CN112804816B

CN112804816B - Circuit board, display screen and electronic equipment

Info

Publication number: CN112804816B
Application number: CN202110217270.8A
Authority: CN
Inventors: 王亚峰
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-07-14
Filing date: 2021-02-26
Publication date: 2022-05-17
Anticipated expiration: 2041-02-26
Also published as: WO2022012193A1; CN112804816A; CN111836457A

Abstract

The application relates to a circuit board, a display screen and an electronic device. The circuit board comprises a main body and an extension part, wherein the main body comprises at least two layers of substrates which are arranged in a stacked mode. The extension part extends out from one side edge of the circuit board main body, the thickness of the extension part is smaller than that of the circuit board main body, and the extension part is provided with a connecting wire. Because the extension of circuit board extends out and the thickness of extension is less than the thickness of main part from a side edge of main part, the connecting wire has been laid to the extension, and the space that the connecting wire of main part was occupied can reduce correspondingly, therefore the length or the width size of main part can reduce correspondingly to provide bigger installation space for other components and parts such as battery. The extension part with the small thickness can be conveniently overlapped and matched with other components, such as a battery, so that the mounting space in the electronic equipment is fully utilized, and the compactness of the arrangement of the components in the electronic equipment is improved.

Description

Circuit board, display screen and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to a circuit board, a display screen and electronic equipment.

Background

A display panel of a display screen of an electronic device such as a smart phone or a tablet computer is generally electrically connected to a driver chip through a Flexible Printed Circuit (FPC). In the thickness direction of the electronic device, the flexible circuit board is generally disposed in a staggered manner with respect to the battery, so as to avoid the adverse effect of the flexible circuit board on the light and thin design of the electronic device. However, the flexible printed circuit board with such a structure generally occupies a relatively large space inside the electronic device, which is not favorable for compact arrangement of components inside the electronic device.

Disclosure of Invention

The embodiment of the application provides a circuit board, a display screen and electronic equipment to promote the compactness of arranging components in the electronic equipment.

A circuit board, comprising:

a main body including at least two layers of substrates stacked; and

the extension part extends out from one side edge of the main body, the thickness of the extension part is smaller than that of the main body, and the extension part is provided with a connecting wire.

A circuit board, comprising:

a first substrate; and

the second substrate comprises a laminating part and an extending part which are integrally formed, the laminating part and the first substrate are arranged in a laminating mode, the extending part protrudes out of the edge of the first substrate, and connecting wires are distributed on the extending part.

A display screen, comprising:

a display panel;

a drive unit; and

the circuit board is electrically connected with the display panel and the driving unit.

An electronic device, comprising:

the middle frame comprises a middle plate and a frame arranged around the middle plate, and the middle plate is provided with a first groove;

in the circuit board, the extension part is accommodated in the first groove; and

and the display panel is connected with the middle plate and covers the first groove, and the display panel is electrically connected with the circuit board.

According to the circuit board, the display screen and the electronic equipment, as the extension part of the circuit board extends out from one side edge of the main body, the thickness of the extension part is smaller than that of the main body, the connecting wire is arranged on the extension part, and the space occupied by the connecting wire of the main body can be correspondingly reduced, the length or width size of the main body can be correspondingly reduced, so that a larger installation space is provided for other components such as a battery; the extension part with the small thickness can be conveniently overlapped and matched with other components such as a battery, so that the mounting space in the electronic equipment is fully utilized, and the compactness of the arrangement of the components in the electronic equipment is improved.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic diagram of a fingerprint position of a mobile phone with a G3 fingerprint module;

FIG. 2 is a schematic diagram of fingerprint positions of a mobile phone employing a G5/G6 fingerprint module; (ii) a

FIG. 3 is a schematic diagram of a flexible printed circuit board of a mobile phone with a G3 fingerprint module;

FIG. 4 is a schematic diagram of a flexible printed circuit board of a mobile phone employing a G3/G6 fingerprint module;

fig. 5 is a schematic top view of a circuit board according to an embodiment of the present disclosure;

fig. 6 is a schematic diagram of an internal structure of a circuit board according to an embodiment of the present application;

fig. 7 is a schematic cross-sectional structure diagram of a circuit board according to an embodiment of the present application;

fig. 8 is a schematic cross-sectional structure diagram of a circuit board according to another embodiment of the present application;

fig. 9 is a schematic top view of a circuit board according to another embodiment of the present disclosure;

fig. 10 is a schematic structural diagram of a second substrate according to another embodiment of the present disclosure;

FIG. 11 is a block diagram of a display screen according to an embodiment of the present application;

fig. 12 is a schematic partial structural diagram of an electronic device according to an embodiment of the present application;

fig. 13 is a schematic cross-sectional structure diagram of a partial structure of an electronic device according to an embodiment of the present application;

FIG. 14 is a schematic diagram of a fingerprint position of an electronic device compatible with the G3 fingerprint module and the G5/G6 fingerprint module according to an embodiment of the present application;

fig. 15 is a schematic cross-sectional structure diagram of a partial structure of an electronic device according to another embodiment of the present application;

fig. 16 is a schematic top view of a circuit board according to another embodiment of the present application;

fig. 17 is a schematic cross-sectional structure view of a circuit board according to still another embodiment of the present application;

fig. 18 is a schematic view of an internal structure of a wiring board according to still another embodiment of the present application;

fig. 19 is a schematic top view of an electronic device according to another embodiment of the present application;

fig. 20 is a schematic bottom view of an electronic device according to another embodiment of the present application;

fig. 21 is a schematic cross-sectional structure diagram of a partial structure of an electronic device according to another embodiment of the present application.

