CN210725505U - Welding pad formed by extending front solder mask layer to back metal - Google Patents
Welding pad formed by extending front solder mask layer to back metal Download PDFInfo
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- CN210725505U CN210725505U CN201920913451.2U CN201920913451U CN210725505U CN 210725505 U CN210725505 U CN 210725505U CN 201920913451 U CN201920913451 U CN 201920913451U CN 210725505 U CN210725505 U CN 210725505U
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Abstract
The utility model relates to a front solder mask extends to the pad that forms on the back metal, particularly, after the rubber coating of a single face circuit board back, a macropore is washed out with the mode that the mould punches a hole, be back circuit board with another single face circuit board, paste the rubber coating face of having had macroporous front circuit board with back circuit board counterpoint, expose towards openly at macropore department back circuit metal, then make the solder mask on front circuit, the pad window that the solder mask was opened in macropore department is less than the macropore, the solder mask has covered the pad on back circuit metal in macropore department, there are not a plurality of steps in pad department, it is more level and smooth, the pad of having solved bowl hole department has the bad problem of outward appearance that a plurality of steps lead to, and the welding that leads to because a plurality of steps is bad, especially, it is chaotic bad to have the tin that flows that a plurality of steps welding that front copper leads to lead to.
Description
Technical Field
The utility model relates to a circuit board field, concretely relates to pad that forms on positive solder mask extends to back metal.
Background
The invention relates to a bowl-hole double-sided circuit board series patent, for example: patent numbers: 200920260552.0, patent name: double-sided circuit board, patent No.: 200920215983.5, patent name: double-sided circuit board with component, patent No.: 201020514646.9, patent name: double-sided circuit board and combination pad etc. thereof, openly hinder welds all on bowl hole department front circuit, do not have the whole all to extend and all cover front circuit metal and intermediate insulation layer, it makes whole pad all be back metal to extend to back circuit metal on, lead to front solder mask and intermediate insulation layer uneven in pore wall department, openly hinder welds and forms a plurality of steps with front copper and intermediate insulation layer and bowl hole bottom, lead to the outward appearance bad, can't do high-end product, front copper is seen from overlooking at bowl hole department simultaneously and has been exposed, hole bottom copper and front copper are because of surface tension after the tin melts during soldering tin, lead to tin to flow the confusion, make soldering tin connect badly.
In order to overcome the defects and shortcomings, the utility model punches or drills a big hole after the back of the single panel is coated with glue, then the back circuit is pasted on the glue surface, the back circuit metal is pasted towards the glue surface, the back metal is exposed to the front side at the large hole, then solder mask ink or a solder mask is pasted on the front side, the solder mask has a solder pad window smaller than the large hole, the solder mask covers the back metal at the large hole, and the back metal is formed with annular cover, and the middle metal is left uncovered to form the pad, the size and shape of the pad are the size and shape of the pad window formed by the front solder mask, the problem of the outward appearance that a plurality of steps lead to in bowl hole pad department is bad has been solved like this firstly, has secondly solved because the welding that a plurality of steps lead to is bad in bowl hole pad department, especially has a plurality of steps that positive copper leads to and welds the chaotic bad of tin that flows that leads to soldering tin.
SUMMERY OF THE UTILITY MODEL
The utility model relates to a front solder mask extends to the pad that forms on the back metal, particularly, after the rubber coating of a single face circuit board back, a macropore is washed out with the mode that the mould punches a hole, be back circuit board with another single face circuit board, paste the rubber coating face of having had macroporous front circuit board with back circuit board counterpoint, expose towards openly at macropore department back circuit metal, then make the solder mask on front circuit, the pad window that the solder mask was opened in macropore department is less than the macropore, the solder mask has covered the pad on back circuit metal in macropore department, there are not a plurality of steps in pad department, it is more level and smooth, the pad of having solved bowl hole department has the bad problem of outward appearance that a plurality of steps lead to, and the welding that leads to because a plurality of steps is bad, especially, it is chaotic bad to have the tin that flows that a plurality of steps welding that front copper leads to lead to.
