CN113543517A - Connection method of SIP module and FPC and electronic product - Google Patents
Connection method of SIP module and FPC and electronic product Download PDFInfo
- Publication number
- CN113543517A CN113543517A CN202110740187.9A CN202110740187A CN113543517A CN 113543517 A CN113543517 A CN 113543517A CN 202110740187 A CN202110740187 A CN 202110740187A CN 113543517 A CN113543517 A CN 113543517A
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- Prior art keywords
- sip module
- fpc
- adapter plate
- welding
- sip
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Abstract
The invention provides a connection method of an SIP module and an FPC (flexible printed circuit) and an electronic product, wherein the SIP module and the FPC are connected and conducted through a transfer board; the connection method comprises the following steps: the adapter plate is attached to a preset position of the SIP module, and one side, close to the SIP module, of the adapter plate is welded and fixed with the SIP module; carrying out whole-surface dispensing fixation on the adapter plate and the SIP module which are welded and fixed through dispensing; the method comprises the following steps of (1) attaching the FPC to one side of an adapter plate far away from an SIP module, and welding and fixing one side of the adapter plate close to the FPC with the FPC; and carrying out whole-surface dispensing and fixing on the adapter plate and the FPC which are welded and fixed through dispensing. The invention can improve the welding yield of the SIP module and the FPC and the assembly quality of products.
Description
Technical Field
The invention relates to the technical field of SIP assembly, in particular to a connection method of an SIP module and an FPC and an electronic product.
Background
Along with the continuous development in intelligence wearing field, the requirement to whole machine size is higher and higher for the size of corresponding SIP module is also littleer and more, and meanwhile, along with the increase of product function, device quantity on the SIP module is also more and more, makes the function more complete when guaranteeing that the size meets the requirements, and partial device can be placed on FPC, then adopts the mode that module and FPC are connected to realize whole scheme. At present, an SIP module and an FPC are generally connected by an interposer, solder balls are arranged on two sides of the interposer, and connection and conduction between the two are realized by melting the solder balls.
However, the existing interplay connection mode has two problems to be solved:
firstly, the solder balls on two sides of the interposer are required to be respectively welded, when the second welding is carried out, the solder ball position after the first welding and fixing can be melted again, and because the gravity stress on each part of the module is uneven, the displacement between the module and the interposer can be caused, and the poor welding is caused.
Secondly, when the module and the FPC are welded and the whole assembly of the next step is carried out, the FPC can be bent at an indefinite angle, and the welding strength of the FPC and the interposer is not blocked due to the fact that the size of a bonding pad connected with the FPC is small, so that the FPC and the interposer are easily separated, and poor assembly of products is further caused.
Disclosure of Invention
In view of the above problems, an object of the present invention is to provide a method for connecting an SIP module and an FPC, and an electronic product, which solve the problems of poor soldering and poor assembly in the assembly of the whole device, which are easily caused by the conventional connection method.
According to the connection method of the SIP module and the FPC, the SIP module and the FPC are connected and conducted through the adapter plate; the connection method comprises the following steps: the adapter plate is attached to a preset position of the SIP module, and one side, close to the SIP module, of the adapter plate is welded and fixed with the SIP module; carrying out whole-surface dispensing fixation on the adapter plate and the SIP module which are welded and fixed through dispensing; the method comprises the following steps of (1) attaching the FPC to one side of an adapter plate far away from an SIP module, and welding and fixing one side of the adapter plate close to the FPC with the FPC; and carrying out whole-surface dispensing and fixing on the adapter plate and the FPC which are welded and fixed through dispensing.
In addition, an optional technical scheme is that the adapter plate is attached to a preset position of the SIP module through an SMT process, and the FPC is attached to one side, far away from the SIP module, of the adapter plate through the SMT process.
In addition, an optional technical solution is that the adapter plate includes a substrate and solder balls respectively disposed on two sides of the substrate; welding spots corresponding to the positions of the welding balls on the lower side of the adapter plate are arranged at the preset positions of the SIP modules; and welding spots corresponding to the positions of the welding balls on the upper side of the adapter plate are arranged on the FPC.
In addition, an optional technical scheme is that in the process of welding and fixing one side of the adapter plate close to the SIP module and the SIP module, the welding balls on one side of the adapter plate close to the SIP module and the SIP module are welded and fixed through reflow soldering.
In addition, an optional technical scheme is that in the process of welding and fixing one side of the adapter plate close to the FPC with the FPC, the solder balls on one side of the adapter plate close to the FPC are welded and fixed with the FPC through reflow soldering.
In addition, an optional technical scheme is that in the direction parallel to the SIP module, the length of the substrate is not greater than the length of the SIP module and not less than the soldering length between the adapter board and the FPC.
