CN103050453A - Surface mount microwave device and packaging process thereof - Google Patents
Surface mount microwave device and packaging process thereof Download PDFInfo
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- CN103050453A CN103050453A CN2012105827308A CN201210582730A CN103050453A CN 103050453 A CN103050453 A CN 103050453A CN 2012105827308 A CN2012105827308 A CN 2012105827308A CN 201210582730 A CN201210582730 A CN 201210582730A CN 103050453 A CN103050453 A CN 103050453A
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- copper foil
- microwave device
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- surface mount
- pcb board
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Abstract
The invention discloses a surface mount microwave device. Copper foil layers (4) and copper foil circuit layers (5) are symmetrically arranged between cover plates and a central medium material layer (3). Medium material layers (6) are arranged between the copper foil layers (4) and the copper foil circuit layers (5). Press-fitting glue film layers (7) for press-fitting are arranged between the copper foil circuit layers (5) and the medium material layers (6). A packaging process comprises the following steps of: tin paste printing, automatic mounting, curing, reflow soldering and cleaning to complete packaging. Since a strip line structure is used instead of a microstrip line and a copper foil circuit line in the strip line is in a folded and multilayer structure, the effective dielectric constant of the circuit is improved and the size of the microwave device is greatly reduced; and since a surface mount packaging method is adopted, slots for installation are not needed to be excavated in a printed circuit board and a chamber body, the printed circuit board is directly installed, the surface mounting is realized, the design and the realization of a microstrip circuit and a microstrip system are facilitated and optimized, the applicability is greatly increased and the application scope is wider.
Description
Technical field
The present invention relates to a kind of surface mount microwave device and packaging technology thereof.
Background technology
Along with the development of microwave technology, the design of microstrip circuit and system progressively becomes design and the application of transmission line, monolithic integrated microwave circuit and microwave passive circuit.But in present many designs, microwave device all can't directly be mounted on the surface of printed circuit board, the engineer has to directly design passive circuit or circuit design is become a lot of modules on microstrip line, then adopt the mode of coaxial connection, but these modes cause equipment volume huge, debugging task is miscellaneous, is unfavorable for the batch production of product, and can not bring into play the strong point of monolithic integrated microwave circuit.
Traditional microwave device adopts the microstrip line construction of individual layer, and the effective dielectric constant of circuit is lower, and small product size is larger, can't satisfy the surface-pasted miniaturization demand of microwave device.
Therefore, research and development can adapt, satisfy with monolithic integrated microwave circuit the microwave device that surface mount requires, so that microwave device can directly use on microwave printed board, the reduction system volume improves product and criticizes production capacity, is the present task of top priority.
Existing microwave device packaged type mainly comprises following two kinds: the packaged type that adopts the screw thread spinning between (1) microwave device and the pcb board; (2) packaged type of employing punching press embedding between microwave device and the pcb board.When using screw thread spinning packaged type, all need machining screw on microwave device and the pcb board, increased difficulty of processing and cost.When using punching press embedding packaged type, need special pressing equipment just can finish, increased packaging cost, and can't take apart and ressemble or keep in repair.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, provide a kind of and replace microstrip line with the band line structure, copper foil circuit line in the strip line adopts folding and sandwich construction, can improve the circuit effective dielectric constant, dwindle the miniaturization surface mount microwave device that can directly be affixed on the pcb board surface of microwave device volume; And a kind of method for packing that the surface mount microwave device is mounted on the pcb board is simple, and packaging density is high, small product size is little, lightweight, and reliability is high, the welding point defect rate is low, high frequency characteristics is good, becomes frequency high, the surface mount microwave device packaging technology that packaging efficiency is high.
The objective of the invention is to be achieved through the following technical solutions: the surface mount microwave device, it comprises upper cover plate, lower cover and central layer of dielectric material, between upper cover plate and the central layer of dielectric material, all be symmetrically arranged with copper foil layer and copper foil circuit layer between lower cover and the central layer of dielectric material, copper foil layer is located at a side of upper and lower cover plate, the copper foil circuit layer is arranged at a side of central layer of dielectric material, also be provided with layer of dielectric material between copper foil layer and the copper foil circuit layer, be provided with the pressing adhesive film for pressing between copper foil circuit layer and the layer of dielectric material.
Preferably, the copper foil circuit line in the copper foil circuit layer adopts strip lines configuration.Further, the copper foil circuit line in the copper foil circuit layer adopts the strip lines configuration of folding and multilayer.
