CN110430678B - Manufacturing process of flexible circuit board - Google Patents
Manufacturing process of flexible circuit board Download PDFInfo
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- CN110430678B CN110430678B CN201910666228.7A CN201910666228A CN110430678B CN 110430678 B CN110430678 B CN 110430678B CN 201910666228 A CN201910666228 A CN 201910666228A CN 110430678 B CN110430678 B CN 110430678B
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- fpc
- circuit board
- pasting
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- film
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a manufacturing process of a flexible circuit board, which comprises the following steps: manufacturing an FPC, pasting a covering film, manufacturing an FPC solder mask, sinking gold, testing a flying probe, pasting an electromagnetic protection film, cutting the appearance for the first time, assembling small steel sheets, SMT (surface mount technology) pasting, assembling special-shaped steel sheets, cutting the appearance for the second time, pasting conductive foam, a sound-transmitting film and waterproof glue, testing, finally detecting, packaging and warehousing; the flexible circuit board manufactured by the invention has all the advantages of the rigid-flexible printed circuit board, and meanwhile, the thickness of a rigid board area in the rigid-flexible printed circuit board can be reduced, and the thickness of a terminal product can be reduced.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to a manufacturing process of a flexible circuit board.
[ background of the invention ]
The development along with the hardware is dressed to intelligence, intelligent hardware such as similar intelligent wrist-watch is designed and developed, the cassette welding of the SIM card of current intelligent wrist-watch is on the PCB board, but the PCB board is thicker, it will be difficult to reduce the thickness of intelligent wrist-watch, people have invented for this reason and have welded the cassette of SIM card on FPC, FPC is thin, but too soft, damage the welding point easily when the plug-in card, people adopt special-shaped steel sheet to strengthen FPC for this reason, make the intensity improvement after FPC is connected with the cassette of SIM card, but bring some difficulties for the manufacturing of circuit board like this.
The invention is researched and proposed aiming at the defects of the prior art.
[ summary of the invention ]
The invention aims to solve the technical problem of providing a manufacturing process of a flexible circuit board, wherein the flexible circuit board manufactured by the invention has all the advantages of a rigid-flex board, and meanwhile, the thickness of a rigid board area in the rigid-flex board can be reduced, and the thickness of a terminal product can be reduced.
The manufacturing process of the flexible circuit board provided by the invention can be used for solving the technical problem, and comprises the following steps:
s01, manufacturing FPC, cutting the double-sided copper foil non-adhesive base material into a fixed size, drilling, hole metallization, cleaning, dry film pasting, exposure, development, etching and film stripping, AOI detection and chemical cleaning to obtain FPC with manufactured front circuit and back circuit;
s02, attaching a cover film, aligning the cover film, attaching the cover film to the FPC, and pressing and curing the cover film;
s03, manufacturing a solder mask of the FPC, silk-screening photosensitive ink on the front side and the back side of the FPC, and obtaining the FPC with the solder mask after pre-drying, exposure, development, curing and cleaning;
s04, gold immersion, wherein the FPC with the solder mask layer is subjected to plate grinding and gold immersion;
s05, flying probe testing, namely, performing flying probe testing on the FPC subjected to gold immersion;
s06, pasting an electromagnetic protection film, pasting the electromagnetic protection film on the front surface and the back surface of the FPC, and pressing;
s07, cutting the shape for the first time, and cutting the shape of the FPC bonding small steel sheet area by using a laser cutting machine;
s08, assembling the small steel sheets, adhering the small steel sheets to the FPC, and performing pressing and cleaning;
s09, SMT pasting, and welding the electronic component on the FPC;
s10, assembling a special-shaped steel sheet in the area where the SIM card holder is welded, firstly pasting a conductive adhesive on the front surface of the FPC, tearing off the release film, and then pasting the special-shaped steel sheet on the FPC;
s11, cutting the shape for the second time, and cutting the rest uncut shapes of the FPC by using a laser cutting machine;
s12, adhering conductive foam, a sound-transmitting film and waterproof glue, and adhering the conductive foam, the sound-transmitting film and the waterproof glue to the FPC;
and S13, testing, finally detecting, packaging and warehousing.
