CN115311949B - Binding structure, display module assembly and electronic equipment - Google Patents
Binding structure, display module assembly and electronic equipment Download PDFInfo
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- CN115311949B CN115311949B CN202211058194.1A CN202211058194A CN115311949B CN 115311949 B CN115311949 B CN 115311949B CN 202211058194 A CN202211058194 A CN 202211058194A CN 115311949 B CN115311949 B CN 115311949B
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- 239000010410 layer Substances 0.000 claims description 52
- 238000005452 bending Methods 0.000 claims description 11
- 239000002356 single layer Substances 0.000 claims description 6
- 238000009434 installation Methods 0.000 abstract description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 239000010931 gold Substances 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 8
- 238000010586 diagram Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
- G09F9/335—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The disclosure provides a binding structure, a display module and electronic equipment. The display module in this disclosure includes flexible circuit board, display panel and tie layer. The flexible circuit board comprises a wiring area, a first binding area and a device area which are sequentially arranged. The display panel includes a second binding region. The binding layer comprises a third binding area and a fourth binding area, wherein the third binding area is bound with the second binding area, and the fourth binding area is bound with the first binding area. In the display module, the first binding area is arranged between the wiring area and the device area, so that the length of the flexible circuit board can be increased, and the assembly of the flexible circuit board and the main board can be prevented from being influenced, and the problem that the installation space of the flexible circuit board is limited is solved.
Description
Technical Field
The disclosure relates to the field of display, and in particular relates to a binding structure, a display module and electronic equipment comprising the binding structure or the display module.
Background
In an electronic apparatus provided with a display panel, the display panel is bound with a flexible circuit board (Flexible Printed Circuit, abbreviated as FPC) for connecting the display panel and other electronic components. Due to the improvement of the performance of the display panel, the circuit wiring of the flexible circuit board is more and more complex, the size of the flexible circuit board is more and more larger, the screen of the electronic equipment is more and more occupied, and the frame is more and more narrow, so that the assembly space of the flexible circuit board in the electronic equipment is insufficient.
Disclosure of Invention
The utility model provides a bind structure, display module assembly and electronic equipment through setting up the binding area of flexible circuit board in the intermediate zone to solve the technical problem that the equipment space of flexible circuit board with display panel binding in the electronic equipment is not enough.
The first aspect of the present disclosure provides a display module including a flexible circuit board, a display panel, and a binding layer. The flexible circuit board comprises a wiring area, a first binding area and a device area which are sequentially arranged. The display panel includes a second binding region. The binding layer comprises a third binding area and a fourth binding area, wherein the third binding area is bound with the second binding area, and the fourth binding area is bound with the first binding area.
In the display module, the first binding area is arranged between the wiring area and the device area, so that the length of the flexible circuit board can be increased, and the assembly of the flexible circuit board and the main board can be prevented from being influenced, and the problem that the installation space of the flexible circuit board is limited is solved.
In a specific embodiment of the first aspect of the present disclosure, the first bonding region and the device region of the flexible circuit board can be bent to a side of the wiring region away from the display panel.
In a specific embodiment of the first aspect of the present disclosure, the front projection of the flexible circuit board on the light emitting surface of the display module in the bent state is at least partially located in the front projection of the display panel on the light emitting surface of the display module.
In the above embodiment, the size of the flexible circuit board in the assembled state is smaller than the size of the display panel, and this way it is ensured that the screen ratio of the electronic device is not increased by the flexible circuit board after the flexible circuit board and the display panel are assembled in the electronic device.
In a specific embodiment of the first aspect of the present disclosure, the flexible circuit board and the display panel are located on the same side of the binding layer. The second bonding area of the display panel is located between the third bonding area and the wiring area.
In a specific embodiment of the first aspect of the present disclosure, a length of the flexible circuit board from an end far from the wiring region to an end far from the device region is greater than a length of the display panel from an end far from the second bonding region to the second bonding region.
In a specific embodiment of the first aspect of the present disclosure, the routing area further includes a inflection region proximate to the first bonding region and a planar region distal to the first bonding region.
For example, further, the bending region is a single-sided circuit board, and/or the planar region is a double-sided circuit board or a multi-layer circuit board.