The surface mount microwave device also comprises rivet, corresponding position is equipped with the rivet hole that matches with rivet on described upper cover plate, lower cover, central layer of dielectric material, copper foil layer, copper foil circuit layer, layer of dielectric material and the pressing adhesive film, and rivet passes successively rivet hole each lamination of surface mount microwave device is combined.Preferably, the quantity of rivet is two or four.
The packaging technology of surface mount microwave device, it may further comprise the steps:
S1: paste solder printing: the circuit board that will print is fixed on the printing positioning table, by the left and right sides scraper of printing machine tin cream or red glue is bitten on the pad of correspondence by steel mesh;
S2: automatic chip mounting: input to and carry out automatic chip mounting on the chip mounter by the band to band transfer module uniform pcb board of will biting, flat microwave device is directly installed on the pcb board, the signal welding position directly is connected on the holding wire of pcb board, and the ground connection welding position is by the ground metallization hole ground connection of pcb board;
S3: solidify: the pcb board that will finish paster is sent in the curing oven and is cured, and Heraeus is melted, and microwave device and pcb board are bonded together;
S4: reflow soldering: will finish pcb board after the curing and send into and carry out reflow soldering in the reflow soldering, soldering paste is melted, microwave device and pcb board are further bonded together;
S5: clean, finish encapsulation.
The step of automatic chip mounting comprises following substep:
S201: advance plate, the uniform pcb board of will biting is put into automatic placement machine;
S202: self study PCBMark;
S203: select suction nozzle;
S204: select feed appliance;
S205: vision centering;
S206: mount microwave device;
S207: suction nozzle is put back to the suction nozzle seat;
S208: finish paster, take out pcb board.
The invention has the beneficial effects as follows:
1) the surface mount microwave device is taked the multiple stratification design, replaces microstrip line with the band line structure, and the copper foil circuit line in the strip line adopts folding and sandwich construction, has improved the circuit effective dielectric constant, has greatly dwindled the microwave device volume;
2) the surface mount microwave device is taked strip lines configuration, has realized the elimination of distributed constant, and is lower than the loss of traditional lumped parameter surface mount passive circuit, isolation is high, standing wave is little, has improved systematic function;
3) adopt surface-pasted method for packing, need not to carry out the grooving installation in printed board and cavity, but directly install in the printed board, realized surface mount, make things convenient for and optimized design and the realization of microstrip circuit and system, and its application is increased greatly, application is more extensive;
4) also to have a method for packing simple for this packaging technology, and packaging density is high, small product size is little, lightweight, and reliability is high, and the welding point defect rate is low, and high frequency characteristics is good, becomes frequency high, the packaging efficiency high.
Description of drawings
Fig. 1 is the hierarchy schematic diagram of surface mount microwave device;
Fig. 2 is the packaging technology flow chart of surface mount microwave device;
Fig. 3 is the operational flowchart of automatic chip mounting step;
Among the figure, 1-upper cover plate, 2-lower cover, 3-central authorities layer of dielectric material, 4-copper foil layer, 5-copper foil circuit layer, 6-layer of dielectric material, 7-pressing adhesive film, 8-rivet.
Embodiment
Below in conjunction with accompanying drawing technical scheme of the present invention is described in further detail, but protection scope of the present invention is not limited to the following stated.
As shown in Figure 1, the surface mount microwave device, it comprises upper cover plate 1, lower cover 2 and central layer of dielectric material 3, between upper cover plate 1 and the central layer of dielectric material 3, all be symmetrically arranged with copper foil layer 4 and copper foil circuit layer 5 between lower cover 2 and the central layer of dielectric material 3, copper foil layer 4 is located at a side of upper and lower cover plate, copper foil circuit layer 5 is arranged at a side of central layer of dielectric material 3, also be provided with layer of dielectric material 6 between copper foil layer 4 and the copper foil circuit layer 5, be provided with the pressing adhesive film 7 for pressing between copper foil circuit layer 5 and the layer of dielectric material 6.
Copper foil circuit line in the copper foil circuit layer 5 adopts strip lines configuration, and the copper foil circuit line in the copper foil circuit layer 5 adopts the strip lines configuration of folding and multilayer.
