CN218183631U - Connection structure of flexible circuit board and base plate - Google Patents
Connection structure of flexible circuit board and base plate Download PDFInfo
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- CN218183631U CN218183631U CN202222431497.5U CN202222431497U CN218183631U CN 218183631 U CN218183631 U CN 218183631U CN 202222431497 U CN202222431497 U CN 202222431497U CN 218183631 U CN218183631 U CN 218183631U
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- circuit board
- flexible circuit
- connecting channel
- silver
- connection structure
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Abstract
The utility model relates to a connection structure of flexible circuit board and base plate, including base plate and flexible circuit board, be equipped with first circuit on the upper surface of base plate, be equipped with second circuit, its characterized in that on the upper surface of flexible circuit board: the flexible circuit board is bonded on the first circuit through an adhesive layer; the flexible circuit board is provided with at least one connecting channel penetrating through the upper surface and the lower surface of the flexible circuit board, the first circuit is positioned at the lower side of the lower port of each connecting channel, and the second circuit extends to the edge part of the upper port of each connecting channel; and a silver connecting piece formed by solidifying silver colloid is arranged in each connecting channel, the upper part of the silver connecting piece extends out of the upper port of the connecting channel and covers the second circuit, and the lower part of the silver connecting piece extends out of the lower port of the connecting channel and covers the first circuit. The connection structure can improve the conductivity and the connection stability between the flexible circuit board and the substrate, and allows the passage of large current.
Description
Technical Field
The utility model relates to a connection structure of circuit board, concretely relates to connection structure of flexible circuit board and base plate.
Background
Devices such as liquid crystal displays and touch screens need to connect a first circuit arranged on a glass substrate or a plastic substrate by using a certain circuit. At present, the first circuit is generally connected to the outside through the flexible circuit board (i.e. FPC), and the second circuit of the flexible circuit board and the first circuit on the glass substrate or the plastic substrate are generally directly combined with each other through a layer of anisotropic conductive adhesive (i.e. ACF), however, since the current between the first circuit and the second circuit is conducted through the limited metal balls on the anisotropic conductive adhesive, and the contact area of the metal balls is very small, when a large current is conducted, the condition of ACF connection failure due to local heating is easily caused, and the conductivity and the connection stability of the flexible circuit board are affected.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a connection structure of flexible circuit board and base plate is provided, this kind of connection structure can improve the electric conductivity between flexible circuit board and the base plate and be connected the steadiness to allow passing through of heavy current. The technical scheme is as follows:
the utility model provides a connection structure of flexible circuit board and base plate, includes base plate and flexible circuit board, is equipped with first circuit on the upper surface of base plate, is equipped with second circuit on the upper surface of flexible circuit board, its characterized in that: the flexible circuit board is bonded on the first circuit through an adhesive layer; the flexible circuit board is provided with at least one connecting channel penetrating through the upper surface and the lower surface of the flexible circuit board, the first circuit is positioned at the lower side of the lower port of each connecting channel, and the second circuit extends to the edge part of the upper port of each connecting channel; and a silver connecting piece formed by solidifying silver colloid is arranged in each connecting channel, the upper part of the silver connecting piece extends out of the upper port of the connecting channel and covers the second circuit, and the lower part of the silver connecting piece extends out of the lower port of the connecting channel and covers the first circuit.
In general, a glass substrate or a plastic substrate is used as the substrate.
In the connection structure, the lower part and the upper part of the silver connecting piece formed by solidifying the silver colloid respectively cover the first circuit and the second circuit to form surface contact instead of point contact, so that large current is allowed to pass between the first circuit and the second circuit, and the silver colloid can be coated to be thicker, so that large current is allowed to pass through the cross section, and the conductivity between the flexible circuit board and the substrate is improved.
In a preferable scheme, the silver adhesive covers the inner wall of the connecting channel, and the thickness of the silver connecting piece is at least 1mm.
In a further preferred scheme, the connection channel is filled with the silver colloid.
In a preferred embodiment, the number of the connecting channels is multiple and the connecting channels are arranged in parallel. The conductivity between the second circuit and the first circuit is further increased by distributing the respective connection channels and the silver paste in the channels thereof all over the flexible circuit board.
In a preferred embodiment, the connecting channel is an opening or a through hole.
In a further preferred embodiment, the connecting channel is circular in shape. Therefore, the deformation of the flexible circuit board can be minimized, and the connection stability of the flexible circuit board can be ensured.
In a preferred scheme, the adhesive layer is pressure-sensitive adhesive, high-temperature curing adhesive or UV curing adhesive. The thickness of the glue layer is generally 0.1-0.3 mm.
In order to prevent the flexible circuit board from being too thick to affect the bridging, the thickness of the flexible circuit board is preferably 0.2mm to 0.4mm.
