CN111836457A

CN111836457A - Circuit board, display screen and electronic equipment

Info

Publication number: CN111836457A
Application number: CN202010674207.2A
Authority: CN
Inventors: 王亚峰; 许少鹏
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-07-14
Filing date: 2020-07-14
Publication date: 2020-10-27
Also published as: CN112804816A; WO2022012193A1; CN112804816B

Abstract

The application relates to a circuit board, display screen and electronic equipment, wherein, the circuit board includes: the circuit board comprises a circuit board main body and a circuit board, wherein the circuit board main body comprises at least two layers of substrates which are arranged in a stacked mode, and a first through hole is formed in the circuit board main body; and the extension part extends out from one side edge of the circuit board main body, and the thickness of the extension part is smaller than that of the circuit board main body. The application provides a circuit board size is less, the installation of being convenient for.

Description

Circuit board, display screen and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to a circuit board, a display screen and electronic equipment.

Background

A Flexible Printed Circuit (FPC) board is a Circuit board for connecting a display screen panel and a driver chip, and is very important in a mobile terminal such as a smart phone and a tablet computer. Simultaneously, along with fingerprint identification technology's development, fingerprint identification technology is more and more mature under the optical screen, and fingerprint module realization fingerprint unblock under the optical screen is all chooseed for use to many electronic equipment. Fingerprint module under optical screen mainly includes G3 (3 rd generation) fingerprint module, G5 (5 th generation) fingerprint module and G6 (6 th generation) fingerprint module. Use the cell-phone as an example, how to realize the normal work of different fingerprint modules, the display screen flexible line way board is to the compatibility of different fingerprint modules to and how to avoid the great problem of display screen flexible line way board size is especially important.

Disclosure of Invention

The embodiment of the application provides a circuit board, a display screen and electronic equipment, which can reduce the size of the circuit board and are convenient to install.

A circuit board, comprising:

the circuit board comprises a circuit board main body and a circuit board, wherein the circuit board main body comprises at least two layers of substrates which are arranged in a stacked mode, and a first through hole is formed in the circuit board main body; and

the extension part extends out from one side edge of the circuit board main body, and the thickness of the extension part is smaller than that of the circuit board main body.

A circuit board, comprising:

a first substrate; and

the second substrate comprises a laminated part and an extension part which are integrally formed, the laminated part and the first substrate are arranged in a laminated mode, the extension part protrudes out of the edge of the first substrate, and the circuit board is provided with a first through hole which penetrates through the first substrate and the laminated part.

A display screen, comprising:

a display panel;

a drive unit; and

according to the circuit board, the circuit board is electrically connected with the display panel and the driving unit.

An electronic device, comprising:

the middle frame comprises a middle plate and a frame wound on the middle plate, and the middle plate is provided with a first groove;

according to the circuit board, the extension part is accommodated in the first groove; and

and the display panel is connected to one side of the middle plate, which deviates from the first groove, and the display panel is electrically connected with the circuit board.

Among above-mentioned circuit board, display screen and electronic equipment, the circuit board includes the base plate of two-layer range upon range of setting at least to increase and walk the line space, can effectively reduce the circuit board size remedies because of seting up the defect that the size that first through-hole brought increases, the installation of being convenient for. Meanwhile, the thickness of the extension part is smaller than that of the circuit board main body, and the extension part with the smaller thickness can be conveniently overlapped and matched with other components, so that the installation space in the electronic equipment is fully utilized.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic diagram of a fingerprint position of a mobile phone using a G3 fingerprint module;

FIG. 2 is a schematic diagram of fingerprint positions of a mobile phone employing a G5/G6 fingerprint module; (ii) a

FIG. 3 is a schematic diagram of a flexible printed circuit board of a mobile phone with a G3 fingerprint module;

FIG. 4 is a schematic diagram of a flexible printed circuit board of a mobile phone employing a G3/G6 fingerprint module;

fig. 5 is a schematic diagram of a top view structure of a circuit board according to an embodiment of the present application;

fig. 6 is a schematic diagram of an internal structure of a circuit board according to an embodiment of the present application;

fig. 7 is a schematic cross-sectional structure diagram of a circuit board according to an embodiment of the present application;

fig. 8 is a schematic cross-sectional structure diagram of a circuit board according to another embodiment of the present application;

fig. 9 is a schematic top view of a circuit board according to another embodiment of the present disclosure;

fig. 10 is a schematic structural diagram of a second substrate according to another embodiment of the present disclosure;

FIG. 11 is a block diagram of a display screen according to an embodiment of the present application;

fig. 12 is a schematic partial structural diagram of an electronic device according to an embodiment of the present application;

fig. 13 is a schematic cross-sectional structure diagram of a partial structure of an electronic device according to an embodiment of the present application;

FIG. 14 is a schematic diagram of a fingerprint position of an electronic device compatible with the G3 fingerprint module and the G5/G6 fingerprint module according to an embodiment of the present disclosure;

fig. 15 is a schematic cross-sectional structure diagram of a partial structure of an electronic device according to another embodiment of the present application.

