CN212411472U - Panel structure, display panel and display device - Google Patents
Panel structure, display panel and display device Download PDFInfo
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- CN212411472U CN212411472U CN202020696333.3U CN202020696333U CN212411472U CN 212411472 U CN212411472 U CN 212411472U CN 202020696333 U CN202020696333 U CN 202020696333U CN 212411472 U CN212411472 U CN 212411472U
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Abstract
The utility model provides a panel structure, which comprises an internal circuit, a substrate and an output layer, wherein the substrate and the output layer are respectively positioned on a first surface and a second surface which are arranged opposite to the panel structure; at least one end of the output layer is provided with a wiring area, the wiring area is provided with metal wires, one end of each metal wire is connected with the internal circuit, and the other end of each metal wire penetrates through the panel structure to be exposed on one side of the substrate back to the output layer. The utility model discloses still provide one kind include panel structure's display panel reaches to include display panel's display device. The utility model provides an among panel structure, display panel and display device, setting when the line is walked to metal among the panel structure, effectively utilized panel structure's thickness space, through after other circuit boards are bound to the line is walked to metal, can not enlarge promptly display panel's frame also can not increase display panel thickness.
Description
Technical Field
The utility model relates to a show technical field, especially relate to a panel structure, include panel structure's display panel reaches to include display panel's display device.
Background
Currently, in the manufacturing process of a display device, a display panel is generally bound to a flexible circuit board, so that the display panel is electrically connected to a main board of the display device through the flexible circuit board. As shown in fig. 1, in the prior art, one end of the display panel 100 'generally includes a bonding region 130' and a wiring region 160', one end of the flexible circuit board 200' partially overlaps the bonding region 130 'of the display panel 100' and is bonded and connected by the anisotropic conductive adhesive 300', and a bonding circuit of the flexible circuit board 200' and an internal circuit of the display panel 100 'are electrically connected by a metal trace in the wiring region 160'. However, in such a panel structure, the bonding regions 130' and the wiring regions 160' are arranged adjacent to each other on the same side of the display panel 100', and the span in the non-display region of the display panel 100' is large, which results in a wide frame of the display panel 100' and is not favorable for implementing a narrow frame design of the display device.
SUMMERY OF THE UTILITY MODEL
To not enough among the prior art, the utility model provides a panel structure and display panel, display device who uses thereof sets up when the line is walked to metal among the panel structure, effectively utilized panel structure's thickness space, through after other circuit boards are bound to metal wiring, can not enlarge promptly display panel's frame also can not increase the thickness of display panel.
In order to solve the above technical problem, in one aspect, the present invention provides a panel structure, which includes an internal circuit, a substrate and an output layer, wherein the substrate and the output layer are respectively located on a first surface and a second surface of the panel structure, which are opposite to each other; at least one end of the output layer is provided with a wiring area, the wiring area is provided with metal wires, one end of each metal wire is connected with the internal circuit, and the other end of each metal wire penetrates through the panel structure to be exposed on one side of the substrate back to the output layer.
In an embodiment, a binding circuit board is disposed on a side of the substrate opposite to the output layer, a binding circuit is disposed on a side of one end of the binding circuit board facing the substrate, and the other end of the metal trace is connected to the binding circuit in a binding manner.
The substrate comprises a rigid substrate or a flexible substrate, and the binding circuit board comprises a flexible circuit board or a printed circuit board.
In an embodiment, one end of the bonding circuit board is bonded to a side of the substrate opposite to the output layer through an anisotropic conductive adhesive, and the other end of the metal trace is bonded to the bonding circuit through the anisotropic conductive adhesive.
Preferably, a conductive piece is arranged at the other end of the metal routing wire, and the conductive piece is bonded and conducted to the anisotropic conductive adhesive.
