CN104768323A - Flexible circuit board of ultra-thin camera module and manufacturing of flexible circuit board - Google Patents
Flexible circuit board of ultra-thin camera module and manufacturing of flexible circuit board Download PDFInfo
- Publication number
- CN104768323A CN104768323A CN201510129852.5A CN201510129852A CN104768323A CN 104768323 A CN104768323 A CN 104768323A CN 201510129852 A CN201510129852 A CN 201510129852A CN 104768323 A CN104768323 A CN 104768323A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- camera module
- chip carrying
- carrying region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
The invention provides a flexible circuit board of an ultra-thin camera module and a manufacturing of the flexible circuit board. The method includes the following steps that 1, a chip carrying area to be hollowed out is defined on the flexible circuit board, wiring of the flexible circuit board is changed so that a line can avoid the chip carrying area, and the flexible circuit board is manufactured; 2, a steel plate reinforcing plate of the flexible circuit board is flattened so as to guarantee flatness of the flattened flexible circuit board; 3, the shape of the flexible circuit board is punched, and the defined chip carrying area in the step 1 is punched and hollowed out; 4, the steel plate reinforcing plate is attached to the back side of the chip area of the flexible circuit board and covers the chip carrying area. The aims of carrying the high-pixel camera module, reducing thickness and keeping flatness are achieved.
Description
Technical field
The present invention relates to the flexible circuit board of the ultrathin camera module of the digital product such as mobile phone, computer.
Background technology
Along with the continuous progress of science and technology, the requirement of people's logarithmic code product is more and more higher, and the convenience of digital product and lightweight are the continuous pursuits of people, and the high pixel of ultra-thin collocation has become the fashion main flow of market development.
At present, the mobile phone camera of less than 5000000 pixels can be arranged in flexible circuit board, but along with the raising (more than such as 8,000,000 or 1,000 ten thousand pixel) of mobile phone camera pixel, the structure of camera is more complicated, also require higher to the precision of focusing and speed, and cannot be arranged in flexible circuit board, therefore can only be arranged on rigid wiring board or Rigid Flex.Such as, in the industry mobile phone camera module with 8,000,000 and above pixel for main flow, the thickness of its conventional wiring board mostly is 0.30-0.40mm, and adopt four-layer soft and hard combined board more, but the material of Rigid Flex is FR4 or Prepreg prepreg mainly, these two kinds of materials are mainly made into by glass fibre yarn.Common plate (Normal Tg) is about 130 ~ 150 DEG C, and the Tg of high Tg plate can reach 170-210 DEG C.The temperature of SMT device welding is generally at 260-280 DEG C, and under the high temperature of 260 DEG C, FR4 or Prepreg prepreg glass fibre yarn can slowly to glassy transition, deliquescing, again can slowly to original recovering state after cooling.In this process, the wiring board evenness of camera module will make a variation increase, and plate surface evenness does not reach the requirement of encapsulation module chip to evenness, affects the quality of camera module imaging.Therefore, Rigid Flex is thinner, the more difficult control of evenness, flexible circuitry plate flatness is poorer than Rigid Flex, so the camera module of high pixel (as 8,000,000 pixels or higher pixel) is difficult to the support plate adopting flexible circuit board as camera module sensitive chip.
Except the puzzlement of evenness, the requirement of thickness is also had to be difficult to meet.From current present situation, the camera of existing more than 1,000 ten thousand pixels mainly or carrying finished product thickness of slab is the Rigid Flex of 0.3-0.4mm, mainly due to while the above pixel product of release ten million, handset also asks most ultra-thin, thick circuit board can make the thickness of camera finished product increase, and causes camera evagination obvious.Such as, the thinnest smart mobile phone in the whole world is vivo X5Max so far, and thickness is 4.75mm, and the camera pixel of lift-launch is 13,000,000.Provide data from the large data platform eWiseTech of smart machine, can see as shown in Figure 1, camera place reaches the thickness of 6.8mm, so the restriction of mobile phone camera module thickness is mobile phone do one of thin obstacle.That is, even if solve the problem of evenness thus be mounted in flexible circuit board by camera, be also difficult to reduce thickness, the problem that camera protrudes still is difficult to solve.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of for the lift-launch of high-pixel camera head mould group, reduction thickness, the flexible circuit board keeping the ultrathin camera module of evenness and preparation method thereof.
