CN107612226B - Surface mounting structure, surface mounting method, motor and surface mounting chip - Google Patents
Surface mounting structure, surface mounting method, motor and surface mounting chip Download PDFInfo
- Publication number
- CN107612226B CN107612226B CN201711050892.6A CN201711050892A CN107612226B CN 107612226 B CN107612226 B CN 107612226B CN 201711050892 A CN201711050892 A CN 201711050892A CN 107612226 B CN107612226 B CN 107612226B
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- chip
- circuit board
- printed circuit
- sensor chip
- sensor
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- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000004804 winding Methods 0.000 claims description 19
- 241000272168 Laridae Species 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 23
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 16
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 16
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- AGCPZMJBXSCWQY-UHFFFAOYSA-N 1,1,2,3,4-pentachlorobutane Chemical compound ClCC(Cl)C(Cl)C(Cl)Cl AGCPZMJBXSCWQY-UHFFFAOYSA-N 0.000 description 1
- 230000005355 Hall effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/20—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for measuring, monitoring, testing, protecting or switching
- H02K11/21—Devices for sensing speed or position, or actuated thereby
- H02K11/215—Magnetic effect devices, e.g. Hall-effect or magneto-resistive elements
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
Abstract
The invention discloses a surface mounting structure, a surface mounting method, a motor and a surface mounting chip, which are used for reducing the thickness of a printed circuit board, reducing the production cost, simplifying the manufacturing process and prolonging the service life. The surface mounting structure includes: the printed circuit board is provided with a hole, and a first surface of the printed circuit board is provided with a circuit layer; the sensor chip comprises a chip body packaged with a sensor element and pins led out from the chip body, wherein the chip body is positioned in the hole, the sensor element faces to the second surface of the printed circuit board, and the pins are connected with the circuit layer.
Description
Technical Field
The invention relates to the technical field of surface mounting, in particular to a surface mounting structure, a surface mounting method, a motor and a surface mounting chip.
Background
Sensor chips such as Hall chips are arranged in motors of electrical equipment such as air conditioners, electric fans and electric vehicles. As shown in fig. 1a, 1b, 2a and 2b, most of the sensor chips, such as the hall chip 03, currently adopt a package form of SOP (Small Out-LINE PACKAGE, small outline package), and the number of pins 031 is typically 8 to 44. Inside the motor, a first surface 01a of the PCB (Printed Circuit Board ) is provided with stator connection pads 012 and a plurality of electrical components 02, a second surface 01b of the PCB is SMT (Surface Mount Technology ), and a plurality of hall chips 03 are mounted forward according to a set distribution, that is, hall elements 003 packaged in the hall chips 03 shown in fig. 1a are disposed opposite to the PCB 01. The stator 04 is fixed to the second face 01b of the PCB and the terminals 043 of the stator windings 042 are connected to the stator connection pads 012 of the first face 01a of the PCB. The hall chip 03 is connected to the power supply circuit of the stator winding 042.
When the rotor (not shown) passes near a certain hall chip, the hall chip outputs a voltage due to the hall effect to conduct a power supply circuit of the stator winding 042, so as to supply power to the stator winding 042, so that the stator winding 042 generates a magnetic field with the same polarity as that of the rotor, and the rotor is repelled to continue rotating. When the rotor passes near the next Hall chip, the Hall chip works to supply power to the stator winding 042, so that the rotor is repelled to continue to rotate, and the previous Hall chip stops working; the motor is kept in a working state by the circulation.
The defects of the prior art are that the second surface 01b of the PCB needs to be provided with the Hall chip 03, so that the second surface 01b of the PCB needs to be provided with related circuits and bonding pads, thereby leading to larger thickness of the PCB01, higher production cost and complex production process; in addition, the hall chip 03 is disposed on the second surface 01b of the PCB, and the PCB01 needs to be soldered twice in a reflow oven, so that the service life of the PCB01 is not ideal.
Disclosure of Invention
The embodiment of the invention aims to provide a surface mounting structure, a surface mounting method, a motor and a surface mounting chip, so as to reduce the thickness of a PCB, reduce the production cost, simplify the manufacturing process and prolong the service life of the PCB.
The embodiment of the invention provides a surface mounting structure, which comprises the following components:
the PCB is provided with a hole, and a first surface of the PCB is provided with a circuit layer;
The sensor chip comprises a chip body packaged with a sensor element and pins led out from the chip body, wherein the chip body is positioned in the hole, the sensor element faces to the second surface of the PCB, and the pins are connected with the circuit layer.