Description of reference numerals:

10. a circuit board; 100. a circuit board main body; 101. a fingerprint hole; 102. a device bonding region; 103 electrical property test points; 20. a circuit board; 200. a circuit board main body; 202. a device bonding region; 203 electrical property test points; 30. a circuit board; 301. routing; 310. a circuit board main body; 311. a first through hole; 312. a first region; 313. a substrate; 314. a middle region; 315. a first surface; 316. a second region; 317. a device bonding region; 319. a second surface; 320. an extension portion; 321. a test area; 322. a first side; 323. a second through hole; 324. a second face; 40. a circuit board; 401. routing; 410. a first substrate; 420. a second substrate; 421. a laminating section; 422. an extension portion; 423. a test area; 424. a second through hole; 431. a first through hole; 432. a first region; 434. a middle region; 436. a second region; 437. a device bonding region; 50. a display screen; 510. a display panel; 520. a drive unit; 60. an electronic device; 610. a middle frame; 611. a middle plate; 612. a frame; 613. a first groove; 615. a second groove; 620. a display panel; 630 a first fingerprint module; 640. a second fingerprint module; 80. a mobile phone; 810. a middle frame; 820. a display panel; 90. a mobile phone; 910. a middle frame; 920. a display panel.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that, as used herein, the terms "first," "second," and the like may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, a first substrate may be referred to as a second substrate, and similarly, a second substrate may be referred to as a first substrate, without departing from the scope of the present application. The first substrate and the second substrate are both substrates, but they are not the same substrate.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise. In the description of the present application, "a number" means at least one, such as one, two, etc., unless specifically limited otherwise.

The technology for recognizing the fingerprints under the optical screen is applied and continuously improved in the market for a long time, has stronger and stronger adaptability to the environment, high stability in the using process, long service life and relatively low price, and is widely applied to electronic equipment.

Fingerprint module under commonly used optical screen mainly includes G3 fingerprint module, G5 fingerprint module, G6 fingerprint module. Because of the relatively thick thickness, the G3 fingerprint module is mostly combined with an OLED (Organic Light-Emitting Diode) hard screen to be applied to electronic devices; g5 fingerprint module and G6 fingerprint module are ultra-thin optical fingerprint module, mostly combine with the flexible screen of OLED to be applied to electronic equipment to reach the frivolous requirement of complete machine.

The electronic device referred to in the present application means a device that is composed of electronic components such as an integrated circuit, a transistor, and an electron tube, and functions by applying an electronic technique, including software. Electronic equipment in this application includes display screen and optics fingerprint module etc. wherein, and the display screen includes display panel and display screen flexible line way board (hereinafter be referred to as flexible line way board for short), and flexible line way board is used for realizing display panel and drive unit's electric connection. The electronic device can be, but is not limited to, a smart phone, a notebook computer, a tablet computer, a POS machine, a vehicle-mounted computer, and the like. For convenience of explanation, the present application will be described with reference to a mobile phone as an example.

The typical design of the mobile phone is a three-section structure of the whole mobile phone. The three-section structure of the whole mobile phone means that the mobile phone comprises a main board section, a battery bin and a small board section. The main board section is mainly used for accommodating the main board and the like, the battery bin is mainly used for accommodating the battery and the like, and the small board section is mainly used for accommodating the small main board, the flexible circuit board and the like.

Referring to fig. 1 and 2, in order to reduce the influence on the thickness of the whole mobile phone based on the three-section structure of the whole mobile phone and using the OLED hard screen, the G3 fingerprint module is generally placed on the small plate section, and the fingerprint unlocking position is relatively lower, as shown in fig. 1. Based on the mobile phone with the whole machine three-section structure and the OLED flexible screen, the G5 fingerprint module or the G6 fingerprint module (hereinafter referred to as G5/G6 fingerprint module for short) has little influence on the thickness of the whole machine, and is generally placed in a battery compartment, and the fingerprint unlocking position is relatively close to the upper position, as shown in FIG. 2.