According to the utility model provides a pad that forms on positive solder mask extends to back metal, include: a front solder mask layer; a front side circuit layer; an intermediate insulating layer; an intermediate glue layer; a back side circuit layer; a back side insulating layer; the method is characterized in that a front circuit and an intermediate insulating layer are removed to form a large hole, back circuit metal is exposed towards the front side at the large hole, then a front solder mask on the front circuit extends to the back circuit metal in the large hole, a pad is formed on the back metal, a pad window formed by the solder mask is smaller than the large hole, and the size and the shape of the pad are the size and the shape of the pad window formed by the front solder mask.
According to a preferred embodiment of the present invention, the front solder mask layer extends to the pad formed on the back metal, and the front solder mask layer is an ink solder mask layer or a cover film solder mask layer.
According to a preferred embodiment of the present invention, the front solder mask layer extends to the pad formed on the back metal, and the cover film solder mask layer is a PI film or a PET film.
According to a preferred embodiment of the present invention, the front solder resist layer extends to a pad formed on the back metal, wherein the pad is used for soldering a front component, a part of the solder fillet through the component is soldered to the back circuit metal, another part of the solder fillet is soldered to the front circuit, and the front circuit and the back circuit are turned on through the component.
According to a preferred embodiment of the utility model, a front solder mask extend to the pad that forms on the back metal, a characterized in that, back circuit layer and back insulating layer in, be provided with bowl hole position department, it has sunken to see from the circuit board back, see from the circuit board openly, back circuit in the bowl hole has upwards been protruding, the pad that back circuit formed in the bowl hole upwards is close on a plane with front circuit pad, with the pad surface on the front circuit as planar reference surface, the pad surface that is formed by back circuit in the bowl hole is with the upper and lower scope of reference surface, is lower than the reference surface down, does not hang down 0.5mm of reference surface, up is higher than the reference surface, does not hang up 0.5mm of reference surface.
According to a preferred embodiment of the present invention, the front solder resist layer extends to a pad formed on the back metal, and the pad at the large hole position is a pad for a soldering element, a pad for a tab, and a pad for a soldering power supply line.
According to a preferred embodiment of the present invention, the front solder resist layer extends to the pad formed on the back metal, and is characterized in that, on the pad of the soldering element at the position of the large hole, part of the solder fillet of the element is soldered to the back circuit through the large hole, and the other part of the solder fillet is soldered to the front circuit, so that the front circuit and the back circuit are turned on through the element.
According to a preferred embodiment of the present invention, the front solder resist layer extends to the pad formed on the back metal, and the power line is soldered to the back circuit through the pad in the large hole on the pad of the soldering power line at the position of the large hole.
According to a preferred embodiment of the present invention, a front solder mask extends to a pad formed on a back metal, and is characterized in that the pad in the large hole is soldered to the back circuit to be connected when the two circuit boards are soldered to each other on the pad of the board at the position of the large hole.
The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below.
Drawings
The features, objects, and advantages of the present invention will become more apparent from the reading of the specification in conjunction with the following drawings, a brief description of which follows.
FIG. 1 is a schematic plan view of a front circuit manufactured by a single-sided flexible copper-clad plate.
Fig. 2 is a schematic plan view of the front side circuit after the adhesive is applied to the back side and the large hole is punched by the die.
Fig. 3 is a schematic plan view of the back side circuit.
Fig. 4 is a schematic diagram showing the metal surface of the back side circuit being attached to the front side circuit adhesive coated surface punched with large holes, and the back side circuit being exposed at the large holes.
FIG. 5 is a schematic plan view of a back circuit bonded to a front circuit to form a front solder mask extending to a back metal to form a pad after solder masking of the front circuit.