Description of reference numerals:

10. circuit board 100, main part 101, fingerprint hole

102. Device bonding area 103, electrical property test point 20, and circuit board

200. Body 202, device pad 203, electrical test point

30. Wiring board 301, connecting wire 310, and main body

311. First through hole 312, first region 313 and substrate

314. Middle region 315, first surface 316, second region

317. Device bond pad 319, second surface 320, extensions

321. Test area 322, first face 323, second via

324. Second surface 40, circuit board 401, connecting line

410. First substrate 420, second substrate 421, laminated part

422. Extension 423, test area 424 and second through hole

431. A first via 432, a first region 434, a middle region

436. Second region 437, device land 50, and display panel

510. Display panel 520, drive unit 60, and electronic device

610. Middle frame 611, middle plate 612 and frame

613. First groove 614, battery cabin 615 and second groove

620. Display panel 630, first fingerprint module 640, second fingerprint module

70. Wiring board 701, connecting wire 710, and main body

712. First region 713, substrate 714, intermediate region

716. Second region 717, device bonding pad 720, extension

721. Test area 80, cell phone 810, center

820. Display panel 90, mobile phone 910 and middle frame

920. Display panel

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are illustrated in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that, as used herein, the terms "first," "second," and the like may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, a first substrate may be referred to as a second substrate, and similarly, a second substrate may be referred to as a first substrate, without departing from the scope of the present application. The first substrate and the second substrate are both substrates, but they are not the same substrate.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise. In the description of the present application, "a number" means at least one, such as one, two, etc., unless specifically limited otherwise.

After long-term application and continuous improvement of the market, the fingerprint identification technology under the optical screen has stronger and stronger adaptability to the environment, high stability in the using process, long service life and relatively low price, so that the fingerprint identification technology is widely applied to electronic equipment such as smart phones, tablet computers and the like.

Fingerprint module under commonly used optical screen mainly includes G3 fingerprint module, G5 fingerprint module, G6 fingerprint module. Among them, the G3 fingerprint module is mostly combined with an LCD (Liquid Crystal Display) screen and an OLED (Organic Light-Emitting Diode) hard screen to be applied to electronic devices due to its relatively thick thickness; g5 fingerprint module and G6 fingerprint module are ultra-thin optical fingerprint module, mostly combine with the flexible screen of OLED to be applied to electronic equipment to reach the frivolous requirement of complete machine.

Electronic devices referred to in the present application generally include electronic components such as integrated circuits, transistors, and electronic tubes, and are devices that function using electronic technology including software. The electronic device comprises a display screen, wherein the display screen can be an LCD screen or an OLED screen. The display screen further comprises a display panel and a flexible circuit board, wherein the flexible circuit board is used for realizing the electrical connection between the display panel and the driving unit. The electronic device of the present application may be, but is not limited to, a smart phone, a notebook computer, a tablet computer, a POS machine, a vehicle-mounted computer, and the like. For convenience of description, the present application takes a mobile phone as an example for description.

The typical design of the mobile phone is a three-section structure of the whole mobile phone. The three-section structure of the whole mobile phone means that the mobile phone comprises a main board section, a battery bin and a small board section. The main board section is mainly used for accommodating a main board and the like, electronic components such as a processor, a storage unit and a power management unit of the electronic equipment are generally integrated on the main board, and a front camera or a rear camera of the electronic equipment is generally connected to the main board. The battery bin is mainly used for accommodating batteries and the like, and the small plate section is mainly used for accommodating small plates, flexible circuit boards and the like. The panel section is generally located to electronic equipment's vibrating motor, the (data) interface that charges, fingerprint module, speaker etc. and the battery can be for mainboard, platelet and connect in the electronic components power supply of mainboard, platelet.

Referring to fig. 1, a mobile phone 80 with an LCD screen or an OLED hard screen is selected based on a three-section structure of the whole phone, and in order to reduce the influence on the thickness of the whole phone, a G3 fingerprint module is generally placed on a small plate section, and the fingerprint unlocking position is relatively lower, as shown in fig. 1. The display panel 820 is used for displaying information and providing an interactive interface for a user. The middle frame 810 is disposed around the display panel 820 and serves to provide structural rigidity. Based on the three-section structure of the whole machine and the mobile phone 90 with the OLED flexible screen, the G5 fingerprint module or the G6 fingerprint module (hereinafter referred to as G5/G6 fingerprint module for short) has little influence on the thickness of the whole machine, and is generally placed in a battery compartment, and the fingerprint unlocking position is relatively close to the upper position, as shown in FIG. 2. The display panel 920 is used for displaying information and providing an interactive interface for a user. The middle frame 910 is disposed around the display panel 920 and serves to provide structural rigidity.

In view of the difference of the setting positions, the display screens used by the mobile phones adopting the G3 fingerprint module and the G5/G6 fingerprint module generally need to design different flexible circuit boards for design matching. Referring to fig. 3, in a mobile phone using a G3 fingerprint module, the flexible printed circuit 10 and the G3 fingerprint module are both required to be disposed on the small board segment, and therefore, a fingerprint hole 101 is required to be formed in the main body 100 of the flexible printed circuit 10, so that the G3 fingerprint module receives an optical signal through the fingerprint hole, and the G3 fingerprint module is ensured to normally operate. Taking OLED hard screen as an example, it is generally packaged by COG (Chip On GLASS) or COF (Chip On Film), and the structure of the flexible circuit board 10 may be as shown in fig. 3. Due to the arrangement of the fingerprint hole 101, the connecting line of the flexible printed circuit board 10 needs to bypass the fingerprint hole 101, so that the flexible printed circuit board 10 has a large size and is inconvenient to install. Specifically, as can be seen from fig. 3, if the connecting line needs to go from the left side to the right side or from the right side to the left side in the X direction, the size of the flexible wiring board 10 in the Y direction is large. Meanwhile, the surface of the body 100 may be further provided with a device soldering region 102 and an electrical test point 103.

Referring to fig. 4, the mobile phone using the G5/G6 fingerprint module can be placed in a battery compartment because the G5/G6 fingerprint module is thin, and the flexible printed circuit board 20 does not affect the normal operation of the G5/G6 fingerprint module, so the main body 200 of the flexible printed circuit board 20 does not have a fingerprint hole. The OLED flexible screen is generally packaged by COP (Chip On PI), and the structure of the flexible circuit board 20 may be as shown in fig. 4. The surface of the main body 200 may be further provided with a device soldering region 202 and an electrical test point 203.

