CN103050453B - Surface mount microwave device - Google Patents
Surface mount microwave device Download PDFInfo
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- CN103050453B CN103050453B CN201210582730.8A CN201210582730A CN103050453B CN 103050453 B CN103050453 B CN 103050453B CN 201210582730 A CN201210582730 A CN 201210582730A CN 103050453 B CN103050453 B CN 103050453B
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Abstract
The invention discloses a surface mount microwave device. Copper foil layers (4) and copper foil circuit layers (5) are symmetrically arranged between cover plates and a central medium material layer (3). Medium material layers (6) are arranged between the copper foil layers (4) and the copper foil circuit layers (5). Press-fitting glue film layers (7) for press-fitting are arranged between the copper foil circuit layers (5) and the medium material layers (6). A packaging process comprises the following steps of: tin paste printing, automatic mounting, curing, reflow soldering and cleaning to complete packaging. Since a strip line structure is used instead of a microstrip line and a copper foil circuit line in the strip line is in a folded and multilayer structure, the effective dielectric constant of the circuit is improved and the size of the microwave device is greatly reduced; and since a surface mount packaging method is adopted, slots for installation are not needed to be excavated in a printed circuit board and a chamber body, the printed circuit board is directly installed, the surface mounting is realized, the design and the realization of a microstrip circuit and a microstrip system are facilitated and optimized, the applicability is greatly increased and the application scope is wider.
Description
Technical field
The present invention relates to a kind of surface mount microwave device.
Background technology
Along with the development of microwave technology, the design of microstrip circuit and system progressively becomes the design and devdlop of transmission line, monolithic integrated microwave circuit and microwave passive circuit.But in current many designs, microwave device all directly cannot be mounted on the surface of printed circuit board, engineer has to directly design passive circuit on the microstrip line or circuit design is become a lot of module, then the coaxial mode connected is adopted, but these modes cause equipment volume huge, debugging task is miscellaneous, is unfavorable for the batch production of product, and can not play the strong point of monolithic integrated microwave circuit.
Traditional microwave device adopts the microstrip line construction of individual layer, and the effective dielectric constant of circuit is lower, and small product size is comparatively large, cannot meet the surface-pasted miniature requirement of microwave device.
Therefore, research and development can adapt with monolithic integrated microwave circuit, meet the microwave device that surface mount requires, microwave device directly can be used on microwave printed board, reduction system volume, and raising product criticizes production capacity, is the current task of top priority.
Existing microwave device packaged type mainly comprises following two kinds: (1) adopts the packaged type of screw thread spinning between microwave device and pcb board; (2) packaged type adopting punching press embedding between microwave device and pcb board.When using screw thread spinning packaged type, microwave device and pcb board all need machining screw, adds difficulty of processing and cost.When using the embedding packaged type of punching press, need special pressing equipment just can complete, add packaging cost, and cannot take apart and ressemble or keep in repair.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, there is provided a kind of and replace microstrip line with strip line structure, copper foil circuit line in strip line adopts folding and sandwich construction, circuit effective dielectric constant can be improved, reduce the miniaturized surface attachment microwave device that directly can be affixed on pcb board surface of microwave device volume; And a kind of surface mount microwave device to be mounted on method for packing on pcb board simple, packaging density is high, small product size is little, lightweight, and reliability is high, welding point defect rate is low, high frequency characteristics is good, becomes frequency high, the surface mount microwave device packaging technology that packaging efficiency is high.
The object of the invention is to be achieved through the following technical solutions: surface mount microwave device, it comprises upper cover plate, lower cover and central dielectric material layer, copper foil layer and copper foil circuit layer is all symmetrically arranged with between upper cover plate and central dielectric material layer, between lower cover and central dielectric material layer, copper foil layer is located at the side of upper and lower cover plate, copper foil circuit layer is arranged at the side of central dielectric material layer, also be provided with layer of dielectric material between copper foil layer and copper foil circuit layer, between copper foil circuit layer and layer of dielectric material, be provided with the pressing adhesive film for pressing.
Preferably, the copper foil circuit line in copper foil circuit layer adopts strip lines configuration.Further, the copper foil circuit line in copper foil circuit layer adopts strip lines configuration that is folding and multilayer.
Surface mount microwave device also comprises rivet, on described upper cover plate, lower cover, central dielectric material layer, copper foil layer, copper foil circuit layer, layer of dielectric material and pressing adhesive film, corresponding position is equipped with the rivet hole matched with rivet, and each lamination of surface mount microwave device is combined through rivet hole by rivet successively.Preferably, the quantity of rivet is two or four.
