ejector pin and the rear side fixed connection of second connecting block, the both ends of rotating the ejector pad contact with third adjusting bolt's head end and the other end of ejector pin respectively.
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| CN201911040799.6A CN110572561B (en) | 2019-10-30 | 2019-10-30 | Production process of VCM mobile phone camera module |
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| CN111715491A (en) * | 2020-06-17 | 2020-09-29 | 无锡豪帮高科股份有限公司 | Dispensing method for VCM module |
| CN117812248A (en) * | 2023-12-28 | 2024-04-02 | 珠海广浩捷科技股份有限公司 | Double-station eight-head VCM tester |
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