Optionally, the hole is located in an inner region of the PCB, or the hole is located at an edge of the PCB.
Optionally, the first surface of the printed circuit board is further provided with a chip connection pad which is located at the edge of the hole and connected with the circuit layer; the pins of the sensor chip are connected with the chip connection pads.
Optionally, the pins are flat pins.
Preferably, the length of the flat pin is 1+/-0.2 mm.
Preferably, the chip body is in clearance fit with the hole.
Optionally, the pin is a gull pin, and includes a lead-out section located in the hole, and a connection section extending to the first surface of the printed circuit board.
Preferably, the length of the connecting section is 1+/-0.2 mm.
Optionally, the surface mount structure is applied to a motor, and a stator of the motor is fixed on the second surface of the PCB; the first surface of the PCB is provided with a stator connecting pad connected with the circuit layer;
The stator comprises a stator magnetic core and a stator winding wound on the stator magnetic core, a terminal of the stator winding is connected with the stator connecting pad, and the stator winding comprises a plurality of groups of coils distributed in a circumference manner; the number of the holes is at least two, each hole is positioned between two adjacent groups of coils, and one sensor chip is correspondingly arranged at each hole.
Optionally, the sensor chip is an SOP sensor chip, a TSOP sensor chip, a QFP sensor chip, a TQFP sensor chip, or an SOIC sensor chip.
By adopting the surface mounting structure of the embodiment of the invention, the sensor chip is mounted on the first surface of the PCB, and the chip body of the sensor chip is arranged in the hole, and by adopting the design, the second surface of the PCB does not need to be provided with a circuit layer and a bonding pad for the sensor chip.
The embodiment of the invention also provides a motor, which comprises the surface mounting structure according to any one of the technical schemes. The PCB of the motor of the embodiment has small thickness, low production cost, simple production process and longer service life of the PCB, so that the motor has better working reliability.
The embodiment of the invention also provides a surface mounting chip applied to the surface mounting structure, which comprises a chip body packaged with the sensor element and flat pin led out from the chip body.
Preferably, the length of the flat pin is 1+/-0.2 mm.
The surface mounting structure adopts the surface mounting chip of the design, the thickness of the PCB is small, the production cost is low, the production process is simple, and the service life of the PCB is longer.
The embodiment of the invention also provides a surface mounting method applied to the surface mounting structure, which comprises the following steps: attaching a sensor chip to the hole of the PCB from the first surface of the PCB; the sensor chip comprises a chip body, a sensor element and a circuit layer, wherein the chip body of the sensor chip is arranged in the hole, the sensor element of the chip body faces to the second surface of the PCB, and pins of the sensor chip are connected with the circuit layer on the first surface of the PCB.
By adopting the surface mounting method of the embodiment, the process is simple, the production cost is lower, and the service life of the PCB is longer because the furnace passing times of the PCB are reduced.
Drawings
FIG. 1a is a front view of a prior art Hall chip and PCB surface mount;
FIG. 1b is a top view of a prior art Hall chip;
FIG. 2a is a schematic diagram of a front structure of a prior art PCB;
FIG. 2b is a schematic diagram of a prior art PCB backside structure;
FIG. 3a is a schematic front view of a surface mount structure according to an embodiment of the present invention;
FIG. 3b is a schematic back view of a surface mount structure according to an embodiment of the present invention;
FIG. 4a is a front view of a sensor chip and PCB surface mount according to an embodiment of the present invention;
FIG. 4b is a top view of a sensor chip according to an embodiment of the invention;
Fig. 5 is a front view of a sensor chip and PCB surface mount according to another embodiment of the present invention.
Reference numerals:
The prior art part:
01-PCB;01 a-a first side of the PCB;01 b-a second side of the PCB; 012-stator connection pads;
02-electrical parts; 03-a hall chip; 04-stator; 042-stator windings; 043-terminals;
003-hall element; 031-pins.
The embodiment part of the invention comprises the following steps:
1-a PCB; 10-digging holes; 2-electrical parts; 11-chip connection pads; 3-a sensor chip;
300-sensor element; 30-chip body; 31-pins; 1 a-a first side of the PCB; 420-coil;
1 b-a second side of the PCB; 311-leading-out section; 312-connecting segments; 4-stator; 12-stator connection pads;
41-stator core; 43-terminals.
