CN108601216A - A kind of PCB and PCB production methods - Google Patents
A kind of PCB and PCB production methods Download PDFInfo
- Publication number
- CN108601216A CN108601216A CN201810398327.7A CN201810398327A CN108601216A CN 108601216 A CN108601216 A CN 108601216A CN 201810398327 A CN201810398327 A CN 201810398327A CN 108601216 A CN108601216 A CN 108601216A
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- China
- Prior art keywords
- plate body
- pcb
- out position
- hollowing out
- empty place
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Abstract
The present invention provides a kind of PCB and PCB production methods, which includes：Plate body, with heavy board-like at least one device on plate body；For any first device therein：There are corresponding with the first device one on plate body to hollow out position；The size and the size of the first device for hollowing out position match, so that the first device is mountable to dig empty place；The first of first device is facing towards plate body front, second facing towards the plate body back side, and the first face is not less than the plate body back side, and the second face is not higher than plate body front；The pin of first device is mutually welded with the pad for digging empty place on plate body.By device with it is heavy it is board-like be installed on PCB, increased with reducing the PCB finished products caused by device installation as far as possible, therefore this programme can avoid or alleviate the problem of inner space height deficiency.
Description
Technical field
The present invention relates to electronic technology field, more particularly to a kind of PCB (Printed Circuit Board, printed circuit
Plate) and PCB production methods.
Background technology
As people pursue the appearance of electronic product, the higher of performance, electronic product is towards high-performance, ultra-thin, light
Direction develop, therefore may require that cabinet, casing internal space are smaller and smaller.Therefore, the design height for reducing PCB as possible seems outstanding
It is important.
Currently, in product PCB layouts, the front or back in PCB can be respectively welded in each device.In this way, PCB finished products
Height can be that the summation of tin height is floated on the fronts PCB element height, plate thickness, the back sides PCB element height, two sides.
But in the case of cabinet, casing internal space are limited, any element height can cause PCB finished products when higher
Height it is higher, therefore easily there is a problem of that inner space height is insufficient.
Invention content
The present invention provides a kind of PCB and PCB production methods, it can avoid or alleviate inner space height insufficient asking
Topic.
In order to achieve the above object, the present invention is achieved through the following technical solutions：
On the one hand, the present invention provides a kind of PCB, including：
Plate body, with heavy board-like at least one device on the plate body；
For any first device at least one device：
There are hollow out position with first device corresponding one on the plate body；
The size for hollowing out position and the size of first device match, so that first device is mountable to institute
State digging empty place；
Facing towards plate body front, second facing towards the plate body back side, first face is not less than the first of first device
The plate body back side, second face is not higher than plate body front；
The pin of first device is mutually welded with the pad for digging empty place on the plate body.
Further, the position that hollows out is present at an edges of boards of the plate body；
The width for hollowing out position is equal to the width of first device；
The depth for hollowing out position is not more than the thickness of first device.
Further, the position that hollows out is present at the first edges of boards of the plate body；
The depth for hollowing out position meets formula one；
The formula one includes：
d≥D-x
Wherein, d is the depth for hollowing out position, and D is the thickness of first device, and x is that the PCB is placed in external shell
When interior, the excess length of first edges of boards away from the external shell.
Further, the middle position for hollowing out position and being present in the ontology；
The width for hollowing out position is equal to the width of first device；
The depth for hollowing out position is equal to the thickness of first device.
Further, there are bending fillets in the digging empty place for the plate body.
Further, the device includes power supply inductance.
On the other hand, the present invention provides a kind of PCB production methods to be connected up using PCB design according to external input information
Tool design PCB models, wherein for any first device at least one device to be installed：The plate of the PCB models
There are hollow out position, the size of the size for hollowing out position and first device with first device corresponding one on body
Match, so that first device is mountable to the digging empty place；Further include：
Based on the PCB models, PCB is manufactured；
Position is hollowed out for each on the plate body of the PCB to be performed both by：Current will hollow out the corresponding target devices in position with
It is heavy it is board-like be mounted on the current digging empty place so that the first of the target devices facing towards plate body front, second facing towards
The plate body back side, first face are not less than the plate body back side, and second face is not higher than plate body front；By the target
The pin of device is mutually welded with the current pad for digging empty place on the plate body of the PCB.
