CN213426586U - Electroplating structure of side wall nickel-gold plated circuit board with outer layer local electroplating edge - Google Patents
Electroplating structure of side wall nickel-gold plated circuit board with outer layer local electroplating edge Download PDFInfo
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- CN213426586U CN213426586U CN202022529802.5U CN202022529802U CN213426586U CN 213426586 U CN213426586 U CN 213426586U CN 202022529802 U CN202022529802 U CN 202022529802U CN 213426586 U CN213426586 U CN 213426586U
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Abstract
The utility model provides a lateral wall nickel-plated gold circuit board electroplating structure with outer local electroplating limit, include: the dry film electroplating device comprises a base material, wherein a rectangular dry film is adhered to the middle of the base material, a rectangular frame area is formed between the rectangular edge of the base material and the edge of the dry film, the rectangular frame area comprises a first group of diagonal areas and a second group of diagonal areas, a first tool hole is formed in the first group of diagonal areas, a rectangular electroplated copper sheet used for forming a local electroplating edge is formed in the second group of diagonal areas, a second tool hole is formed in the rectangular electroplated copper sheet, and only the rectangular electroplated copper sheet in the rectangular frame area is a conductive area. The utility model changes the electroplating edge into the local electroplating edge, simplifies the manufacturing process, saves the cost and simultaneously improves the yield.
Description
Technical Field
The utility model relates to a circuit board field of making, in particular to lateral wall nickel-plated gold circuit board electroplating structure with outer local electroplating limit.
Background
The side wall is plated with nickel and gold PCB board, when manufacturing, in order to achieve the effect of plating the side wall with nickel and gold, the circuit pattern is etched out firstly, then the position which does not need to be plated with nickel and gold in the unit is covered with dry film, and then the nickel and gold plating is carried out. Electroplating is needed to conduct electricity during nickel and gold plating, and the pattern design of the outer electroplating edge basically has two general methods at present. Firstly, leaving an electroplating edge on the whole plate edge, sealing adhesive paper before electrogilding, and then windowing an electroplating clamp position; the other is to carry out the design of keeping off a little with electroplating clip position external light film, expose clip position copper after developing, this design of remaining limit has the garrulous residue of board edge dry film, can drop during the development and pollute the water flat line and the garrulous residue of dry film to the unit in, influence product quality. At this time, the outer layer is electroplated with a pattern design, which plays a key role.
SUMMERY OF THE UTILITY MODEL
The utility model provides a lateral wall nickel-gold plating circuit board electroplating structure with outer local electroplating limit to solve at least one above-mentioned technical problem.
In order to solve the above problem, as an aspect of the present invention, there is provided a sidewall nickel-gold plated circuit board electroplating structure having an outer local electroplating edge, including: the dry film electroplating device comprises a base material, wherein a rectangular dry film is adhered to the middle of the base material, a rectangular frame area is formed between the rectangular edge of the base material and the edge of the dry film, the rectangular frame area comprises a first group of diagonal areas and a second group of diagonal areas, a first tool hole is formed in the first group of diagonal areas, a rectangular electroplated copper sheet used for forming a local electroplating edge is formed in the second group of diagonal areas, a second tool hole is formed in the rectangular electroplated copper sheet, and only the rectangular electroplated copper sheet in the rectangular frame area is a conductive area.
Preferably, the rectangular electroplated copper sheet has a length of 3cm and a width of 1.3 cm.
Due to the adoption of the technical scheme, the utility model discloses remain the limit change with electroplating for local electroplating limit to simplify the preparation flow, practice thrift the cost, promote output simultaneously.
Drawings
Fig. 1 schematically shows a front view of the present invention.
Reference numbers in the figures: 1. a substrate; 2. drying the film; 3. a first tool hole; 4. rectangular electroplated copper sheets; 5. a second tool aperture.
Detailed Description
The embodiments of the invention will be described in detail below with reference to the drawings, but the invention can be implemented in many different ways as defined and covered by the claims.
As an aspect of the utility model, a lateral wall nickel-gold plating circuit board electroplating structure with outer local electroplating limit is provided, include: the special tool comprises a base material 1, wherein a rectangular dry film 2 is adhered to the middle of the base material 1, a rectangular frame area is formed between the rectangular edge of the base material 1 and the edge of the dry film 2, the rectangular frame area comprises a first group of diagonal areas and a second group of diagonal areas, a first tool hole 3 is formed in the first group of diagonal areas, a rectangular electroplated copper sheet 4 used for forming a local electroplating edge is formed in the second group of diagonal areas, a second tool hole 5 is formed in the rectangular electroplated copper sheet 4, and a conductive area is only arranged at the rectangular electroplated copper sheet 4 in the rectangular frame area. Preferably, the rectangular electroplated copper sheet 4 has a length of 3cm and a width of 1.3 cm.
In the technical scheme, the structure of the utility model is used for manufacturing the local electroplating edge, so that the processes of 'gummed paper sealing electroplating edge' and 'electroplating clamping windowing' can be omitted, the manufacturing process can be simplified, the cost can be saved, and the yield can be improved; meanwhile, no dry film broken residue exists at the plate edge, so that the horizontal line is not polluted, and the dry film broken residue cannot enter the unit to influence the product quality.
Due to the adoption of the technical scheme, the utility model discloses remain the limit change with electroplating for local electroplating limit to simplify the preparation flow, practice thrift the cost, promote output simultaneously.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (2)
1. The utility model provides a lateral wall nickel gold plating circuit board electroplating structure with outer local plating limit which characterized in that includes: the special tool comprises a base material (1), a rectangular dry film (2) is adhered to the middle of the base material (1), a rectangular frame area is formed between the rectangular edge of the base material (1) and the edge of the dry film (2), the rectangular frame area comprises a first group of diagonal areas and a second group of diagonal areas, a first tool hole (3) is formed in the first group of diagonal areas, a rectangular electroplated copper sheet (4) used for forming a local electroplated edge is formed in the second group of diagonal areas, a second tool hole (5) is formed in the rectangular electroplated copper sheet (4), and a conductive area is only arranged at the rectangular electroplated copper sheet (4) in the rectangular frame area.
2. The electroplating structure of the side wall nickel-gold plated circuit board with the outer layer local electroplating edge as claimed in claim 1, wherein the rectangular electroplated copper sheet (4) is 3cm in length and 1.3cm in width.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022529802.5U CN213426586U (en) | 2020-11-05 | 2020-11-05 | Electroplating structure of side wall nickel-gold plated circuit board with outer layer local electroplating edge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022529802.5U CN213426586U (en) | 2020-11-05 | 2020-11-05 | Electroplating structure of side wall nickel-gold plated circuit board with outer layer local electroplating edge |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213426586U true CN213426586U (en) | 2021-06-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022529802.5U Active CN213426586U (en) | 2020-11-05 | 2020-11-05 | Electroplating structure of side wall nickel-gold plated circuit board with outer layer local electroplating edge |
Country Status (1)
| Country | Link |
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| CN (1) | CN213426586U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114867220A (en) * | 2022-05-27 | 2022-08-05 | 广州美维电子有限公司 | Pattern design method for reducing fine circuit board dry film breakage |
-
2020
- 2020-11-05 CN CN202022529802.5U patent/CN213426586U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114867220A (en) * | 2022-05-27 | 2022-08-05 | 广州美维电子有限公司 | Pattern design method for reducing fine circuit board dry film breakage |
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