In order to solve the problems of the technologies described above, the invention provides a kind of manufacture method of flexible circuit board of ultrathin camera module, it is characterized in that: comprise the following steps,
Step 1, flexible circuit board delimited chip carrying region to be hollowed out, and the wiring of change flexible circuit board makes circuit cabling walk around this chip carrying region, and makes flexible circuit board;
Step 2, the steel plate reinforcement plate of leveling flexible circuit board, to guarantee the evenness after its laminating;
Step 3, the external form of punching flexible circuit board, simultaneously die-cut, hollow out the chip carrying region delimited in step 1;
Step 4, fits in the flexible circuit board chip area back side by steel plate reinforcement plate and covers described chip carrying region.
As optimal way, in described step 1, make flexible circuit board and comprise the steps: blanking, boring, copper facing, D.E.S, coverlay laminating, welding resistance, change gold, word silk-screen, cloth glue, shaping, wherein cloth adhesive plaster in the circuit board.
As optimal way, circuit cabling and chip carrying region at least distance 0.2mm in described step 1.
As optimal way, in described step 3, adopt mould die-cut, open precise forming mold, the mode of simultaneously being rushed by target for the location hole that mould is die-cut is out die-cut.
As optimal way, in described step 4, by pressing machine pressing steel plate reinforcement plate and flexible circuit board, steel plate reinforcement plate is placed on the auxiliary material of rigidity, and flexible circuit board is just facing to the auxiliary face of fillibility.
Present invention also offers a kind of flexible circuit board of ultrathin camera module, comprise flexible circuit board and steel plate reinforcement plate, it is characterized in that: the circuit cabling of described flexible circuit board walks around this chip carrying region, the chip carrying region of described flexible circuit board hollows out, and described steel plate reinforcement plate fits in flexible circuitry back and covers its chip carrying region.
As optimal way, the chip of described camera module is embedded on the steel plate reinforcement plate in chip carrying region.
As optimal way, described circuit cabling and described chip carrying region are at least at a distance of 0.2mm.
The chip carrying region of flexible circuit board of the ultrathin camera module of the present invention and preparation method thereof by hollowing out flexible circuit board, steel plate reinforcement plate is fitted in the flexible circuit board chip area back side and covers described chip carrying region, thus on the steel plate reinforcement plate that the chip of camera module can be embedded in chip carrying region, compared with traditional resolving ideas, the present invention is without the need to solving the problem of evenness when camera module carries in the circuit board, but directly camera module is mounted on steel plate reinforcement plate, for the lift-launch solving high-pixel camera head mould group provides new thinking.By above-mentioned improvement, ensure that the evenness of camera module mounting surface on the one hand, because the evenness of steel plate reinforcement plate can not affect by temperature during SMT paster, overcome the evenness defect that in prior art, flexible circuit board causes when SMT paster, effective combination realizing employing flexible circuit board and high-pixel camera head mould group, meets high-pixel camera head mould group to the requirement of evenness; On the other hand, the chip of camera module is fixed on steel plate reinforcement plate but not in flexible circuit board, decreases the thickness of one deck flexible circuit board, reduces the projecting degree of camera.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail:
Fig. 1 is the mobile phone vertical section thickness schematic diagram in background technology.
Fig. 2 is the front view of the flexible circuit board of the ultrathin camera module of the present invention.
Fig. 3 is the flexible circuit board of the ultrathin camera module of the present invention and steel plate reinforcement plate installation side view when fitting.
Fig. 4 is the end view of the flexible circuit board of the ultrathin camera module of the present invention.
Fig. 5 is the end view after the flexible circuit board chip of the ultrathin camera module of the present invention.