Further, at the corresponding edges of boards for hollowing out the plate body that position is present in the PCB models of first device；
The corresponding width for hollowing out position of first device is equal to the width of first device；
The corresponding depth for hollowing out position of first device is not more than the thickness of first device.
Further, this method further includes：According to formula one, the corresponding depth for hollowing out position of first device is calculated；
The formula one includes：
d≥D-x
Wherein, d is the corresponding depth for hollowing out position of first device, and D is the thickness of first device, and x is described
When PCB is placed in external shell, excess length of first edges of boards away from the external shell, there are described at first edges of boards
First device is corresponding to hollow out position.
Further, the corresponding target devices in position that current will hollow out described currently hollow out position with heavy board-like be mounted on
Place, including：According to surplus capacity under surplus capacity on predetermined plate and plate, positioning tool is installed on and described currently hollows out position
Place current will hollow out the corresponding target devices in position and described currently hollow out position with heavy board-like be mounted on to be based on the positioning tool
Place, so that the positive distance of plate body described in first identity distance is not more than surplus capacity on the plate, plate described in second identity distance
The distance at the body back side is not more than surplus capacity under the plate.
The present invention provides a kind of PCB and PCB production methods, which includes：Plate body board-like is mounted on plate body with heavy
At least one device；For any first device therein：There are corresponding with the first device one on plate body to hollow out position；
The size and the size of the first device for hollowing out position match, so that the first device is mountable to dig empty place；The of first device
One facing towards plate body front, second facing towards the plate body back side, and the first face is not less than the plate body back side, and the second face is just not higher than plate body
Face；The pin of first device is mutually welded with the pad for digging empty place on plate body.By device with it is heavy it is board-like be installed on PCB, with to the greatest extent
The possible PCB finished products reduced caused by device installation increase, therefore the present invention can avoid or alleviate inner space height insufficient
The problem of.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is the present invention
Some embodiments for those of ordinary skill in the art without creative efforts, can also basis
These attached drawings obtain other attached drawings.
Fig. 1 is a kind of schematic diagram for PCB that one embodiment of the invention provides；
Fig. 2 is the schematic diagram for another PCB that one embodiment of the invention provides；
Fig. 3 is the schematic diagram for another PCB that one embodiment of the invention provides；
Fig. 4 is a kind of flow chart for PCB production methods that one embodiment of the invention provides；
Fig. 5 is the schematic diagram for another PCB that one embodiment of the invention provides.
Specific implementation mode
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments, based on the embodiments of the present invention, those of ordinary skill in the art
The every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
As shown in Figure 1, an embodiment of the present invention provides a kind of PCB, may include：
Plate body 101, with heavy board-like at least one device 102 on the plate body 101；
For any first device 102 at least one device 102：
There are hollow out position with first device 102 corresponding one on the plate body 101；
The size for hollowing out position and the size of first device 102 match, so that first device 102 can pacify
Loaded on the digging empty place；
For the first of first device 102 facing towards plate body front, second facing towards the plate body back side, first face is not low
In the plate body back side, second face is not higher than plate body front；
The pin 1021 of first device 102 is welded with 1011 phase of pad for digging empty place on the plate body 101.
An embodiment of the present invention provides a kind of PCB, including plate body, with heavy board-like at least one device on plate body
Part；For any first device therein：There are corresponding with the first device one on plate body to hollow out position；Hollow out the size of position
Match with the size of the first device, so that the first device is mountable to dig empty place；The first of first device is facing towards plate body
Front, second are facing towards the plate body back side, and the first face is not less than the plate body back side, and the second face is not higher than plate body front；First device
Pin is mutually welded with the pad for digging empty place on plate body.By device with it is heavy it is board-like be installed on PCB, to reduce device as far as possible
PCB finished products caused by installation increase, therefore the embodiment of the present invention can avoid or alleviate the problem of inner space height deficiency.
