CN108155455A - A kind of microstrip antenna - Google Patents
A kind of microstrip antenna Download PDFInfo
- Publication number
- CN108155455A CN108155455A CN201711319314.8A CN201711319314A CN108155455A CN 108155455 A CN108155455 A CN 108155455A CN 201711319314 A CN201711319314 A CN 201711319314A CN 108155455 A CN108155455 A CN 108155455A
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- micro
- strip plate
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- dielectric
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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Abstract
The application discloses a kind of microstrip antenna, and including bottom plate, the multilayer micro-strip plate being arranged on bottom plate, dielectric-slab and positioning device are set and Nian Jie using glued membrane between the dielectric-slab and micro-strip plate, and the positioning device is for fixing the position of micro-strip plate and dielectric-slab.The microstrip antenna that the application proposes can ensure the position relationship on micro-strip plate between microstrip line by location hole, it can ensure the bond quality and thickness between each section by glued membrane, distance in-between can be ensured by the position relationship between upper lower platen, it can ensure fusion and the bonding of glued membrane by way of external heating mode and pressure, stable quality is reliable, the microstrip antenna for being suitble to single and mini-batch production cementing.
Description
Technical field
The present invention relates to microstrip antenna technical field, particularly a kind of microstrip antenna.
Background technology
With the development of the development of antenna technology, particularly microwave integrated circuit, application is more next in antennas for microstrip antenna
It is more extensive.Due to microstrip antenna is small, low cost, easily production, easily integrated with integrated circuit the features such as, in Antenna Design more
To be more taken seriously and consider.With increasing for antenna frequency of use, the requirement for the microstrip antenna accuracy of manufacture is also increasingly
Height, especially for microstrip antenna in itself, the general process using etching, substantially precision can reach a 0.03mm left sides
The right side, high-precision etching can reach 0.01mm or so.But for the microstrip antenna of most of 5G-10G, general precision requirement exists
0.05mm or so.If using more complicated method of manufacturing technology, production efficiency and expense cost also accordingly improve.
Particularly to single and mini-batch production product, how fast and low-cost produces reliable and stable microstrip antenna, becomes its design
Key point.
In view of this, the application proposes a kind of microstrip antenna.
Invention content
The purpose of the present invention is to provide a kind of microstrip antennas.
In order to achieve the above objectives, the present invention uses following technical proposals：
Including bottom plate, the multilayer micro-strip plate being arranged on bottom plate, dielectric-slab and positioning device, the dielectric-slab and micro-strip plate
Between set and be bonded using glued membrane, the positioning device is for fixing the position of micro-strip plate and dielectric-slab；
The micro-strip plate includes at least first layer micro-strip plate and second layer micro-strip plate, and the first layer micro-strip plate is arranged on
On bottom plate, the dielectric-slab includes first layer dielectric-slab, and first is set between the first layer micro-strip plate and second layer micro-strip plate
Layer dielectric-slab, the first layer micro-strip plate use glued membrane Nian Jie with first layer dielectric-slab, the first layer dielectric-slab and the second layer
Micro-strip plate is bonded using glued membrane.
The micro-strip plate further includes third layer micro-strip plate, and the dielectric-slab further includes second layer dielectric-slab, and described
Two layer medium plate is arranged on second layer micro-strip plate, and the third layer micro-strip plate is Nian Jie using glued membrane with second layer micro-strip plate.
The positioning device includes location hole and positioning pin, and the positioning pin is fixed on bottom plate, the positioning
Hole is opened on micro-strip plate and dielectric-slab, and the positioning pin passes through multilayer micro-strip plate and dielectric-slab to position it.
The positioning device sets two sets, including the first positioning device and the second positioning device, the first positioning dress
It puts and is set with the second positioning device axial symmetry.
The positioning device at least sets two sets, including the first positioning device, the second positioning device and third positioning dress
It puts, the micro-strip plate, dielectric-slab are set as rectangular slab, the first positioning device, and the second positioning device and third positioning device are determined
Position hole is arranged on the vertex of plate, and positioning pin corresponds to location hole and is arranged on bottom plate.
