JPS6356991A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPS6356991A JPS6356991A JP20045186A JP20045186A JPS6356991A JP S6356991 A JPS6356991 A JP S6356991A JP 20045186 A JP20045186 A JP 20045186A JP 20045186 A JP20045186 A JP 20045186A JP S6356991 A JPS6356991 A JP S6356991A
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- layer
- printed wiring
- insulating substrate
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000010410 layer Substances 0.000 claims description 56
- 239000004020 conductor Substances 0.000 claims description 41
- 239000000758 substrate Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 16
- 238000005530 etching Methods 0.000 claims description 15
- 239000012790 adhesive layer Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 238000001259 photo etching Methods 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 239000011888 foil Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 239000003292 glue Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000037303 wrinkles Effects 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、配線と部品搭載の両穀能を持つプリント配
Ｉ！Ｉｌ板の製造法に関し、より詳細には選択的なフォ
］へエツヂレグ法ににってより品質の高いプリント配線
板を’！ｌ ３２ｉづ′る方法に関する。[Detailed Description of the Invention] (Field of Industrial Application) This invention is a printed wiring board that has both wiring and component mounting capabilities! Regarding the manufacturing method of Il boards, in more detail, we use the selective photo-edzireg method to produce higher quality printed wiring boards! 32i.
（従来の技術）
従来、プリント配線板は、一般的に、フォトエツチング
法などにより製造されている。特に、第２図に示すよう
な窓あきプリント配ｖＡ根や先端露出プリント配線板な
どの導体配線パターンをその下から支持する絶縁基板部
分が存在ｉ！ザに導体パターンがむき出しになっている
箇所を部分的に有するプリント配線板の製造法は、第３
図にその工程を示づように、のりなどの接台剤層３１を
介して導体金属箔３２を絶縁基板３３にプレス接着し、
この金属層をフォトエツチング法によって配線パターン
３４を形成してなるものである。この例では、端辺や窓
３５からむき出した導体パターン３６が露出する。(Prior Art) Conventionally, printed wiring boards have generally been manufactured by a photoetching method or the like. In particular, there is an insulating substrate part that supports conductor wiring patterns such as window-perforated printed wiring boards and printed wiring boards with exposed tips as shown in Figure 2 from below. The manufacturing method of a printed wiring board having a part where the conductor pattern is exposed is the third method.
As shown in the figure, a conductive metal foil 32 is press-bonded to an insulating substrate 33 via a bonding agent layer 31 such as glue,
A wiring pattern 34 is formed on this metal layer by photoetching. In this example, the conductor pattern 36 exposed from the edge and window 35 is exposed.
（発明が解決しようとする問題点）
しかしながら、導体金属箔３２と絶縁基板３３とは、従
来の方法で、プレス接着されるので、特に、必要な形状
にくり抜き加工された絶縁基板のように導体金属箔の一
部に絶縁基板と接着しない部分が存在する場合、基板で
支持される部分と基板で支１）されない部分との境界に
段差が生じ、また、基板で支持されない導体金属箔部分
に延びや皺が生じる。そのために、フォトエツチング工
程に、ｔ５いて上記の段差、延びおよび皺によってレジ
ストの密着不良およびレジスト厚の不均一を起して配線
パターンの断線もしくは短絡を起こす。この問題点は、
特に高密度、微細な配線パターンである程顕著である。(Problem to be Solved by the Invention) However, since the conductive metal foil 32 and the insulating substrate 33 are press-bonded using a conventional method, it is particularly difficult to use a conductor metal foil 32 and an insulating substrate 33, such as an insulating substrate hollowed out into a required shape. If there is a part of the metal foil that does not adhere to the insulating board, there will be a step between the part supported by the board and the part not supported by the board, and the part of the conductive metal foil that is not supported by the board will Stretching and wrinkles occur. Therefore, at t5 in the photo-etching process, the above-mentioned steps, extensions and wrinkles cause poor adhesion of the resist and non-uniform resist thickness, resulting in disconnection or short-circuiting of the wiring pattern. This problem is
This is particularly noticeable in higher-density and finer wiring patterns.
この発明は上述の事情を背景とするものであり、その目
的とするところは高密度、微Ｉ’ｌｌな配線パターンを
有するプリント配線板を製造する方法、特に、導体パタ
ーンをその下から支持１［る絶縁基板部分が存在せず導
体パターンの一部がむき出しになっているプリント配線
板を、配線パターンの断線や短絡なく、製造することの
できる方法を提供覆ることである。The present invention is based on the above-mentioned circumstances, and its object is to provide a method for manufacturing a printed wiring board having a high-density, minute wiring pattern. [To provide a method for manufacturing a printed wiring board in which there is no insulating substrate part and a part of the conductor pattern is exposed without disconnection or short circuit of the wiring pattern.