In detail, the existence position of position is respectively hollowed out, there can be following two ways：
Mode 1：It is present at any edges of boards of plate body；
Mode 2：It is present in plate body middle position.
For aforesaid way 1：
Referring to FIG. 1, Fig. 1 can be the front view of a PCB, the one of the front side edges of boards of PCB dig there are one empty place installations
Device.Due to device be installed on hollow out position after can cover this and hollow out position, therefore this is not clearly shown in Fig. 1 and hollows out position.
In Fig. 1, device tool is there are two pin, and the plate body front for digging empty place has a pad, welded processing, can be with
Each pin is mutually welded with pad, to realize that installation of the device on plate body is fixedly connected.
Since the pin of device shown in Fig. 1 runs through entire height of pin, therefore only realize that the part welding of pad and pin is
Can, in this way, shown in FIG. 1 be located at the positive pad of plate body, in an alternative embodiment of the invention, it can be equally located on the plate body back of the body
Face.
In detail, device shown in FIG. 1 can be face-up installed on plate body, equally can be upward installed on bottom surface
On plate body, both it can reach with the effect of the heavy board-like installing device on PCB.
Based on same realization principle, on any edges of boards there may be have it is multiple hollow out position, each empty place that digs can install one
The device of corresponding size dimension.
For mode 1, position is hollowed out in edges of boards design, it can be in order to coordinate installation tool, to realize device on plate body
Precisely installation.
For aforesaid way 2：
Referring to FIG. 2, Fig. 2 can be the front view of another PCB, there are one at one position of centre of PCB to hollow out position, should
It digs empty place and one device is installed.Due to device be installed on hollow out position after can cover this and hollow out position, therefore unknown display in Fig. 2
Go out this and hollows out position.
In Fig. 2, there are two pins for the lower part tool of device, and the plate body back side for digging empty place has a pad, welded place
Reason, can mutually weld each pin with pad, to realize that installation of the device on plate body is fixedly connected.
In this way, device shown in Fig. 2 is face-up to be installed on plate body, certainly, when device is that bottom surface is installed on upward
When on plate body, the pad of the digging empty place should be located at plate body front on plate body.
Based on same realization principle, plate body centre position there may be have it is multiple hollow out position, each empty place that digs can be installed
One corresponds to the device of size dimension.
For mode 2, can according to nearby principle, setting hollows out position at required position among the plate body, it is unnecessary to reduce
Length of arrangement wire.
Referring to FIG. 3, Fig. 3 can be the vertical view of a PCB for not yet installing whole devices, one among the plate body of the PCB
Hollow out position there are one at position, at the edges of boards of front side there are size dimension identical two hollow out position, and left side hollows out and has pacified on position
Fill a device.In figure 3, the pad that empty place is respectively dug on plate body is not shown.
Corresponding to aforesaid way 1, in one embodiment of the invention, referring to FIG. 3, it is described hollow out position be present in it is described
At one edges of boards of plate body 101；
The width for hollowing out position is equal to the width of first device 102；
The depth for hollowing out position is not more than the thickness of first device 102.
By in Fig. 3 front side edges of boards at existing for left side hollow out position for, hollow out position width be equal to device width, such as scheme
Shown in A sections middle.Here width is equal, it is generally understood that the width for hollowing out position is equal or slightly larger than the width of device, with
It is installed convenient for device to hollowing out position.
In addition, the depth for hollowing out position is less than the thickness of device, i.e. d ＜ D.
In one embodiment of the invention, referring to FIG. 3, first edges of boards for hollowing out position and being present in the plate body
Place；
The depth for hollowing out position meets formula one；
The formula one includes：
d≥D-x
Wherein, d is the depth for hollowing out position, and D is the thickness of first device, and x is that the PCB is placed in external shell
When interior, the excess length of first edges of boards away from the external shell.
In figure 3, the first edges of boards can be with the front side edges of boards for plate body, in excess length such as Fig. 3 shown in x sections.When more than needed
When length is more, d ＜ D can be set, to increase the usable area of plate body as far as possible, while not influencing the normal mounting of device,
And it does not influence to be equipped in the PCB normal mountings to external shell of device.