The surface mount microwave device also comprises rivet 8, corresponding position is equipped with the rivet hole that matches with rivet 8 on described upper cover plate 1, lower cover 2, central layer of dielectric material 3, copper foil layer 4, copper foil circuit layer 5, layer of dielectric material 6 and the pressing adhesive film 7, and rivet 8 passes successively rivet hole each lamination of surface mount microwave device is combined.
Preferably, the quantity of rivet 8 is two or four.
The packaging technology of surface mount microwave device, it may further comprise the steps:
S1: paste solder printing: the circuit board that will print is fixed on the printing positioning table, by the left and right sides scraper of printing machine tin cream or red glue is bitten on the pad of correspondence by steel mesh;
S2: automatic chip mounting: input to and carry out automatic chip mounting on the chip mounter by the band to band transfer module uniform pcb board of will biting, flat microwave device is directly installed on the pcb board, the signal welding position directly is connected on the holding wire of pcb board, and the ground connection welding position is by the ground metallization hole ground connection of pcb board;
S3: solidify: the pcb board that will finish paster is sent in the curing oven and is cured, and Heraeus is melted, and microwave device and pcb board are bonded together;
S4: reflow soldering: will finish pcb board after the curing and send into and carry out reflow soldering in the reflow soldering, soldering paste is melted, microwave device and pcb board are further bonded together;
S5: clean, finish encapsulation.
The step of automatic chip mounting comprises following substep:
S201: advance plate, the uniform pcb board of will biting is put into automatic placement machine;
S202: self study PCBMark;
S203: select suction nozzle;
S204: select feed appliance;
S205: vision centering;
S206: mount microwave device;
S207: suction nozzle is put back to the suction nozzle seat;
S208: finish paster, take out pcb board.
Compare with Embedded multilayer circuit, surface-pasted microwave device need not to carry out the grooving installation in printed board and cavity, but directly installs on the printed board.Even now has reduced the power bearing ability of device, but surface-pasted packaged type so that it can use in more wide field and use, so the embedded multi-layer circuit usually is applied in power and uses as synthesis unit in synthetic, and the surface mount microwave device is orientated the middle low power product as, comprise power splitter, coupler, electric bridge, the part filter, Ba Lun, frequency mixer (IQ modulator and IQ demodulator) etc., use occasion also can expand to receiver, solid state power amplifier and transmitter front ends allocation units, the less demanding power of power bearing ability is synthetic terminal, all microwave applications backgrounds such as frequency synthesizer.
Claims (7)
1. surface mount microwave device, it comprises upper cover plate (1), lower cover (2) and central layer of dielectric material (3), it is characterized in that: between upper cover plate (1) and the central layer of dielectric material (3), all be symmetrically arranged with copper foil layer (4) and copper foil circuit layer (5) between lower cover (2) and the central layer of dielectric material (3), copper foil layer (4) is located at, one side of lower cover, copper foil circuit layer (5) is arranged at a side of central layer of dielectric material (3), also be provided with layer of dielectric material (6) between copper foil layer (4) and the copper foil circuit layer (5), be provided with the pressing adhesive film (7) for pressing between copper foil circuit layer (5) and the layer of dielectric material (6).
2. surface mount microwave device according to claim 1 is characterized in that: the copper foil circuit line employing strip lines configuration in the described copper foil circuit layer (5).
3. surface mount microwave device according to claim 2 is characterized in that: the copper foil circuit line in the described copper foil circuit layer (5) adopts the strip lines configuration of folding and multilayer.
4. surface mount microwave device according to claim 1, it is characterized in that: it also comprises rivet (8), the upper corresponding position of described upper cover plate (1), lower cover (2), central layer of dielectric material (3), copper foil layer (4), copper foil circuit layer (5), layer of dielectric material (6) and pressing adhesive film (7) is equipped with the rivet hole that matches with rivet (8), and rivet (8) passes successively rivet hole each lamination of surface mount microwave device is combined.
5. surface mount microwave device according to claim 4, it is characterized in that: the quantity of described rivet (8) is two or four.
6. the packaging technology of surface mount microwave device, it is characterized in that: it may further comprise the steps:
S1: paste solder printing: the circuit board that will print is fixed on the printing positioning table, by the left and right sides scraper of printing machine tin cream or red glue is bitten on the pad of correspondence by steel mesh;
S2: automatic chip mounting: input to and carry out automatic chip mounting on the chip mounter by the band to band transfer module uniform pcb board of will biting, flat microwave device is directly installed on the pcb board, the signal welding position directly is connected on the holding wire of pcb board, and the ground connection welding position is by the ground metallization hole ground connection of pcb board;
S3: solidify: the pcb board that will finish paster is sent in the curing oven and is cured, and Heraeus is melted, and microwave device and pcb board are bonded together;
S4: reflow soldering: will finish pcb board after the curing and send into and carry out reflow soldering in the reflow soldering, soldering paste is melted, microwave device and pcb board are further bonded together;
S5: clean, finish encapsulation.