Wherein, the panel structure is still including being located the output layer with barrier layer and viscose layer between the base plate, electrically conductive keeping away from the one end protrusion of anisotropic conducting resin in base plate and butt in the barrier layer, the viscose layer bond in the base plate with between the barrier layer, and the cladding electrically conductive protrusion in the part of base plate.
Optionally, the conductive member is bonded to an end surface of one end of the anisotropic conductive adhesive, and is flush with or partially protrudes from a surface of the substrate on a side opposite to the output layer.
The substrate is provided with a wiring area, a through hole is formed in the area, corresponding to the wiring area, of the substrate, and the conductive piece is made of conductive materials embedded in the through hole.
On the other hand, the utility model also provides a display panel including above-mentioned panel structure.
In another aspect, the present invention further provides a display device including the display panel.
The utility model provides an among panel structure, display panel and display device, panel structure includes internal circuit and is located respectively the base plate and the output layer on the relative two surfaces of panel structure, the output layer is provided with the wiring district, the wiring district is equipped with the metal and walks or trace, the one end of metal walking trace is connected the internal circuit, and the other end pierces through panel structure to expose in the base plate dorsad output layer one side, the setting of metal walking trace has effectively utilized the thickness space of panel structure, through after other circuit boards are bound to the metal walking trace, this circuit board can be bound in the base plate dorsad one side of wiring district, makes the orthographic projection of the binding district of this circuit board and display panel on the output layer be located in the wiring district to can not enlarge the frame of display panel; moreover, the metal wiring is contained in the panel structure, and the thickness of the display panel cannot be increased.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic diagram of a panel structure of a display panel in the prior art.
Fig. 2 is a schematic diagram of a panel structure of a display panel according to an embodiment of the present invention.
Fig. 3 is a schematic diagram comparing the panel structure of fig. 1 with the panel structure of fig. 2.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without any creative effort belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Referring to fig. 2, the present invention provides a panel structure applied to a display panel 100, the panel structure includes an internal circuit, a substrate 120 located on a first surface of the panel structure, and an output layer 140 located on a second surface of the panel structure, wherein the first surface and the second surface are disposed opposite to each other. The internal circuits (not shown) of the display panel 100 include, but are not limited to, a driving circuit and a gate circuit; the first surface and the second surface are opposite to the display panel 100. At least one end of the output layer 140 is provided with a wiring region 160, the wiring region 160 is provided with a metal trace 162, one end of the metal trace 162 is connected to the internal circuit, and the other end of the metal trace 162 penetrates through the panel structure to the side exposed on the substrate 120 and facing away from the output layer 140, that is, the metal trace 162 penetrates through the panel structure along the thickness direction of the display panel 100.
The metal traces 162 are arranged to effectively utilize the thickness space of the panel structure, and after the display panel 100 adopting the panel structure is bound with other circuit boards through the metal traces 162, the circuit board can be bound on the side of the substrate 120 opposite to the wiring region 160, so that the orthographic projection of the binding region 130 of the circuit board and the display panel 100 on the output layer 140 is located in the wiring region 160, and the frame of the display panel 100 is not enlarged; as shown in fig. 3, compare with the span in the non-display area when the wiring area 160' is arranged adjacent to the same side of the display panel 100' in the binding area 130' and the fan-out wiring area 160' in the existing panel structure, the utility model discloses in the binding area 130 with the span in the non-display area when the wiring area 160 is located the both sides that the display panel 100 is relative respectively and the projection coincides has reduced the shared distance L of binding area 130', is favorable to the narrow frame design of the display panel 100. Moreover, compared with the metal trace 162 which is disposed on the output layer 140 upward along the thickness direction of the display panel 100, when the metal trace 162 penetrates through the panel structure along the thickness direction of the display panel 100, the metal trace 162 is contained in the thickness space of the display panel 100, which does not increase the thickness of the display panel 100, and is also beneficial to the light and thin design of the display panel 100.
