CN213960422U

CN213960422U - Ultra-thick copper nickel plating gold plate pressing structure

Info

Publication number: CN213960422U
Application number: CN202023281209.XU
Authority: CN
Inventors: 马卓; 王志明; 李成; 王一雄
Original assignee: Shenzhen Xunjiexing Technology Corp ltd
Current assignee: Shenzhen Xunjiexing Technology Corp ltd
Priority date: 2020-12-30
Filing date: 2020-12-30
Publication date: 2021-08-13
Anticipated expiration: 2030-12-30

Abstract

The utility model provides an ultra-thick copper nickel plating gold plate pressfitting structure, include: first purple copper foil, first semi-solid board, bare board, second semi-solid board and the purple copper foil of second that from top to bottom set gradually, be formed with the second circuit that corresponds with the first circuit that waits to form protrudingly on the lower surface of first purple copper foil, be formed with the fourth circuit that corresponds with the third circuit that waits to form protrudingly on the upper surface of first purple copper foil, first semi-solid board, bare board, second semi-solid board and the purple copper foil of second are synthetic integratively. The utility model discloses a positive and negative two-sided etching mode preparation makes the more meticulous circuit ization of thick copper nickel plating gold plate, has reduced outer etching base copper thickness.

Description

Ultra-thick copper nickel plating gold plate pressing structure

Technical Field

The utility model relates to a circuit board makes the field, in particular to super thick copper nickel plating gold plate pressfitting structure.

Background

The development of technology promotes the printed circuit board to develop towards multi-functionalization, the product forms are diversified, the surface treatment is diversified, and the nickel-gold electroplating is one of the nickel-gold electroplating methods, but when the copper thickness is larger than or equal to 12OZ, the design line width and space capacity of a similar board needs to be larger than or equal to 32/32mil, because when the line width and line distance of the nickel-plated gold board is smaller than the capacity range, the problem of line reduction caused by side etching is solved. For example, when the copper thickness is required to be 12OZ and the line width and line spacing are 10/10.5mil, the super-capability can not be manufactured in the industry. This results in line width limitations in the fabrication of higher copper thickness and fine routing.

SUMMERY OF THE UTILITY MODEL

The utility model provides an ultra-thick copper nickel plating gold plate pressfitting structure to solve at least one above-mentioned technical problem.

In order to solve the above problem, as an aspect of the utility model, a super thick copper nickel plating gold plate pressfitting structure is provided, include: first purple copper foil, first semi-solid board, bare board, second semi-solid board and the purple copper foil of second that from top to bottom set gradually, be formed with the second circuit that corresponds with the first circuit that waits to form protrudingly on the lower surface of first purple copper foil, be formed with the fourth circuit that corresponds with the third circuit that waits to form protrudingly on the upper surface of first purple copper foil, first semi-solid board, bare board, second semi-solid board and the purple copper foil of second are synthetic integratively.

Preferably, a region of the first purple copper foil located above the first prepreg except the first line forms a first etching removal region, and a region of the second purple copper foil located below the second prepreg except the third line forms a second etching removal region.

Since the technical scheme is used, the utility model provides a circuit takes two red copper foils (the hard copper) of corresponding thickness, through the preparation of positive and negative two-sided etching mode, make the more meticulous circuit of thick copper nickel plating gold plate, outer etching base copper thickness has been reduced, avoided super thick copper nickel gold plate in the past to be etched so that the nickel-gold layer is unsettled "dangling limit" that appears the nickel-gold because of the copper under the nickel-gold layer, the extrusion of back process because of the printing ink printing has effectively been stopped, lead to the electric conductivity nickel gold silk of hanging to drop and become foreign matter under the printing ink, arouse the short circuit of circuit.

Drawings

FIG. 1 schematically illustrates a schematic of the structure before lamination;

FIG. 2 schematically illustrates a schematic of the structure after lamination;

fig. 3 schematically shows a schematic view of the structure after the acid etching.

Reference numbers in the figures: 1. a first purple copper foil; 2. a first semi-cured panel; 3. a light panel; 4. a second prepreg; 5. a second purple copper foil; 6. a first line; 7. a second line; 8. a third line; 9. a fourth line; 10. a first etch removal region; 11. a second etch removal region; 12. a gold layer.