（問題点を解決するための手段）
本発明者らはプリント配線板の製造工程について種々の
試験・研究を行った結果、この発明のプリント配線板を
製造する方法を完成するに至った。(Means for Solving the Problems) The present inventors conducted various tests and research on the manufacturing process of printed wiring boards, and as a result, they completed the method of manufacturing printed wiring boards of the present invention.
１“なりら、この発明ににる方法は、次の工程からなる
ことを特徴とするプリント配線板の製造法である。1", the method according to the present invention is a method for manufacturing a printed wiring board characterized by comprising the following steps.
（ａ） 導電層と支持層とからなる積層板の該ど１電
層をフォトエツチング法
の導体パターンを形成づる工程
（ｂ） 接着剤層が表面に設けられた所定形状の絶縁
基板を、該接着剤層を介して該導体パターン面に接合さ
せる工程
（ｃ） 該支持層を選択的にエツチング除去して該導
体パターンを露出させる工程
この発明の好ましい態様として、（ａ）工程で用いる積
層板を、二種の金属層からなるものとすることができる
。(a) Step of forming a conductive pattern by photo-etching each conductive layer of a laminate consisting of a conductive layer and a supporting layer. (b) An insulating substrate of a predetermined shape with an adhesive layer provided on the surface. A step (c) of bonding to the surface of the conductor pattern via an adhesive layer A step of selectively etching away the support layer to expose the conductor pattern As a preferred embodiment of the present invention, the laminate used in step (a) may consist of two metal layers.
さらに、別の態様として、絶縁基板を、その−部で接着
剤層を介して導体パターンと接解しないものとすること
ができる。Furthermore, as another embodiment, the insulating substrate may not be connected to the conductive pattern through the adhesive layer at the negative portion thereof.
以下、この発明を、第１図を参照しつつ、より詳細に説
明する。Hereinafter, this invention will be explained in more detail with reference to FIG.
この発明の製造法の導体パターン形成工程において、導
電層と支持層とからなるＶ４層板が用いられる。この導
電層はフォトエツチング法によって導体パターンに形成
されるものであり、少なくとも導電性を有する。また、
支持層は製造中力電位または導体パターンを機械的に支
持するものであり、少なくとも機械的強度を有する。従
って、導電層おＪ：び支持層の材質の種類（よ、それぞ
れの癲能に応じて適宜選択されるが、選択的エツチング
のために、各々は異種のものである。王のような導電層
の材料として、アルミニウム、銀、銅、ニッケル、金、
はんだなどの合金などがあり、支持層の材料として、ア
ルミニウム、銀、銅、ステンレス鋼、チタン、鉄、亜鉛
、などの金属、ポリイミド、エポキシ樹脂などのエツチ
ング可能な樹脂などがある。好ましい積層板として、第
１図に示す積層板２のように二種の舎属幀すなわＪ５導
電層３と支持層４とからなる複合材を用いることができ
る。フォトエツチング法によって支持層４上に所望の導
体パターン５を形成する。この発明において、フォトエ
ツチング法は通常の技術による。In the conductor pattern forming step of the manufacturing method of this invention, a V4 layer plate consisting of a conductive layer and a support layer is used. This conductive layer is formed into a conductive pattern by photoetching and has at least electrical conductivity. Also,
The support layer mechanically supports the force potential or conductor pattern during manufacture and has at least mechanical strength. Therefore, the types of materials for the conductive layer and the support layer are appropriately selected depending on their respective properties, but due to selective etching, each is of a different type. Layer materials include aluminum, silver, copper, nickel, gold,
Examples include alloys such as solder, and materials for the support layer include metals such as aluminum, silver, copper, stainless steel, titanium, iron, and zinc, and etched resins such as polyimide and epoxy resin. As a preferred laminate, a composite material consisting of two types of conductive layer 3 and support layer 4, such as laminate 2 shown in FIG. 1, can be used. A desired conductor pattern 5 is formed on the support layer 4 by photoetching. In this invention, the photoetching method is a conventional technique.