The packaging technology of surface mount microwave device, it comprises the following steps:
S1: paste solder printing: the circuit board that will print is fixed on printing positioning table, bites on the pad of correspondence by the left and right scraper of printing machine by tin cream or red glue by steel mesh;
S2: automatic chip mounting: input on chip mounter carry out automatic chip mounting by band to band transfer module uniform pcb board of biting, flat microwave device is directly installed on pcb board, signal welding position is connected directly between on the holding wire of pcb board, and ground connection welding position is by the ground metallization hole ground connection of pcb board;
S3: solidification: the pcb board completing paster is sent in curing oven and is cured, Heraeus is melted, microwave device and pcb board are bonded together;
S4: reflow soldering: carrying out reflow soldering by completing in the feeding of the pcb board after solidification reflow soldering, soldering paste being melted, microwave device and pcb board are bonded together further;
S5: clean, complete encapsulation.
The step of automatic chip mounting comprises following sub-step:
S201: enter plate, uniform pcb board of biting puts into automatic placement machine;
S202: self study PCBMark;
S203: select suction nozzle;
S204: select feed appliance;
S205: vision centering;
S206: attachment microwave device;
S207: suction nozzle puts back to suction nozzle seat;
S208: complete paster, takes out pcb board.
The invention has the beneficial effects as follows:
1) surface mount microwave device takes multiple stratification to design, and replaces microstrip line with strip line structure, and the copper foil circuit line in strip line adopts folding and sandwich construction, improves circuit effective dielectric constant, greatly reduces microwave device volume;
2) surface mount microwave device takes strip lines configuration, achieves the elimination of distributed constant, lower than the loss of traditional lumped parameter surface mount passive circuit, isolation is high, standing wave is little, improves systematic function;
3) adopting surface-pasted method for packing, without the need to carrying out grooving installation in printed board and cavity, but directly installing in printed board, achieve surface mount, facilitate and optimize the design basis ground motion of microstrip circuit and system, and its application is increased greatly, application is more extensive;
4) also to have method for packing simple for this packaging technology, and packaging density is high, small product size is little, lightweight, and reliability is high, and welding point defect rate is low, and high frequency characteristics is good, becomes frequency high, packaging efficiency high.
Accompanying drawing explanation
Fig. 1 is the hierarchy schematic diagram of surface mount microwave device;
Fig. 2 is the packaging technology flow chart of surface mount microwave device;
Fig. 3 is the operational flowchart of automatic chip mounting step;
In figure, 1-upper cover plate, 2-lower cover, 3-central dielectric material layer, 4-copper foil layer, 5-copper foil circuit layer, 6-layer of dielectric material, 7-pressing adhesive film, 8-rivet.
Embodiment
Below in conjunction with accompanying drawing, technical scheme of the present invention is described in further detail, but protection scope of the present invention is not limited to the following stated.
As shown in Figure 1, surface mount microwave device, it comprises upper cover plate 1, lower cover 2 and central dielectric material layer 3, copper foil layer 4 and copper foil circuit layer 5 is all symmetrically arranged with between upper cover plate 1 and central dielectric material layer 3, between lower cover 2 and central dielectric material layer 3, copper foil layer 4 is located at the side of upper and lower cover plate, copper foil circuit layer 5 is arranged at the side of central dielectric material layer 3, also be provided with layer of dielectric material 6 between copper foil layer 4 and copper foil circuit layer 5, between copper foil circuit layer 5 and layer of dielectric material 6, be provided with the pressing adhesive film 7 for pressing.
Copper foil circuit line in copper foil circuit layer 5 adopts strip lines configuration, and the copper foil circuit line in copper foil circuit layer 5 adopts strip lines configuration that is folding and multilayer.
Surface mount microwave device also comprises rivet 8, on described upper cover plate 1, lower cover 2, central dielectric material layer 3, copper foil layer 4, copper foil circuit layer 5, layer of dielectric material 6 and pressing adhesive film 7, corresponding position is equipped with the rivet hole matched with rivet 8, and each lamination of surface mount microwave device is combined through rivet hole by rivet 8 successively.
Preferably, the quantity of rivet 8 is two or four.
The packaging technology of surface mount microwave device, it comprises the following steps:
S1: paste solder printing: the circuit board that will print is fixed on printing positioning table, bites on the pad of correspondence by the left and right scraper of printing machine by tin cream or red glue by steel mesh;
S2: automatic chip mounting: input on chip mounter carry out automatic chip mounting by band to band transfer module uniform pcb board of biting, flat microwave device is directly installed on pcb board, signal welding position is connected directly between on the holding wire of pcb board, and ground connection welding position is by the ground metallization hole ground connection of pcb board;
S3: solidification: the pcb board completing paster is sent in curing oven and is cured, Heraeus is melted, microwave device and pcb board are bonded together;
S4: reflow soldering: carrying out reflow soldering by completing in the feeding of the pcb board after solidification reflow soldering, soldering paste being melted, microwave device and pcb board are bonded together further;
S5: clean, complete encapsulation.
The step of automatic chip mounting comprises following sub-step:
S201: enter plate, uniform pcb board of biting puts into automatic placement machine;
S202: self study PCBMark;
S203: select suction nozzle;
S204: select feed appliance;
S205: vision centering;
S206: attachment microwave device;
S207: suction nozzle puts back to suction nozzle seat;
S208: complete paster, takes out pcb board.
