CN204425776U - A kind of high-flatness Back Word type ink is windowed Rigid Flex - Google Patents
A kind of high-flatness Back Word type ink is windowed Rigid Flex Download PDFInfo
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- CN204425776U CN204425776U CN201520112148.4U CN201520112148U CN204425776U CN 204425776 U CN204425776 U CN 204425776U CN 201520112148 U CN201520112148 U CN 201520112148U CN 204425776 U CN204425776 U CN 204425776U
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Abstract
A kind of high-flatness Back Word type ink is windowed Rigid Flex, comprise rigid wiring board (101,102) and Flexible Printed Circuit (103), the chip area silk-screen of described rigid wiring board (101) has solder mask (109), it is characterized in that, described solder mask (109) has three-back-shaped window (108) of hollow out to rigid wiring board (101).Rigid Flex of the present utility model avoids positive and negative ink area difference, and evenness is high.
Description
Technical field
The utility model relates to the digital product such as mobile phone, computer camera module wiring board art, particularly relates to a kind of high-flatness Rigid Flex.
Background technology
At present, along with the continuous progress of science and technology, the requirement of people to quality life is more and more higher, and digital product is constantly to convenience and lightweight development, and the lift-launch of the camera of high pixel has become the trend of market development.The convenience of digital product and lightweight make the requirement of circuit board also more and more higher, the Rigid Flex that particularly the camera module of the digital product such as mobile phone, computer is conventional.
The support plate of the camera of the high pixel of consumer level is Rigid Flex now mostly, and thin Rigid Flex, represents and can make thinner module and thinner digital product.But when material stiffness cannot improve, thinner Rigid Flex, its morphotropism is larger, after SMT paster, the plate surface evenness of Rigid Flex does not often reach the requirement (at present in the industry cross Reflow Soldering after, the planarity requirements that carry the plane place of the Rigid Flex of chip be less than 50um) of encapsulation module chip to it.Exceed this scope, camera image blur after assembling can be made, the problem that focusing is inaccurate.
The high temperature of the temperatures as high 260 DEG C-300 DEG C of the welding of Rigid Flex device or Reflow Soldering, if evenness warpage is excessive after device welding, as the optical axis of the lens group 1002 in Fig. 1 and the off-centring of image sensor 1005 increase, affects the quality of module imaging.Rigid Flex each layer convergent force that Rigid Flex can cause because of the factor of welding resistance design is inconsistent, so scleroma plywood is easily out of shape, warpage, after especially crossing Reflow Soldering after SMT paster, distortion, the warpage of Rigid Flex can increase the weight of.The stability of the distortion warpage of ultra-thin Rigid Flex becomes the biggest obstacle making ultra-thin Rigid Flex.
At present, mobile phone camera module is with 8,000,000 pixels and above for main flow in the industry, a lot of 1,300 ten thousand pixels on market, the camera of more than 2,000 ten thousand pixels.Flatness requirement is more and more higher, simultaneously because camera module pixel is more and more higher, chip power-consumption is also more and more higher, the heat produced also gets more and more, as shown in Figure 3, so rigid wiring board 101 chip carrying chip can design behind be mostly provided with golden face 107 so that chip cooling, finished product thickness is in industry started to walk soon at the Rigid Flex of 0.25-0.45mm, due to its thinner thickness, its integral rigidity is more weak, and plate face is easily out of shape in components and parts attachment process.The structure of this and plank has much relations, and see Fig. 2, main manifestations is that bonding face (chip face) solder mask 106 area is comparatively large, accounts for the area of 80% of whole chip face, only has that a few place is irregular, area is very little commonly windows 104; The back side of chip place Rigid Flex is mainly occupied by golden face 107 that (this one side is gold-plated large copper face, for high-pixel camera head product ground connection and heat radiation, except several via needs with except the covering of welding resistance oil 106 ink, other is all exposed, so face ink area coverage about 20%), due to the difference of positive and negative solder mask area, make the convergent force of two sides when crossing 260 DEG C of high temperature inconsistent, punching shear is comparatively large, affects evenness.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of minimizing because of high-flatness Back Word type ink that solder mask difference in shrinkage affects evenness and windows Rigid Flex.
