CN214852008U

CN214852008U - Novel non-exposed-hole double-sided conducting circuit film

Info

Publication number: CN214852008U
Application number: CN202120698123.2U
Authority: CN
Inventors: 陈文君; 黎梁
Original assignee: Shenzhen Sijingke Electronics Co ltd
Current assignee: Shenzhen Sijingke Electronics Co ltd
Priority date: 2021-04-07
Filing date: 2021-04-07
Publication date: 2021-11-23
Anticipated expiration: 2031-04-07

Abstract

The utility model discloses a novel no open pore two-sided circuit film that switches on belongs to the two-sided technical field that switches on of circuit, a novel no open pore two-sided circuit film that switches on, including insulating film, insulating film's the equal bottom in top bonds respectively has first electrically conductive printing layer and the electrically conductive printing layer of second. The utility model discloses a, inside the draw-in groove can be inserted to the stretch strip, and then play and carry out the purpose of fixing a position to first conductive printing layer and second conductive printing layer, avoid first conductive printing layer and second conductive printing layer and insulating film position skew to appear, and then improve the stability that first conductive printing layer and second conductive printing layer and insulating film bond, and can increase the area that first conductive printing layer and second conductive printing layer and insulating film bond through the setting of draw-in groove and stretch strip, and then improve the stability that bonds, and can increase the device's toughness through the setting of stretch strip, improve the device's anti-roll over effect.

Description

Novel non-exposed-hole double-sided conducting circuit film

Technical Field

The utility model relates to a two-sided technical field that switches on of circuit, more specifically say, relate to a novel no hole two-sided circuit film that switches on that exposes.

Background

In the early Printed Circuit Board (PCB) and flexible printed circuit board (FPC) technologies, a copper-clad layer is first attached to the surface of a base material, and a Plated Through Hole (PTH) is formed by punching and then electroplating. The through hole shape of the plated through hole before electroplating is helpful for the double-sided distribution of the etching solution for etching the circuit in the wet process. However, with the development of tiny thinning of devices and the change of manufacturing processes, the circuit film has a thinner structure than a flexible circuit board, and the biggest difference between the two is that the circuit film does not use copper foil, an adhesive layer does not exist between a circuit and a base material, no etching process is used in manufacturing, the thickness of the whole product of the circuit film is more biased to a diaphragm rather than a plate, and the whole product of the circuit film has better bending and flexibility characteristics. However, in the process of manufacturing the circuit film, the circuit structure is directly printed by using metal paste such as silver paste, and the design of the through hole with two-sided conduction causes overflow pollution of the paste during printing, which easily causes the problem of inaccurate circuit pattern and short circuit of the circuit.

At present, among the two-sided circuit film that switches on of no open pore, conductive printing layer and insulating film are connected and are used the mode that bonds usually, but conductive printing layer and insulating film bonding local area are limited, lead to connecting stability poor, the condition that conductive printing layer and insulating film break away from can appear, and can not effectually fix a position when being connected conductive printing layer and insulating film, lead to conductive printing layer and insulating film hookup location to appear the excursion further stability that influences the connection, so need a novel two-sided circuit film that switches on of no open pore.

SUMMERY OF THE UTILITY MODEL

To the problem that exists among the prior art, the utility model aims to provide a novel no open pore two-sided circuit film that switches on to solve and be connected the poor problem of stability between conductive printing layer and the insulating film.

In order to solve the above problems, the utility model adopts the following technical proposal.

The utility model provides a novel no open pore two-sided circuit film that switches on, includes insulating film, the equal bottom in insulating film's top bonds respectively has first electrically conductive printing layer and the electrically conductive printing layer of second, the elastic strip that the equal fixedly connected with equidistance was arranged in one side relative of first electrically conductive printing layer and the electrically conductive printing layer of second was arranged, the draw-in groove that the equidistance was arranged is all seted up to insulating film's top and bottom, the inner wall and the elastic strip of draw-in groove bond mutually.

As a further description of the above technical solution:

the top of the first conductive printing layer is fixedly connected with two induction electrodes, and the input end of the first conductive printing layer is in signal connection with the induction electrodes.

As a further description of the above technical solution:

the top of the first conductive printing layer is fixedly connected with a top surface film, and the bottom of the second conductive printing layer is fixedly connected with a bottom surface film.

Compared with the prior art, the utility model has the advantages of:

(1) the scheme can be used as a substrate for connecting the first conductive printing layer and the second conductive printing layer through the insulating film, when the substrate is connected, the top and the bottom of the insulating film and the inner walls of all the clamping grooves are fully coated with glue, then the first conductive printing layer and the second conductive printing layer are paved on two sides of the insulating film, in the process, the elastic strip can be inserted into the clamping grooves, the purpose of positioning the first conductive printing layer and the second conductive printing layer is achieved, the first conductive printing layer and the second conductive printing layer are prevented from deviating from the insulating film, the bonding stability of the first conductive printing layer and the second conductive printing layer with the insulating film is improved, the bonding area of the first conductive printing layer and the second conductive printing layer with the insulating film can be increased through the arrangement of the clamping grooves and the elastic strip, and the bonding stability is improved, and the toughness of the device can be improved through the arrangement of the elastic strips, and the anti-bending effect of the device is improved.

(2) This scheme can be used for being connected with electronic component through two response electrodes of first conductive printing layer top fixed connection, improves the practicality of device.

