CN204498460U - A kind of flexible circuit board of ultrathin camera module - Google Patents
A kind of flexible circuit board of ultrathin camera module Download PDFInfo
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- CN204498460U CN204498460U CN201520169230.0U CN201520169230U CN204498460U CN 204498460 U CN204498460 U CN 204498460U CN 201520169230 U CN201520169230 U CN 201520169230U CN 204498460 U CN204498460 U CN 204498460U
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Abstract
A kind of flexible circuit board of ultrathin camera module, comprise flexible circuit board and steel plate reinforcement plate, the circuit cabling of described flexible circuit board walks around this chip carrying region, the chip carrying region of described flexible circuit board hollows out, and described steel plate reinforcement plate fits in flexible circuitry back and covers its chip carrying region.The utility model ensure that the evenness of camera module mounting surface, because the evenness of steel plate reinforcement plate can not affect by temperature during SMT paster, overcome the evenness defect that in prior art, flexible circuit board causes when SMT paster, effective combination realizing employing flexible circuit board and high-pixel camera head mould group, meets high-pixel camera head mould group to the requirement of evenness; On the other hand, the chip of camera module is fixed on steel plate reinforcement plate but not in flexible circuit board, decreases the thickness of one deck flexible circuit board, reduces the projecting degree of camera.
Description
Technical field
The utility model relates to the flexible circuit board of the ultrathin camera module of the digital product such as mobile phone, computer.
Background technology
Along with the continuous progress of science and technology, the requirement of people's logarithmic code product is more and more higher, and the convenience of digital product and lightweight are the continuous pursuits of people, and the high pixel of ultra-thin collocation has become the fashion main flow of market development.
At present, the mobile phone camera of less than 5000000 pixels can be arranged in flexible circuit board, but along with the raising (more than such as 8,000,000 or 1,000 ten thousand pixel) of mobile phone camera pixel, the structure of camera is more complicated, also require higher to the precision of focusing and speed, and cannot be arranged in flexible circuit board, therefore can only be arranged on rigid wiring board or Rigid Flex.Such as, in the industry mobile phone camera module with 8,000,000 and above pixel for main flow, the thickness of its conventional wiring board mostly is 0.30-0.40mm, and adopt four-layer soft and hard combined board more, but the material of Rigid Flex is FR4 or Prepreg prepreg mainly, these two kinds of materials are mainly made into by glass fibre yarn.Common plate (Normal Tg) is about 130 ~ 150 DEG C, and the Tg of high Tg plate can reach 170-210 DEG C.The temperature of SMT device welding is generally at 260-280 DEG C, and under the high temperature of 260 DEG C, FR4 or Prepreg prepreg glass fibre yarn can slowly to glassy transition, deliquescing, again can slowly to original recovering state after cooling.In this process, the wiring board evenness of camera module will make a variation increase, and plate surface evenness does not reach the requirement of encapsulation module chip to evenness, affects the quality of camera module imaging.Therefore, Rigid Flex is thinner, the more difficult control of evenness, flexible circuitry plate flatness is poorer than Rigid Flex, so the camera module of high pixel (as 8,000,000 pixels or higher pixel) is difficult to the support plate adopting flexible circuit board as camera module sensitive chip.
Except the puzzlement of evenness, the requirement of thickness is also had to be difficult to meet.From current present situation, the camera of existing more than 1,000 ten thousand pixels mainly or carrying finished product thickness of slab is the Rigid Flex of 0.3-0.4mm, mainly due to while the above pixel product of release ten million, handset also asks most ultra-thin, thick circuit board can make the thickness of camera finished product increase, and causes camera evagination obvious.Such as, the thinnest smart mobile phone in the whole world is vivo X5Max so far, and thickness is 4.75mm, and the camera pixel of lift-launch is 13,000,000.Provide data from the large data platform eWiseTech of smart machine, can see as shown in Figure 1, camera place reaches the thickness of 6.8mm, so the restriction of mobile phone camera module thickness is mobile phone do one of thin obstacle.That is, even if solve the problem of evenness thus be mounted in flexible circuit board by camera, be also difficult to reduce thickness, the problem that camera protrudes still is difficult to solve.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of flexible circuit board of carrying for high-pixel camera head mould group, reducing thickness, keeping the ultrathin camera module of evenness.