As can be seen from fig. 3 and 4, the flexible circuit board of the display screen of the mobile phone using the G3 fingerprint module and the G5/56 fingerprint module needs to be designed differently, so that the compatibility of the flexible circuit board is poor. In addition, along with the iterative upgrade of G3 fingerprint module, its optical unlocking performance promotes step by step, and for G5/G6 fingerprint module, there is also relatively great advantage in the price in G3 fingerprint module. Therefore, the mobile phone adopting the OLED flexible screen generally has advantages in performance and cost by selecting the G3 fingerprint module to realize unlocking.

Referring to fig. 5 to 7, the embodiment of the present application provides a circuit board 30, which includes a main body 310 and an extending portion 320. The extension 320 extends from one side edge of the main body 310, and the connection line 301 is disposed on the extension 320. The thickness of the extension 320 is less than the thickness of the body 310.

It is understood that the circuit board 30 may be a flexible circuit board or a non-flexible circuit board, as desired. The following embodiments are all described by taking the wiring board 30 as an example of a flexible wiring board.

The main body 310 may include a plurality of edges, and the extension 320 may extend from any one of the edges of the circuit board 310. As shown in FIG. 5, in one embodiment, the main body 310 includes four edges, and the extension 320 extends from the upper edge of the main body 310 in the Y-direction. The shape, material, and size of the main body 310 and the extension 320 are selected according to actual requirements, and the embodiment of the present application is not limited in any way.

The specific thickness of the extension 320 can be designed according to actual needs. The thickness of the extension part 320 is smaller than that of the main body 310, so that when the installation positions of the extension part 320 and other parts of the mobile phone are overlapped, the influence on the installation of the other parts is reduced, the installation is convenient, and the thickness of the whole mobile phone can be reduced. Taking the circuit board 30 applied to the mobile phone with the whole three-section structure as an example, the main body 310 can be arranged on a small board section, and the size of the main body 310 is small, so that a large area does not need to be occupied; the extension part 320 with smaller thickness can extend to the back side of the battery compartment, has less influence on the installation of the battery in the battery compartment, and can reduce the thickness of the whole mobile phone, so as to be beneficial to the light and thin design of electronic equipment.

The main body 310 defines a first through hole 311. The first through hole 311 can be used to cooperate with other components of the mobile phone to realize corresponding functions, for example, the first through hole 311 cooperates with the optical fingerprint identification module to be used for passing through of fingerprint identification light; or the first through hole 311 may be matched with an image acquisition component for realizing an image acquisition function of the camera under the screen, and the like. The shape, size and specific position of the first through hole 311 may be set according to actual needs. In one embodiment, the first through hole 311 is circumferentially closed. In another embodiment, the first through hole 311 penetrates through the edge of the main body 310, and the extension 320 and the main body 310 together enclose the first through hole 311. Of course, the first through hole 311 may be opened at other edges of the main body 310 to be semi-closed as required.

As shown in fig. 7, the main body 310 includes at least two layers of the substrate 313 stacked. The substrate 313 may include a substrate and a conductor layer stacked on the substrate, and the conductor layer may be, but is not limited to, a copper foil layer. At least two substrates 313 may be bonded by an adhesive or the like. The number of layers and the specific structure of the substrate 313 may be selected according to actual requirements. In one embodiment, the body 310 includes 2 layers of substrates 313, each layer of substrates 313 including 1 layer of substrate and 2 layers of conductor layers, with the substrate sandwiched between the 2 layers of conductor layers, i.e., the body 310 may be a 4-layer plate structure having 4 layers of conductor layers. In another embodiment, the body 310 includes 3 layers of substrates 313, each layer of substrates 313 including 1 layer of substrate and 2 layers of conductor layers, with the substrate sandwiched between the 2 layers of conductor layers, i.e., the body 310 may be a 6-layer plate structure of 6 layers of conductor layers.

The substrate 313 may be provided with the connection lines 301. The connecting wires 301 may be disposed on any one of the substrates 313 as needed. The connection line 301 may be a display driving trace for transmitting a signal related to display driving to realize display driving, for example, the connection line 301 may be a scan signal line, an MIPI (mobile industry processor interface) line, or a power line. The connection line 301 may also be a Touch Panel (TP) driving trace for transmitting signals related to driving of the Touch Panel, so as to drive the Touch Panel. When the circuit board 30 is provided with both the display driving wiring and the touch screen driving wiring, the circuit board 30 can be bound with the display panel and the touch panel without respectively arranging the flexible circuit board of the display panel and the flexible circuit board of the touch screen, so that the installation space of the mobile phone can be greatly saved, and the thickness of the whole mobile phone can be reduced.

In the circuit board 30 provided by this embodiment, since the extension 320 of the circuit board 30 extends from one side edge of the main body 310, and the thickness of the extension 320 is smaller than that of the main body 310, and the connecting line 301 is disposed on the extension 320, the space occupied by the connecting line 301 of the main body 310 can be correspondingly reduced, so that the length dimension (the dimension in the X direction shown in fig. 5) or the width dimension (the dimension in the Y direction shown in fig. 5) of the main body 310 can be correspondingly reduced, so as to provide a larger mounting space for other components such as a battery. The main body 310 includes at least two layers of substrates 313 stacked one on another, so that a wiring space is increased, the length or width of the main body 310 of the circuit board 30 can be further reduced, the defect of size increase caused by the first through hole 311 is overcome, and the circuit board is convenient to mount. Meanwhile, the extension 320 with a smaller thickness can be conveniently overlapped and matched with other components, such as a battery, so as to fully utilize the installation space inside the electronic device, and keep the electronic device light and thin while improving the compactness of the arrangement of the components inside the electronic device.

In one embodiment, the extension 320 may be integrally formed with any one or more layers of the substrate 313. For example, the extension 320 may be integrally formed with the plurality of layers of substrate 313 in the body 310. The extension 320 may be integrally formed with the substrate 313 of the outermost layer of the body 310. The outermost substrate 313 is the top or bottom substrate 313 in the thickness direction (horizontal direction in fig. 7) of the extension 320 and the main body 310. The specific top or bottom layer may be determined based on the orientation of the wiring board 30 when mounted. The extension part 320 and the substrate 313 at the outermost layer of the main body 310 are integrally formed, so that the extension part 320 is flush with the surface at the outermost layer of the main body 310, the extension part 320 is more easily attached to other parts of the mobile phone, the space occupied by the circuit board 30 is further reduced, and the thickness of the whole mobile phone is reduced. Meanwhile, the structure can also avoid bending of the extension part 320 when the circuit board 30 is installed, so as to improve the reliability and the service life of the circuit board 30.