It should be noted that the panel structure may be processed by etching, drilling, laser, etc. to obtain a through hole for the metal trace 162 to pass through, where the metal trace 162 may be a conductive wire disposed in the through hole of the panel structure, or may be a conductive material filled in the through hole, and the conductive material includes but is not limited to copper. In this embodiment, the metal trace 162 is a conductive material filled in the through hole of the panel structure.
Specifically, as shown in fig. 2, in this embodiment, a bonding circuit board 200 is disposed on a side of the substrate 120 opposite to the output layer 140, a bonding circuit (not shown) is disposed on a side of the bonding circuit board 200 facing the substrate 120, and the other end of the metal trace 162 is connected to the bonding circuit in a bonding manner. It is understood that, when the other end of the binding circuit board 200 is bound to a main board in a display device including the display panel 100, the display panel 100 is electrically connected to the main board through the binding circuit board 200.
The substrate 120 may be a rigid substrate or a flexible substrate, and the bonding circuit board 200 may be a flexible circuit board or a printed circuit board. In this embodiment, the substrate 120 is a flexible substrate, and specifically, may be a flexible substrate made of polyimide material, so that the display panel 100 may be bent; the binding circuit board 200 is preferably a flexible circuit board, and the main board bound to the other end of the binding circuit board 200 is placed on the side of the display panel 100 facing away from the output layer 140 by folding the flexible circuit board, so as to reduce the volume of the display device.
The bonding circuit may be a circuit that is prepared inside the bonding circuit board 200 and connected with a bonding pin, and the bonding pin is exposed out of the bonding circuit board 200 for bonding with the metal trace 162; of course, the bonding circuit may also be a metal layer circuit prepared on the surface of the bonding circuit board 200, or a conductive ink printed circuit or a conductive film circuit prepared on the surface of the bonding circuit board 200. In this embodiment, the bonding circuit is a circuit prepared inside the bonding circuit board 200 and is bonded to the metal trace 162 through an exposed bonding pin, and the bonding circuit is located inside the bonding circuit board 200, which is beneficial to protecting the bonding circuit.
In this embodiment, one end of the bonding circuit board 200 is bonded to the side of the substrate 120 opposite to the output layer 140 through the anisotropic conductive adhesive 300, and the other end of the metal trace 162 is bonded to the bonding circuit through the anisotropic conductive adhesive 300.
Preferably, as shown in fig. 2, in the present embodiment, a conductive member 164 is disposed at the other end of the metal trace 162, and the conductive member 164 is adhered to and conducted with the anisotropic conductive adhesive 300. Specifically, a via hole is formed in an area of the substrate 120 corresponding to the wiring region 160, and the conductive member 164 is a conductive material embedded in the via hole. In this embodiment, the conductive member 164 is a copper block embedded in the via hole of the substrate 120, and the other end of the metal trace 162 is provided with the copper block, so that the contact area with the anisotropic conductive adhesive 300 can be increased to enhance the contact electrical performance, and the length of the metal trace 162 can be reduced, which is beneficial to simplifying the manufacturing process of the metal trace 162.
As shown in fig. 2, in this embodiment, the panel structure further includes a barrier layer 150 and an adhesive layer 170 located between the output layer 140 and the substrate 120, wherein one end of the conductive member 164, which is far away from the anisotropic conductive adhesive 300, protrudes out of the substrate 120 and abuts against the barrier layer 150, and the adhesive layer 170 is adhered between the substrate 120 and the barrier layer 150 and covers a portion of the conductive member 164 protruding out of the substrate 120. The adhesive layer 170 covers a portion of the conductive member 164, and may function to fix the conductive member 16, so as to prevent the loose electrical connection between the metal trace 162 and the conductive member 164 when the display substrate 100 is bent.
In this embodiment, the end surface of the conductive member 164 adhered to one end of the anisotropic conductive film 300 protrudes from the surface of the substrate 120 facing away from the output layer 140.