In order to solve the problems of the technologies described above, the utility model provides a kind of high-flatness Back Word type ink and to window Rigid Flex, comprise rigid wiring board and Flexible Printed Circuit, the chip area silk-screen of described rigid wiring board has solder mask, it is characterized in that, described solder mask has hollow out to the three-back-shaped of rigid wiring board and windows.
As optimal way, describedly three-back-shapedly to window and the width of wherein ink bridge is 0.4-1mm.
As optimal way, the thickness of described solder mask is 10-20um.
As optimal way, the another side in described rigid wiring board opposite chip region is provided with the golden face for dispelling the heat, and there is the solder mask of some covering vias on this surface, golden face.
The utility model is windowed by forming Back Word type to the solder mask in front, ink bridge is also in three-back-shaped accordingly, decrease the ink area in front on the one hand, reduce the difference of positive and negative ink area, on the other hand because the shape of ink bridge be three-back-shaped, thus often the shrinkage direction of circle ink bridge unlike original monoblock ink to central reduction, but to linear shrinkage in each ink bridge, make overall shrinkage become local contraction, make up area discrepancy further and bring excessive impact.Compared with prior art, the utility model shrinks inconsistent and warpage that is that produce because above two factors effectively reduce solder mask ink when element welds 260 DEG C of high temperature, obtains the Rigid Flex of high-flatness.
Further, ink thickness controls at 10-20um, within the scope of the ink thickness that this is very thin, the evenness of the convergent force and rear warpage modification of lowering the temperature after being conducive to element welding that can reduce ink is recovered, through creation data checking, the Rigid Flex that Back Word type ink is windowed promotes 4-12um than the evenness of common Rigid Flex of windowing after crossing stove.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail:
Fig. 1 is the assembling schematic diagram of camera in background technology.
Fig. 2 is the front schematic view of existing Rigid Flex in background technology.
Fig. 3 is the schematic rear view of existing Rigid Flex in background technology.
Fig. 4 is the front schematic view of the utility model Rigid Flex.
Fig. 5 is the cutaway view along A-A line in Fig. 4.
Embodiment
As shown in Figure 4 and Figure 5, the utility model high-flatness Back Word type ink Rigid Flex of windowing comprises rigid wiring board 101,102 and Flexible Printed Circuit 103, the chip area silk-screen of described rigid wiring board 101 has solder mask 109, the another side in this rigid wiring board 101 opposite chip region is provided with the golden face 107 for dispelling the heat equally, this surface, golden face 107 only has some vias to be coated with solder mask, and described solder mask 109 has hollow out to the three-back-shaped of rigid wiring board 101 and windows 108.
Three-back-shapedly 108 are windowed for forming this, the utility model provides high-flatness Back Word type ink and to window the manufacture method of Rigid Flex, comprise the following steps: step 1, rigid wiring board 101, 102 and Flexible Printed Circuit 103 adhesive solidification after, by boring, copper facing, the operations such as circuit making, outer-layer circuit is made the bare board becoming and only have and do not have solder mask, then at the rigid wiring board 101 of Rigid Flex, silk-screen solder mask 109 is covered on 102, low temperature precuring baking is carried out at the temperature of 80 ~ 100 DEG C, the effect of low-temperature bake is by preliminary for the ink of thickness precuring, step 2, figure on the anti-welding film is set to three-back-shaped, three-back-shaped Graphic transitions on the anti-welding film to solder mask 109 will be exposed by exposure machine, Shang the film ?look region be lightproof area, there is not polymeric chemical reaction and taken off by the liquid medicine of welding masking developing machine and wash off in the solder mask 109 in this region, is formed three-back-shapedly to window 108, solder mask 109 outside lightproof area is subject to exposure light irradiation, polymeric chemical reaction occurs, thus avoids being taken off by the liquid medicine of welding masking developing machine washing off, form ink bridge 110 described three-back-shaped windowing between 108, step 3, carries out high-temperature baking, is thoroughly solidified by solder mask at the temperature of 150-180 DEG C, step 4, surface treatment, changes gold shaping, obtains high-flatness Back Word type ink and to window Rigid Flex finished product.