In addition, an optional technical solution is that the FPC includes a fixing portion fixed to the interposer by welding, a bending portion disposed at one side of the fixing portion, and an extending portion extending from the fixing portion; the length of the substrate is the same as that of the bending part.
In addition, an optional technical scheme is that the fixing portion, the bending portion and the extending portion are of an integrally formed structure.
In addition, an optional technical solution is that the substrate and the SIP module are made of the same material.
According to another aspect of the present invention, an electronic product is provided, which includes an SIP module and an FPC connected to the SIP module, wherein the SIP module is connected to and conducted with the FPC through a patch panel; one side of the adapter plate, which is close to the SIP module, is welded and fixed with the SIP module, and one side of the adapter plate, which is far away from the SIP module, is welded and fixed with the FPC; and, all face adhesive dispensing is carried out and fixed at the welding positions of the adapter plate, the SIP module and the FPC.
By utilizing the connection method of the SIP module and the FPC and the electronic product, one side of the adapter plate close to the SIP module is welded and fixed with the SIP module, then the adapter plate and the SIP module after welding and fixing are subjected to whole-surface glue dispensing and fixing through glue dispensing, glue between the adapter plate and the SIP module can be prevented from moving in the welding process of the FPC, welding points between the adapter plate and the SIP module are melted and move, the welding yield is ensured, in addition, one side of the adapter plate close to the FPC is welded and fixed with the FPC, and the adapter plate and the FPC after welding and fixing are subjected to whole-surface glue dispensing and fixing through glue dispensing, the connection strength between the FPC and the adapter plate can be improved in the whole-machine assembling process, and the situation that the FPC is separated from the adapter plate is prevented.
To the accomplishment of the foregoing and related ends, one or more aspects of the invention comprise the features hereinafter fully described. The following description and the annexed drawings set forth in detail certain illustrative aspects of the invention. These aspects are indicative, however, of but a few of the various ways in which the principles of the invention may be employed. Further, the present invention is intended to include all such aspects and their equivalents.
Drawings
Other objects and results of the present invention will become more apparent and more readily appreciated as the same becomes better understood by reference to the following description taken in conjunction with the accompanying drawings. In the drawings:
fig. 1 is a flowchart of a connection method of an SIP module and an FPC according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a connection method of an SIP module and an FPC according to an embodiment of the present invention.
Wherein the reference numerals include: the device comprises a substrate 1, an SIP module 2, a full-face dispensing structure 3, an FPC4 and a full-face dispensing structure 5.
The same reference numbers in all figures indicate similar or corresponding features or functions.
Detailed Description
In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It may be evident, however, that such embodiment(s) may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to facilitate describing one or more embodiments.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
In order to describe the connection method of the SIP module and the FPC and the electronic product in detail, embodiments of the invention will be described in detail below with reference to the accompanying drawings.
Fig. 1 and 2 respectively show a schematic flow and principle of a connection method of an SIP module and an FPC according to an embodiment of the present invention.
As shown in fig. 1 and fig. 2, the method for connecting an SIP module and an FPC according to the embodiment of the present invention connects and conducts the SIP module 2 and the FPC4 through an adapter board, and mainly includes the following steps:
s100: the adapter plate is attached to the preset position of the SIP module, and one side, close to the SIP module, of the adapter plate is welded and fixed with the SIP module.
The adapter plate comprises a substrate 1 and welding balls respectively arranged on two sides of the substrate, when the adapter plate is attached to the SIP module 2, the adapter plate can be attached to a preset position of the SIP module 2 through a Surface Mount Technology (SMT) process, and welding points respectively corresponding to the positions of the welding balls on the adapter plate are arranged at the preset position.
Further, the solder balls (lower solder balls) on the side of the interposer close to the SIP module 2 and the SIP module 2 are soldered and fixed by a soldering process, and for example, the solder balls on the side of the interposer close to the SIP module 2 and the SIP module 2 are soldered and fixed by reflow soldering.
S200: and carrying out whole-surface dispensing and fixing on the adapter plate and the SIP module which are welded and fixed through dispensing.
In this step, for preventing keysets and SIP module 2 after the welded fastening at the secondary welding in-process, the welding point melts, lead to the keysets aversion scheduling problem, the accessible point is glued and is carried out whole face point to keysets and SIP module 2 after the welded fastening and is glued fixedly, form whole face point and glue structure 3, the arbitrary clearance department between keysets and SIP module 2 can be arranged in to the point glue needle, the glue of extruding can inhale automatically in the space between keysets and SIP module 2, accomplish the further fixed of keysets and SIP module 2 after the welded fastening.