Certainly, when there is no rich length, i.e. x=0, to ensure the normal mounting of device and PCB, d=can be set
D。
For aforesaid way 2：
In one embodiment of the invention, referring to FIG. 3, the centre position for hollowing out position and being present in the ontology
Place；
The width for hollowing out position is equal to the width of first device；
The depth for hollowing out position is equal to the thickness of first device.
Referring to FIG. 3, the width for hollowing out position is equal to the width of device, as shown in A' sections in Fig. 3, the depth for hollowing out position is equal to
The thickness of device, as shown in d' sections in Fig. 3.
In one embodiment of the invention, referring to FIG. 3, the plate body is in the digging empty place, there are bending circles
Angle.
Right side present on please referring to Fig.3 plate body front side edges of boards hollows out position, which has bending fillet at two.
In detail, in product PCB layout, each chip such as CPU, video card has multi-group power, because pcb board card size,
The part encapsulation of casing and the limitation of principle design requirement, power supply inductance is higher, to be unsatisfactory for setting for casing internal spatial altitude
Meter requires.The performance requirement of product determines that inductance used in power supply cannot replace the inductance of short encapsulation, and the thickness of product case
Degree cannot change.
Therefore, in one embodiment of the invention, the device includes power supply inductance.
As shown in figure 4, one embodiment of the invention provides a kind of PCB production methods, following steps are specifically included：
Step 401：According to external input information, PCB design wiring tool Design PCB model is utilized, wherein for waiting pacifying
Any first device at least one device of dress：There are opposite with first device on the plate body of the PCB models
One answered hollows out position, and the size for hollowing out position and the size of first device match, so that first device can pacify
Loaded on the digging empty place.
In detail, PCB design wiring tool can be this design software of Cadence Allegro PCB Editor.
In detail, external input information can be a series of designs instruction of staff's input, so that system is based on being somebody's turn to do
Design instruction goes out PCB models through Software for Design.Here PCB models can be PCB design figure.
In detail, since each device to be installed on PCB fixes, therefore the size of each device is it is known that therefore can
To be based on this size, each accordingly position is hollowed out using on software setting PCB models.
Step 402：Based on the PCB models, PCB is manufactured.
In detail, equipment being generated by specific PCB, corresponding PCB material objects are manufactured out based on PCB design figure.Here
PCB be that there are hollow out position but each PCB for digging empty place and not yet installing corresponding device on plate body.
Step 403：Position is hollowed out for each on the plate body of the PCB to be performed both by：To the corresponding mesh in position currently be hollowed out
Mark device with it is heavy it is board-like be mounted on the current digging empty place so that the first of the target devices facing towards plate body front, the
Two facing towards the plate body back side, and first face is not less than the plate body back side, and second face is not higher than plate body front；It will
The pin of the target devices is mutually welded with the current pad for digging empty place on the plate body of the PCB.
In this step, empty place can accordingly be dug with the board-like installation that each device sinks of manual operation or automation.
For example, referring to FIG. 2, the upper surface of device or the front of device can be with for above-mentioned first faces, under device
Surface or the bottom surface of device can be with for above-mentioned second faces.First face is higher than the plate body back side, and the second face is positive less than plate body,
When so that device being installed on plate body, the PCB whole heights after installation are less than the adduction of plate body thickness and thickness of detector, to reach
The effect increased to the PCB finished products reduced caused by device installation.
In an embodiment of the invention, the corresponding plate body for hollowing out position and being present in the PCB models of first device
An edges of boards at；
The corresponding width for hollowing out position of first device is equal to the width of first device；
The corresponding depth for hollowing out position of first device is not more than the thickness of first device.
In an embodiment of the invention, which may further include：According to above-mentioned formula one, calculate
The corresponding depth for hollowing out position of first device.
In detail, in step 401, in the PCB models of design exist hollow out position, hollow out position depth can be based on it is above-mentioned
Formula one is obtained.