With continued reference to fig. 5, in one embodiment, body 310 is provided with device bond pads 317 on a surface thereof. The device pads 317 are used for soldering circuit components including, but not limited to, any components for implementing the functions of the circuit board 30, such as a chip, a shift register, a resistor, and the like. It is understood that device bond pads 317 may be disposed at various locations on body 310. For example, in connection with fig. 7, body 310 includes opposing first and

second surfaces

315, 319. The device bonding pad 317 may be exposed to at least one of the first surface 315 and the second surface 319. Here, "exposed" may be simply understood as being directly observable by a user, that is, the device pads 317 are exposed to the first surface 315 or the second surface 319, so as to improve convenience in use. Further, in embodiments where the device pad 317 is disposed on one of the first surface 315 and the second surface 319, the extension 320 may be integrally formed with the substrate 313 facing away from an outermost layer of the device pad 317. For example, in embodiments where the first surface 315 is exposed with the device bond pad 317, the extension 320 may be integrally formed with the substrate 313 of the outermost layer facing away from the first surface. The structure enables the circuit board 30 to be approximately planar on the side away from the device welding area 317, so that the circuit board 30 can be conveniently attached to other parts (such as a middle frame of electronic equipment) arranged on the side, the gap between the extension part 320 and other parts is further reduced, and the overall thickness of the mobile phone is reduced. This configuration also avoids bending of the extension 320 during installation, improving the reliability and life of the circuit board 30.

With continued reference to fig. 5, in one embodiment, the body 310 includes a first region 312, an intermediate region 314, and a second region 316, the intermediate region 314 being located between the first region 312 and the second region 316, and the first via 311 opening into the intermediate region 314. It is understood that the first region 312, the intermediate region 314, and the second region 316 may be spatial regions, and the first region 312, the intermediate region 314, and the second region 316 may each include all of the substrates 313 in the thickness direction of the body 310. The first area 312, the middle area 314, and the second area 316 may be divided by defining an area where the position of the first through hole 311 is opened and a predetermined peripheral area as the middle area 314 based on the position of the first through hole 311, and two sides of the middle area 314 are the first area 312 and the second area 316, respectively.

The surfaces of the first region 312 and the second region 316 may be exposed with the bonding regions. The first region 312 and the second region 316 are both provided with the connection line 301. The connection line 301 of the extension portion 320 connects the connection line 301 of the first region 312 and the connection line 301 of the second region 316. That is, the connecting wire 301 of the circuit board 30 passes through the extension portion 320 from the first region 312 to bypass one side of the first through hole 311 and reach the second region 316, so as to achieve the conduction between the wires of the first region 312 and the second region 316. For example, the connection lines 301 of the extension portion 320 may be used to electrically connect the connection lines 301 of any layer of the substrate 313 of the first region 312 with the connection lines 301 of any layer of the substrate 313 of the second region 316. For example, the extension 320 may be used only to conduct the wires of the first region 312 and the second region 316 of the layer where the extension 320 is located. For another example, the multi-layer substrates 313 in the first region 312 may be electrically connected to each other, the multi-layer substrates 313 in the second region 316 may be electrically connected to each other, and the connection lines 301 in the first region 312 and the connection lines 301 in the second region 316 are electrically connected to each other through the extension portions 320.

In this embodiment, the connecting line 301 is disposed on the extension portion 320 with a smaller thickness to avoid the first through hole 311, so that the space of the main body 310 can be effectively saved, the length or width of the main body 310 is further reduced, the installation space inside the electronic device is saved, the circuit board 30 is convenient to install, and the installation influence on the thickness of the whole mobile phone and other components is small.

In one embodiment, at least one of the first region 312, the intermediate region 314, and the second region 316 is provided with a device pad 317. As an alternative embodiment, the first area 312 and the second area 316 are respectively provided with device pads 317, i.e., the device pads 317 are distributed in the first area 312 and the second area 316. Thus, the area of each device pad 317 is small, and the influence of the device soldered to the device pad 317 on other parts of the mobile phone is avoided. For example, the influence on the parts such as the card slot and the loudspeaker arranged on the small plate section is avoided, and the installation is convenient. Device bond pads 317 may also be disposed on a side of first region 312 and second region 316 proximate to intermediate region 314, saving space on body 310 proximate to the edges to further reduce impact on other devices of the handset for ease of installation.

Referring to fig. 6, in one embodiment, the wiring board 30 further includes a testing region 321, the testing region 321 being exposed at the surface of the extension 320. Specifically, referring to fig. 7, the extension 320 may include first and

second faces

322 and 324 disposed opposite to each other, and the test region 321 may be exposed to at least one of the first and

second faces

322 and 324. The test area 321 may be disposed with devices for testing electrical performance of the display panel or the touch screen, such as electrical test points, electrical test interfaces, or electrical test lines. The test area 321 is exposed on the surface of the extension 320, which can further save the space of the main body 310, thereby further reducing the length or width dimension of the main body 310, and facilitating the installation of the circuit board 30.

In one embodiment, first side 322 is closer to device bond pad 317 than second side 324, and test area 321 is exposed at first side 322. That is, the test area 321 and the device pad 317 are disposed on the same side of the wiring board 30. When the display screen is tested, the device welding area 317 is generally placed upwards, and the testing area 321 are arranged on the same side of the circuit board 30, so that the use is convenient, and the practicability is high.

With continued reference to fig. 5 to 7, in an embodiment, the extending portion 320 may further be provided with a second through hole 323 that is circumferentially closed, and the second through hole 323 is provided at a connection position of the extending portion 320 and the main body 310. The shape of the second through hole 323 may be, but is not limited to, an elongated shape. The size of the second through hole 323 may be set according to actual needs. The substrate 313 on the layer where the extension part 320 is located and the substrate 313 on other layers can generate certain stress when being bonded, the stress can be effectively released by arranging the second through hole 323, the extension part 320 is prevented from being torn, and the structural stability of the circuit board 30 is improved.