In order to solve the problems of the technologies described above, the utility model provides a kind of flexible circuit board of ultrathin camera module, comprise flexible circuit board and steel plate reinforcement plate, the circuit cabling of described flexible circuit board walks around this chip carrying region, the chip carrying region of described flexible circuit board hollows out, and described steel plate reinforcement plate fits in flexible circuitry back and covers its chip carrying region.
As optimal way, the chip of described camera module is embedded on the steel plate reinforcement plate in chip carrying region.
As optimal way, described circuit cabling and described chip carrying region are at least at a distance of 0.2mm.
The flexible circuit board of the ultrathin camera module of the utility model is by hollowing out the chip carrying region of flexible circuit board, steel plate reinforcement plate is fitted in the flexible circuit board chip area back side and covers described chip carrying region, thus on the steel plate reinforcement plate that the chip of camera module can be embedded in chip carrying region, compared with traditional resolving ideas, the utility model is without the need to solving the problem of evenness when camera module carries in the circuit board, but directly camera module is mounted on steel plate reinforcement plate, for the lift-launch solving high-pixel camera head mould group provides new thinking.By above-mentioned improvement, ensure that the evenness of camera module mounting surface on the one hand, because the evenness of steel plate reinforcement plate can not affect by temperature during SMT paster, overcome the evenness defect that in prior art, flexible circuit board causes when SMT paster, effective combination realizing employing flexible circuit board and high-pixel camera head mould group, meets high-pixel camera head mould group to the requirement of evenness; On the other hand, the chip of camera module is fixed on steel plate reinforcement plate but not in flexible circuit board, decreases the thickness of one deck flexible circuit board, reduces the projecting degree of camera.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail:
Fig. 1 is the mobile phone vertical section thickness schematic diagram in background technology.
Fig. 2 is the front view of the flexible circuit board of the ultrathin camera module of the utility model.
Fig. 3 is the flexible circuit board of the ultrathin camera module of the utility model and steel plate reinforcement plate installation side view when fitting.
Fig. 4 is the end view of the flexible circuit board of the ultrathin camera module of the utility model.
Fig. 5 is the end view after the flexible circuit board chip of the ultrathin camera module of the utility model.
Embodiment
Be illustrated in figure 4 the end view of the flexible circuit board of the ultrathin camera module of the utility model, comprise flexible circuit board 100 and steel plate reinforcement plate 210,220, the chip carrying region 110 of described flexible circuit board 100 hollows out (see Fig. 2), described steel plate reinforcement plate 210 fits in flexible circuit board 100 back side and covers its chip carrying region 110, and the circuit cabling of described flexible circuit board 100 walks around this chip carrying region 110.After assembling side obtains this flexible circuit board, the chip 300 of camera module can be embedded on the steel plate reinforcement plate 210 in chip carrying region 110 (as shown in Figure 5), thus reduction thickness, namely decrease the thickness (0.1-0.25mm) of flexible circuit board 100.Because the heat conductivility of steel plate reinforcement plate 210 is better, it is higher that chip 300 is fixed on radiating efficiency after on steel plate reinforcement plate 210.
The manufacture method of the flexible circuit board of the ultrathin camera module of the utility model comprises following 4 steps:
Step 1, flexible circuit board 100 delimited chip carrying region 110 to be hollowed out, the wiring of change flexible circuit board 100 makes circuit cabling walk around this chip carrying region 110, and make flexible circuit board 100, the manufacturing process of flexible circuit board 100 adopts existing manufacture craft, specifically comprise the steps: blanking, boring, copper facing, D.E.S (development, etching, stripping), coverlay is fitted, welding resistance, change gold, word silk-screen, cloth glue, shaping, in prior art, cloth glue has two kinds of modes, one is that cloth is on steel plate reinforcement plate 210, another is that cloth is in flexible circuit board 100, and preferred scheme of the present utility model is cloth adhesive plaster need fit on the position of steel disc reinforcement plate in flexible circuit board 100, when its effect is and in forming process, chip area is emptied, the glue of chip area is drawn together, to reduce the exposed glue when steel disc pressing, wiring board and production equipment are polluted.Circuit cabling and chip carrying region 110 be 0.2mm at least apart, to avoid injuring circuit when hollowing out chip carrying region 110 (referring to hereinafter).