In an embodiment of the invention, described to hollow out the corresponding target devices in position by current to sink described in board-like be mounted on
Current digging empty place, including：According to surplus capacity under surplus capacity on predetermined plate and plate, positioning tool is installed on described work as
Preceding digging empty place will currently hollow out the corresponding target devices in position and be worked as described in board-like be mounted on sinking to be based on the positioning tool
Preceding digging empty place, so that the positive distance of plate body described in first identity distance is no more than surplus capacity, second face on the plate
Distance away from the plate body back side is not more than surplus capacity under the plate.
In detail, when hollowing out position and being set to edges of boards, be conducive to the installation of positioning tool, so as to carry out installation positioning effect
Fruit.
For example, according to the size of external shell, it is desirable that the PCB that whole height is not more than 5.8mm can be accommodated.When
So, it also needs to consider that tin height is floated on two sides in this 5.8mm, for example assumes be 0.1mm.Wherein, plate body thickness is 1.2mm.It examines
Consider the height of other components on PCB, therefore it is 2.5mm that can require on plate surplus capacity simultaneously, surplus capacity is 2mm under plate.
Assuming that the height of an inductance component is 3mm, it is directly welded to plate body front or the back side, it is rich on discontented pedal plate
The requirement of surplus capacity under surplus and plate, therefore can be through hollowing out position with heavy board-like installation inductance component.So, it is assumed that inductance component is just
Installation up, therefore when inductance component can be set on the plate body, on plate under exposed 1mm, plate exposed 0.8mm set of dimensions
It closes, i.e., inductance component upper surface or the positive positive distance of identity distance plate body are 1mm, and inductance component lower surface or bottom surface are away from plate body
The distance at the back side is 0.8mm.It is of course also possible to exposed 0.9mm under exposed 0.9mm, plate on option board；Exposed 1.1mm, plate on plate
Under exposed 0.7mm, equidimension combination.
Then, based on the dimension combination determined, you can positioning tool is fixedly installed in the corresponding digging empty place of plate body,
This fixed installation needs to reach following effect：Inductance component is based on the positioning tool fixed accordingly to be dug according on plate body
When vacancy, meet the above-mentioned dimension combination determined, to realize heavy board-like accurate installation of the inductance component on plate body.
By inductance component with it is heavy it is board-like be installed on pcb board body after, that is, produce with the heavy board-like device that is equipped with
PCB.In this way, being based on above-mentioned PCB production methods, any of the above-described PCB product can be produced.
As shown in figure 5, Fig. 5 can be the produced pictorial diagram with the heavy board-like PCB for being equipped with inductance component.
On front side of the PCB at edges of boards, there are two inductance components for heavy board-like installation.
Content involved by above method embodiment, it is specific interior due to being based on same design with product embodiments of the present invention
Hold the narration that can be found in product embodiments of the present invention, details are not described herein again.
In conclusion each embodiment of the present invention at least has the advantages that：
1, in the embodiment of the present invention, provide a kind of PCB, including plate body, with it is heavy it is board-like on plate body at least one
A device；For any first device therein：There are corresponding with the first device one on plate body to hollow out position；Hollow out position
Size and the size of the first device match, so that the first device is mountable to dig empty place；The first of first device facing towards
Plate body front, second are facing towards the plate body back side, and the first face is not less than the plate body back side, and the second face is not higher than plate body front；First device
The pin of part is mutually welded with the pad for digging empty place on plate body.By device with it is heavy it is board-like be installed on PCB, to reduce as far as possible
PCB finished products caused by device installation increase, therefore the embodiment of the present invention can avoid or alleviate inner space height is insufficient from asking
Topic.
2, in the embodiment of the present invention, by putting the adjustment of layout to conventional power source inductance, heavy plate is changed to by being commonly laid out
Layout, PCB design whole height is obviously reduced,, can be to PCB design by changing putting for inductance it is possible thereby to prove
Height optimization meets chassis height requirement.
It should be noted that herein, such as first and second etc relational terms are used merely to an entity
Or operation is distinguished with another entity or operation, is existed without necessarily requiring or implying between these entities or operation
Any actual relationship or order.Moreover, the terms "include", "comprise" or its any other variant be intended to it is non-
It is exclusive to include, so that the process, method, article or equipment including a series of elements includes not only those elements,
But also include other elements that are not explicitly listed, or further include solid by this process, method, article or equipment
Some elements.In the absence of more restrictions, the element limited by sentence " including one ", is not arranged
Except there is also other identical factors in the process, method, article or apparatus that includes the element.