In a specific embodiment of the first aspect of the present disclosure, the bonding layer further comprises a conductive layer connecting the third bonding layer and the fourth bonding layer.
For example, further, the conductive layer includes a plurality of wires arranged in a single layer.
In the embodiment, the flexible circuit board and the binding layer are arranged as a single layer, so that the flexibility of the flexible circuit board and the binding layer can be improved, the internal wires are prevented from being broken, and the reliability of the display module is further improved.
In a specific embodiment of the first aspect of the present disclosure, the flexible circuit board further comprises a connector. The connector is arranged at one end of the device area of the display panel, which is far away from the binding area.
A second aspect of the present disclosure provides an electronic device comprising a display module as referred to in the first aspect.
A third aspect of the present disclosure provides a binding structure including a flexible circuit board and a binding layer. The flexible circuit board comprises a wiring area, a first binding area and a device area which are sequentially arranged. The binding layer is used for binding with the first binding area so as to enable the flexible circuit board to be electrically connected with the structure to be bound. The first binding area and the device area of the flexible circuit board are bent to one side of the wiring area, which is far away from the structure to be bound.
In the present disclosure, by disposing the first binding region between the wiring region and the device region, not only the length of the flexible circuit board can be increased, but also the assembly of the flexible circuit board and the motherboard can be prevented from being affected, so that the problem of limited installation space of the flexible circuit board is solved in this way.
Drawings
Fig. 1 is a top view of a display module.
Fig. 2 is a front view of a display module in an assembled state.
Fig. 3 is a top view of a display module according to an embodiment of the disclosure.
Fig. 4 is a cross-sectional view of a display module according to an embodiment of the present disclosure.
Fig. 5 is a top view of a display panel of a display module according to an embodiment of the disclosure.
Fig. 6 is a top view of a binding layer of a display module according to an embodiment of the disclosure.
Fig. 7 is a front view of a display module according to an embodiment of the disclosure in an assembled state.
Fig. 8 is a front view of a display module according to an embodiment of the disclosure in an assembled state.
Fig. 9 is a top view of an electronic device according to an embodiment of the present disclosure.
Fig. 10 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.
Detailed Description
The following description of the technical solutions in the embodiments of the present disclosure will be made clearly and completely with reference to the accompanying drawings in the embodiments of the present disclosure, and it is apparent that the described embodiments are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments in this disclosure, all other embodiments that a person of ordinary skill in the art would obtain without making any inventive effort are within the scope of protection of this disclosure.
In an electronic device, a display panel may be bound to a flexible circuit board electrically connected to a motherboard to electrically connect the display panel and the motherboard of the electronic device. In order to increase the screen ratio of the electronic device, as shown in fig. 1, the flexible circuit board 30' and the display panel 10' are respectively bonded with the bonding layer 20' such that the flexible circuit board 30' and the display panel 10' are electrically connected. Specifically, the display panel 10' includes a display area AA ' and a non-display area 11', and for example, the display area AA ' of the display panel 10' corresponds to an area of the mobile phone where an image is displayed, and the non-display area 11' of the display panel 10' is located in an area corresponding to a mobile phone frame. The bonding layer 20 'includes a first pin 21' bonded to the display panel 10 'and a second pin 22' for bonding to the flexible circuit board 30', the first pin 21' being bonded to the non-display region 11 'of the display panel 10' and the second pin 22 'being bonded to an end portion of the flexible circuit board 30'. The end of the flexible circuit board 30' remote from the second pins 22' is provided with a connector 32' for connection with a motherboard.
As shown in fig. 2, the binding layer 20' is bent toward the backlight side of the display panel 10', and the second lead is bent toward the backlight side of the display panel 10 '. The flexible circuit board 30 'is disposed substantially in parallel on the backlight side of the display panel 10'. The connector 32' is located on a side of the flexible circuit board 30' remote from the display panel 10 '.