In the manufacturing process of the flexible circuit board, after the chemical cleaning is completed in step S01, the first impedance test is performed on the circuit, and the first impedance test requires that the resistance value satisfies: 120 omega-138 omega.
After step S04 is completed, the manufacturing process of the flexible printed circuit board performs a second impedance test on the circuit, where the second impedance test requires that the resistance value satisfies: 112 omega to 130 omega.
After step S06 is completed, the third impedance test is performed on the circuit, where the third impedance test requires that the resistance value satisfies: 85 omega-103 omega.
After step S10 is completed, the ICT test is performed on the FPC, and then the fourth impedance test is performed on the circuit, where the fourth impedance test requires that the resistance value satisfies: 81 omega to 99 omega.
In the manufacturing process of the flexible circuit board, in step S03, the curing temperature is 145-155 ℃, and the duration is 55-65 min.
In step S09, the manufacturing process of the flexible printed circuit board is performed by dispensing the data line connector, wherein the glue is used in the form of the adhesive solution of the debadon 6220.
Compared with the prior art, the invention has the following advantages:
1. the flexible circuit board manufactured by the invention has all the advantages of the rigid-flexible printed circuit board, and meanwhile, the thickness of a rigid board area in the rigid-flexible printed circuit board can be reduced, and the thickness of a terminal product can be reduced.
2. The invention adds the steps S03-S13 on the basis of the traditional FPC production process, and manufactures the solder mask on the traditional FPC to lay a foundation for welding electronic components on the FPC.
3. The flat small steel sheet is pressed on the FPC, so that the FPC is harder under the condition of ensuring low thickness, and the reliability and stability of the electronic element welded on the FPC are improved.
4. Before the small steel sheets are assembled, the appearance is firstly cut for the first time, the outer side of the small steel sheet area of the FPC is cut out, the small steel sheets are convenient to position when being adhered, and the accuracy of adhering the small steel sheets is improved.
5. The area of the SIM card holder is welded is reinforced by the special-shaped steel sheet, so that the connection stability of the SIM card holder and the FPC can be improved, and the connection contact of the SIM card holder and the FPC, which is damaged during card insertion, is reduced.
[ description of the drawings ]
The following detailed description of embodiments of the invention is provided in conjunction with the appended drawings, in which:
FIG. 1 is a schematic front view of a finished product according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a back structure of a finished product according to an embodiment of the present invention;
the shaded portion in fig. 3 is the area of the front-side screen-printed photosensitive ink in step S03 of the embodiment of the present invention;
the shaded portion in fig. 4 is the area of the back-side screen printing photosensitive ink in step S03 of the embodiment of the present invention;
the shaded portion in fig. 5 is the area of the electromagnetic protection film attached on the front side in step S06 of the embodiment of the present invention;
the shaded portion in fig. 6 is the region of the electromagnetic protection film attached on the back side in step S06 of the embodiment of the present invention;
FIG. 7 shows the installation positions of the small steel sheets and the special-shaped steel sheets according to the embodiment of the invention;
FIG. 8 is a side view of a profiled steel sheet according to an embodiment of the present invention;
FIG. 9 is a top view of a profiled steel sheet according to an embodiment of the present invention.