In view of different installation positions, the display screens used by the mobile phones adopting the G3 fingerprint module and the G5/G6 fingerprint module generally need to design different flexible circuit boards for design matching. Referring to fig. 3, in a mobile phone using a G3 fingerprint module, the flexible printed circuit 10 and the G3 fingerprint module are both required to be disposed on the small board segment, and therefore, a finger hole 101 is required to be formed in the circuit board main body 100 of the flexible printed circuit 10, so that the G3 fingerprint module receives an optical signal through the finger hole, and the normal operation of the G3 fingerprint module is ensured. The OLED hard screen is generally packaged by COG (Chip On GLASS) or COF (Chip On Film), and the structure of the flexible circuit board 10 may be as shown in fig. 3. Due to the arrangement of the fingerprint hole 101, the routing of the flexible circuit board 10 needs to be bypassed through the fingerprint hole 101, so that the flexible circuit board 10 is large in size and inconvenient to install. Specifically, as shown in fig. 3, if the routing needs to go from the left side to the right side or from the right side to the left side along the X direction, the size of the flexible printed circuit board 10 along the Y direction is large. Meanwhile, as shown in fig. 4, the surface of the circuit board main body 100 may be further provided with a device soldering region 102 and an electrical test point 103.

Referring to fig. 4, the mobile phone using the G5/G6 fingerprint module can be placed in a battery compartment because the G5/G6 fingerprint module is thin, and the flexible circuit board 20 does not affect the normal operation of the G5/G6 fingerprint module, so the circuit board main body 200 does not need to be provided with a fingerprint hole. The OLED flexible screen is generally packaged by COP (Chip On PI), and the structure of the flexible circuit board 20 may be as shown in fig. 4. The surface of the circuit board main body 200 may further be provided with a device soldering area 202 and an electrical test point 203.

As can be seen from fig. 3 and 4, the flexible circuit board of the display screen of the mobile phone using the G3 fingerprint module and the G5/56 fingerprint module needs to be designed differently, so that the compatibility of the flexible circuit board is poor. In addition, along with the iterative upgrade of G3 fingerprint module, its optics unblock performance promotes step by step, and for G5/G6 fingerprint module, G3 fingerprint module also has absolute advantage in the price. Therefore, the mobile phone adopting the OLED flexible screen has the advantages of performance and cost due to the fact that the G3 fingerprint module is selected to achieve unlocking.

Referring to fig. 5 to 7, the embodiment of the present application provides a circuit board 30, which includes a circuit board main body 310 and an extension portion 320. The extension 320 extends from one side edge of the circuit board main body 310. The extension 320 has a thickness smaller than that of the wiring board body 310.

It is understood that the circuit board 30 may be a flexible circuit board or a non-flexible circuit board, as required. The following embodiments are all described by taking the circuit board 30 as an example of a flexible circuit board.

The circuit board body 310 may include a plurality of edges, and the extension 320 may extend from any one of the edges of the circuit board 310. As shown in fig. 5, in one embodiment, the circuit board main body 310 includes four edges, and the extension portion 320 extends from an upper edge of the circuit board main body 310 along the Y direction. The shapes, materials, dimensions, and the like of the circuit board main body 310 and the extension portion 320 are selected according to actual requirements, and the embodiment of the present application is not limited at all.

The specific thickness of the extension 320 can be designed according to actual needs. The thickness of the extension part 320 is smaller than that of the circuit board main body 310, so that when the installation positions of the extension part 320 and other parts of the mobile phone are overlapped, the influence on the installation of other parts is reduced, the installation is convenient, and the thickness of the whole mobile phone can be reduced. Taking the circuit board 30 applied to a mobile phone with a three-section structure as an example, the circuit board main body 310 may be arranged on a small board section, and the circuit board main body 310 has a small size and does not occupy a large area; the extension part 320 with smaller thickness can extend to the battery compartment, so that the influence on the installation of the battery in the battery compartment is smaller, and the thickness of the whole mobile phone is reduced.

The circuit board main body 310 is provided with a first through hole 311. The first through hole 311 may be used to cooperate with other components of the mobile phone to implement corresponding functions, for example, the first through hole 311 cooperates with an optical fingerprint identification module to allow light rays to pass through for fingerprint identification; or the first through hole 311 is matched with the image acquisition component and used for extending the camera to realize image acquisition and the like. The shape, size and specific position of the first through hole 311 can be set according to actual needs. In one embodiment, the first through hole 311 is circumferentially closed. In another embodiment, the first through hole 311 penetrates through the edge of the circuit board main body 310, and the extension portion 320 and the circuit board main body 310 together enclose to form the first through hole 311. Of course, the first through hole 311 may also be opened at other edges of the circuit board main body 310 and be semi-closed as required.