例えば、導電層３の表面にフォトレジストを塗布し、こ
の上に所要のパターンの画かれたマスク（フォトマスク
）などをのせ、紫外線などを照射して、未感光のレジス
トを選択的に除去し、残ったレジストをマスクとしてｉ
４重層をエツチングすることができる。For example, a photoresist is applied to the surface of the conductive layer 3, a mask (photomask) with a desired pattern is placed on top of the photoresist, and the unexposed resist is selectively removed by irradiating it with ultraviolet rays or the like. , use the remaining resist as a mask i
Four layers can be etched.
次いで、接着剤層、例えば生硬化状態ののり層７が表面
に設けられた所定形状の絶縁基板６を準備する。絶縁基
板６は、所定の寸法、形状、また、第１図に示すような
窓部８を成形するために必要な加工が副される。この絶
縁基板６は、のり層７を介して導体パターン５と接合さ
せる。この発明において用いられる絶縁基板としては、
エポキシ樹脂、ポリイミド樹脂、ポリアミド樹脂、不飽
和ポリエステル樹脂などの樹脂、これらにガラス絨Ｉｆ
ｆなどの補強剤が充填されたもの、紙、布、金属板など
と積層したものなどがある。接着剤としては、種々のも
のを使用することができ、適宜選択して用いるが、絶縁
性を有するものである。接着剤による絶縁基板６と導体
パターン５との接合は、接着剤の種類などに応じて、通
常の接合法のなかから適宜選択して行なうことが望まし
い。例えば、半硬化状ののりを用いてプレスＩＩＩし、
こののりが導体パターン５の間隙にも充填させ、次いで
熱硬化させることができる。Next, an insulating substrate 6 having a predetermined shape and having an adhesive layer, for example, a green adhesive layer 7 provided on its surface, is prepared. The insulating substrate 6 has a predetermined size and shape, and is subjected to processing necessary to form a window portion 8 as shown in FIG. This insulating substrate 6 is bonded to the conductive pattern 5 via the adhesive layer 7. The insulating substrate used in this invention is
Resins such as epoxy resins, polyimide resins, polyamide resins, unsaturated polyester resins, and glass carpet If
There are some types filled with reinforcing agents such as F, and others laminated with paper, cloth, metal plates, etc. Various types of adhesives can be used and are selected as appropriate, but they must have insulating properties. The bonding between the insulating substrate 6 and the conductor pattern 5 using an adhesive is desirably carried out by selecting an appropriate bonding method from among ordinary bonding methods depending on the type of adhesive and the like. For example, press III using semi-hardened glue,
This glue can also be filled into the gaps between the conductor patterns 5 and then heat cured.
絶縁基板６を、接着剤層７を介して導体パターン５の而
に接合した後、支持層４を選択的にエツチング除去して
導体パターン５を露出させる。ごの選択的エツチングで
用いられるエツチング液は、支持層４を溶かすが、導体
パターン５を実質的に溶かさない物質である。そのよう
なエツチング液は、支持層４と導体パターン５の各々の
材質に応じて適宜選択することができる。この工程にお
ける選択的エツチングは、支持層全面を除去することも
できるが、必要に応じて所定のレジストを設けて支持層
の一部を残し、他を除去して導体パターンを露出させて
もよい。この工程の選択エツチングによって、絶縁基板
の窓部８などに絶縁基板で支持されない導体パターン部
分つがむき出しになる。After the insulating substrate 6 is bonded to the conductor pattern 5 via the adhesive layer 7, the support layer 4 is selectively etched away to expose the conductor pattern 5. The etching solution used in the selective etching is a substance that dissolves the support layer 4 but does not substantially dissolve the conductive pattern 5. Such an etching solution can be appropriately selected depending on the materials of the support layer 4 and the conductive pattern 5. The selective etching in this step can remove the entire surface of the support layer, but if necessary, a predetermined resist may be provided to leave part of the support layer and remove the rest to expose the conductor pattern. . By selective etching in this step, the portions of the conductor pattern that are not supported by the insulating substrate are exposed, such as in the window 8 of the insulating substrate.
上述のように得られたプリント配線板は、必要に応じて
種々の処理が施され、その用途に供される。The printed wiring board obtained as described above is subjected to various treatments as necessary and then used for its intended purpose.
（作 用）
この発明のプリント配線板の製造法によって次のように
作用する。(Function) The method of manufacturing a printed wiring board of the present invention works as follows.