Compared with Embedded multilayer circuit, surface-pasted microwave device without the need to carrying out grooving installation in printed board and cavity, but is directly installed on printed board.Even now reduces the power bearing ability of device, but surface-pasted packaged type makes it can carry out applying and using in more wide field, use so embedded multi-layer circuit is applied in power combing usually as synthesis unit, and surface mount microwave device orientates middle low power product as, comprise power splitter, coupler, electric bridge, part filter, Ba Lun, frequency mixer (I/Q modulator and IQ demodulator) etc., use occasion also can expand to receiver, solid state power amplifier and transmitter front ends allocation units, the less demanding power combing end of power bearing ability, all microwave applications backgrounds such as frequency synthesizer.
Claims (5)
1. surface mount microwave device, it comprises upper cover plate (1), lower cover (2) and central dielectric material layer (3), it is characterized in that: between upper cover plate (1) and central dielectric material layer (3), copper foil layer (4) and copper foil circuit layer (5) is all symmetrically arranged with between lower cover (2) and central dielectric material layer (3), copper foil layer (4) is located at, the side of lower cover, copper foil circuit layer (5) is arranged at the side of central dielectric material layer (3), layer of dielectric material (6) is also provided with between copper foil layer (4) and copper foil circuit layer (5), the pressing adhesive film (7) for pressing is provided with between copper foil circuit layer (5) and layer of dielectric material (6).
2. surface mount microwave device according to claim 1, is characterized in that: the copper foil circuit line in described copper foil circuit layer (5) adopts strip lines configuration.
3. surface mount microwave device according to claim 2, is characterized in that: the copper foil circuit line in described copper foil circuit layer (5) adopts strip lines configuration that is folding and multilayer.
4. surface mount microwave device according to claim 1, it is characterized in that: it also comprises rivet (8), the upper corresponding position of described upper cover plate (1), lower cover (2), central dielectric material layer (3), copper foil layer (4), copper foil circuit layer (5), layer of dielectric material (6) and pressing adhesive film (7) is equipped with the rivet hole matched with rivet (8), and each lamination of surface mount microwave device is combined through rivet hole by rivet (8) successively.
5. surface mount microwave device according to claim 4, is characterized in that: the quantity of described rivet (8) is two or four.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210582730.8A CN103050453B (en) | 2012-12-28 | 2012-12-28 | Surface mount microwave device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210582730.8A CN103050453B (en) | 2012-12-28 | 2012-12-28 | Surface mount microwave device |
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| Publication Number | Publication Date |
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| CN103050453A CN103050453A (en) | 2013-04-17 |
| CN103050453B true CN103050453B (en) | 2015-04-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210582730.8A Active CN103050453B (en) | 2012-12-28 | 2012-12-28 | Surface mount microwave device |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103317203A (en) * | 2013-06-20 | 2013-09-25 | 成都九洲迪飞科技有限责任公司 | Welding technology for microwave substrate |
| CN103433171A (en) * | 2013-08-30 | 2013-12-11 | 深圳创维－Rgb电子有限公司 | Device and method for coating adhesion agents on bonding pads of PCB (printed circuit board) of LED (light-emitting diode) area light source |
| CN105099370B (en) * | 2015-08-12 | 2018-10-23 | 安徽华东光电技术研究所 | The processing method of preposition frequency mixer |
| CN106332470A (en) * | 2016-08-31 | 2017-01-11 | 河源西普电子有限公司 | SMD technique |
| CN108155455A (en) * | 2017-12-12 | 2018-06-12 | 北京无线电测量研究所 | A kind of microstrip antenna |
| CN109104826A (en) * | 2018-06-14 | 2018-12-28 | 安徽华东光电技术研究所有限公司 | A kind of manufacture craft of multiple-frequency modulation device |
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| EP1923950A1 (en) * | 2006-11-17 | 2008-05-21 | Siemens S.p.A. | SMT enabled microwave package with waveguide interface |
| CN101932195A (en) * | 2010-09-28 | 2010-12-29 | 天津三星电子显示器有限公司 | Method for realizing integration of printed circuit boards of monitor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1293009A4 (en) * | 2000-06-09 | 2004-06-09 | Synergy Microwave Corproation | Multi-layer microwave circuits and methods of manufacture |
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- 2012-12-28 CN CN201210582730.8A patent/CN103050453B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1923950A1 (en) * | 2006-11-17 | 2008-05-21 | Siemens S.p.A. | SMT enabled microwave package with waveguide interface |
| CN101932195A (en) * | 2010-09-28 | 2010-12-29 | 天津三星电子显示器有限公司 | Method for realizing integration of printed circuit boards of monitor |
Non-Patent Citations (1)
| Title |
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| 朱生传等.表面贴装型微波器件.《电子元件与材料》.2002,第21卷(第9期), * |
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