In another embodiment, the first through hole 311 may penetrate through the edge of the main body 310, the extension portion 320 and the main body 310 together enclose the first through hole 311, and the first through hole 311 may also be used to release stress, thereby improving the structural stability of the circuit board 30. At this time, the second through hole 323 is not opened any more, so that the area of the extension portion 320 can be saved, and the size of the circuit board 30 can be further reduced.

Referring to fig. 8 to 10, an embodiment of the present application further provides a circuit board 40, which includes a first substrate 410 and a second substrate 420. The first substrate 410 and the second substrate 420 may be uniformly provided with the connection lines 401. The second substrate 420 includes a laminated portion 421 and an extending portion 422, which are integrally formed, the laminated portion 421 is laminated with the first substrate 410, and the extending portion 422 protrudes from an edge of the first substrate 410.

The structure of the first substrate 410 and the second substrate 420 can refer to the substrate 313 in the previous embodiment, and will not be described herein. The thickness of the extension portion 422 is the thickness of the second substrate 420, and obviously, the thickness of the stacked portion 421 and the first substrate 410 after being stacked is greater than the thickness of the extension portion 422. The wiring board 40 is provided with a first through hole 431 penetrating the first substrate 410 and the layered portion 421.

In this embodiment, the wiring board 40 includes a first substrate 410 and a second substrate 420, and the laminated portion 421 of the first substrate 410 and the second substrate 420 is laminated. The first substrate 410 and the stacked portion 421 can increase the wiring space, effectively reduce the size of the circuit board 40, make up for the defect of size increase caused by the first through hole 431, and facilitate installation. The extension portion 422 of the circuit board 40 protrudes from the edge of the first substrate 410, the thickness of the extension portion 422 is smaller than the thickness of the stacked portion 421 and the first substrate 410, and the arrangement of the connecting line 401 is combined with the arrangement of the extension portion 422, so that the space occupied by the stacked portion 421 and the connecting line 401 of the first substrate can be correspondingly reduced, and therefore the length or width dimensions of the stacked portion 421 and the first substrate 410 can be correspondingly reduced, so as to provide a larger installation space for other components such as a battery. Meanwhile, the thickness of the extension part 422 is smaller than the thickness of the stacked part 421 and the first substrate 410, and the extension part 422 with smaller thickness can be conveniently stacked and matched with other components such as a battery, so as to fully utilize the installation space in the electronic device.

In one embodiment, the wiring board 40 includes a first area 432, a middle area 434, and a second area 436, and each of the first area 432, the middle area 434, and the second area 436 includes a portion of the stacked portion 421 and a portion of the first substrate 410. The middle area 434 is located between the first area 432 and the second area 436, and the first via 431 opens in the middle area 434. Specifically, the first region 432 includes one end of the stacked portion 421 and one end of the first substrate 410, the second region 436 includes the opposite end of the stacked portion 421 and the opposite end of the first substrate 410, and the middle region 434 includes the portion of the stacked portion 421 and the first substrate 410 between the first region 432 and the second region 436. The connection lines 401 are disposed in the first area 432 and the second area 436, and the connection lines 401 of the extension portions 422 conduct the connection lines 401 of the first area 432 and the connection lines 401 of the second area 436. The definition, structure, and the like of the first area 432, the middle area 434, and the second area 436 refer to the first area 312, the middle area 314, and the second area 316 in the above-described embodiment.

Referring to fig. 9, in one embodiment, the first area 432 and the second area 436 are provided with device lands 437, respectively. The function and the like of the device land 437 can be referred to the device land 317 in the foregoing embodiments, and will not be described in detail.

Referring to fig. 10, in one embodiment, the wiring board 40 further includes a test region 423, the test region 423 being exposed to the surface of the extension 422. In one embodiment, the test region 423 is exposed at a surface of the extension 422 near the first substrate 410. The function and the like of the test region 423 can refer to the test region 321 in the foregoing embodiment.

Referring to fig. 9 and 10, in an embodiment, the extending portion 422 is opened with a second through hole 424 closed in the circumferential direction, and the second through hole 424 is opened at the connection position of the laminated portion 421 and the extending portion 422.

In one embodiment, the first substrate 410 is provided with at least two. All the first substrates 410 are located on the same side of the second substrate 420, or the second substrate 420 is sandwiched between two first substrates 410.

In one embodiment, the first through hole 431 may be circumferentially closed. The first through hole 431 may also penetrate through the edge of the first substrate 410, and the extension portion 422, the stacked portion 421 and the first substrate 410 together enclose to form the first through hole 431.

In the above embodiments, reference is made to the circuit board 30 in the foregoing embodiments with respect to the structure, beneficial effects, and the like of the circuit board 40, which is not described herein again.

Referring to fig. 11, an embodiment of the present application further provides a display screen 50, which includes a display panel 510, a driving unit 520, and a flexible circuit board. Wherein the flexible circuit board may be the circuit board 30 or the circuit board 40 as in the above embodiments. The following description will be given taking an example in which the display screen 50 includes the wiring board 30.

The display panel 510 may be a flexible display panel or a rigid display panel, as required. For example, the display panel 510 may be an OLED display panel, an AMOLED, or the like. The driving unit 520 includes a display driver chip (IC) for driving the display panel 510. The circuit board 30 is electrically connected to the display panel 510 and the driving unit 520. The line card 30 may include a display panel binding region for implementing binding with the display panel 510 and a driver binding region for implementing binding with the driving unit 520. The display panel 510 is electrically connected to the driving unit 520 through the circuit board 30.

The display screen 50 provided by the embodiment includes the circuit board 30, since the extension 320 of the circuit board 30 extends from one side edge of the main body 310 and the thickness of the extension 320 is smaller than that of the main body 310, the connecting line 301 is disposed on the extension 320, and the space occupied by the connecting line 301 of the main body 310 can be correspondingly reduced, so that the length dimension or the width dimension of the main body 310 can be correspondingly reduced to provide a larger installation space for other components such as a battery. The main body 310 of the circuit board 30 comprises at least two layers of substrates 313 arranged in a stacked manner, and the connecting wires 301 are arranged on the substrates 313, so that the wiring space is increased, the size of the main body 310 can be effectively reduced, the defect of size increase caused by the arrangement of the first through holes 311 is overcome, and the circuit board is convenient to mount. Meanwhile, the extension 320 with a smaller thickness can be conveniently overlapped and matched with other components, such as a battery, so as to fully utilize the installation space inside the electronic device, and keep the electronic device light and thin while improving the compactness of the arrangement of the components inside the electronic device.