Furthermore, when the other side of the adapter plate is welded, even if the welding point between the adapter plate and the SIP module 2 is melted due to the existence of the glue, the adapter plate is not displaced, and the welding yield between the adapter plate and the SIP module is ensured.
S300: and the FPC is attached to one side of the adapter plate, which is far away from the SIP module, and the side of the adapter plate, which is close to the FPC, is welded and fixed with the FPC.
After the step S200, the FPC4 to be connected may be attached to the side of the interposer far from the SIP module 2 by an SMT process, the specific attachment position may also be flexibly adjusted according to the installation requirement, and then the side of the interposer near the FPC4 and the FPC4 may be soldered and fixed by a soldering process, for example, solder balls on the side of the interposer near the FPC4 and the FPC4 may be soldered and fixed by reflow soldering.
S400: and carrying out whole-surface dispensing and fixing on the adapter plate and the FPC which are welded and fixed through dispensing.
In this step, in order to further improve the welding firmness degree between the FPC4 and the interposer, the interposer and the FPC4 after welding and fixing can be subjected to whole-surface dispensing and fixing through a dispensing needle to form a whole-surface dispensing structure 5, the dispensing needle can be placed in any gap between the interposer and the FPC4, glue extruded by the dispensing needle can be automatically sucked into a gap between the interposer and the FPC4, and the further fixing of the soldered interposer and the FPC4 is completed.
Furthermore, after the SIP module 2 and the FPC4 are assembled, when the whole assembly is carried out, the FPC4 bent at an indefinite angle can be kept firm with the SIP module 2 at all times, and the problem that the product assembly yield is affected due to the separation between the two caused by the small size of the solder balls is avoided.
It should be noted that, the length of the substrate 1 of the adapter plate is generally smaller at present, and when the adapter plate and the FPC4 which are fixed by welding are fixed by dispensing on the whole, the dispensing operation is inconvenient to be performed, in a specific embodiment of the present invention, the length of the substrate 1 of the adapter plate can be set to be not more than the length of the SIP module 2 and not less than the welding length between the adapter plate and the FPC4 in the direction parallel to the SIP module 2; in other words, the substrate 1 is lengthened and the length of the substrate is set to be slightly longer than or equal to the length of the solder between the FPC4 and the interposer under the condition that the substrate is ensured not to exceed the boundary of the SIP module 2, so that one end of the substrate 1 is close to the edge position of the FPC4 and meets the dispensing size requirement of the dispensing needle.
In an embodiment of the invention, the FPC4 may include a fixing portion fixed to the interposer by soldering, a bending portion disposed on one side of the fixing portion, and an extending portion extending from the fixing portion, and the fixing portion, the bending portion, and the extending portion are integrally formed, wherein the length of the substrate 1 may be the same as the length of the bending portion, or may be adjusted according to the processing requirement, and may meet the size requirement of the dispensing device.
In addition, the substrate 1 can be made of the same material as the SIP module 2, and the solder balls on both sides of the substrate 1 can be arranged in position, size and number according to the product requirement.
Corresponding to the connection method of the SIP module and the FPC, the invention also provides an electronic product which comprises the SIP module and the FPC connected with the SIP module, wherein the SIP module and the FPC are connected and conducted through the connection method, for example, the SIP module is connected and conducted with the FPC through a transfer board; one side of the adapter plate, which is close to the SIP module, is welded and fixed with the SIP module, and one side of the adapter plate, which is far away from the SIP module, is welded and fixed with the FPC; and, all face adhesive dispensing is carried out and fixed at the welding positions of the adapter plate, the SIP module and the FPC.
It should be noted that, in the embodiments of the electronic product, reference may be made to the description in the embodiment of the connection method between the SIP module and the FPC, and details are not repeated here.
According to the embodiment, the connection method of the SIP module and the FPC and the electronic device provided by the invention can prevent the position deviation caused by the melting of the welding ball between the SIP module and the adapter plate during the secondary welding and prevent the cracking phenomenon caused by the insufficient connection strength between the adapter plate and the FPC by performing the whole-surface dispensing and fixing between the SIP module and the adapter plate and between the adapter plate and the FPC, thereby ensuring the welding yield between the SIP module and the FPC and the later assembly yield.
The connection method of the SIP module and the FPC and the electronic product according to the present invention are described above by way of example with reference to the accompanying drawings. However, it should be understood by those skilled in the art that various modifications can be made to the connection method of the SIP module and the FPC and the electronic product provided by the present invention without departing from the scope of the present invention. Therefore, the scope of the present invention should be determined by the contents of the appended claims.