7. the packaging technology of surface mount microwave device according to claim 6, it is characterized in that: the step of described automatic chip mounting comprises following substep:
S201: advance plate, the uniform pcb board of will biting is put into automatic placement machine;
S202: self study PCBMark;
S203: select suction nozzle;
S204: select feed appliance;
S205: vision centering;
S206: mount microwave device;
S207: suction nozzle is put back to the suction nozzle seat;
S208: finish paster, take out pcb board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210582730.8A CN103050453B (en) | 2012-12-28 | 2012-12-28 | Surface mount microwave device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210582730.8A CN103050453B (en) | 2012-12-28 | 2012-12-28 | Surface mount microwave device |
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| CN103050453A true CN103050453A (en) | 2013-04-17 |
| CN103050453B CN103050453B (en) | 2015-04-15 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103317203A (en) * | 2013-06-20 | 2013-09-25 | 成都九洲迪飞科技有限责任公司 | Welding technology for microwave substrate |
| CN103433171A (en) * | 2013-08-30 | 2013-12-11 | 深圳创维－Rgb电子有限公司 | Device and method for coating adhesion agents on bonding pads of PCB (printed circuit board) of LED (light-emitting diode) area light source |
| CN105099370A (en) * | 2015-08-12 | 2015-11-25 | 安徽华东光电技术研究所 | Pre-frequency mixer processing method |
| CN106332470A (en) * | 2016-08-31 | 2017-01-11 | 河源西普电子有限公司 | SMD technique |
| CN108155455A (en) * | 2017-12-12 | 2018-06-12 | 北京无线电测量研究所 | A kind of microstrip antenna |
| CN109104826A (en) * | 2018-06-14 | 2018-12-28 | 安徽华东光电技术研究所有限公司 | A kind of manufacture craft of multiple-frequency modulation device |
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| US20020008599A1 (en) * | 2000-06-09 | 2002-01-24 | Mahadevan Sridharan | Multi-layer microwave circuits and methods of manufacture |
| EP1923950A1 (en) * | 2006-11-17 | 2008-05-21 | Siemens S.p.A. | SMT enabled microwave package with waveguide interface |
| CN101932195A (en) * | 2010-09-28 | 2010-12-29 | 天津三星电子显示器有限公司 | Method for realizing integration of printed circuit boards of monitor |
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2012
- 2012-12-28 CN CN201210582730.8A patent/CN103050453B/en active Active
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| US20020008599A1 (en) * | 2000-06-09 | 2002-01-24 | Mahadevan Sridharan | Multi-layer microwave circuits and methods of manufacture |
| EP1923950A1 (en) * | 2006-11-17 | 2008-05-21 | Siemens S.p.A. | SMT enabled microwave package with waveguide interface |
| CN101932195A (en) * | 2010-09-28 | 2010-12-29 | 天津三星电子显示器有限公司 | Method for realizing integration of printed circuit boards of monitor |
Non-Patent Citations (1)
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103317203A (en) * | 2013-06-20 | 2013-09-25 | 成都九洲迪飞科技有限责任公司 | Welding technology for microwave substrate |
| CN103433171A (en) * | 2013-08-30 | 2013-12-11 | 深圳创维－Rgb电子有限公司 | Device and method for coating adhesion agents on bonding pads of PCB (printed circuit board) of LED (light-emitting diode) area light source |
| CN105099370A (en) * | 2015-08-12 | 2015-11-25 | 安徽华东光电技术研究所 | Pre-frequency mixer processing method |
| CN106332470A (en) * | 2016-08-31 | 2017-01-11 | 河源西普电子有限公司 | SMD technique |
| CN108155455A (en) * | 2017-12-12 | 2018-06-12 | 北京无线电测量研究所 | A kind of microstrip antenna |
| CN109104826A (en) * | 2018-06-14 | 2018-12-28 | 安徽华东光电技术研究所有限公司 | A kind of manufacture craft of multiple-frequency modulation device |
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| CN103050453B (en) | 2015-04-15 |
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