In one embodiment, at least one of the main body 310 and the extension 320 is disposed with a driving trace, and the driving trace is used for transmitting a touch screen driving signal. The main body 310 further includes a touch driving binding region and a touch panel binding region, and the circuit board 30 is further used to electrically connect the touch panel and the touch screen driver. The circuit board 30 can be bound with the display panel and the touch panel at the same time, and a display screen flexible circuit board and a touch screen flexible circuit board do not need to be arranged respectively, so that the space of the electronic equipment is greatly saved, and the thickness of the whole machine is reduced.

Referring to fig. 12 and 13, an embodiment of the present application further provides an electronic device 60, where the electronic device 60 includes at least a middle frame 610, a flexible printed circuit board, and a display panel 620. The flexible circuit board may be the circuit board 30 in the above embodiments, or may be the circuit board 40. The electronic device 60 including the wiring board 30 will be described below as an example.

Middle bezel 610 includes a midplane 611 and a bezel 612, where bezel 612 is disposed around midplane 611. The middle plate 611 defines a first groove 613, and the extension 320 is received in the first groove 613. The extension portion 320 may be completely received in the first groove 613, or may be partially received in the first groove 613. The opening position of the first groove 613 may be determined according to the placement position of the circuit board 30 in the electronic device 60, and the size of the first groove 613 may be determined according to the size of the extension part 320. The display panel 620 is connected to the middle plate 611 at the side of the first groove 613 and covers the first groove 613. The display panel 620 is electrically connected to the circuit board 30.

It is understood that the electronic device 60 may further include a battery (not shown), a rear cover (not shown), and the like. A battery compartment 614 is disposed on a side of the middle frame 610 facing away from the display panel 620, and the battery compartment 614 may be formed by the middle plate 611 and the bezel 612, and the battery is disposed in the battery compartment 614. Further, the battery is stacked on the extension portion 320 in the thickness direction of the electronic device 60 (i.e., the horizontal direction of fig. 13). In other words, when a geometric plane perpendicular to the thickness direction of the electronic device 60 is made, there is an overlapping region in the orthogonal projection of the battery and the extension portion 320 on the geometric plane, that is, in the thickness direction of the electronic device 60, the thickness of the battery and the thickness of the extension portion 320 of the circuit board 30 can be mutually overlapped without affecting the thickness of the whole electronic device, thereby ensuring the lightness and thinness of the electronic device 60. The rear cover is connected to the rim and covers the battery and the main body 310.

In this embodiment, the electronic device 60 includes the circuit board 30, since the extension 320 of the circuit board 30 extends from one side edge of the main body 310 and the thickness of the extension 320 is smaller than that of the main body 310, the connecting line 301 is disposed on the extension 320, and the space occupied by the connecting line 301 of the main body 310 can be correspondingly reduced, so that the length or width of the main body 310 can be correspondingly reduced to provide a larger installation space for other components such as a battery. The main body 310 of the circuit board 30 comprises at least two layers of substrates 313 arranged in a stacked manner, and the connecting wires 301 are arranged on the substrates 313, so that the wiring space is increased, the size of the main body 310 can be effectively reduced, the defect of size increase caused by the arrangement of the first through holes 311 is overcome, and the circuit board is convenient to mount. Meanwhile, the extension 320 with a smaller thickness can be conveniently overlapped and matched with other components, such as a battery, so as to fully utilize the installation space inside the electronic device 60, and keep the electronic device 60 light and thin while improving the compactness of the arrangement of the components inside the electronic device 60. In addition, the middle plate 611 has a first groove 613, and the extension 320 is accommodated in the first groove 613, so that the extension 320 is sunk, the influence of the extension 320 on the overall thickness of the electronic device 60 or the influence of the extension 320 on the battery capacity is further reduced, and the practicability is high.

With reference to fig. 13, in an embodiment, the middle plate 611 further defines a second groove 615 communicated with the first groove 613, a depth of the second groove 615 is greater than a depth of the first groove 613, and at least a portion of the main body 310 is received in the second groove 615. The second groove 615 may be considered a small plate segment in a three-piece construction of the overall machine, or may be considered at least as part of a small plate segment. The size of the main body 310 is smaller than or equal to the opening size of the second groove 615, so that the main body 310 can be completely received in the second groove 615.

In the embodiment shown in fig. 13, the main body 310 accommodated in the second groove 615 is provided with a first through hole 311, and the first through hole 311 can be used for passing through the fingerprint identification light, so that the circuit board 30 can be used in cooperation with a G3 fingerprint module. Meanwhile, the circuit board 30 is small in size and can be used in cooperation with the G5/G6 fingerprint module without affecting the overall thickness of the electronic device 60 or the capacity of a battery. The circuit board 30 improves the compatibility of the display screen to the application of the G3 fingerprint module and the G5/G6 fingerprint module, thereby providing more choices for users and prolonging the iteration cycle of the display screen and the electronic equipment. In one embodiment, the fingerprint position of a cell phone that is compatible with the G3 fingerprint module and the G5/G6 fingerprint module is shown in FIG. 14.

In addition, the main body 310 has a smaller size, and the extension portion 320 can be accommodated in the first groove 613, and the size in the thickness direction is smaller, so that the circuit board 30 can be well matched with a flexible display panel, and an ultra-thin design of the thickness of the whole device is realized. Further, when the circuit board 30 is applied to the electronic equipment with the flexible display panel, the circuit board can be matched with the G3 fingerprint module for use, so that the cost of the electronic equipment 60 is greatly reduced, and the cost performance of the electronic equipment 60 is improved.

In one embodiment, the depth of the first groove 613 is greater than or equal to the thickness of the extension portion 320, so that the extension portion 320 can be completely accommodated in the first groove 613, and the influence on the overall thickness of the electronic device 60 or the influence on the battery capacity is further reduced.