In a further preferred embodiment, at the corresponding position of the connecting channel, the inner edge of the adhesive layer is located outside the inner edge of the connecting channel, and an air guide gap is formed between the flexible circuit board and the first circuit at the periphery of the connecting channel. Through setting up the air guide gap, make in silver colloid can permeate the interface channel better and cross the thick liquid opening, avoid forming the bubble in the interface channel and the influence switches on, and when seepage flow or extrusion silver colloid, because the effect in air guide gap, make gapped between silver colloid and the glue film, both do not have the contact, the great influence that generates heat and cause the adhesive force of glue film that the event leads to when switching on the heavy current is less, can not influence the fixed of flexible circuit board, thereby improve the connection steadiness between flexible circuit board and the base plate.
In a preferred scheme, a third circuit is arranged on the lower surface of the flexible circuit board and extends to the edge of the lower port of each connecting channel; the lower part of the silver connecting piece extends out of the lower port of the connecting channel and covers the first circuit and the third circuit; the flexible circuit board is provided with at least one conductive hole, and a conductive layer for conducting the third circuit and the second circuit is arranged in the conductive hole. Usually, the conductive layer is made of copper. Therefore, double-sided connection of the flexible circuit board can be formed, and the conductivity and the reliability are better.
Compared with the prior art, the utility model, have following advantage:
according to the connection structure, the connection channel penetrating through the upper surface and the lower surface of the flexible circuit board is arranged on the flexible circuit board, the silver connecting piece formed by solidifying the silver adhesive is arranged in the connection channel, the lower part and the upper part of the silver connecting piece respectively cover the first circuit and the second circuit to form surface contact instead of point contact, so that large current is allowed to pass between the first circuit and the second circuit, the silver adhesive can be coated to be thick, the large current is allowed to pass through the cross section, and the conductivity and the connection stability between the flexible circuit board and the substrate are improved.
Drawings
Fig. 1 is a schematic structural diagram of a first preferred embodiment of the present invention.
Fig. 2 isbase:Sub>A sectional viewbase:Sub>A-base:Sub>A of fig. 1.
Fig. 3 is a partial sectional view of a second preferred embodiment of the present invention.
Detailed Description
Example one
As shown in fig. 1 and fig. 2, the connection structure of the flexible circuit board and the substrate includes a substrate 1 and a flexible circuit board 2, a first circuit 11 is disposed on the upper surface of the substrate 1, a second circuit 21 is disposed on the upper surface of the flexible circuit board 2, and the flexible circuit board 2 is bonded on the first circuit 11 through an adhesive layer 3; the flexible circuit board 2 is provided with at least one connecting channel 22 penetrating through the upper surface and the lower surface of the flexible circuit board 2, the first circuit 11 is positioned at the lower side of the lower port of each connecting channel 22, and the second circuit 21 extends to the edge part of the upper port of each connecting channel 22; each connecting channel 22 is provided with a silver connecting piece 23 formed by solidifying silver adhesive 231, the upper part of the silver connecting piece 23 extends out of the upper port of the connecting channel 22 and covers the second circuit 21, and the lower part of the silver connecting piece 23 extends out of the lower port of the connecting channel 22 and covers the first circuit 11.
In the present embodiment, a glass substrate or a plastic substrate is used as the substrate 1.
In this embodiment, the silver paste 231 fills the connecting channel 22 and covers the inner wall of the connecting channel 22, and the thickness of the silver connecting member 23 is at least 1mm.
In the present embodiment, the number of the connecting passages 22 is plural and arranged in parallel. The conductivity between its second circuit 21 and the first circuit 11 is further increased by distributing the respective connection channels 22 and the silver paste 231 within the channels thereof throughout the flexible circuit board 2.
In the present embodiment, the connecting passage 22 is a circular opening or through hole. This minimizes the deformation of the flexible circuit board 2, and is advantageous for ensuring the stability of the connection of the flexible circuit board 2.
In this embodiment, the adhesive layer 3 is a pressure-sensitive adhesive, a high temperature curing adhesive or a UV curing adhesive, and the thickness of the adhesive layer 3 is 0.1 to 0.3mm.
In order to prevent the flexible circuit board 2 from being too thick to affect the crossover, in the present embodiment, the thickness of the flexible circuit board 2 is 0.2mm to 0.4mm.
In the present embodiment, at the corresponding position of the connecting channel 22, the inner edge of the glue layer 3 is outside the inner edge of the connecting channel 22, and an air guide slit 24 is formed between the flexible circuit board 2 and the first circuit 11 at the periphery of the connecting channel 22. Through setting up air guide gap 24, make in silver colloid 231 can permeate connecting channel 22 better, avoid forming the bubble in connecting channel 22 and the influence switches on, and when seepage flow or extrusion silver colloid 231, because air guide gap 24's effect, make gapped between silver colloid 231 and the glue film 3, both do not have the contact, the great influence that generates heat and cause the adhesive force of glue film 3 that the event leads to when switching on the heavy current is less, can not influence the fixed of flexible circuit board 2, thereby improve the connection steadiness between flexible circuit board 2 and the base plate 1.