80 DEG C of the glued membrane melting temperature, the thickness before being heated are 0.15mm.
The microstrip antenna that the application proposes can ensure the position relationship on micro-strip plate between microstrip line by location hole, pass through
Glued membrane can ensure the bond quality and thickness between each section, can be ensured in-between by the position relationship between upper lower platen
Distance, can ensure fusion and the bonding of glued membrane by way of external heating mode and pressure, stable quality is reliable, be suitble to unit price
The cementing microstrip antenna of small lot.
Description of the drawings
The specific embodiment of the present invention is described in further detail below in conjunction with the accompanying drawings：
Fig. 1 is multi-layer microstrip antenna molding structure schematic diagram；
Fig. 2 is two layers of microstrip antenna structure schematic diagram；
Fig. 3 is two layers of microstrip antenna side structure diagram；
Fig. 4 is two layers of microstrip antenna cross-sectional structure schematic diagram.
1st, top board；2nd, micro-strip plate；3rd, glued membrane；4th, dielectric-slab；5th, bottom plate；6th, lower platen；7th, positioning pin；8th, location hole.
Specific embodiment
In order to illustrate more clearly of the present invention, the present invention is done further with reference to preferred embodiments and drawings
It is bright.Similar component is indicated with identical reference numeral in attached drawing.It will be appreciated by those skilled in the art that institute is specific below
The content of description is illustrative and be not restrictive, and should not be limited the scope of the invention with this.
The present embodiment provides a kind of microstrip antennas, are provided with bottom plate 5, the multilayer micro-strip plate being arranged on bottom plate 5, dielectric-slab
4 and positioning device, the micro-strip plate at least set two layers, the dielectric-slab 4 setting alternate with micro-strip plate 2 and using glued membrane 3
Bonding, the positioning device are used to fix the position of micro-strip plate 2 and dielectric-slab 4；
The micro-strip plate includes first layer micro-strip plate and second layer micro-strip plate, and the first layer micro-strip plate is arranged on bottom plate
On, the dielectric-slab alternate setting corresponding with multilayer micro-strip plate, including first layer dielectric-slab；
Between the first layer micro-strip plate and second layer micro-strip plate set first layer dielectric-slab, the first layer micro-strip plate with
First layer dielectric-slab is bonded using glued membrane, and the first layer dielectric-slab is carried out be bonded with second layer micro-strip plate using glued membrane.
The micro-strip plate further includes third layer micro-strip plate, and the dielectric-slab further includes second layer dielectric-slab, described
Second layer dielectric-slab is arranged on second layer micro-strip plate, and the third layer micro-strip plate is glued with second layer micro-strip plate using glued membrane
It connects.
Microstrip antenna is made of following technique, including lower platen 6, bottom plate 5, glued membrane 3, first layer micro-strip plate, glued membrane, the
One layer of dielectric-slab, glued membrane 3, second layer micro-strip plate, glued membrane 3, second layer dielectric-slab ... n-th layer micro-strip plate, top board 1, show
It is intended to as shown in Figure 1.
Lower platen heats during providing support and unit formation needed for entire microstrip antenna；
Bottom plate provides microstrip antenna installation basis, mainly provides the strength and stiffness of its structure；
Micro-strip plate is mainly used for the electric property of antenna element, has circuit of etching etc. on general micro-strip plate；
Dielectric-slab is mainly used for providing the mutual isolation of micro-strip plate and the effect of structural support；
Glued membrane mainly provides the cementation between each adjacent layer, and glued membrane can ensure between each section in forming process
Bond uniformity；
Top board mainly provides the pressure of forming process needs and upper heating part.
Forming process：
1) according to the forming frock of 6 grade needs of the corresponding top board 1 of the microstrip antenna designs of design and lower platen；
2) lower platen generally provides the support and positioning of entire forming process.The positioning device includes 7 He of positioning pin
Location hole 8, the positioning pin 7 are fixed on bottom plate 5, and the location hole 8 is opened on micro-strip plate 2 and dielectric-slab 4, described
Positioning pin 7 passes through multilayer micro-strip plate and dielectric-slab to position it.
The positioning device sets two sets, including the first positioning device and the second positioning device, the first positioning dress
It puts and is set with the second positioning device axial symmetry.
The positioning device at least sets two sets, including the first positioning device, the second positioning device and third positioning dress
It puts, the bottom plate is rectangle, the first positioning device, and the positioning pin in the second positioning device and third positioning device is arranged on top plate
Vertex.