As the performance of the display panel 10' increases, for example, the resolution of the display panel increases, the circuit wiring in the flexible circuit board 30' also becomes more complicated, and the length L1 of the flexible circuit board 30' needs to be designed longer. However, as the requirements of consumers for the light and thin mobile phones and the screen ratio are higher and higher, the overall size of the mobile phones is not changed or becomes smaller, which results in the length L1 of the flexible circuit board 30 'being longer than the length H' of the display panel 10', so that the frame of the electronic device including the display module 100' needs to be designed to be larger, which results in the screen ratio of the electronic device being reduced. However, if the flexible circuit board 30 'is bent near one end of the connector so as not to enlarge the frame of the electronic device, the bending of the end of the flexible circuit board 30' at the connector 32 'toward the light emitting side of the display panel 10' or toward the backlight side of the display panel 10 'may result in the mismatch of the mounting positions of the connector 32' and the motherboard, affect the assembly of the connector 32 'and the motherboard, and may also cause a risk of disconnection during bending, resulting in a reduction in the reliability of the display panel 10'.
In view of this, at least one embodiment of the present disclosure provides a display module, in which a binding area in a flexible circuit board is disposed between a wiring area and a device area of the flexible circuit board, so as to solve the problem that an installation space of the flexible circuit board is limited.
Next, a specific structure of the display module in at least one embodiment of the present disclosure will be described with reference to the accompanying drawings. In these drawings, a space rectangular coordinate system is established with the surface of the display panel as a reference to explain the positions of the structures in the display module. In the rectangular space coordinate system, the X axis and the Y axis are parallel to the plane of the display panel, and the Z axis is perpendicular to the plane of the display panel.
Fig. 3 is a schematic diagram of a display module 100 according to an embodiment of the disclosure. Fig. 4 is a sectional view taken along the line AB in fig. 3. As shown in fig. 3 and 4, at least one embodiment of the present disclosure provides a display module 100, the display module 100 including a display panel 10, a binding layer 20, and a flexible circuit board 30.
The flexible circuit board 30 includes a wiring region 311, a first bonding region 312, and a device region 313 arranged in this order. The display panel 10 includes a second binding area 12. The binding layer 20 includes a third binding area 21 and a fourth binding area 22. The third binding area 21 is bound with the second binding area 12, and the fourth binding area 22 is bound with the first binding area 312. Specifically, the third bonding region 21 and the second bonding region 12 and the fourth bonding region 22 and the first bonding region 312 may be bonded with conductive adhesive.
In the embodiment of the disclosure, the first binding area is arranged between the wiring area and the device area, so that the length of the flexible circuit board can be increased, and the assembly of the flexible circuit board and the main board can be prevented from being influenced, and the problem that the installation space of the flexible circuit board is limited is solved.
In one implementation of at least one embodiment of the present disclosure, the display panel 10 may be a liquid crystal display (Liquid Crystal Display, simply referred to as LCD). In one implementation of at least one embodiment of the present disclosure, the display panel 10 may also be an organic light emitting semiconductor display (Organic Electroluminescence Display, abbreviated as OLED).
Next, a structure of the flexible circuit board 30 in at least one embodiment of the present disclosure will be described with reference to the accompanying drawings.
As shown in fig. 5, the wiring region 311, the first binding region 312, and the device region 313 in the flexible circuit board 30 are sequentially arranged along the positive direction of the X axis. The flexible circuit board 30 further includes an electronic component 33, and the electronic component 33 is disposed in the device region 313. The electronic components 33 include devices such as capacitors, resistors, and diodes, and the flexible circuit board 30 includes a wiring layer therein, and these electronic components 33 are connected to form a predetermined circuit. The flexible circuit board 30 further includes a connector 32, and in particular, the structure of the connector 32 may refer to the connector 32' in fig. 1 and 2, and the connector 32 is disposed at an end of the device region 313 of the flexible circuit board 30 remote from the first binding region 312. The connector 32 is used for connecting with a mobile phone motherboard. Accordingly, the flexible circuit board 30 may electrically connect the display panel 10 and the main board.