この発明の導体パターン形成工程において、ここで用い
られるエツチング液が導電層を溶かすが、支持層を溶さ
ない試薬であるので、支持層上に導体パターンが形成さ
れる。この支持層として機械的強度のあるものが用いら
れるために、導体パターンを高密度かつ微細なものとす
ることができる。In the conductor pattern forming step of the present invention, the etching solution used here dissolves the conductive layer but does not dissolve the support layer, so that a conductor pattern is formed on the support layer. Since a material with mechanical strength is used as this support layer, the conductor pattern can be made high-density and fine.
高密度かつ微細な導体パターンは、支持層で確実に支持
された状態のまま、絶縁基板面と接合されるので導体パ
ターンの変形、歪発生、断線、短絡等の不都合を最少限
にする。特に、絶縁基板に窓部などがある場合、有効で
ある。Since the high-density and fine conductor pattern is bonded to the insulating substrate surface while being reliably supported by the support layer, inconveniences such as deformation, distortion, disconnection, short circuit, etc. of the conductor pattern are minimized. This is particularly effective when the insulating substrate has a window or the like.
次いで、絶縁基板と接合された導体パターンは、不要と
なった支持層で被覆されているので、支持層を選択的に
溶かすエツチング液を用いて、この支持層を選択エツチ
ングする。この選択エツチングによって支持層が除去さ
れて導体パターンが露出する。絶縁基板の窓部などに位
置する導体パターン部分は、弱い外部力によっても容易
に変形、歪発生、破断などを起すが、支持層を単に化学
的に除去１′るだけなので導体パターンに何等の機械的
外力をかけることがない。Next, since the conductor pattern bonded to the insulating substrate is covered with the unnecessary support layer, this support layer is selectively etched using an etching solution that selectively dissolves the support layer. This selective etching removes the support layer and exposes the conductor pattern. Conductor pattern parts located in windows of insulating substrates are easily deformed, strained, broken, etc. even by weak external forces, but since the support layer is simply removed 1' chemically, no damage to the conductor pattern is caused. No external mechanical force is applied.
（実施例） この発明を、以下の例によって具体的に説明する。(Example) This invention will be specifically explained by the following examples.
層厚１８μｍの銅層と層厚４０μｍのアルミニウム層と
からなる積層根を準備し、銅を）り電層どし、アルミニ
ウムを支ｆ’Ｊ ｈｎとする。銅表面にネガタイプの水
溶性ドライフィルムをラミネートし、配線パターン形成
に必要なマスクを使用して、露光・現像を行ない、レジ
スト層を形成した。次いで、銅のみを溶解してエツチン
グし、レジスト層とアルミニウムを溶かさない過硫酸ア
ン七ニウｌ＼液をエツチング液として用いて銅層の選択
エツチングを行ない、所定の導体パターンを形成した。A laminated base consisting of a copper layer with a layer thickness of 18 μm and an aluminum layer with a layer thickness of 40 μm is prepared, the copper is used as the conductor layer, and the aluminum is used as the support f'J hn. A negative type water-soluble dry film was laminated on the copper surface, and a resist layer was formed by exposing and developing the film using the mask necessary for wiring pattern formation. Next, only the copper was dissolved and etched, and a predetermined conductor pattern was formed by selectively etching the copper layer using an anhydrous persulfate solution which does not dissolve the resist layer and aluminum as an etching solution.
半硬化状のりが塗布された絶縁基板（三井東圧製ポリイ
ミドフィルムベースのり厚３８μｍ、 ）を加工処理し
て、窓部を右する所定の形状に成形した。アルミニウム
支持層に形成されＩＣ銅の配線パターン面をのり塗布側
の絶縁基板面に）Ｆね、両面からホットプレスによって
熱圧着し、配線パターンを絶縁基板面に接合した。この
ポットプレスのプレス圧は４０に’Ｊｆ／ｃｍ、温度は
１８０℃であっｌこ 。An insulating substrate coated with semi-cured glue (Mitsui Toatsu polyimide film base glue thickness: 38 μm) was processed and molded into a predetermined shape with a window on the right. The IC copper wiring pattern formed on the aluminum support layer was bonded to the insulating substrate surface on the glue-applied side by hot pressing from both sides, and the wiring pattern was bonded to the insulating substrate surface. The pressure of this pot press was 40 Jf/cm, and the temperature was 180°C.