The position relationship between each layer is determined by the positioning pin on lower platen and each location hole, location hole generally uses
2, it can also be used 3 and multiple；
3) relationship in Fig. 1 is gradually laid with each layer, generally comprises sequence as bottom plate 5, glued membrane 3, micro-strip plate 2, glued membrane
3rd, dielectric-slab 4, glued membrane 3, micro-strip plate 2 etc..General microband antenna unit includes one layer of dielectric-slab and two layers of micro-strip plate, can not also wrap
Containing bottom plate, include multilayer acoustical panel or multilayer micro-strip plate.Generally glued membrane is equipped between every layer of dielectric-slab or micro-strip plate；
4) after laying, lower platen gradually applies pressure by external force to antenna, can be controlled according to the parameter of glued membrane
System applies stressed size and time.General course of exerting pressure is a slow process.Period lower platen and top board, which carry, to be added
Thermal, the purpose is to glued membrane between layers is dissolved.Also it can be placed after laying together with tooling entire antenna
The heating in the baking oven of temperature-controllable is so that glued membrane dissolves；
After glued membrane dissolves completely, stop heating until cooling down completely, detach top board, take out microstrip antenna, modify bottom
The forming process of microstrip antenna is completed in gap between plate and micro-strip plate, dielectric-slab.
In the present embodiment, microstrip antenna uses two layers of micro-strip plate, and two layers of microstrip antenna is most common in daily design
A kind of microstrip antenna, lower floor's micro-strip plate are mainly responsible for feed, and upper strata micro-strip plate couples for feeding, and centre is carried out using dielectric-slab
Isolation.Generally in order to which there be one layer of bottom plate in bottom easy for installation for structural support.Two layers of microstrip antenna is from top to bottom mainly by micro-
Band plate, dielectric-slab, micro-strip plate, bottom plate composition, when being molded between every two layers with the presence of one layer of glued membrane, structure diagram is as schemed
Shown in 2.
Design result：Base plate thickness 3mm, first layer micro-strip plate thickness 0.508mm, media plate thickness 1.5mm, the second layer are micro-
Band plate thickness 0.508mm.Use glued membrane 0.15mm, 80 DEG C of melting temperature.Microstrip antenna overall thickness is 5.516mm.It is laid with and completes
Thickness afterwards is 5.516+0.15+0.15+0.15=5.966mm (glued membrane does not dissolve).
Microstrip antenna forming process is as follows：
1) lower platen and positioning pin are installed, determine each layer of position relationship；
2) bottom plate is laid with, passes through the position of positioning pin positioning plate；
3) glued membrane being laid between bottom plate and first layer micro-strip plate, for bonding bottom plate and first layer micro-strip plate；
4) first layer micro-strip plate is laid with, and passes through and positions its position of finger setting；
5) glued membrane being laid between first layer micro-strip plate and dielectric-slab；
6) dielectric-slab is laid with, and passes through and positions its position of finger setting；
7) glued membrane being laid between dielectric-slab and second layer micro-strip plate；
8) second layer micro-strip plate is laid with, and passes through and positions its position of finger setting；
9) top board is installed, and the position of top board location hole and positioning pin is positioned；
10) top board is moved, the distance that distance pushes plate surface reaches 5.966mm；
11) top board lower platen is heated, temperature is started to step up from room temperature to 80 DEG C, every 5 minutes temperature liters
High 5 DEG C until temperature reaches 80 DEG C；
12) distance moved at 80 DEG C between top board and lower platen reaches 5.516mm, is kept for 10 minutes；
13) stop the heating of top board and lower platen, it is to be restored to top board is removed after room temperature, take out microstrip antenna list
Member；
14) hand finish is carried out to microstrip antenna surrounding.
So far, the making of two layers of microstrip antenna is completed, gives the making side of two layers of microstrip antenna in the present embodiment
Formula for multi-layer microstrip antenna, suitably increases the quantity of micro-strip plate and dielectric-slab according to actual needs, micro-strip plate and dielectric-slab it
Between be bonded using glued membrane.
Obviously, the above embodiment of the present invention be only to clearly illustrate example of the present invention, and not be pair
The restriction of embodiments of the present invention for those of ordinary skill in the art, may be used also on the basis of the above description
To make other variations or changes in different ways, all embodiments can not be exhaustive here, it is every to belong to this hair
The obvious changes or variations that bright technical solution is extended out are still in the row of protection scope of the present invention.