[ detailed description ] embodiments
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
As shown in fig. 1 to 9, the manufacturing process of the flexible printed circuit board of this embodiment includes the following steps:
s01, manufacturing FPC, cutting the double-sided copper foil non-adhesive base material into a fixed size, drilling, hole metallization, cleaning, dry film pasting, exposure, development, etching and film stripping, AOI detection and chemical cleaning to obtain FPC with manufactured front circuit and back circuit;
s02, attaching a cover film, aligning the cover film, attaching the cover film to the FPC, and pressing and curing the cover film;
s03, manufacturing a solder mask of the FPC, silk-screening photosensitive ink on the front side and the back side of the FPC, and obtaining the FPC with the solder mask after pre-drying, exposure, development, curing and cleaning;
s04, gold immersion, wherein the FPC with the solder mask layer is subjected to plate grinding and gold immersion;
s05, flying probe testing, namely, performing flying probe testing on the FPC subjected to gold immersion;
s06, pasting an electromagnetic protection film, pasting the electromagnetic protection film on the front surface and the back surface of the FPC, and pressing;
s07, cutting the shape for the first time, namely cutting the shape of the FPC bonding small steel sheet 101 area by using a laser cutting machine;
s08, assembling the small steel sheet 101, adhering the small steel sheet 101 to the FPC, and performing pressing and cleaning;
s09, SMT pasting, and welding the electronic component on the FPC;
s10, assembling the special-shaped steel sheet 102 in the area where the SIM card holder is welded, firstly pasting conductive adhesive on the front surface of the FPC, tearing off the release film, and then pasting the special-shaped steel sheet 102 on the FPC;
s11, cutting the shape for the second time, and cutting the rest uncut shapes of the FPC by using a laser cutting machine;
s12, adhering conductive foam, a sound-transmitting film and waterproof glue, and adhering the conductive foam, the sound-transmitting film and the waterproof glue to the FPC;
and S13, testing, finally detecting, packaging and warehousing.
In order to ensure that the line impedance value reaches the requirement, the present embodiment performs four impedance tests, which are respectively as follows:
after the chemical cleaning is completed in step S01, a first impedance test is performed on the line, where the first impedance test requires that the resistance value satisfy: 120 omega-138 omega.
After step S04 is completed, performing a second impedance test on the line, where the second impedance test requires that the resistance value satisfy: 112 omega to 130 omega.
After step S06 is completed, performing a third impedance test on the line, where the third impedance test requires that the resistance value satisfies: 85-103 omega.
After step S10 is completed, performing ICT test on the FPC, and then performing a fourth impedance test on the line, where the fourth impedance test requires that the resistance value satisfies: 81 omega to 99 omega.
In order to ensure the stability of the solder resist, in step S03, the curing temperature is 145 to 155 ℃ for 55 to 65 min.
In order to improve the stability of the connection between the data line connector and the FPC, in step S09, a glue dispensing process is performed on the data line connector, wherein the glue is used by daub 6220.
The embodiments described above are merely intended to enable those skilled in the art to better implement or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (7)
1. A manufacturing process of a flexible circuit board is characterized by comprising the following steps:
s01, manufacturing FPC, cutting the double-sided copper foil non-adhesive base material into a fixed size, drilling, hole metallization, cleaning, dry film pasting, exposure, development, etching and film stripping, AOI detection and chemical cleaning to obtain FPC with manufactured front circuit and back circuit;
s02, attaching a cover film, aligning the cover film, attaching the cover film to the FPC, and pressing and curing the cover film;
s03, manufacturing a solder mask of the FPC, silk-screening photosensitive ink on the front side and the back side of the FPC, and obtaining the FPC with the solder mask after pre-drying, exposure, development, curing and cleaning;
s04, gold immersion, wherein the FPC with the solder mask layer is subjected to plate grinding and gold immersion;
s05, flying probe testing, namely, performing flying probe testing on the FPC subjected to gold immersion;
s06, pasting an electromagnetic protection film, pasting the electromagnetic protection film on the front surface and the back surface of the FPC, and pressing;
s07, cutting the shape for the first time, and cutting the shape of the FPC bonding small steel sheet (101) area by using a laser cutting machine;
s08, assembling the small steel sheet (101), adhering the small steel sheet (101) to the FPC, and performing pressing and cleaning;
s09, SMT pasting, and welding the electronic component on the FPC;
s10, assembling a special-shaped steel sheet (102) in the area where the SIM card holder is welded, firstly pasting a conductive adhesive on the front surface of the FPC, tearing off the release film, and then pasting the special-shaped steel sheet (102) on the FPC;
s11, cutting the shape for the second time, and cutting the rest uncut shapes of the FPC by using a laser cutting machine;
s12, adhering conductive foam, a sound-transmitting film and waterproof glue, and adhering the conductive foam, the sound-transmitting film and the waterproof glue to the FPC;
and S13, testing, finally detecting, packaging and warehousing.