次いで、アルミニウム支持層にＪＦ酸（２０〜３０％１
−ＩＣ，ｉｌ水溶液）で処理してアルミニウムだけを溶
かして選択エツチングした。なお、塩酸以外にＮ ａ
ＯＨ液、Ｋ ＯＨ液を用いてもよい。この選択エツチン
グによって銅の配線パターンが露出して所望のプリント
配線板を得ることができた。The aluminum support layer was then coated with JF acid (20-30% 1
- IC, IL aqueous solution) to dissolve only the aluminum and perform selective etching. In addition, in addition to hydrochloric acid, Na
An OH liquid or a KOH liquid may also be used. Through this selective etching, the copper wiring pattern was exposed and a desired printed wiring board could be obtained.
このプリント配線板では、基板の窓部などに導体パター
ンが突き出てむき出しになっているが、パターンの破損
、変形、接触などの不良の発生がほとんどなかった。In this printed wiring board, the conductor patterns protrude from the windows of the board and are exposed, but there were almost no occurrences of defects such as pattern damage, deformation, or contact.
（発明の効果） ：
この発明によって従来技術の問題点が解決して次のよう
な効果が得られる。(Effects of the invention): This invention solves the problems of the prior art and provides the following effects.
（１） この発明においてフォトエツチング法で導体パ
ターンを形成する工程が、接合（プレス）づ゛る工程前
に行なうので、プレスによる折れやシワのない状態でフ
ォトエツチングでき、特に高密度かつ微細なパターンの
形成に有利である。従って、フォトエツチングにおける
レジスト密着性が良く、レジスミ−厚みも均一となって
、断線や短絡のない良好なプリント配線板を１３ＩＩＮ
できる。(1) In this invention, the process of forming a conductor pattern by photoetching is performed before the bonding (pressing) process, so photoetching can be performed without bending or wrinkles caused by pressing, and it is possible to form a conductor pattern with a particularly high density and fine pattern. It is advantageous for pattern formation. Therefore, the resist adhesion during photoetching is good and the resist thickness is uniform, making it possible to produce a good printed wiring board without disconnections or short circuits.
can.
（２） この発明において、導体配線バク−〉゛は、機
械的強度のある支持層で、製ｊ古工程中、確実に支持固
定されているので、接合（プレス）時でも、熱による延
びやシワなどの発生、圧力による折れなどの発生を防止
することができる。(2) In this invention, the conductor wiring bag is a mechanically strong support layer and is securely supported and fixed during the manufacturing process, so it will not stretch due to heat even during bonding (pressing). It is possible to prevent the occurrence of wrinkles and bending due to pressure.
（３） この発明において、支持層の除去は、機械的な
剥離でなく、化学的なエツチング除去であるので、導体
パターン、特に絶縁基板面から突出した）ｇ体パターン
部分に不要な外力が作用せず、残留応力等が残らない。(3) In this invention, since the support layer is removed by chemical etching rather than mechanical peeling, unnecessary external force is applied to the conductor pattern, especially the part of the g-shaped pattern that protrudes from the insulating substrate surface. No residual stress remains.
（４） 従来の製造法では、第３図の断面に示すように
、導体パターン３４は接着剤層３１の面上に設けられ一
方向から支持されているのに対し、この発明の方法では
、導体パターン５が接着剤層７に入り込み、三方向から
支持されて、導体パターンが確実に固定される。また、
導体むぎ出し部９の自ＩＦによるたわみを少なくするこ
とノックできる。(4) In the conventional manufacturing method, the conductor pattern 34 is provided on the surface of the adhesive layer 31 and supported from one direction, as shown in the cross section of FIG. 3, whereas in the method of the present invention, The conductor pattern 5 enters into the adhesive layer 7 and is supported from three directions, so that the conductor pattern is securely fixed. Also,
This can be achieved by reducing the deflection of the exposed conductor portion 9 due to its own IF.
第１図は本発明の製造法の各工程を説明するための概略
図、第２図はプリント配線板の斜視図、第３図は従来の
製造法の各工程を説明するための概略図である。
１・・・プリント配線板、２・・・積層板、３・・・導
電層、４・・・支持層、５・・・導体パターン、６・・
・絶縁基板、７・・・接着剤層、８・・・窓部、９・・
・むき出しパターン部分、３１・・・接着剤層、３２・
・・金属箔、３３・・・絶縁Ｌ１也、３４・・・パター
ン、３５・・・窓、３６・・・むき出しパターン部分。
出願人代理人 佐 値 −離
島 ２ にFIG. 1 is a schematic diagram for explaining each step of the manufacturing method of the present invention, FIG. 2 is a perspective view of a printed wiring board, and FIG. 3 is a schematic diagram for explaining each step of the conventional manufacturing method. be. DESCRIPTION OF SYMBOLS 1... Printed wiring board, 2... Laminate board, 3... Conductive layer, 4... Support layer, 5... Conductor pattern, 6...