Claims (6)
1. a kind of microstrip antenna, which is characterized in that including bottom plate, the multilayer micro-strip plate being arranged on bottom plate, dielectric-slab and positioning
Device, the dielectric-slab and micro-strip plate be alternate to be set and Nian Jie using glued membrane, the positioning device be used to fixing micro-strip plate with
The position of dielectric-slab；
The micro-strip plate includes at least first layer micro-strip plate and second layer micro-strip plate, and the first layer micro-strip plate is arranged on bottom plate
On, the dielectric-slab includes first layer dielectric-slab, first layer is set to be situated between the first layer micro-strip plate and second layer micro-strip plate
Scutum, the first layer micro-strip plate is Nian Jie using glued membrane with first layer dielectric-slab, the first layer dielectric-slab and second layer micro-strip
Plate is bonded using glued membrane.
2. a kind of microstrip antenna according to claim 1, which is characterized in that the micro-strip plate further includes third layer micro-strip plate,
The dielectric-slab further includes second layer dielectric-slab, and the second layer dielectric-slab is arranged on second layer micro-strip plate, described
Third layer micro-strip plate is Nian Jie using glued membrane with second layer micro-strip plate.
3. a kind of microstrip antenna according to claim 1 or 2, which is characterized in that the positioning device includes location hole
And positioning pin, the positioning pin are fixed on bottom plate, the location hole is opened on micro-strip plate and dielectric-slab, the positioning
Pin positions it across multilayer micro-strip plate and dielectric-slab.
4. a kind of microstrip antenna according to claim 3, which is characterized in that the positioning device sets two sets, including
First positioning device and the second positioning device, first positioning device are set with the second positioning device axial symmetry.
5. a kind of microstrip antenna according to claim 3, which is characterized in that the positioning device at least sets two sets,
Including the first positioning device, the second positioning device and third positioning device, the micro-strip plate, dielectric-slab are set as rectangular slab, the
The location hole of one positioning device, the second positioning device and third positioning device is arranged on the vertex of plate, and positioning pin corresponds to positioning
Hole is arranged on bottom plate.
6. a kind of microstrip antenna according to claim 1, which is characterized in that 80 DEG C of the glued membrane melting temperature is carrying out
Thickness before heating is 0.15mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711319314.8A CN108155455A (en) | 2017-12-12 | 2017-12-12 | A kind of microstrip antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711319314.8A CN108155455A (en) | 2017-12-12 | 2017-12-12 | A kind of microstrip antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108155455A true CN108155455A (en) | 2018-06-12 |
Family
ID=62467088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711319314.8A Pending CN108155455A (en) | 2017-12-12 | 2017-12-12 | A kind of microstrip antenna |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108155455A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112558016A (en) * | 2020-12-10 | 2021-03-26 | 中国电子科技集团公司第三十八研究所 | Radar receiving and transmitting system adopting multilayer microstrip connection |
| EP3955381A1 (en) * | 2020-08-12 | 2022-02-16 | Rohde & Schwarz GmbH & Co. KG | Mounting gauge, system for assembling an antenna and method of assembling an antenna |
| TWI821812B (en) * | 2021-12-06 | 2023-11-11 | 和碩聯合科技股份有限公司 | Electronic device |
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| US20020109633A1 (en) * | 2001-02-14 | 2002-08-15 | Steven Ow | Low cost microstrip antenna |
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2017
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|---|---|---|---|---|
| US20020109633A1 (en) * | 2001-02-14 | 2002-08-15 | Steven Ow | Low cost microstrip antenna |
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| CN103050453A (en) * | 2012-12-28 | 2013-04-17 | 成都泰格微电子研究所有限责任公司 | Surface mount microwave device and packaging process thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3955381A1 (en) * | 2020-08-12 | 2022-02-16 | Rohde & Schwarz GmbH & Co. KG | Mounting gauge, system for assembling an antenna and method of assembling an antenna |
| CN112558016A (en) * | 2020-12-10 | 2021-03-26 | 中国电子科技集团公司第三十八研究所 | Radar receiving and transmitting system adopting multilayer microstrip connection |
| TWI821812B (en) * | 2021-12-06 | 2023-11-11 | 和碩聯合科技股份有限公司 | Electronic device |
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Application publication date: 20180612 |