Step 2, with the steel plate reinforcement plate 210 of steel plate evener leveling flexible circuit board 100.Because mostly the steel plate that making steel plate reinforcement plate adopts at present is web-like material, to be flattened steel plate by steel plate evener before using, then be made into the steel plate reinforcement plate mated with flexible circuit board, to guarantee the evenness after its laminating.If what buy is reached the sheet steel plate that flatness requirement requires, can flatten.
Step 3, the external form of punching flexible circuit board 100, simultaneously die-cut, hollow out the chip carrying region 110 delimited in step 1.This step preferably adopts mould die-cut, namely precise forming mold is opened, mould and die accuracy tolerance is in the scope of ± 0.05mm, and the mode of to be rushed by target for the location hole that mould is die-cut is out die-cut, its effect is that the precision of location hole target punching can accomplish ± 25um, more guarantee precision when external form is die-cut, especially chip empties the precision at place, so that the high accuracy of chip and module is installed.
Step 4, as shown in Figure 3 and Figure 4, fits in chip carrying region, flexible circuit board 100 back side 110 and covers described chip carrying region 110 by steel plate reinforcement plate 210.For ensureing the evenness of steel plate reinforcement plate 210, this step preferably uses pressing machine pressing steel plate reinforcement plate 210 and flexible circuit board 100, steel plate reinforcement plate 210 is placed on the auxiliary material of rigidity, flexible circuit board 100, just facing to the auxiliary face of fillibility, bends to the chip carrying region 110 hollowed out to avoid steel plate reinforcement plate 210.
Claims (3)
1. the flexible circuit board of a ultrathin camera module, comprise flexible circuit board and steel plate reinforcement plate, it is characterized in that: the circuit cabling of described flexible circuit board walks around this chip carrying region, the chip carrying region of described flexible circuit board hollows out, and described steel plate reinforcement plate fits in flexible circuitry back and covers its chip carrying region.
2. the flexible circuit board of ultrathin camera module according to claim 1, is characterized in that: the chip of described camera module is embedded on the steel plate reinforcement plate in chip carrying region.
3. the flexible circuit board of ultrathin camera module according to claim 1 and 2, is characterized in that: described circuit cabling and described chip carrying region are at least at a distance of 0.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520169230.0U CN204498460U (en) | 2015-03-24 | 2015-03-24 | A kind of flexible circuit board of ultrathin camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520169230.0U CN204498460U (en) | 2015-03-24 | 2015-03-24 | A kind of flexible circuit board of ultrathin camera module |
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| Publication Number | Publication Date |
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| CN204498460U true CN204498460U (en) | 2015-07-22 |
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| CN201520169230.0U Active CN204498460U (en) | 2015-03-24 | 2015-03-24 | A kind of flexible circuit board of ultrathin camera module |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104768323A (en) * | 2015-03-24 | 2015-07-08 | 深圳华麟电路技术有限公司 | Flexible circuit board of ultra-thin camera module and manufacturing of flexible circuit board |
| CN106559957A (en) * | 2016-04-01 | 2017-04-05 | 昆山丘钛微电子科技有限公司 | Rigid Flex and cell-phone camera module |
| CN108601216A (en) * | 2018-04-28 | 2018-09-28 | 济南浪潮高新科技投资发展有限公司 | A kind of PCB and PCB production methods |
-
2015
- 2015-03-24 CN CN201520169230.0U patent/CN204498460U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104768323A (en) * | 2015-03-24 | 2015-07-08 | 深圳华麟电路技术有限公司 | Flexible circuit board of ultra-thin camera module and manufacturing of flexible circuit board |
| CN106559957A (en) * | 2016-04-01 | 2017-04-05 | 昆山丘钛微电子科技有限公司 | Rigid Flex and cell-phone camera module |
| CN108601216A (en) * | 2018-04-28 | 2018-09-28 | 济南浪潮高新科技投资发展有限公司 | A kind of PCB and PCB production methods |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PP01 | Preservation of patent right |
Effective date of registration: 20220406 Granted publication date: 20150722 |
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| PP01 | Preservation of patent right |