In one embodiment, the extension 320 is a 2-layer plate, the thickness of the 2-layer plate is about 0.13mm, which is smaller than the thickness of the middle plate 611, and the extension 320 can be completely received in the first groove 613.

In one embodiment, extension 320 is integrally formed with the outermost substrate 313 away from the device bond pad. When the extension portion 320 is accommodated in the first groove 613, the extension portion 320 can better adhere to the bottom of the first groove 613 without folding or bending the extension portion 320, which does not affect the electrical performance of the circuit board 30 and prolongs the service life of the circuit board 30.

As shown in fig. 13, in one embodiment, the electronic device 60 further includes a first fingerprint module 630, and the first fingerprint module 630 may be a G3 fingerprint module. The first fingerprint module 630 is accommodated in the second groove 615, and the first fingerprint module 630 covers at least a portion of the first through hole 311, so that the fingerprint identification light passes through. That is, the first fingerprint module 630 corresponds to the first through hole 311, so that the first through hole 311 is located in the view angle range of the first fingerprint module 630, and the fingerprint identification light can pass through the first through hole 311.

Referring to fig. 15, in an embodiment, the electronic device 60 includes a second fingerprint module 640, and the second fingerprint module 640 may be a G5/G6 fingerprint module. The second fingerprint module 640 is disposed between the middle plate 611 and the display panel 620, and an orthographic projection of the second fingerprint module 640 is spaced from an orthographic projection of the extension portion 320 on a reference plane perpendicular to a thickness direction of the electronic device 60, so as to prevent the extension portion 320 from shielding the second fingerprint module 640.

Referring to fig. 16 to 18, it can be understood that the first through hole 311 and the second through hole 323 are not necessary in the embodiment using the G5/G6 fingerprint module or the later-updated fingerprint module with light weight and thin profile. Referring to fig. 16 and 17, in the embodiment where the first through hole 311 and the second through hole 323 are absent, the wiring board 70 may also include a main body 710 and an extension portion 720. With reference to fig. 18, the extension portion 720 is used for disposing the connection line 701, so that the main body 710 can save the space of the connection line 701, and further reduce the length or width of the main body 710, so as to reduce the installation space of the main body 710 in the electronic device, and facilitate the arrangement of other electronic components, such as a battery, thereby improving the compactness of the arrangement of the internal components of the electronic device, and ensuring the lightness and thinness of the electronic device.

In particular, referring to fig. 16, in such an embodiment, the body 710 may also include a first region 712, an intermediate region 714, and a second region 716, the intermediate region 714 being located between the first and

second regions

712, 716. The first area 712 and the second area 716 are disposed with connection lines 701, and the connection lines 701 of the extension portion 720 connect the connection lines 701 of the first area 712 and the connection lines 701 of the second area 716. Further, in this embodiment, a geometric plane perpendicular to the thickness direction of the main body 710 is taken, and the geometric plane is taken as a reference plane, and the orthographic projection of the middle region 714 on the reference plane is taken as a single connected region. Wherein a simply connected region means that the interior of any simple closed curve within the region still belongs to the region. In other words, a single communication zone is simply understood to be a zone that is not "holed". In the embodiment shown in fig. 16, the middle region 714 is provided with the device land 717, and thus the device land 717 and the region of the outer circumference of the preset range thereof may be regarded as the middle region 714. The preset range may be specified to extend outward from the edge of the device bonding pad 717 by a relatively small width, for example, 3mm or 5mm, etc. The connection line 701 of the extension portion 720 bypasses one side of the device bonding pad 717 from the first region 712 and extends to the second region 716, and conduction between the first region 712 and the second region 716 is achieved.

In some embodiments, the connection lines 701 of the extension portion 720 may also include driving traces of the display panel for transmitting display driving related signals to realize display driving. For example, the connection line 701 may be a scan signal line, a MIPI line, or a power line. Of course, the connection line 701 of the extension portion 720 may also include a touch screen driving trace for transmitting signals related to the touch screen driving, so as to drive the touch screen. Further, referring to fig. 18, the extension portion 720 may also be provided with a testing region 721, and the testing region 721 may be provided with devices for testing the electrical performance of the display panel or the touch screen, such as electrical testing points, electrical testing interfaces, or electrical testing lines. The test area 721 is exposed on the surface of the extension portion 720, which can further save the space of the main body 710, thereby further reducing the length or width dimension of the main body 710, and facilitating the installation of the circuit board 70. The structure and other arrangements of the main body 710 and the extension portion 720 can refer to the circuit board 30 or the circuit board 40 of the previous embodiment, and are not described herein again.

Of course, it is understood that the second through hole 323 may remain. That is, the connection between the extension portion 720 and the main body 710 may be provided with a circumferentially closed second through hole 323, and the shape of the second through hole 323 may be, but is not limited to, an elongated shape. The size of the second through hole 323 may be set according to actual needs. Certain stress can be generated when the substrate 713 at the layer where the extension portion 720 is located and the substrate 713 at other layers are bonded, the stress can be effectively released by arranging the second through hole 323, the extension portion 720 is prevented from being torn, and the structural stability of the circuit board 70 is improved.

With reference to fig. 19 to fig. 21, in the default embodiment of the first through hole 311, the plate 611 of the electronic device 60 may also be provided with a first groove 613 for receiving the extending portion 720. The extension portion 720 may be completely received in the first groove 613, or may be partially received in the first groove 613. The opening position of the first groove 613 may be determined according to the placement position of the wiring board 70 in the electronic device 60, and the size of the first groove 613 may be determined according to the size of the extension portion 720. The display panel 620 is connected to the middle plate 611 at the side of the first groove 613 and covers the first groove 613. The display panel 620 is electrically connected to the circuit board 70.