Three-back-shaped window 108 width be preferably 0.4-1mm, the width of ink bridge 110 is equally also 0.4-1mm.108 are windowed by forming Back Word type, ink bridge 110 is also in three-back-shaped accordingly, decrease the ink area in front on the one hand, reduce the difference of positive and negative ink area, on the other hand because the shape of ink bridge 110 be three-back-shaped, thus often the shrinkage direction of circle ink bridge 110 unlike original monoblock ink to central reduction, but to linear shrinkage in each ink bridge 110, make overall shrinkage become local contraction, make up the impact that area discrepancy brings further.Above two factors effectively reduce solder mask when element welds 260 DEG C of high temperature ink shrink inconsistent and produce warpage; Ink thickness controls at 10-20um simultaneously, within the scope of the ink thickness that this is very thin, the evenness of the convergent force and rear warpage modification of lowering the temperature after being conducive to element welding that can reduce ink is recovered, through creation data checking, the Rigid Flex that Back Word type ink is windowed promotes 4-12um than the evenness of common Rigid Flex of windowing after crossing stove.
Claims (4)
1. a high-flatness Back Word type ink is windowed Rigid Flex, comprise rigid wiring board (101,102) and Flexible Printed Circuit (103), the chip area silk-screen of described rigid wiring board (101) has solder mask (109), it is characterized in that, described solder mask (109) has three-back-shaped window (108) of hollow out to rigid wiring board (101).
2. a kind of high-flatness Back Word type ink according to claim 1 is windowed Rigid Flex, it is characterized in that, describedly three-back-shapedly to window (108) and the width of wherein ink bridge (110) is 0.4-1mm.
3. a kind of high-flatness Back Word type ink according to claim 1 and 2 is windowed Rigid Flex, and it is characterized in that, the thickness of described solder mask (109) is 10-20um.
4. a kind of high-flatness Back Word type ink according to claim 3 is windowed Rigid Flex, the another side in described rigid wiring board (101) opposite chip region is provided with the golden face (107) for dispelling the heat, and there is the solder mask of some covering vias on this golden face (107) surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520112148.4U CN204425776U (en) | 2015-02-16 | 2015-02-16 | A kind of high-flatness Back Word type ink is windowed Rigid Flex |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520112148.4U CN204425776U (en) | 2015-02-16 | 2015-02-16 | A kind of high-flatness Back Word type ink is windowed Rigid Flex |
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| Publication Number | Publication Date |
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| CN204425776U true CN204425776U (en) | 2015-06-24 |
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| CN201520112148.4U Active CN204425776U (en) | 2015-02-16 | 2015-02-16 | A kind of high-flatness Back Word type ink is windowed Rigid Flex |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104661444A (en) * | 2015-02-16 | 2015-05-27 | 深圳华麟电路技术有限公司 | High-flatness rigid-flex board provided with ink windows shaped like dual nested rectangles and manufacturing method |
| CN105357875A (en) * | 2015-10-23 | 2016-02-24 | 清远市富盈电子有限公司 | Fabrication technology for light source high-reflectivity PCB |
| CN106559957A (en) * | 2016-04-01 | 2017-04-05 | 昆山丘钛微电子科技有限公司 | Rigid Flex and cell-phone camera module |
-
2015
- 2015-02-16 CN CN201520112148.4U patent/CN204425776U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104661444A (en) * | 2015-02-16 | 2015-05-27 | 深圳华麟电路技术有限公司 | High-flatness rigid-flex board provided with ink windows shaped like dual nested rectangles and manufacturing method |
| CN105357875A (en) * | 2015-10-23 | 2016-02-24 | 清远市富盈电子有限公司 | Fabrication technology for light source high-reflectivity PCB |
| CN106559957A (en) * | 2016-04-01 | 2017-04-05 | 昆山丘钛微电子科技有限公司 | Rigid Flex and cell-phone camera module |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PP01 | Preservation of patent right |
Effective date of registration: 20220406 Granted publication date: 20150624 |
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| PP01 | Preservation of patent right |