Embodiment
Be illustrated in figure 4 the end view of the flexible circuit board of the ultrathin camera module of the present invention, comprise flexible circuit board 100 and steel plate reinforcement plate 210,220, the chip carrying region 110 of described flexible circuit board 100 hollows out (see Fig. 2), described steel plate reinforcement plate 210 fits in flexible circuit board 100 back side and covers its chip carrying region 110, and the circuit cabling of described flexible circuit board 100 walks around this chip carrying region 110.After assembling side obtains this flexible circuit board, the chip 300 of camera module can be embedded on the steel plate reinforcement plate 210 in chip carrying region 110 (as shown in Figure 5), thus reduction thickness, namely decrease the thickness (0.1-0.25mm) of flexible circuit board 100.Because the heat conductivility of steel plate reinforcement plate 210 is better, it is higher that chip 300 is fixed on radiating efficiency after on steel plate reinforcement plate 210.
The manufacture method of the flexible circuit board of the ultrathin camera module of the present invention comprises following 4 steps:
Step 1, flexible circuit board 100 delimited chip carrying region 110 to be hollowed out, the wiring of change flexible circuit board 100 makes circuit cabling walk around this chip carrying region 110, and make flexible circuit board 100, the manufacturing process of flexible circuit board 100 adopts existing manufacture craft, specifically comprise the steps: blanking, boring, copper facing, D.E.S (development, etching, stripping), coverlay is fitted, welding resistance, change gold, word silk-screen, cloth glue, shaping, in prior art, cloth glue has two kinds of modes, one is that cloth is on steel plate reinforcement plate 210, another is that cloth is in flexible circuit board 100, and preferred scheme of the present invention is cloth adhesive plaster need fit on the position of steel disc reinforcement plate in flexible circuit board 100, when its effect is and in forming process, chip area is emptied, the glue of chip area is drawn together, to reduce the exposed glue when steel disc pressing, wiring board and production equipment are polluted.Circuit cabling and chip carrying region 110 be 0.2mm at least apart, to avoid injuring circuit when hollowing out chip carrying region 110 (referring to hereinafter).
Step 2, with the steel plate reinforcement plate 210 of steel plate evener leveling flexible circuit board 100.Because mostly the steel plate that making steel plate reinforcement plate adopts at present is web-like material, to be flattened steel plate by steel plate evener before using, then be made into the steel plate reinforcement plate mated with flexible circuit board, to guarantee the evenness after its laminating.If what buy is reached the sheet steel plate that flatness requirement requires, can flatten.
Step 3, the external form of punching flexible circuit board 100, simultaneously die-cut, hollow out the chip carrying region 110 delimited in step 1.This step preferably adopts mould die-cut, namely precise forming mold is opened, mould and die accuracy tolerance is in the scope of ± 0.05mm, and the mode of to be rushed by target for the location hole that mould is die-cut is out die-cut, its effect is that the precision of location hole target punching can accomplish ± 25um, more guarantee precision when external form is die-cut, especially chip empties the precision at place, so that the high accuracy of chip and module is installed.
Step 4, as shown in Figure 3 and Figure 4, fits in chip carrying region, flexible circuit board 100 back side 110 and covers described chip carrying region 110 by steel plate reinforcement plate 210.For ensureing the evenness of steel plate reinforcement plate 210, this step preferably uses pressing machine pressing steel plate reinforcement plate 210 and flexible circuit board 100, steel plate reinforcement plate 210 is placed on the auxiliary material of rigidity, flexible circuit board 100, just facing to the auxiliary face of fillibility, bends to the chip carrying region 110 hollowed out to avoid steel plate reinforcement plate 210.
Claims (8)
1. a manufacture method for the flexible circuit board of ultrathin camera module, is characterized in that: comprise the following steps,
Step 1, flexible circuit board delimited chip carrying region to be hollowed out, and the wiring of change flexible circuit board makes circuit cabling walk around this chip carrying region, and makes flexible circuit board;
Step 2, the steel plate reinforcement plate of leveling flexible circuit board, to guarantee the evenness after its laminating;
Step 3, the external form of punching flexible circuit board, simultaneously die-cut, hollow out the chip carrying region delimited in step 1;
Step 4, fits in the flexible circuit board chip area back side by steel plate reinforcement plate and covers described chip carrying region.
2. the manufacture method of the flexible circuit board of ultrathin camera module according to claim 1, it is characterized in that: in described step 1, make flexible circuit board and comprise the steps: blanking, boring, copper facing, D.E.S, coverlay laminating, welding resistance, change gold, word silk-screen, cloth glue, shaping, wherein cloth adhesive plaster in the circuit board.