As shown in fig. 7, the circuit board main body 310 includes at least two layers of substrates 313 stacked one on another. The substrate 313 may include a substrate and a conductor layer stacked on the substrate, and the conductor layer may be, but is not limited to, a copper foil layer. At least two of the substrates 313 may be bonded by an adhesive or the like. The number of layers and the specific structure of the substrate 313 may be selected according to actual requirements, in one embodiment, the circuit board main body 310 includes 2 layers of the substrates 313, each layer of the substrate 313 includes 1 layer of the base material and 2 layers of the conductor layers, and the base material is sandwiched between the 2 layers of the conductor layers, that is, the circuit board main body 310 may have a 4-layer board structure with 4 layers of the conductor layers. In another embodiment, the circuit board main body 310 includes 3 layers of the substrates 313, each layer of the substrate 313 includes 1 layer of the base material and 2 layers of the conductor layer, and the base material is sandwiched between 2 layers of the conductor layer, that is, the circuit board main body 310 may have a 6-layer board structure with 6 layers of the conductor layer.

The substrate 313 and the extension 320 may be uniformly provided with traces 301. The traces 301 can be disposed on any layer of the substrate 313 as required. The trace 301 may be a display driving trace for transmitting a signal related to display driving to realize display driving, for example, the trace 301 may be a scanning signal line, an MIPI (mobile industry processor interface) line, or a power line. The trace 301 may also be a Touch Panel (TP) driving trace, and is configured to transmit signals related to driving of the Touch Panel, so as to drive the Touch Panel. The circuit board 30 is provided with the display driving wiring and the touch screen driving wiring, the circuit board 30 can be bound with the display panel and the touch panel at the same time, the display screen flexible circuit board and the touch screen flexible circuit board do not need to be arranged respectively, the space of the mobile phone is greatly saved, and the thickness of the whole mobile phone is reduced.

In the circuit board 30 provided in this embodiment, the circuit board main body 310 includes at least two layers of stacked substrates 313, so as to increase the routing space, and the size of the circuit board 30 can be effectively reduced, thereby making up for the defect of size increase caused by the opening of the first through hole 311, and facilitating installation. Meanwhile, the thickness of the extension part 320 is smaller than that of the circuit board main body 310, and the extension part 320 with the smaller thickness can be conveniently overlapped and matched with other components, so that the installation space in the electronic device is fully utilized.

In one embodiment, the extension 320 may be integrally formed with any one or more layers of the substrate 313. For example, the extension 320 may be integrally formed with several layers of the substrate 313 in the circuit board main body 310; the extension 320 may be integrally formed with the substrate 313 at the outermost layer of the circuit board main body 310. The outermost substrate 313 refers to the substrate 313 on the top layer or the bottom layer in the thickness direction of the extension part 320 and the circuit board main body 310. The specific top or bottom layer may be determined based on the orientation of the circuit board 30 when installed. The extension part 320 and the substrate 313 on the outermost layer of the circuit board main body 310 are integrally formed, so that the extension part 320 is flush with the surface of the outermost layer of the circuit board main body 310, the extension part 320 is more easily attached to other parts of the mobile phone, the space occupied by the circuit board 30 is further reduced, and the thickness of the whole mobile phone is reduced. Meanwhile, the circuit board 30 can be prevented from bending the extension part 320 during installation, and the reliability and the service life of the circuit board 30 are improved.

In one embodiment, device pads 317 are exposed at a surface of the wiring board body 310. The device bonding pad 317 is used for bonding circuit components, including but not limited to a chip, a shift register, a resistor, and any other components for realizing the functions of the circuit board 30. It is understood that the device pads 317 may be disposed at a plurality of locations on the wiring board body 310. For example, the wiring board body 310 includes opposing first and

second surfaces

315, 319. The device bonding pad 317 may be exposed to at least one of the first surface 315 and the second surface 319. Further, the extension 320 may be integrally formed with the substrate 313 facing away from the outermost layer of the device pad 317, and if the device pad 317 is exposed at the first surface 315, the extension 320 may be integrally formed with the substrate 313 facing away from the outermost layer of the first surface. Therefore, the circuit board 30 can be completely attached to the bottom part of the circuit board, the gap between the extension part 320 and the bottom part is further reduced, and the thickness of the whole mobile phone is reduced. Meanwhile, the bending of the extension part 320 during installation can be avoided, and the reliability and the service life of the circuit board 30 are improved.

In one embodiment, the circuit board body 310 includes a first region 312, a middle region 314 and a second region 316, the middle region 314 is located between the first region 312 and the second region 316, and the first through hole 311 is opened in the middle region 314. It is understood that the first region 312, the middle region 314, and the second region 316 may be space regions, and the first region 312, the middle region 314, and the second region 316 may include all of the substrates 313 in the thickness direction of the circuit board body 310. The first region 312, the middle region 314, and the second region 316 may be divided by defining a region where the position of the first through hole 311 is opened and a predetermined peripheral range as the middle region 314 with reference to the position of the first through hole 311, and the first region 312 and the second region 316 are respectively located at two sides of the middle region 314.