In other embodiments, an end surface of the conductive member 164 adhered to one end of the anisotropic conductive film 300 may be flush with a surface of the substrate 120 facing away from the output layer 140, so as to further reduce the overall thickness of the display panel 100 and the bonded circuit board 200 after bonding.
As described above, in the panel structure, the metal routing 162 is disposed in the panel structure, so as to effectively utilize the thickness space of the panel structure, and the display panel 100 of the panel structure is disposed through the metal routing 162 and bound with other circuit boards, so as not to enlarge the frame of the display panel 100, and not to increase the thickness of the display panel 100.
Further, the present invention also provides the display panel 100. In some embodiments, when the substrate 120 in the panel structure is a rigid substrate, the display panel is an unfoldable display panel. In other embodiments, when the substrate 120 in the panel structure is a flexible substrate, the display panel 100 is a foldable display panel.
The utility model also provides a display device, display device includes foretell display panel 100.
It is understood that the display panel 100 and the display device have all the features and functions of the panel structure described above, and the description thereof is omitted.
The above is an implementation manner of the embodiments of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principles of the embodiments of the present invention, and these improvements and decorations are also considered as the protection scope of the present invention.
Claims (10)
1. A panel structure, comprising:
an internal circuit;
the substrate is positioned on the first surface of the panel structure; and
an output layer on a second surface of the panel structure, the first surface being disposed opposite the second surface;
at least one end of the output layer is provided with a wiring area, the wiring area is provided with metal wires, one end of each metal wire is connected with the internal circuit, and the other end of each metal wire penetrates through the panel structure to be exposed on one side of the substrate back to the output layer.
2. The panel structure according to claim 1, wherein a bonding circuit board is disposed on a side of the substrate facing away from the output layer, a bonding circuit is disposed on a side of the bonding circuit board facing the substrate, and another end of the metal trace is connected to the bonding circuit in a bonding manner.
3. The panel structure according to claim 2, wherein one end of the bonding circuit board is bonded to a side of the substrate facing away from the output layer through an anisotropic conductive adhesive, and the other end of the metal trace is bonded to the bonding circuit through the anisotropic conductive adhesive.
4. The panel structure of claim 3, wherein a conductive member is disposed at the other end of the metal trace, and the conductive member is bonded to and conducted with the anisotropic conductive adhesive.
5. The panel structure of claim 4, further comprising a barrier layer and an adhesive layer between the output layer and the substrate, wherein one end of the conductive member away from the anisotropic conductive adhesive protrudes from the substrate and abuts against the barrier layer, and the adhesive layer is adhered between the substrate and the barrier layer and covers the portion of the conductive member protruding from the substrate.
6. The panel structure of claim 5, wherein the conductive member is adhered to the anisotropic conductive adhesive such that an end surface of one end of the anisotropic conductive adhesive is flush with or partially protrudes from a surface of the substrate on a side opposite to the output layer.
7. The panel structure according to claim 4, wherein a via hole is formed in a region of the substrate corresponding to the wiring region, and the conductive member is a conductive material embedded in the via hole.
8. The panel structure of claim 2, wherein the substrate comprises a rigid substrate or a flexible substrate, and the bound circuit board comprises a flexible circuit board or a printed circuit board.
9. A display panel comprising the panel structure according to any one of claims 1 to 8.
10. A display device comprising a display panel comprising the panel structure according to any one of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020696333.3U CN212411472U (en) | 2020-04-29 | 2020-04-29 | Panel structure, display panel and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020696333.3U CN212411472U (en) | 2020-04-29 | 2020-04-29 | Panel structure, display panel and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212411472U true CN212411472U (en) | 2021-01-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020696333.3U Active CN212411472U (en) | 2020-04-29 | 2020-04-29 | Panel structure, display panel and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212411472U (en) |
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2020
- 2020-04-29 CN CN202020696333.3U patent/CN212411472U/en active Active
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Effective date of registration: 20220511 Granted publication date: 20210126 |
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