3. the manufacture method of the flexible circuit board of ultrathin camera module according to claim 1, is characterized in that: circuit cabling and chip carrying region at least distance 0.2mm in described step 1.
4. the manufacture method of the flexible circuit board of ultrathin camera module according to claim 1, it is characterized in that: in described step 3, employing mould is die-cut, opens precise forming mold, and the mode of simultaneously being rushed by target for the location hole that mould is die-cut is out die-cut.
5. the manufacture method of the flexible circuit board of the ultrathin camera module according to Claims 1 to 4 any one, it is characterized in that: in described step 4, by pressing machine pressing steel plate reinforcement plate and flexible circuit board, steel plate reinforcement plate is placed on the auxiliary material of rigidity, and flexible circuit board is just facing to the auxiliary face of fillibility.
6. the flexible circuit board of a ultrathin camera module, comprise flexible circuit board and steel plate reinforcement plate, it is characterized in that: the circuit cabling of described flexible circuit board walks around this chip carrying region, the chip carrying region of described flexible circuit board hollows out, and described steel plate reinforcement plate fits in flexible circuitry back and covers its chip carrying region.
7. the flexible circuit board of ultrathin camera module according to claim 6, is characterized in that: the chip of described camera module is embedded on the steel plate reinforcement plate in chip carrying region.
8. the flexible circuit board of the ultrathin camera module according to claim 6 or 7, is characterized in that: described circuit cabling and described chip carrying region are at least at a distance of 0.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510129852.5A CN104768323A (en) | 2015-03-24 | 2015-03-24 | Flexible circuit board of ultra-thin camera module and manufacturing of flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510129852.5A CN104768323A (en) | 2015-03-24 | 2015-03-24 | Flexible circuit board of ultra-thin camera module and manufacturing of flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104768323A true CN104768323A (en) | 2015-07-08 |
Family
ID=53649833
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510129852.5A Pending CN104768323A (en) | 2015-03-24 | 2015-03-24 | Flexible circuit board of ultra-thin camera module and manufacturing of flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104768323A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105578736A (en) * | 2016-03-15 | 2016-05-11 | 深圳华麟电路技术有限公司 | High-cooling-efficiency FPC board used for camera module group and manufacturing method thereof |
| WO2016180378A3 (en) * | 2015-05-14 | 2016-12-29 | 宁波舜宇光电信息有限公司 | Image capturing module and assembly method therefor |
| CN106559609A (en) * | 2015-09-29 | 2017-04-05 | 宁波舜宇光电信息有限公司 | Camera module and its assemble method |
| CN106851979A (en) * | 2016-12-28 | 2017-06-13 | 深圳天珑无线科技有限公司 | A kind of electronic equipment and Portable intelligent terminal |
| CN110267454A (en) * | 2019-06-26 | 2019-09-20 | 深圳市新宇腾跃电子有限公司 | A kind of FPC production technology and structure |
| CN110430678A (en) * | 2019-07-23 | 2019-11-08 | 深圳市蓝特电路板有限公司 | A kind of manufacture craft of flexible circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000277667A (en) * | 1999-03-25 | 2000-10-06 | Sumitomo Bakelite Co Ltd | Interposer with reinforcing plate and manufacture thereof |
| CN101064989A (en) * | 2006-04-30 | 2007-10-31 | 比亚迪股份有限公司 | Multi-layer flexible circuit board and its producing method |
| US20140027158A1 (en) * | 2012-07-30 | 2014-01-30 | Hon Hai Precision Industry Co., Ltd. | Circuit board assembly with flexible printed circuit board and reinforcing plate |
| CN203722914U (en) * | 2014-01-13 | 2014-07-16 | 上海温良昌平电器科技有限公司 | Flexible printed circuit board |
| CN204498460U (en) * | 2015-03-24 | 2015-07-22 | 深圳华麟电路技术有限公司 | A kind of flexible circuit board of ultrathin camera module |
-
2015