The surfaces of the first region 312 and the second region 316 may be exposed with a bonding region. The first area 312 and the second area 316 are both provided with the trace 301. The trace 301 of the extension 320 connects the trace 301 of the first area 312 with the trace 301 of the second area 316. That is to say, the trace 301 of the circuit board 30 passes through the first region 312 and bypasses the first via 311 through the extension 320 to reach the second region 316, so as to achieve the connection between the lines of the first region 312 and the second region 316. For example, the traces 301 of the extension 320 can be used to connect the traces 301 of any layer of the substrate 313 in the first area 312 with the traces 301 of any layer of the substrate 313 in the second area 316. For example, the extension 320 may be used only to conduct the lines of the first region 312 and the second region 316 of the layer where the extension 320 is located; for another example, the plurality of layers of the substrate 313 in the first area 312 may be electrically connected to each other, the plurality of layers of the substrate 313 in the second area 316 may also be electrically connected to each other, and the trace 301 in the first area 312 and the trace 301 in the second area 316 are electrically connected to each other through the extension 320.

In this embodiment, the extension 320 with a smaller thickness is routed to avoid the first through hole 311, so that the space of the circuit board main body 310 can be effectively saved, the size of the circuit board main body 310 is further reduced, the circuit board 30 is convenient to mount, and the mounting influence on the overall thickness of the mobile phone and other components is small.

In one embodiment, at least one of the first region 312, the intermediate region 314, and the second region 316 exposes the device bond pad 317. As an alternative embodiment, the device pads 317 are exposed in the first region 312 and the second region 316, that is, the device pads 317 are distributed in the first region 312 and the second region 316, so that the area of each device pad 317 is small, which avoids the influence of the device soldered to the device pad 317 on other components of the mobile phone, for example, the influence on components disposed on a small board segment, such as a card slot, a sound, and the like, and facilitates installation. The device bonding pad 317 may also be disposed on a side of the first region 312 and the second region 316 close to the middle region 314, so as to save a space of the circuit board body 310 close to the edge, thereby further reducing influence on other devices of the mobile phone, and facilitating installation.

In one embodiment, the wiring board 30 further includes a testing region 321, and the testing region 321 is exposed on the surface of the extension 320. The extension 320 includes a first side 322 and a second side 324 opposite to each other, and the test region 321 may be exposed on at least one of the first side 322 and the second side 324. The test area 321 may be disposed with devices for testing electrical performance of the display panel or the touch screen, such as an electrical test point, an electrical test interface, or an electrical test line. The test region 321 is exposed on the surface of the extension part 320, so that the space of the circuit board main body 310 can be further saved, the size of the circuit board main body 310 can be further reduced, and the circuit board 30 can be conveniently installed.

In one embodiment, the first side 322 is closer to the device bond pad 317 than the second side 324, and the test area 321 is exposed at the first side 322. That is, the test area 321 is exposed on the same side of the wiring board 30 as the test area 321. When the display screen is tested, the device welding area is generally placed upwards, the test area 321 and the test area 321 are exposed on the same side of the circuit board 30, the use is convenient, and the practicability is high.

With reference to fig. 5 to 7, in an embodiment, the extending portion 320 may further have a second through hole 323 that is circumferentially closed, and the second through hole 323 is opened at a connection position of the extending portion 320 and the circuit board main body 310. The second through hole 323 may be, but is not limited to, an elongated shape. The size of the second through hole 323 can be set according to actual needs. The substrate 313 on the layer where the extension part 320 is located and the substrate 313 on other layers can generate certain stress when being bonded, and the stress can be effectively released by arranging the second through hole 323, so that the extension part 320 is prevented from being torn, and the structural stability of the circuit board 30 is improved.

In one embodiment, the first through hole 311 penetrates through the edge of the circuit board main body 310, and when the extension portion 320 and the circuit board main body 310 together enclose the first through hole 311, the first through hole 311 may also be used to release stress, so as to improve the structural stability of the circuit board 30. At this time, the second through hole 323 is not opened any more, so that the area of the extension portion 320 can be saved, and the size of the circuit board 30 can be further reduced.

Referring to fig. 8 to 10, an embodiment of the present application further provides a circuit board 40, which includes a first substrate 410 and a second substrate 420. The first substrate 410 and the second substrate 420 may be uniformly provided with traces 401. The second substrate 420 includes a laminated portion 421 and an extended portion 422, which are integrally formed, the laminated portion 421 is laminated with the first substrate 410, and the extended portion 422 protrudes from an edge of the first substrate 410.