Detailed Description
In order to reduce the thickness of a PCB, reduce the production cost, simplify the manufacturing process and prolong the service life of the PCB, the embodiment of the invention provides a surface mounting structure, a surface mounting method, a motor and a surface mounting chip. The present invention will be further described in detail with reference to the following examples, in order to make the objects, technical solutions and advantages of the present invention more apparent.
As shown in fig. 3a, 3b, 4a and 4b, the surface mount structure according to an embodiment of the present invention includes:
A PCB 1 having a hole 10, a first face 1a of the PCB 1 being provided with a wiring layer (not shown in the drawings);
The sensor chip 3 includes a chip body 30 in which the sensor element 300 is encapsulated, and pins 31 led out from the chip body 30, the chip body 30 is located in the hole 10, the sensor element 300 faces the second face of the PCB1, and the pins 31 are connected with the wiring layer.
As shown in fig. 3a, the first side 1a of the PCB is typically provided with electrical components 2, such as diodes, which side is also typically referred to as the front side of the PCB 1, and the second side 1b of the PCB is correspondingly referred to as the back side of the PCB 1. The sensor chip 3 is mounted from the first side 1a of the PCB at the hole 10 of the PCB 1, as shown in fig. 3b and 4a, with the sensor element 3 facing the second side 1b of the PCB, in a direction opposite to the mounting direction of the prior art, also called reverse mounting.
With continued reference to fig. 3a, in this embodiment, the first surface 1a of the PCB is further provided with a chip connection pad 11 located at the edge of the hole 10 and connected to the circuit layer; the pins 31 of the sensor chip 3 are connected to the chip connection pads 11, i.e. the pins 31 are connected to the wiring layer via the chip connection pads 11.
In the embodiment of the present invention, the sensor chip 3 may be a hall chip or other sensor chip. The specific Package type of the sensor chip 3 is not limited, and may be, for example, an SOP sensor chip, a TSOP (THIN SMALL Outline Package), a QFP (Quad flat Package) sensor chip, a TQFP (Thin Quad flat Package) sensor chip, an SOIC (Small Outline Integrated Circuit Package ) sensor chip, or the like. The specific package type of the sensor chip 3 may vary, as may the number of pins 31.
The particular number of holes 10 in the present embodiment is not limited and may be one, two or more. As shown in fig. 3a, when there are at least two holes 10, the number of sensor chips is set correspondingly, and one sensor chip 3 is set correspondingly at each hole 10.
In the embodiment of the present invention, the specific distribution position of the holes 10 is not limited, and may be designed according to the specific wiring of the circuit layer and the product of the specific application of the PCB 1. In an alternative embodiment of the invention, the hole 10 in the PCB 1 is located in the inner region. To facilitate the routing of the wiring layers, in the preferred embodiment of the present invention, the hollowed-out holes 10 are located at the edge of the PCB 1, as shown in fig. 3a and 3 b.
According to the surface mounting structure of the embodiment of the invention, the sensor chip 3 is mounted on the first surface 1a of the PCB, and the chip body 30 of the sensor chip 3 is arranged in the hole 10, and by adopting the design, the second surface 1b of the PCB does not need to be provided with a circuit layer and a bonding pad for the sensor chip 3, compared with the prior art, the thickness of the PCB 1 is reduced, the production cost is reduced, the manufacturing process is simplified, and the sensor chip 3 is mounted on the first surface 1a of the PCB and is positioned on the same side with the circuit layer, so that the structure of the first surface 1a of the PCB is only required to be subjected to furnace reflow, the furnace passing times in the PCB 1 manufacturing process are reduced, and the service life of the PCB 1 is prolonged.
As shown in fig. 3a and 3b, in this embodiment of the present invention, the surface mount structure is applied to a motor, and a stator 4 of the motor is fixed to a second face 1b of the PCB; the first face 1a of the PCB is provided with stator connection pads 12 connected to the circuit layer; the stator 4 comprises a stator magnetic core 41 and a stator winding wound on the stator magnetic core 41, a terminal 43 of the stator winding is connected with the stator connecting pad 12, and the stator winding comprises a plurality of groups of coils 420 distributed in a circumference manner; at least two holes 10 are provided, each hole 10 is located between two adjacent groups of coils 420, and a sensor chip 3 is correspondingly arranged at each hole 10. When the sensor chip 3 is a hall chip, the working principle of the motor is similar to that of the prior art, and the description thereof will not be repeated here.