- 2015-03-24 CN CN201510129852.5A patent/CN104768323A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000277667A (en) * | 1999-03-25 | 2000-10-06 | Sumitomo Bakelite Co Ltd | Interposer with reinforcing plate and manufacture thereof |
| CN101064989A (en) * | 2006-04-30 | 2007-10-31 | 比亚迪股份有限公司 | Multi-layer flexible circuit board and its producing method |
| US20140027158A1 (en) * | 2012-07-30 | 2014-01-30 | Hon Hai Precision Industry Co., Ltd. | Circuit board assembly with flexible printed circuit board and reinforcing plate |
| CN203722914U (en) * | 2014-01-13 | 2014-07-16 | 上海温良昌平电器科技有限公司 | Flexible printed circuit board |
| CN204498460U (en) * | 2015-03-24 | 2015-07-22 | 深圳华麟电路技术有限公司 | A kind of flexible circuit board of ultrathin camera module |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016180378A3 (en) * | 2015-05-14 | 2016-12-29 | 宁波舜宇光电信息有限公司 | Image capturing module and assembly method therefor |
| CN106559609A (en) * | 2015-09-29 | 2017-04-05 | 宁波舜宇光电信息有限公司 | Camera module and its assemble method |
| CN106559609B (en) * | 2015-09-29 | 2019-11-29 | 宁波舜宇光电信息有限公司 | Camera module and its assemble method |
| CN105578736A (en) * | 2016-03-15 | 2016-05-11 | 深圳华麟电路技术有限公司 | High-cooling-efficiency FPC board used for camera module group and manufacturing method thereof |
| CN106851979A (en) * | 2016-12-28 | 2017-06-13 | 深圳天珑无线科技有限公司 | A kind of electronic equipment and Portable intelligent terminal |
| CN110267454A (en) * | 2019-06-26 | 2019-09-20 | 深圳市新宇腾跃电子有限公司 | A kind of FPC production technology and structure |
| CN110430678A (en) * | 2019-07-23 | 2019-11-08 | 深圳市蓝特电路板有限公司 | A kind of manufacture craft of flexible circuit board |
| CN110430678B (en) * | 2019-07-23 | 2022-05-06 | 深圳市蓝特电路板有限公司 | Manufacturing process of flexible circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104768323A (en) | Flexible circuit board of ultra-thin camera module and manufacturing of flexible circuit board | |
| CN110191216B (en) | Cover plate assembly, display device, electronic equipment and assembly method of electronic equipment | |
| TWI742441B (en) | Camera module, photosensitive element and manufacturing method thereof | |
| CN109688303B (en) | Photosensitive assembly jointed board, photosensitive assembly, camera shooting module and manufacturing method | |
| CN204498460U (en) | A kind of flexible circuit board of ultrathin camera module | |
| CN110149470B (en) | Electronic equipment | |
| CN209964110U (en) | Cover plate assembly, display device and electronic equipment thereof | |
| CN104661444A (en) | High-flatness rigid-flex board provided with ink windows shaped like dual nested rectangles and manufacturing method | |
| CN209964152U (en) | Electronic device | |
| CN104808857A (en) | Full-laminating double-side touch display screen and manufacturing technology thereof | |
| CN110708891B (en) | Preparation method of circuit board for steel sheet embedded CCM module | |
| CN205667019U (en) | Sunken rigid -flexible printed circuit board | |
| CN110677979B (en) | Preparation method of circuit board for CCM module | |
| CN101374162A (en) | Mobile phone with external antennae and preparation method thereof | |
| CN110533008A (en) | Optical bio identifies mould group and preparation method, display device and electronic equipment | |
| CN204425776U (en) | A kind of high-flatness Back Word type ink is windowed Rigid Flex | |
| CN104039068A (en) | Ultra-thin rigid-flex (R-F) circuit board and manufacturing method thereof | |
| CN116234192B (en) | Electronic device, housing assembly, protective assembly, decoration and assembly method | |
| CN208298141U (en) | Metal grill sensor and touch screen | |
| CN108122476B (en) | Method for making mark on mobile phone cover plate and mobile phone | |
| CN217336017U (en) | Half soft and hard combined plate of regional two-sided circuit buckles | |
| CN207340274U (en) | A kind of PCB produces plate | |
| CN206962877U (en) | Integrated form camera and mobile phone | |
| CN209964156U (en) | Electronic device | |
| CN209964157U (en) | Electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150708 |
|
| WD01 | Invention patent application deemed withdrawn after publication |