The middle frame 610 of the electronic device 60 may be provided with a battery compartment 614 at a side facing away from the display panel 620, the battery compartment 614 may be formed by the middle plate 611 and the bezel 612 together, and a battery (not shown) is disposed in the battery compartment 614. Further, in the thickness direction of the electronic device 60, the battery may be stacked on the extension portion 720. In other words, when a geometric plane perpendicular to the thickness direction of the electronic device 60 is made, an overlapping region exists in the orthogonal projection of the battery and the extension portion 720 on the geometric plane, that is, in the thickness direction of the electronic device 60, the thickness of the battery and the thickness of the extension portion 720 of the circuit board 70 can be mutually overlapped without affecting the thickness of the whole electronic device 60, thereby ensuring the lightness and thinness of the electronic device 60.

In this embodiment, the electronic device 60 includes the circuit board 70, because the extension portion 720 of the circuit board 70 extends from one side edge of the main body 710 and the thickness of the extension portion 720 is smaller than the thickness of the main body 710, the connecting line 701 is disposed on the extension portion 720, and the space occupied by the connecting line 701 of the main body 710 can be correspondingly reduced, so the length dimension or the width dimension of the main body 710 can be correspondingly reduced, so as to provide a larger installation space for other components such as a battery, thereby increasing the battery capacity, improving the cruising ability of the electronic device 60, and improving the user experience. The main body 710 of the wiring board 70 includes at least two layers of substrates 713 arranged in a stacked manner, and the connecting wires 701 are arranged on the substrates 713, so that the space for the connecting wires 701 is increased and the installation is convenient. Meanwhile, the extension portion 720 with a smaller thickness can be conveniently overlapped and matched with other components, such as a battery, so as to fully utilize the installation space inside the electronic device 60, and keep the electronic device 60 light and thin while improving the compactness of the arrangement of the components inside the electronic device 60. In addition, the middle plate 611 has a first groove 613, the extension portion 720 is accommodated in the first groove 613, the extension portion 720 is sunk, the influence of the extension portion 720 on the overall thickness of the electronic device 60 or the influence on the battery capacity is further reduced, and the practicability is high.

In the default implementation of the first through hole 311, the structure for matching the circuit board 70 with the display panel 620, the middle frame 610, the battery and other components can refer to the circuit board 30 and the circuit board 40 of the previous embodiment, and details thereof are omitted here.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A circuit board, comprising:

the body comprises at least two layers of substrates which are arranged in a stacked mode, and the body comprises a first area, a middle area and a second area, wherein the middle area is located between the first area and the second area; and

the extension portion extends out from one side edge of the main body, the thickness of the extension portion is smaller than that of the main body, a connecting wire is arranged on the extension portion, a device welding area is arranged in the middle area, and the connecting wire of the extension portion bypasses one side of the device welding area from the first area and extends to the second area.

2. The circuit board of claim 1, wherein the first region and the second region are both provided with connecting wires, and the connecting wires of the extension portion conduct the connecting wires of the first region and the connecting wires of the second region.

3. The wiring board of claim 2, wherein the orthographic projection of the intermediate region on a reference plane is a single communication region, and the reference plane is a geometric plane perpendicular to the thickness direction of the main body.

4. The circuit board of claim 2, wherein the middle region is provided with a first through hole, and the first through hole is used for light transmission of the fingerprint module or the image acquisition assembly.

5. The wiring board according to claim 4, wherein at least one of the first region and the second region is provided with a device land.

6. The wiring board of claim 5, wherein the first through hole is circumferentially closed; or the first through hole penetrates through the edge of the main body so that the extension part and the main body jointly enclose to form the first through hole.

7. The wiring board of claim 1, wherein the extension is integrally formed with either of the substrates.

8. The wiring board of claim 7, wherein the extension is integrally formed with the outermost substrate.

9. The wiring board of any one of claims 1 to 8, wherein the wiring board further comprises a test area, the extension portion comprising first and second oppositely disposed faces, the test area being exposed at least one of the first and second faces.

10. The circuit board according to any one of claims 1 to 8, wherein the extension portion defines a second through hole that is circumferentially closed, and the second through hole is defined at a connection position of the extension portion and the main body.

11. A circuit board, comprising:

a first substrate; and

the second substrate comprises a laminated part and an extension part which are integrally formed, the laminated part is laminated with the first substrate, and the extension part protrudes out of the edge of the first substrate; the circuit board includes first region, middle zone and second area, first region include the one end of range upon range of portion and the one end of first base plate, the second area includes the relative other end of range upon range of portion and the relative other end of first base plate, middle zone is including being located first region with between the second area range upon range of portion reaches first base plate, the connecting wire has been laid to the extension, middle zone is provided with the device pad, the connecting wire of extension is followed first region is walked around one side of device pad and is extended to the second area.

12. The circuit board of claim 11, wherein the first region and the second region are both provided with connecting wires, and the connecting wires of the extension portion conduct the connecting wires of the first region and the connecting wires of the second region.

13. The wiring board of claim 12, wherein an orthographic projection of the intermediate region on a reference plane is a single connected region, and the reference plane is a geometric plane perpendicular to a thickness direction of the first substrate.

14. The circuit board of claim 12, wherein the middle region defines a first through hole, and the first through hole is used for light transmission of the fingerprint module or the image capturing device.

15. The wiring board of claim 14, wherein the first region and the second region are each provided with a device land.

16. The wiring board of claim 15, wherein the first through hole is circumferentially closed; or the first through hole penetrates through the edge of the first substrate, and the extension part, the laminating part and the first substrate jointly enclose to form the first through hole.

17. The wiring board of claim 11, further comprising a test area exposed to a surface of the extension portion proximate the first substrate.

18. A display screen, comprising:

a display panel;

a drive unit; and

the wiring board according to any one of claims 1 to 17, wherein the wiring board electrically connects the display panel and the driving unit.

19. An electronic device, comprising:

the wiring board of any one of claims 1 to 17, wherein the extension portion is received in the first recess; and

20. The electronic device of claim 19, wherein the middle plate defines a second recess communicating with the first recess, the second recess having a depth greater than the first recess, and at least a portion of the circuit board is received in the second recess.

21. The electronic device of claim 19, wherein a depth of the first groove is greater than or equal to a thickness of the extension.

22. The electronic device according to claim 19, wherein a side of the middle frame facing away from the first groove is provided with a battery compartment for accommodating a battery, and the battery is stacked on the extending portion in a thickness direction of the electronic device.