2. The manufacturing process of the flexible circuit board according to claim 1, wherein after the step S01 of completing the chemical cleaning, a first impedance test is performed on the circuit, and the first impedance test requires that the resistance value satisfies: 120 omega-138 omega.
3. The manufacturing process of the flexible circuit board according to claim 1, wherein after step S04 is completed, a second impedance test is performed on the circuit, and the second impedance test requires that the resistance value satisfies: 112 omega to 130 omega.
4. The manufacturing process of the flexible circuit board according to claim 1, wherein after step S06 is completed, a third impedance test is performed on the circuit, and the third impedance test requires that the resistance value satisfies: 85 omega-103 omega.
5. The manufacturing process of the flexible circuit board according to claim 1, wherein after step S10 is completed, ICT test is performed on the FPC, and then fourth impedance test is performed on the circuit, wherein the fourth impedance test requires that the resistance value satisfies: 81 omega to 99 omega.
6. The manufacturing process of the flexible circuit board according to claim 1, wherein in step S03, the curing temperature is 145 ℃ to 155 ℃ and the duration is 55min to 65 min.
7. The process of claim 1, wherein in step S09, the data line connector is subjected to glue dispensing, wherein the glue is used as a glue solution in a form of a bang 6220.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910666228.7A CN110430678B (en) | 2019-07-23 | 2019-07-23 | Manufacturing process of flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910666228.7A CN110430678B (en) | 2019-07-23 | 2019-07-23 | Manufacturing process of flexible circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN110430678A CN110430678A (en) | 2019-11-08 |
| CN110430678B true CN110430678B (en) | 2022-05-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910666228.7A Active CN110430678B (en) | 2019-07-23 | 2019-07-23 | Manufacturing process of flexible circuit board |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112969276A (en) * | 2021-02-02 | 2021-06-15 | 隽美经纬电路有限公司 | Flexible circuit board for demisting car lamp and manufacturing process thereof |
| CN113438813B (en) * | 2021-06-21 | 2022-04-26 | 淮安帝泰华懋精密科技有限公司 | FPC reinforcement steel sheet material collecting device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200994133Y (en) * | 2006-11-29 | 2007-12-19 | 中兴通讯股份有限公司 | Mobile phone SIM card seat fixing structure |
| CN104768323A (en) * | 2015-03-24 | 2015-07-08 | 深圳华麟电路技术有限公司 | Flexible circuit board of ultra-thin camera module and manufacturing of flexible circuit board |
| CN106122824A (en) * | 2016-07-15 | 2016-11-16 | 天禧光电科技有限公司 | LED lamp bar SMT low temperature process |
| CN107623996A (en) * | 2017-09-27 | 2018-01-23 | 昆山圆裕电子科技有限公司 | FPC and steel disc part pressing manufacture method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150338879A1 (en) * | 2014-05-23 | 2015-11-26 | Kabushiki Kaisha Toshiba | Circuit board device |
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2019
- 2019-07-23 CN CN201910666228.7A patent/CN110430678B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200994133Y (en) * | 2006-11-29 | 2007-12-19 | 中兴通讯股份有限公司 | Mobile phone SIM card seat fixing structure |
| CN104768323A (en) * | 2015-03-24 | 2015-07-08 | 深圳华麟电路技术有限公司 | Flexible circuit board of ultra-thin camera module and manufacturing of flexible circuit board |
| CN106122824A (en) * | 2016-07-15 | 2016-11-16 | 天禧光电科技有限公司 | LED lamp bar SMT low temperature process |
| CN107623996A (en) * | 2017-09-27 | 2018-01-23 | 昆山圆裕电子科技有限公司 | FPC and steel disc part pressing manufacture method |
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| Publication number | Publication date |
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| CN110430678A (en) | 2019-11-08 |
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