The structures of the first substrate 410 and the second substrate 420 can refer to the substrate 313 in the foregoing embodiments, and are not described herein again. The thickness of the extension portion 422 is the thickness of the second substrate 420, and obviously, the thickness of the stacked portion 421 stacked on the first substrate 410 is greater than the thickness of the extension portion 422. The wiring board 40 is provided with a first through hole 431 penetrating the first substrate 410 and the laminated portion 421.

In this embodiment, the wiring board 40 includes the first substrate 410 and the second substrate 420, and the laminated portion 421 of the first substrate 410 and the second substrate 420 are laminated. The first substrate 410 and the stacking portion 421 can increase the routing space, effectively reduce the size of the circuit board 40, make up for the defect of size increase caused by the first through hole 431, and facilitate installation. Meanwhile, the thickness of the extension part 422 is smaller than the thickness of the laminated part 421 and the first substrate 410 after lamination, and the extension part 422 with smaller thickness can be conveniently laminated and matched with other components, so as to fully utilize the installation space in the electronic device.

In one embodiment, the wiring board 40 includes a first region 432, a middle region 434, and a second region 436, and each of the first region 432, the middle region 434, and the second region 436 includes a portion of the stacked portion 421 and a portion of the first substrate 410. The middle area 434 is located between the first area 432 and the second area 436, and the first through hole 431 is opened in the middle area 434. The first area 432 and the second area 436 are uniformly provided with traces, and the traces of the extension 422 conduct the traces of the first area 432 and the traces of the second area 436. The definition, structure, etc. of the first area 432, the middle area 434, and the second area 436 refer to the first area 312, the middle area 314, and the second area 316 in the above embodiments.

In one embodiment, the first area 432 and the second area 436 are exposed with the device land 437, respectively. The function and the like of the device land 437 can be referred to the device land 317 in the foregoing embodiments, and will not be described in detail.

In one embodiment, the wiring board 40 further includes a test region 423, the test region 423 being exposed to the surface of the extension 422. In one embodiment, the testing region 423 is exposed at a surface of the extension 422 near the first substrate 410. The function of the test region 423 and the like can refer to the test region 321 in the previous embodiment.

In one embodiment, the extending portion 422 defines a second through hole 424, which is circumferentially closed, and the second through hole 424 is defined at a connection position of the laminating portion 421 and the extending portion 422.

In one embodiment, at least two first substrates 410 are provided. All the first substrates 410 are located on the same side of the second substrate 420, or the second substrate 420 is sandwiched between two first substrates 410.

In one embodiment, the first through hole 431 may be circumferentially closed. The first through hole 431 may also penetrate through an edge of the first substrate 410, and the extension portion 422, the laminating portion 421 and the first substrate 410 together enclose the first through hole 431.

In the above embodiments, reference is made to the circuit board 30 in the foregoing embodiments regarding the structure, beneficial effects, and the like of the circuit board 40, and details are not repeated herein.

Referring to fig. 11, an embodiment of the present application further provides a display screen 50, which includes a display panel 510, a driving unit 520, and a flexible circuit board. Wherein the flexible circuit board may be the circuit board 30 or the circuit board 40 as described in the above embodiments. The display screen 50 including the circuit board 30 will be described below as an example.

The display panel 510 may be a flexible display panel or a rigid display panel, as required. The display panel 510 may be an OLED display panel, an AMOLED, or the like. The driving unit 520 includes an Integrated Circuit (IC) for driving the display panel 510. The circuit board 30 is electrically connected to the display panel 510 and the driving unit 520. The circuit board 30 may include a display panel binding region for implementing binding with the display panel 510 and a driver binding region for implementing binding with the driving unit 520. The display panel 510 is electrically connected to the driving unit 520 through the circuit board 30.

The display screen 50 provided by this embodiment includes the circuit board 30, the circuit board main body 310 of the circuit board 30 includes at least two layers of substrates 313 arranged in a stacked manner, and the wiring 301 is laid on the substrates 313, so that the wiring space is increased, the size of the circuit board main body 310 can be effectively reduced, the defect of size increase caused by the arrangement of the first through hole 311 is made up, and the installation is facilitated. Meanwhile, the thickness of the extension part 320 is smaller than that of the circuit board main body 310, and the extension part 320 with the smaller thickness can be conveniently overlapped and matched with other components, so that the installation space in the electronic device is fully utilized.

In one embodiment, at least one of the circuit board main body 310 and the extension portion 320 is provided with a driving trace, and the driving trace is used for transmitting a touch screen driving signal. The circuit board main body 310 further includes a touch driving binding region and a touch panel binding region, and the circuit board 30 is further used for electrically connecting the touch panel and the touch screen driver. The circuit board 30 can be bound with the display panel and the touch panel at the same time, and a display screen flexible circuit board and a touch screen flexible circuit board do not need to be arranged respectively, so that the space of the electronic equipment is greatly saved, and the thickness of the whole machine is reduced.