Example two
Referring to fig. 3, in the case where the other parts are the same as those of the first embodiment, the difference is: in the present embodiment, the lower surface of the flexible circuit board 2 is provided with a third circuit 25, and the third circuit 25 extends to the lower port edge of each connecting channel 22; the lower part of the silver connecting piece 23 extends out of the lower port of the connecting channel 22 and covers the first circuit 11 and the third circuit 25; at least one conductive hole 26 is formed in the flexible circuit board 2, and a copper conductive layer 261 for conducting the third circuit 25 and the second circuit 21 is formed in the conductive hole 26. This makes it possible to electrically connect both surfaces of the flexible printed circuit board 2, and the electrical conductivity and reliability are improved.
In addition, it should be noted that the names of the parts and the like of the embodiments described in the present specification may be different, and all the equivalent or simple changes made according to the structure, the features and the principle of the present invention are included in the protection scope of the present invention. Various modifications, additions and substitutions may be made by those skilled in the art without departing from the scope of the invention as defined in the accompanying claims.
Claims (10)
1. The utility model provides a connection structure of flexible circuit board and base plate, includes base plate and flexible circuit board, is equipped with first circuit on the upper surface of base plate, is equipped with second circuit on the upper surface of flexible circuit board, its characterized in that: the flexible circuit board is bonded on the first circuit through an adhesive layer; the flexible circuit board is provided with at least one connecting channel penetrating through the upper surface and the lower surface of the flexible circuit board, the first circuit is positioned at the lower side of the lower port of each connecting channel, and the second circuit extends to the edge part of the upper port of each connecting channel; and a silver connecting piece formed by solidifying silver adhesive is arranged in each connecting channel, the upper part of the silver connecting piece extends out of the upper port of the connecting channel and covers the second circuit, and the lower part of the silver connecting piece extends out of the lower port of the connecting channel and covers the first circuit.
2. A connection structure of a flexible circuit board and a substrate as claimed in claim 1, wherein: the silver glue covers on the inner wall of the connecting channel, and the thickness of the silver connecting piece is at least 1mm.
3. A connection structure of a flexible circuit board and a substrate as claimed in claim 2, wherein: the silver colloid is filled in the connecting channel.
4. A connection structure of a flexible circuit board and a substrate as claimed in claim 1, wherein: the number of the connecting channels is multiple and the connecting channels are arranged in parallel.
5. The structure of claim 4, wherein: the connecting channel is circular in shape.
6. A connection structure of a flexible circuit board and a substrate as claimed in claim 1, wherein: and at the corresponding position of the connecting channel, the inner edge of the adhesive layer is positioned outside the inner edge of the connecting channel, and an air guide gap is formed between the flexible circuit board and the first circuit, which are arranged on the periphery of the connecting channel.
7. A connection structure of a flexible circuit board and a substrate according to any one of claims 1 to 6, wherein: the lower surface of the flexible circuit board is provided with a third circuit, and the third circuit extends to the edge part of the lower port of each connecting channel; the lower part of the silver connecting piece extends out of the lower port of the connecting channel and covers the first circuit and the third circuit; the flexible circuit board is provided with at least one conductive hole, and a conductive layer for conducting the third circuit and the second circuit is arranged in the conductive hole.
8. A connection structure of a flexible circuit board and a substrate as set forth in any one of claims 1 to 6, wherein: the substrate is a glass substrate or a plastic substrate.
9. A connection structure of a flexible circuit board and a substrate as set forth in any one of claims 1 to 6, wherein: the adhesive layer is pressure-sensitive adhesive, high-temperature curing adhesive or UV curing adhesive.
10. A connection structure of a flexible circuit board and a substrate according to any one of claims 1 to 6, wherein: the thickness of the flexible circuit board is 0.2 mm-0.4 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222431497.5U CN218183631U (en) | 2022-09-14 | 2022-09-14 | Connection structure of flexible circuit board and base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222431497.5U CN218183631U (en) | 2022-09-14 | 2022-09-14 | Connection structure of flexible circuit board and base plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218183631U true CN218183631U (en) | 2022-12-30 |
Family
ID=84623133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222431497.5U Active CN218183631U (en) | 2022-09-14 | 2022-09-14 | Connection structure of flexible circuit board and base plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218183631U (en) |
-
2022
- 2022-09-14 CN CN202222431497.5U patent/CN218183631U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Jiang Shuren Inventor after: Shen Yi Inventor after: Lv Yuemin Inventor after: Zhang Gaomin Inventor after: Zheng Weipeng Inventor after: Chang Bibo Inventor before: Jiang Shuren Inventor before: Shen Yi Inventor before: Lv Yuemin Inventor before: Zhang Gaomin Inventor before: Zheng Weipeng Inventor before: Wen Bibo |
|
| CB03 | Change of inventor or designer information |