FIG. 6 is a front side solder mask at macro-hole 1.1; a front side circuit layer; an intermediate insulating layer; an intermediate glue layer; a back side circuit layer; a cross-sectional view of the back side insulating stack.
Fig. 7 is a schematic cross-sectional view of the backside circuit layer and backside insulating layer raised upward at the large hole 1.1.
Detailed Description
The present invention will be described in detail below by taking preferred embodiments as examples.
It will be understood by those skilled in the art that the following descriptions are provided for purposes of illustration and description of certain preferred embodiments only and are not intended to limit the scope of the present invention.
The front circuit 1 (shown in figure 1) is manufactured by adopting a traditional circuit board manufacturing process and carrying out processes of circuit anti-corrosion printing ink silk-screen printing, baking curing, etching and film stripping on the single-sided flexible copper-clad plate.
Then, glue is applied to the back surface, namely the intermediate insulating layer 3, to form an intermediate glue layer 4, and then a designed and manufactured die is used on a punching machine to punch a large hole 1.1 and a large hole 1.2 (as shown in fig. 2, 6 and 7) at the position where the large hole is required to be arranged on the double-layer circuit.
The back circuit 5 (shown in figure 3) is manufactured by adopting the traditional circuit board manufacturing process and carrying out the processes of circuit anti-corrosion printing ink silk-screen printing, baking curing, etching and film stripping on the single-sided flexible copper-clad plate.
And aligning, laminating and hot-pressing the metal surface of the back circuit 5 and the intermediate glue layer 4 of the single-sided circuit board punched with the large holes, wherein the back circuit 5 is exposed from the large holes 1.1 and 1.2 to the front side to form the shapes of 1.1a and 1.2a (as shown in figure 4).
And then silk-screen printing solder resist 2 on the front circuit 1, exposing a pad 1.2 of a welding element, wherein at the positions of 1.1a and 1.2a, the solder resist has a solder resist window smaller than a large hole, the solder resist extends and covers the back circuit 5 to form a pad 1.1b and a pad 1.2b of the welding element, the pad 1.1b is a pad for welding a power line and a pad for connecting a board, baking and curing are carried out, and then the manufacturing of the pad formed by extending the front solder resist layer to the back metal is completed through the processes of silk-screen character printing, OSP anti-oxidation surface treatment, molding, FQC and the like (as shown in figures 5, 6 and 7).
As shown in fig. 7, the back surface circuit 5 and the back surface insulating layer 6 protrude toward the front surface circuit 1 at the position of the large hole 1.1, the back surface circuit 5 in the large hole 1.1 forms a pad 1.1b, the pad on the front surface circuit is used as a reference plane of the plane, i.e., the position of the reference line 7.1, the upper and lower ranges of the plane position of the pad opened to the front surface of the back surface circuit are, lower than the reference plane, not lower than 0.5mm of the reference plane, i.e., the position of the reference line 7.3, higher than the reference plane, not higher than 0.5mm of the reference plane, i.e., the position of the reference line 7.2, when the pad 1.1b is used as a pad for welding a power supply line, the power supply line is welded to the back surface circuit through a bowl hole, and when the pads 1.1b are used as a pad of a tab, and a plurality of circuit boards.
When the component is fabricated in SMT patch bonding, as shown in fig. 5, one leg of one component is bonded to pad 1.2b and the other leg is bonded to pad 1.3, and front side circuit 1 and back side circuit 5 are electrically connected through the component.
The utility model punches or drills a big hole after coating the back of the single panel, then pastes the back circuit on the adhesive surface, the metal of the back circuit is pasted towards the adhesive surface, the back metal is exposed to the front side at the large hole, then solder mask ink or a solder mask is pasted on the front side, the solder mask has a solder pad window smaller than the large hole, the solder mask covers the back metal at the large hole, and the back metal is formed with annular cover, and the middle metal is left uncovered to form the pad, the size and shape of the pad are the size and shape of the pad window formed by the front solder mask, the problem of the outward appearance that a plurality of steps lead to in bowl hole pad department is bad has been solved like this firstly, has secondly solved because the welding that a plurality of steps lead to is bad in bowl hole pad department, especially has a plurality of steps that positive copper leads to and welds the chaotic bad of tin that flows that leads to soldering tin.