Referring to fig. 12 and 13, an embodiment of the present application further provides an electronic device 60, where the electronic device 60 includes at least a middle frame 610, a flexible printed circuit board, and a display panel 620. The flexible circuit board may be the circuit board 30 in the above embodiment, or may be the circuit board 40. The electronic device 60 including the wiring board 30 will be described below as an example.

The middle frame 610 includes a middle plate 611 and a frame 612, and the frame 612 is disposed around the middle plate 611. The middle plate 611 defines a first groove 613, and the extension 320 is received in the first groove 613. In the thickness direction of the electronic device 60, the extension portion 320 may be completely received in the first groove 613, or may be partially received in the first groove 613. The opening position of the first groove 613 may be determined according to the placement position of the circuit board 30 in the electronic device 60, and the size of the first groove 613 may be determined according to the size of the extension part 320. The display panel 620 is connected to a side of the middle plate 611 facing away from the first groove. The display panel 620 is electrically connected to the circuit board 30. It is understood that the electronic device 60 may further include a battery (not shown), a rear cover (not shown), and the like. The battery is disposed in a battery compartment surrounded by the middle plate 611 and the frame 612, and the battery covers the extension 320 and the first groove 613. The rear cover is connected to the frame and covers the battery and the circuit board main body 310.

In this embodiment, the electronic device 60 includes the circuit board 30, the circuit board main body 310 of the circuit board 30 includes at least two layers of substrates 313 arranged in a stacked manner, and the wiring 301 is disposed on the substrates 313, so that the wiring space is increased, the size of the circuit board main body 310 can be effectively reduced, the defect of size increase caused by the first through hole 311 is overcome, and the mounting is facilitated. Meanwhile, the thickness of the extension part 320 is smaller than that of the circuit board main body 310, and the extension part 320 with the smaller thickness can be conveniently overlapped and matched with other components, so that the installation space in the electronic device is fully utilized. In addition, the middle plate 611 is provided with a first groove 613, the extension part 320 is accommodated in the first groove 613, the extension part 320 is sunk, the influence of the extension part 320 on the overall thickness of the electronic device 60 or the influence of the extension part on the battery capacity is further reduced, and the practicability is high.

In one embodiment, the middle plate 611 further defines a second groove 615, and the circuit board main body 310 is received in the second groove 615. The second groove 615 is a small plate section in a three-section structure of the whole machine, and the size of the circuit board main body 310 is smaller than or equal to the opening size of the second groove 615, so that the circuit board main body 310 can be completely accommodated in the second groove 615.

In this embodiment, the first through hole 311 is formed in the circuit board main body 310 accommodated in the second groove 615, and the first through hole 311 can be used for passing through a fingerprint identification light, so that the circuit board 30 can be used in cooperation with a G3 fingerprint module. Meanwhile, the circuit board 30 is small in size and can be used in cooperation with a G5/G6 fingerprint module without affecting the overall thickness of the electronic device 60 or the capacity of a battery. The circuit board 30 improves the compatibility of the display screen to the application of the G3 fingerprint module and the G5/G6 fingerprint module, thereby providing more choices for users and prolonging the iteration period of the display screen and the electronic equipment. In one embodiment, the fingerprint positions of a cell phone compatible with the G3 fingerprint module and the G5/G6 fingerprint module are shown in FIG. 14.

In addition, the size of the circuit board main body 310 is small, the extension portion 320 can be accommodated in the first groove 613, and the size in the thickness direction is small, so that the circuit board 30 can be well matched with a flexible display panel, and an ultra-thin design of the thickness of the whole device is realized. Further, when the circuit board 30 is applied to the electronic device with the flexible display panel, the circuit board can be matched with the G3 fingerprint module for use, so that the cost of the electronic device 60 is greatly reduced, and the cost performance of the electronic device 60 is improved.

In one embodiment, the depth of the first groove 613 is greater than or equal to the thickness of the extension part 320, so that the extension part 320 can be completely accommodated in the first groove 613, and the influence on the overall thickness of the electronic device 60 or the influence on the battery capacity is further reduced.

In one embodiment, the extension 320 is a 2-layer plate structure, the thickness of the 2-layer plate is about 0.13mm, which is smaller than the thickness of the middle plate 611, and the extension 320 can be completely received in the first groove 613.

In one embodiment, the extension 320 is integrally formed with the outermost substrate 313 away from the device bond pad. When the extension portion 320 is accommodated in the first groove 613, the extension portion 320 can better adhere to the bottom of the first groove 613 without folding or bending the extension portion 320, so that the electrical performance of the circuit board 30 is not affected, and the service life of the circuit board 30 is prolonged.