It should be noted that the surface mount structure of the above embodiment may be applied to various products in which the sensor chip 3 is required to be disposed opposite to the front surface of the PCB 1, and is not limited to the application in the motor, and the specific shape and structural design of the PCB 1 are not limited.
In an alternative embodiment of the present invention, as shown in fig. 4a, pins 31 are flat pins and die body 30 is clearance fit with hole 10. Specifically, in this embodiment, the flat pin is soldered to the die attach pad 11 on the first side 1a of the PCB. When the sensor chip 3 is attached to the first surface 1a of the PCB, the hole 10 can be used for positioning the sensor chip 3, so that the assembly operation is facilitated, and the processing and manufacturing of the sensor chip 3 are also facilitated by adopting the structural design of the flat pin. Preferably, the length C of the flat pin is designed to be 1+/-0.2 mm, so that the flat pin is convenient to weld with the chip connecting bonding pad 11, and the welding reliability is good.
In another alternative embodiment of the invention, shown in fig. 5, pin 31 is a gull-leg pin, including a lead-out section 311 located within the cutout 10, and a connection section 312 extending to the first face 1a of the PCB. Because the packaging structure of the sensor chip commonly used at present adopts the gull foot pin, the pin can be manufactured by using the existing rib cutting die, thereby saving the equipment cost. In a preferred embodiment, the length A of the connection section 312 is designed to be 1.+ -. 0.2mm in order to facilitate soldering with the chip connection pad 11 and ensure soldering reliability.
The embodiment of the invention also provides a motor, which comprises the surface mounting structure of any one of the technical schemes. Referring to fig. 3b, the stator 4 of the motor is fixed to the second face 1b of the PCB; the first face 1a of the PCB is provided with stator connection pads 12 connected to the circuit layer; the stator 4 comprises a stator magnetic core 41 and a stator winding wound on the stator magnetic core 41, a terminal 43 of the stator winding is connected with the stator connecting pad 12, and the stator winding comprises a plurality of groups of coils 420 distributed in a circumference manner; at least two holes 10 are provided, each hole 10 is located between two adjacent groups of coils 420, and a sensor chip 3 is correspondingly arranged at each hole 10. The PCB 1 of the motor of the embodiment has small thickness, low production cost, simple production process and longer service life of the PCB 1, so that the motor has better working reliability.
Referring to fig. 4a and 4b, the embodiment of the present invention further provides a surface mount chip 3 applied to the foregoing surface mount structure, which includes a chip body 30 in which the sensor element 300 is packaged, and pins 31 led out from the chip body 30, where the pins 31 are flat pins.
The surface mounting structure adopts the designed surface mounting chip, the thickness of the PCB is small, the production cost is low, the production process is simple, the service life of the PCB is longer, and the structural design of the flat pin is also convenient for processing and manufacturing the sensor chip. In a preferred embodiment, the length C of the flat pin is designed to be 1+/-0.2 mm, so that the flat pin is convenient to weld with a chip connecting pad, and the welding reliability is good.
Referring to fig. 4a, the embodiment of the present invention further provides a surface mounting method applied to the surface mounting structure, which includes the following steps: attaching the sensor chip 3 from the first face 1a of the PCB to the hole 10 of the PCB 1; wherein, the chip body 30 of the sensor chip 3 is disposed in the hole 10 and the sensor element 300 of the chip body 30 faces the second surface 1b of the PCB, and the pins 31 of the sensor chip 3 are connected with the circuit layer of the first surface 1a of the PCB.
By adopting the surface mounting method of the embodiment, the process is simple, the production cost is lower, and the service life of the PCB is longer because the furnace passing times of the PCB are reduced.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (10)
1. A surface mount structure, characterized in that the surface mount structure is applied to a motor, comprising:
The printed circuit board is provided with a hole, a circuit layer and a stator connecting pad connected with the circuit layer are arranged on the first surface of the printed circuit board; the stator of the motor is fixed on the second surface of the printed circuit board; the stator comprises a stator magnetic core and a stator winding wound on the stator magnetic core, a terminal of the stator winding is connected with the stator connecting pad, and the stator winding comprises a plurality of groups of coils distributed in a circumference manner; the number of the digging holes is at least two, and each digging hole is positioned between two adjacent groups of coils;
the sensor chip comprises a chip body packaged with a sensor element and pins led out from the chip body, wherein the chip body is positioned in the hole, the sensor chip is attached to the hole from the first surface of the printed circuit board, the sensor element faces the second surface of the printed circuit board, and the pins are connected with the circuit layer; the number of the sensor chips is the same as that of the digging holes, so that one sensor chip is correspondingly arranged in each digging hole;
the pin is a gull pin, and comprises a leading-out section positioned in the hole and a connecting section extending to the first surface of the printed circuit board, wherein the length of the connecting section is 1+/-0.2 mm.