Claims (10)
1. A method for connecting an SIP module and an FPC is characterized in that the SIP module and the FPC are connected and conducted through a pinboard; wherein the connection method comprises:
the adapter plate is attached to a preset position of the SIP module, and one side, close to the SIP module, of the adapter plate is welded and fixed with the SIP module;
carrying out whole-surface dispensing fixation on the adapter plate and the SIP module which are welded and fixed through dispensing;
the FPC is attached to one side, far away from the SIP module, of the adapter plate, and one side, close to the FPC, of the adapter plate is welded and fixed with the FPC;
and carrying out whole-surface dispensing and fixing on the adapter plate and the FPC which are welded and fixed through dispensing.
2. The method for connecting an SIP module and an FPC according to claim 1,
the adapter plate is attached to the preset position of the SIP module through an SMT process, and the FPC is attached to one side, far away from the SIP module, of the adapter plate through the SMT process.
3. The method for connecting an SIP module and an FPC according to claim 1,
the adapter plate comprises a substrate and welding balls respectively arranged on two sides of the substrate;
welding spots corresponding to the positions of the welding balls on the lower side of the adapter plate are arranged at the preset positions of the SIP modules;
and welding spots corresponding to the positions of the welding balls on the upper side of the adapter plate are arranged on the FPC.
4. The method for connecting an SIP module and an FPC according to claim 3, wherein in the process of soldering and fixing the side of the interposer close to the SIP module and the SIP module,
and welding and fixing the welding ball on one side of the adapter plate close to the SIP module and the SIP module through reflow soldering.
5. The method for connecting an SIP module and an FPC according to claim 3, wherein in the process of soldering and fixing the FPC to the side of the interposer close to the FPC,
and welding and fixing the welding balls on one side of the adapter plate close to the FPC and the FPC by reflow soldering.
6. The method for connecting an SIP module and an FPC according to claim 3,
in the direction parallel to the SIP module, the length of the substrate is not more than that of the SIP module and not less than the welding length between the adapter plate and the FPC.
7. The method for connecting an SIP module and an FPC according to claim 6,
the FPC comprises a fixing part fixed with the adapter plate in a welding mode, a bending part arranged on one side of the fixing part and an extending part extending out of the fixing part;
the length of the substrate is the same as that of the bending part.
8. The method for connecting an SIP module and an FPC according to claim 6,
the fixing portion, the bending portion and the extending portion are of an integrally formed structure.
9. The method for connecting an SIP module and an FPC according to claim 3,
the substrate and the SIP module are made of the same material.
10. An electronic product, comprising an SIP module and an FPC connected with the SIP module,
the SIP module is connected and conducted with the FPC through a patch panel;
one side of the adapter plate, which is close to the SIP module, is welded and fixed with the SIP module, and one side of the adapter plate, which is far away from the SIP module, is welded and fixed with the FPC; and the number of the first and second electrodes,
and carrying out whole-surface dispensing and fixing on the welding positions of the adapter plate, the SIP module and the FPC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110740187.9A CN113543517A (en) | 2021-06-30 | 2021-06-30 | Connection method of SIP module and FPC and electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110740187.9A CN113543517A (en) | 2021-06-30 | 2021-06-30 | Connection method of SIP module and FPC and electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113543517A true CN113543517A (en) | 2021-10-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110740187.9A Pending CN113543517A (en) | 2021-06-30 | 2021-06-30 | Connection method of SIP module and FPC and electronic product |
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| Country | Link |
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| CN (1) | CN113543517A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02234447A (en) * | 1989-03-07 | 1990-09-17 | Nec Corp | Method of connection semiconductor integrated circuit element |
| JPH098446A (en) * | 1995-06-26 | 1997-01-10 | Matsushita Electric Ind Co Ltd | High-density mounting to printed board |
| CN106604564A (en) * | 2016-12-01 | 2017-04-26 | 广东威创视讯科技股份有限公司 | Surface mounting method for printed circuit board |
| CN110320972A (en) * | 2019-05-20 | 2019-10-11 | 华为技术有限公司 | A kind of fingerprint recognition mould group and a kind of electronic equipment |
-
2021
- 2021-06-30 CN CN202110740187.9A patent/CN113543517A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02234447A (en) * | 1989-03-07 | 1990-09-17 | Nec Corp | Method of connection semiconductor integrated circuit element |
| JPH098446A (en) * | 1995-06-26 | 1997-01-10 | Matsushita Electric Ind Co Ltd | High-density mounting to printed board |
| CN106604564A (en) * | 2016-12-01 | 2017-04-26 | 广东威创视讯科技股份有限公司 | Surface mounting method for printed circuit board |
| CN110320972A (en) * | 2019-05-20 | 2019-10-11 | 华为技术有限公司 | A kind of fingerprint recognition mould group and a kind of electronic equipment |
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Application publication date: 20211022 |