The present invention has been described in detail with reference to the accompanying drawings in which a front solder resist layer is extended to a pad formed on a back metal. It will be understood by those skilled in the art, however, that the foregoing is illustrative and descriptive of some specific embodiments only, and not limiting as to the scope of the invention, and particularly the scope of the claims.
Claims (9)
1. A pad formed with a front side solder mask extending onto a back side metal, comprising:
a positive welding layer on the front surface;
a front side circuit layer;
an intermediate insulating layer;
an intermediate glue layer;
a back side circuit layer;
a back side insulating layer;
the method is characterized in that a front circuit and an intermediate insulating layer are removed to form a large hole, back circuit metal is exposed towards the front side at the large hole, then a front solder mask on the front circuit extends to the back circuit metal in the large hole, a pad is formed on the back metal, a pad window formed by the solder mask is smaller than the large hole, and the size and the shape of the pad are the size and the shape of the pad window formed by the front solder mask.
2. A front side solder mask-extended back side metal formed pad as claimed in claim 1 wherein said front side solder mask is an ink solder mask or a coverlay solder mask.
3. A solder mask according to claim 2, wherein the cover film solder mask is PI film or PET film.
4. A solder pad formed by extending a solder mask on a front side to a back side metal according to claim 1, wherein the solder pad is a component for soldering the front side, and a part of the solder tail of the component is soldered to the back side circuit metal, and another part of the solder tail is soldered to the front side circuit, and the front side circuit and the back side circuit are conducted through the component.
5. The solder mask of claim 1, wherein the back circuit layer and the back insulating layer are recessed from the back side of the circuit board at the position where the bowl hole is formed, and the back circuit in the bowl hole is raised from the front side of the circuit board, the pad formed by the back circuit in the bowl hole is located on a plane close to the pad of the front circuit, and the pad surface on the front circuit is used as a reference plane of the plane, and the upper and lower ranges of the pad surface formed by the back circuit in the bowl hole and the reference plane are lower than the reference plane by 0.5mm and higher than the reference plane by 0.5 mm.
6. A front side solder mask-extended back side metal formed pad as claimed in claim 1, wherein the pad at the position of the large hole is a pad for soldering a component, a pad for a tab, a pad for soldering a power supply line.
7. A front side solder mask according to claim 6 extended to pads formed on the back side metal, wherein on the pads of the component soldered at the position of the large hole, part of the solder leg of the component is soldered to the back side circuit through the solder leg in the large hole, and the other part of the solder leg is soldered to the front side circuit, and the front side circuit and the back side circuit are electrically conducted through the component.
8. A front side solder mask according to claim 6 extending to pads formed on the back side metal, wherein the power supply line is soldered to the back side circuit through pads in the large holes on the solder power line pads at the positions of the large holes.
9. A solder mask according to claim 6 wherein the pads in the large holes are soldered to the back side circuitry when the two circuit boards are soldered to each other at the pads in the large holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920913451.2U CN210725505U (en) | 2019-06-07 | 2019-06-07 | Welding pad formed by extending front solder mask layer to back metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920913451.2U CN210725505U (en) | 2019-06-07 | 2019-06-07 | Welding pad formed by extending front solder mask layer to back metal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210725505U true CN210725505U (en) | 2020-06-09 |
Family
ID=70933192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920913451.2U Active CN210725505U (en) | 2019-06-07 | 2019-06-07 | Welding pad formed by extending front solder mask layer to back metal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210725505U (en) |
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2019
- 2019-06-07 CN CN201920913451.2U patent/CN210725505U/en active Active
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