2. The surface mount structure of claim 1, wherein the cutout is located in an interior region of the printed circuit board or the cutout is located at an edge of the printed circuit board.
3. The surface mount structure of claim 1, wherein the first side of the printed circuit board is further provided with a die attach pad located at the edge of the cutout and connected to the wiring layer; the pins of the sensor chip are connected with the chip connection pads.
4. The surface mount structure of claim 1, wherein the pins are flat pin.
5. The surface mount structure of claim 4, wherein the flat pin has a length of 1 ± 0.2mm.
6. The surface mount structure of claim 4, wherein the die body is in clearance fit with the cutout.
7. The surface mount structure of claim 1, wherein the sensor chip is an SOP sensor chip, a TSOP sensor chip, a QFP sensor chip, a TQFP sensor chip, or an SOIC sensor chip.
8. An electric motor comprising the surface mount structure according to any one of claims 1 to 7.
9. A surface mount chip applied to the surface mount structure of claim 1, comprising a chip body in which a sensor element is packaged, and gull pins led out from the chip body.
10. A surface mounting method applied to the surface mounting structure according to claim 1, characterized by comprising the steps of:
attaching a sensor chip to the hole of the printed circuit board from the first surface of the printed circuit board; the sensor chip comprises a chip body, a printed circuit board, a sensor element, a pin and a circuit layer, wherein the chip body of the sensor chip is arranged in the hole, the sensor element of the chip body faces to the second surface of the printed circuit board, and the pin of the sensor chip is connected with the circuit layer on the first surface of the printed circuit board.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711050892.6A CN107612226B (en) | 2017-10-31 | 2017-10-31 | Surface mounting structure, surface mounting method, motor and surface mounting chip |
| PCT/CN2018/100505 WO2019085586A1 (en) | 2017-10-31 | 2018-08-14 | Surface mounted structure, surface mounting method, motor, and surface mounted chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711050892.6A CN107612226B (en) | 2017-10-31 | 2017-10-31 | Surface mounting structure, surface mounting method, motor and surface mounting chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107612226A CN107612226A (en) | 2018-01-19 |
| CN107612226B true CN107612226B (en) | 2024-05-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711050892.6A Active CN107612226B (en) | 2017-10-31 | 2017-10-31 | Surface mounting structure, surface mounting method, motor and surface mounting chip |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107612226B (en) |
| WO (1) | WO2019085586A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107612226B (en) * | 2017-10-31 | 2024-05-03 | 珠海格力电器股份有限公司 | Surface mounting structure, surface mounting method, motor and surface mounting chip |
| CN108601216A (en) * | 2018-04-28 | 2018-09-28 | 济南浪潮高新科技投资发展有限公司 | A kind of PCB and PCB production methods |
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| JP2002243768A (en) * | 2001-02-21 | 2002-08-28 | Stanley Electric Co Ltd | Electric current detector |
| KR100416000B1 (en) * | 2001-07-11 | 2004-01-24 | 삼성전자주식회사 | Pcb mounting chip having plural pins |
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| CN201378776Y (en) * | 2009-04-14 | 2010-01-06 | 涂阳东 | Permanent magnet DC motor with magnetic brushes |
| CN107612226B (en) * | 2017-10-31 | 2024-05-03 | 珠海格力电器股份有限公司 | Surface mounting structure, surface mounting method, motor and surface mounting chip |
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2017
- 2017-10-31 CN CN201711050892.6A patent/CN107612226B/en active Active
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2018
- 2018-08-14 WO PCT/CN2018/100505 patent/WO2019085586A1/en active Application Filing
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103108498A (en) * | 2013-01-10 | 2013-05-15 | 太仓市同维电子有限公司 | Method of placing parts on printed circuit board (PCB) circuit board surfaces |
| CN104578664A (en) * | 2013-10-18 | 2015-04-29 | 株式会社一宫电机 | Brushless motor |
| CN204434268U (en) * | 2014-12-25 | 2015-07-01 | 歌尔声学股份有限公司 | A kind of encapsulating structure of MEMS inertial sensor |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN107612226A (en) | 2018-01-19 |
| WO2019085586A1 (en) | 2019-05-09 |
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