・Insulating substrate, 7...adhesive layer, 8...window part, 9...
・Exposed pattern part, 31...Adhesive layer, 32・
...Metal foil, 33...Insulation L1, 34...Pattern, 35...Window, 36...Exposed pattern part. Applicant's representative: On remote islands 2
Claims (1)
製造法。 （ａ）導電層と支持層とからなる積層板の該導電層をフ
ォトエッチングして該支持層上に所望の導体パターンを
形成する工程 （ｂ）接着剤層が表面に設けられた所定形状の絶縁基板
を、該接着剤層を介して該導体パターン面に接合させる
工程 （ｃ）該支持層を選択的にエッチング除去して該導体パ
ターンを露出させる工程 ２、積層板が二種の金属層からなるものである、特許請
求の範囲第１項記載の方法。 ３、製造されたプリント配線板は、導体パターンの一部
が絶縁基板で下から支持されずむき出しになっているも
のである、特許請求の範囲第１項または第２項記載の製
造法。[Scope of Claims] 1. A method for manufacturing a printed wiring board, characterized by including the following steps. (a) Step of photo-etching the conductive layer of a laminate consisting of a conductive layer and a support layer to form a desired conductor pattern on the support layer. Step (c) of bonding the insulating substrate to the conductor pattern surface via the adhesive layer; Step 2 of selectively etching and removing the support layer to expose the conductor pattern; the laminate is made of two types of metal layers; The method according to claim 1, which comprises: 3. The manufacturing method according to claim 1 or 2, wherein in the manufactured printed wiring board, a part of the conductor pattern is not supported from below by an insulating substrate and is exposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20045186A JPS6356991A (en) | 1986-08-27 | 1986-08-27 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20045186A JPS6356991A (en) | 1986-08-27 | 1986-08-27 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6356991A true JPS6356991A (en) | 1988-03-11 |
Family
ID=16424520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20045186A Pending JPS6356991A (en) | 1986-08-27 | 1986-08-27 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6356991A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02283095A (en) * | 1989-04-25 | 1990-11-20 | Furukawa Electric Co Ltd:The | Manufacture of surface flat circuit board |
| US6532651B1 (en) | 1998-05-14 | 2003-03-18 | Matsushita Electric Industrial Co., Ltd. | Circuit board and method of manufacturing the same |
| US6691409B2 (en) | 2000-08-21 | 2004-02-17 | Matsushita Electric Industrial Co., Ltd. | Method of producing a circuit board |
| US6703565B1 (en) | 1996-09-06 | 2004-03-09 | Matsushita Electric Industrial Co., Ltd. | Printed wiring board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS541880A (en) * | 1977-06-06 | 1979-01-09 | Asahi Chemical Ind | Method of making print circuit board and carrier plate therefor |
| JPS60164392A (en) * | 1984-02-07 | 1985-08-27 | 日本電産コパル株式会社 | Method of forming circuit board |
| JPS6255997A (en) * | 1985-09-05 | 1987-03-11 | 住友電気工業株式会社 | Manufacture of substrate for printed circuit |
-
1986
- 1986-08-27 JP JP20045186A patent/JPS6356991A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS541880A (en) * | 1977-06-06 | 1979-01-09 | Asahi Chemical Ind | Method of making print circuit board and carrier plate therefor |
| JPS60164392A (en) * | 1984-02-07 | 1985-08-27 | 日本電産コパル株式会社 | Method of forming circuit board |
| JPS6255997A (en) * | 1985-09-05 | 1987-03-11 | 住友電気工業株式会社 | Manufacture of substrate for printed circuit |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02283095A (en) * | 1989-04-25 | 1990-11-20 | Furukawa Electric Co Ltd:The | Manufacture of surface flat circuit board |
| US6703565B1 (en) | 1996-09-06 | 2004-03-09 | Matsushita Electric Industrial Co., Ltd. | Printed wiring board |
| US7059039B2 (en) | 1996-09-06 | 2006-06-13 | Matsushita Electric Industrial Co., Ltd. | Method for producing printed wiring boards |
| US6532651B1 (en) | 1998-05-14 | 2003-03-18 | Matsushita Electric Industrial Co., Ltd. | Circuit board and method of manufacturing the same |
| US6691409B2 (en) | 2000-08-21 | 2004-02-17 | Matsushita Electric Industrial Co., Ltd. | Method of producing a circuit board |
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