(3) This scheme can protect first conductive printing layer and second conductive printing layer through the top surface tectorial membrane of first conductive printing layer top fixed connection and the bottom surface tectorial membrane of second conductive printing layer bottom fixed connection to there can be the effect of response isolation.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a top view of the present invention;

fig. 3 is a front sectional view of the present invention;

fig. 4 is an enlarged view of a portion a in fig. 3 according to the present invention.

The reference numbers in the figures illustrate:

1. an insulating film; 2. a first conductive printed layer; 3. a second conductive printed layer; 4. an elastic strip; 5. a card slot; 6. an induction electrode; 7. coating a film on the top surface; 8. the bottom surface is covered with a film.

Detailed Description

The technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiment of the present invention;

please refer to fig. 1 to 4, wherein, a novel non-open-hole double-sided conductive circuit film comprises an insulating film 1, a first conductive printing layer 2 and a second conductive printing layer 3 are respectively bonded to the bottoms of the tops of the insulating film 1, elastic strips 4 arranged at equal intervals are fixedly connected to the opposite sides of the first conductive printing layer 2 and the second conductive printing layer 3, clamping grooves 5 arranged at equal intervals are respectively formed in the tops and the bottoms of the insulating film 1, and the inner walls of the clamping grooves 5 are bonded to the elastic strips 4.

In the utility model, the insulating film 1 can be used as a substrate for connecting the first conductive printing layer 2 and the second conductive printing layer 3, when the connection is carried out, the top and the bottom of the insulating film 1 and the inner walls of all the clamping grooves 5 are coated with glue, then the first conductive printing layer 2 and the second conductive printing layer 3 are paved on both sides of the insulating film 1, in the process, the elastic strip 4 can be inserted into the clamping groove 5, the purpose of positioning the first conductive printing layer 2 and the second conductive printing layer 3 is achieved, the position deviation of the first conductive printing layer 2 and the second conductive printing layer 3 and the insulating film 1 is avoided, the bonding stability of the first conductive printing layer 2 and the second conductive printing layer 3 and the insulating film 1 is improved, and the bonding area of the first conductive printing layer 2 and the second conductive printing layer 3 and the insulating film 1 can be increased through the arrangement of the clamping grooves 5 and the elastic strips 4, and then improve the stability of bonding to can increase the toughness of device through the setting of elasticity strip 4, improve the anti effect of rolling over of device.

Please refer to fig. 1-3, wherein: the top of the first conductive printing layer 2 is fixedly connected with two induction electrodes 6, and the input end of the first conductive printing layer 2 is in signal connection with the induction electrodes 6.

The utility model discloses in, two response electrodes 6 through 2 top fixed connection of first conductive printing layer can be used for being connected with electronic component, improve device's practicality.

Please refer to fig. 1-4, wherein: the top of the first conductive printing layer 2 is fixedly connected with a top surface coating 7, and the bottom of the second conductive printing layer 3 is fixedly connected with a bottom surface coating 8.

The utility model discloses in, top surface tectorial membrane 7 through 2 top fixed connection of first conductive printing layer and the bottom surface tectorial membrane 8 of 3 bottom fixed connection of second conductive printing layer can protect first conductive printing layer 2 and second conductive printing layer 3 to there can be the effect of response isolation.

The working principle is as follows: the insulating film 1 can be used as a substrate for connecting the first conductive printing layer 2 and the second conductive printing layer 3, when the connection is performed, the top and the bottom of the insulating film 1 and the inner walls of all the clamping grooves 5 are coated with glue, then the first conductive printing layer 2 and the second conductive printing layer 3 are laid on two sides of the insulating film 1, in the process, the elastic strip 4 can be inserted into the clamping grooves 5, the purpose of positioning the first conductive printing layer 2 and the second conductive printing layer 3 is achieved, the first conductive printing layer 2 and the second conductive printing layer 3 are prevented from being deviated from the insulating film 1, the bonding stability of the first conductive printing layer 2 and the second conductive printing layer 3 with the insulating film 1 is improved, and the bonding area of the first conductive printing layer 2 and the second conductive printing layer 3 with the insulating film 1 can be increased through the arrangement of the clamping grooves 5 and the elastic strips 4, and then improve the stability of bonding to can increase the toughness of device through the setting of elasticity strip 4, improve the anti effect of rolling over of device.

The above is only a preferred embodiment of the present invention; the scope of the present invention is not limited thereto. Any person skilled in the art should also be able to cover the technical scope of the present invention by replacing or changing the technical solution and the improvement concept of the present invention with equivalents and modifications within the technical scope of the present invention.

Claims

1. The utility model provides a novel no open pore two-sided circuit film that switches on, includes insulating film (1), its characterized in that: the utility model discloses a conductive printing structure, including insulating film (1), first conductive printing layer (2) and second conductive printing layer (3) bond respectively in the equal bottom in top of insulating film (1), the equal fixedly connected with equidistance elasticity strip (4) of arranging in the relative one side of first conductive printing layer (2) and second conductive printing layer (3), draw-in groove (5) that the equidistance was arranged are all seted up to the top and the bottom of insulating film (1), the inner wall and the elasticity strip (4) of draw-in groove (5) bond mutually.

2. The novel non-open hole double-sided conduction circuit film as claimed in claim 1, wherein: the top of the first conductive printing layer (2) is fixedly connected with two induction electrodes (6), and the input end of the first conductive printing layer (2) is in signal connection with the induction electrodes (6).

3. The novel non-open hole double-sided conduction circuit film as claimed in claim 1, wherein: the top of the first conductive printing layer (2) is fixedly connected with a top surface covering film (7), and the bottom of the second conductive printing layer (3) is fixedly connected with a bottom surface covering film (8).