As shown in fig. 13, in an embodiment, the electronic device 60 further includes a first fingerprint module 630, and the first fingerprint module 630 may be a G3 fingerprint module. The first fingerprint module 630 is accommodated in the second groove 615, and the first fingerprint module 630 covers at least a portion of the first through hole 311, so that the fingerprint identification light passes through. That is, the first fingerprint module 630 and the first through hole 311 are correspondingly disposed, so that the first through hole 311 is located in the view angle range of the first fingerprint module 630, and the fingerprint identification light can pass through the first through hole 311.

Referring to fig. 15, in an embodiment, the electronic device 60 includes a second fingerprint module 640, and the second fingerprint module 640 may be a G5/G6 fingerprint module. The second fingerprint module 640 is disposed between the middle plate 611 and the display panel 620, and an orthographic projection of the second fingerprint module 640 is spaced from an orthographic projection of the extension portion 320 on a reference plane perpendicular to a thickness direction of the electronic device 60, so as to prevent the extension portion 320 from shielding the second fingerprint module 640.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present application. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A circuit board, comprising:

2. The circuit board according to claim 1, wherein the circuit board main body includes a first region, a middle region and a second region, the middle region is located between the first region and the second region, the first through hole is opened in the middle region, the first region and the second region are uniformly provided with traces, and the traces of the extension portion conduct the traces of the first region with the traces of the second region.

3. The wiring board of claim 2, wherein at least one of the first region, the intermediate region, and the second region is exposed with a device land.

4. The wiring board of claim 1, wherein the extension is integrally formed with either of the substrates.

5. The wiring board of claim 4, wherein the extension portion is integrally formed with the outermost substrate.

6. The wiring board of any one of claims 1 to 5, wherein the wiring board further comprises a test area, the extension portion comprising first and second oppositely disposed faces, the test area being exposed at least one of the first and second faces.

7. The circuit board according to any one of claims 1 to 5, wherein the extension portion defines a second through hole that is circumferentially closed, and the second through hole is defined at a connection position of the extension portion and the circuit board main body.

8. The wiring board of any one of claims 1 to 5, wherein the first through hole is circumferentially closed; or the first through hole penetrates through the edge of the circuit board main body, and the extension part and the circuit board main body jointly enclose to form the first through hole.

9. A circuit board, comprising:

a first substrate; and

10. The wiring board of claim 9, wherein the wiring board comprises a first region, an intermediate region, and a second region, each of the first region, the intermediate region, and the second region comprising a portion of the laminate and a portion of the first substrate; the middle area is located between the first area and the second area, the first through hole is formed in the middle area, the first area and the second area are uniformly provided with wires, and the wires in the first area are conducted with the wires in the second area through the wires of the extending portion.

11. The wiring board defined in claim 10, wherein the first and second regions are each exposed to a device bond pad.

12. The wiring board of claim 9, further comprising a test area exposed to a surface of the extension portion proximate the first substrate.

13. The wiring board of claim 9, wherein the extension portion defines a second through hole that is circumferentially closed, and the second through hole is defined at a connection between the lamination portion and the extension portion.

14. The wiring board of any one of claims 9 to 13, further comprising:

the first base plates are at least two, all the first base plates are located on the same side of the second base plate, or the second base plate is clamped between the two first base plates.

15. The wiring board of any one of claims 9 to 13, wherein the first through hole is circumferentially closed; or the first through hole penetrates through the edge of the first substrate, and the extension part, the laminating part and the first substrate jointly enclose to form the first through hole.

16. The circuit board of claim 15, wherein the first via is a fingerprint hole.

17. A display screen, comprising:

a display panel;

a drive unit; and

the wiring board according to any one of claims 1 to 16, wherein the wiring board electrically connects the display panel and the driving unit.

18. The display screen of claim 17, wherein the extension is provided with drive traces, and the drive traces are used for transmitting touch screen drive signals.

19. An electronic device, comprising:

the wiring board of any one of claims 1 to 16, wherein the extension portion is received in the first recess; and

20. The electronic device of claim 19, wherein the middle plate has a second recess, and a portion of the circuit board having the first through hole is received in the second recess.

21. The electronic device of claim 19, wherein a depth of the first groove is greater than or equal to a thickness of the extension.

22. The electronic device of claim 20 or 21, further comprising a first fingerprint module, wherein the first fingerprint module is accommodated in the second groove, and the first fingerprint module covers at least a portion of the first through hole, so that the fingerprint identification light passes through.

23. The electronic device according to any one of claims 19 to 21, further comprising a second fingerprint module disposed between the middle plate and the display panel; on a reference plane perpendicular to the thickness direction of the electronic device, an orthographic projection of the second fingerprint module is spaced from an orthographic projection of the extension portion.