One of ordinary skill in the art will appreciate that：Realize that all or part of step of above method embodiment can pass through
The relevant hardware of program instruction is completed, and program above-mentioned can be stored in computer-readable storage medium, the program
When being executed, step including the steps of the foregoing method embodiments is executed；And storage medium above-mentioned includes：ROM, RAM, magnetic disc or light
In the various media that can store program code such as disk.
Finally, it should be noted that：The foregoing is merely presently preferred embodiments of the present invention, is merely to illustrate the skill of the present invention
Art scheme, is not intended to limit the scope of the present invention.Any modification for being made all within the spirits and principles of the present invention,
Equivalent replacement, improvement etc., are included within the scope of protection of the present invention.
Claims (10)
1. a kind of printing board PCB, which is characterized in that including：
Plate body, with heavy board-like at least one device on the plate body；
For any first device at least one device：
There are hollow out position with first device corresponding one on the plate body；
The size for hollowing out position and the size of first device match, so that first device is mountable to the digging
Empty place；
The first of first device is facing towards plate body front, second facing towards the plate body back side, and first face is not less than described
The plate body back side, second face is not higher than plate body front；
The pin of first device is mutually welded with the pad for digging empty place on the plate body.
2. PCB according to claim 1, which is characterized in that
The position that hollows out is present at an edges of boards of the plate body；
The width for hollowing out position is equal to the width of first device；
The depth for hollowing out position is not more than the thickness of first device.
3. PCB according to claim 2, which is characterized in that
The position that hollows out is present at the first edges of boards of the plate body；
The depth for hollowing out position meets formula one；
The formula one includes：
d≥D-x
Wherein, d is the depth for hollowing out position, and D is the thickness of first device, and x is that the PCB is placed in external shell
When, the excess length of first edges of boards away from the external shell.
4. PCB according to claim 1, which is characterized in that
The middle position for hollowing out position and being present in the ontology；
The width for hollowing out position is equal to the width of first device；
The depth for hollowing out position is equal to the thickness of first device.
5. PCB according to claim 1, which is characterized in that
There are bending fillets in the digging empty place for the plate body.
6. according to any PCB in claim 1 to 5, which is characterized in that
The device includes power supply inductance.
7. a kind of printing board PCB production method, which is characterized in that according to external input information, work is connected up using PCB design
Has Design PCB model, wherein for any first device at least one device to be installed：The plate body of the PCB models
On there are hollow out position, the size phase of the size for hollowing out position and first device with first device corresponding one
Matching, so that first device is mountable to the digging empty place；Further include：
Based on the PCB models, PCB is manufactured；
Position is hollowed out for each on the plate body of the PCB to be performed both by：By the current corresponding target devices in position that hollow out with heavy plate
Formula is mounted on the current digging empty place, so that the first of the target devices facing towards plate body front, second facing towards plate body
The back side, first face are not less than the plate body back side, and second face is not higher than plate body front；By the target devices
Pin and on the plate body of the PCB it is described it is current dig empty place pad mutually weld.
8. PCB production methods according to claim 7, which is characterized in that
At the corresponding edges of boards for hollowing out the plate body that position is present in the PCB models of first device；
The corresponding width for hollowing out position of first device is equal to the width of first device；
The corresponding depth for hollowing out position of first device is not more than the thickness of first device.
9. PCB production methods according to claim 8, which is characterized in that
Further comprise：According to formula one, the corresponding depth for hollowing out position of first device is calculated；
The formula one includes：
d≥D-x
Wherein, d is the corresponding depth for hollowing out position of first device, and D is the thickness of first device, and x is that the PCB is set
When in external shell, excess length of first edges of boards away from the external shell, there are described first at first edges of boards
Device is corresponding to hollow out position.