Detailed Description

The embodiments of the invention will be described in detail below with reference to the drawings, but the invention can be implemented in many different ways as defined and covered by the claims.

As an aspect of the utility model, a super thick copper nickel plating gold plate pressfitting structure is provided, include: first purple copper foil 1, first semi-solid board 2, worn-out fur 3, second semi-solid board 4 and the purple copper foil 5 of second that from top to bottom set gradually, be formed with the second circuit 7 that corresponds with the first circuit 6 that waits to form protrudingly on the lower surface of first purple copper foil 1, be formed with the fourth circuit 9 that corresponds with the third circuit 8 that waits to form protrudingly on the upper surface of first purple copper foil 1, first semi-solid board 2, worn-out fur 3, second semi-solid board 4 and second purple copper foil 5 pressfitting are integrative.

Preferably, a region of the first purple copper foil 1 located above the first prepreg 2 except for the first lines 6 forms a first etching removal region 10, and a region of the second purple copper foil 5 located below the second prepreg 4 except for the third lines 8 forms a second etching removal region 11.

In the technical scheme, the utility model discloses directly adopt two first red copper foils 1 of corresponding thickness, second red copper foil 5 (hard copper), make earlier with positive reverse circuit figure (be second line 7, fourth line 9) after, control the deep etching and fall half (please refer to fig. 1) of total copper thickness, then through the mode of riveting with first semi-solid board 2, second semi-solid board 4 with two first red copper foils 1 after the reverse side control deep etching, second red copper foil 5 and the smooth plate 3 pressfitting form the base plate together. And then, the hole copper and the surface copper are subjected to drilling, copper deposition and whole-plate copper electroplating to meet the customer requirements. When outer layer circuit patterns (namely the first circuit 6 and the third circuit 8) are manufactured, a film for exposing the circuit is not compensated, the exposed circuit patterns are consistent with original patterns, after nickel and gold are electroplated, the dry film is firstly cleaned, then the board is coated with a wet film, a layer of dry film is pasted after precuring, and then the board is exposed by changed pattern data, so that the nickel layer is coated with the wet film and pasted with the dry film, the thicknesses of the nickel layer and the gold layer 12 are only 4 micrometers, the wet film has fluidity, gaps can be filled to ensure that nickel and gold edges do not remain, and the dry film covers and protects holes from being bitten and corroded by liquid medicine.

The utility model discloses not directly with and accomplish the thick slightly thin base plate of copper and plate the nickel gold preparation, but with two red copper foils (the hard copper) of corresponding thickness, adopt earlier preparation and positive reverse circuit figure to control the deep etching and fall the half of total copper thickness, then through the mode of riveting with the high glue bonding sheet with two copper foil pressfitting after the reverse side control deep etching form the base plate together, again with positive circuit figure through the mode preparation of nickel gold plating. The circuit is made by positive and negative double-sided etching, and the making capability and compensation definition of line width and line distance are carried out according to half of the total copper thickness during making, for example, a plate of copper 12OZ is completed, the line width and line distance only needs 10/10.5mil, and the circuit compensation can be made for 2.5mil, so that the thick copper nickel-plated gold plate is more finely wired.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides an ultra-thick copper nickel plating gold plate pressfitting structure which characterized in that includes: first purple copper foil (1), first prepreg (2), worn-out fur (3), second prepreg (4) and second purple copper foil (5) that from top to bottom set gradually, be formed with second circuit (7) that correspond with first circuit (6) of waiting to form protrudingly on the lower surface of first purple copper foil (1), fourth circuit (9) that are formed with third circuit (8) of waiting to form and correspond protrudingly on the upper surface of first purple copper foil (1), first prepreg (2), worn-out fur (3), second prepreg (4) and second purple copper foil (5) are synthetic integratively.

2. The ultra-thick copper nickel-plated gold plate lamination structure according to claim 1, wherein a region of the first red copper foil (1) above the first prepreg (2) except the first wiring (6) forms a first etching removal region (10), and a region of the second red copper foil (5) below the second prepreg (4) except the third wiring (8) forms a second etching removal region (11).