10. according to any PCB production methods in claim 7 to 9, which is characterized in that
It is described current will hollow out the corresponding target devices in position with it is heavy it is board-like be mounted on the current digging empty place, including：According to pre-
Surplus capacity under surplus capacity and plate, the current digging empty place is installed on by positioning tool on first determining plate, described fixed to be based on
Position tool, by the current corresponding target devices in position that hollow out with heavy board-like mounted on the current digging empty place, so that described first
It is little that the positive distance of plate body described in identity distance is not more than surplus capacity on the plate, the distance at the plate body back side described in second identity distance
The surplus capacity under the plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810398327.7A CN108601216A (en) | 2018-04-28 | 2018-04-28 | A kind of PCB and PCB production methods |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109842998A (en) * | 2019-03-27 | 2019-06-04 | 深圳市中孚能电气设备有限公司 | Pcb board pasting method and structure |
| CN112115673A (en) * | 2020-09-27 | 2020-12-22 | 浪潮电子信息产业股份有限公司 | PCIE signal PIN adjacent layer hollowing design method, system, device and storage medium |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050121224A1 (en) * | 2003-12-05 | 2005-06-09 | Optimum Care International Tech. Inc. | Circuit board having deposit holes |
| CN1930658A (en) * | 2004-03-09 | 2007-03-14 | 赛博光学半导体公司 | Wireless substrate-like sensor |
| CN202221699U (en) * | 2011-08-16 | 2012-05-16 | 许文豪 | Capacitor fixing device and circuit board structure applying the same |
| CN203351734U (en) * | 2013-06-09 | 2013-12-18 | 河北金博电梯智能设备有限公司 | Antenna of elevator control device |
| JP2015023071A (en) * | 2013-07-17 | 2015-02-02 | Ｎｅｃプラットフォームズ株式会社 | Laminated circuit board |
| CN204316868U (en) * | 2014-09-30 | 2015-05-06 | 上海移远通信技术有限公司 | The integrated structure of circuit board |
| CN204498460U (en) * | 2015-03-24 | 2015-07-22 | 深圳华麟电路技术有限公司 | A kind of flexible circuit board of ultrathin camera module |
| CN107612226A (en) * | 2017-10-31 | 2018-01-19 | 珠海格力电器股份有限公司 | Surface mounting structure, surface mount method, motor and surface mount chip |
-
2018
- 2018-04-28 CN CN201810398327.7A patent/CN108601216A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050121224A1 (en) * | 2003-12-05 | 2005-06-09 | Optimum Care International Tech. Inc. | Circuit board having deposit holes |
| CN1930658A (en) * | 2004-03-09 | 2007-03-14 | 赛博光学半导体公司 | Wireless substrate-like sensor |
| CN202221699U (en) * | 2011-08-16 | 2012-05-16 | 许文豪 | Capacitor fixing device and circuit board structure applying the same |
| CN203351734U (en) * | 2013-06-09 | 2013-12-18 | 河北金博电梯智能设备有限公司 | Antenna of elevator control device |
| JP2015023071A (en) * | 2013-07-17 | 2015-02-02 | Ｎｅｃプラットフォームズ株式会社 | Laminated circuit board |
| CN204316868U (en) * | 2014-09-30 | 2015-05-06 | 上海移远通信技术有限公司 | The integrated structure of circuit board |
| CN204498460U (en) * | 2015-03-24 | 2015-07-22 | 深圳华麟电路技术有限公司 | A kind of flexible circuit board of ultrathin camera module |
| CN107612226A (en) * | 2017-10-31 | 2018-01-19 | 珠海格力电器股份有限公司 | Surface mounting structure, surface mount method, motor and surface mount chip |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109842998A (en) * | 2019-03-27 | 2019-06-04 | 深圳市中孚能电气设备有限公司 | Pcb board pasting method and structure |
| WO2020192768A1 (en) * | 2019-03-27 | 2020-10-01 | 深圳市中孚能电气设备有限公司 | Method and structure for patching pcb |
| CN112115673A (en) * | 2020-09-27 | 2020-12-22 | 浪潮电子信息产业股份有限公司 | PCIE signal PIN adjacent layer hollowing design method, system, device and storage medium |
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