In at least one implementation of at least one embodiment of the present disclosure, the total length of the flexible circuit board 30 along the X-axis direction is elongated with respect to the total length L1 of the flexible circuit board 30' in fig. 1, and the distance from the first bonding region 312 to the connector 32 along the X-axis is less than or substantially equal to the distance from the second pin 22' to the connector 32' along the X-axis. That is, in a state where the connector 32 is maintained in a position where it can be connected to the motherboard, the flexible circuit board 30 on the side of the first binding region 312 away from the connector 32 is extended, and thus the overall length of the flexible circuit board 30 in the X-axis direction is extended, thereby solving the problem that the mounting space of the flexible circuit board 30 is limited due to the increase in the overall length of the flexible circuit board 30 in the X-axis direction.
The structure of the binding layer in at least one embodiment of the present disclosure is described below with reference to the accompanying drawings.
As shown in fig. 6, the bonding layer 20 includes a third bonding region 21 and a fourth bonding region 22 sequentially arranged along the positive direction of the X-axis, and gold fingers (Connecting Finger) are respectively disposed in the third bonding region 21 and the fourth bonding region 22. The gold finger is actually coated with a layer of gold on the copper-clad plate through an electroplating process, because the gold has extremely high oxidation resistance, the internal circuit can be protected from corrosion, the electrical conductivity is also extremely high, the signal loss is not caused, meanwhile, the gold has extremely high ductility, and the contact area between the contacts can be larger under proper pressure, so that the contact resistance is reduced, and the signal transmission efficiency is improved.
In an alternative implementation of the embodiment of the present disclosure, the gold finger disposed in the third binding area 21 is used to bind with the display panel 10 to achieve the electrical connection of the display panel 10 and the binding layer 20. The gold finger disposed in the fourth bonding region 22 is used to bond with the flexible circuit board 30 to achieve electrical connection of the bonding layer 20 and the flexible circuit board 30.
In an alternative implementation of the disclosed embodiment, the binding layer 20 further includes a driving chip 23, and the driving chip 23 is used to control brightness of a Pixel (Pixel) of the display panel 10. The driving chip 23 is located between the third binding area 21 and the fourth binding area 22.
In an optional implementation manner of the embodiment of the present disclosure, the binding layer 20 includes a flexible carrier board, where gold fingers are respectively disposed in positions of the third binding region 21 and the fourth binding region 22, and where a driving chip 23 is disposed in a position of the flexible carrier board between the third binding region 21 and the fourth binding region 22. After the binding layer 20 is bent, the driving chip 23 is located at the backlight side of the display panel 10, and the orthographic projection of the driving chip 23 on the light emitting surface of the display module 100 is located in the orthographic projection of the display panel 10 on the light emitting surface of the display module 100, so that the size of the frame of the electronic device can be reduced.
Next, a structure of the display module 100 in an assembled state in at least one embodiment of the present disclosure will be described with reference to the accompanying drawings.
Fig. 7 is a schematic diagram of a display module 100 in an assembled state according to an embodiment of the disclosure. As shown in fig. 7, in the assembled state, the first binding region 312 and the device region 313 of the flexible circuit board 30 are folded to a side of the wiring region 311 away from the display panel 10. Specifically, in the Z-axis direction, the second bonding region 12 is located between the third bonding region 21 and the wiring region 311. In the present disclosure, the flexible circuit board 30 is disposed at the backlight side of the display panel 10 in a bent state, which can improve flexibility of the flexible circuit board 30, and the flexible circuit board 30 can be designed longer along the length of the X-axis in the unfolded state without affecting assembly of the flexible circuit board 30 and the main board.
As shown in fig. 7, in order to increase the wiring space of the flexible circuit board 30, in one implementation of an embodiment of the present disclosure, the length of the flexible circuit board 30 along the X-axis is greater than the length of the display panel 10 along the X-axis. In the present embodiment, the area of the flexible circuit board 30 is increased by increasing the length of the flexible circuit board 30, and thus the wiring space of the flexible circuit board 30 is increased. Therefore, this approach can solve the problem of insufficient wiring space of the flexible circuit board 30.
Further, the length of the wiring area 311 of the flexible circuit board 30 along the X-axis direction may be adaptively extended according to design requirements, for example, the length of the wiring area 311 along the X-axis direction extending to the flexible circuit board 30 along the X-axis direction is substantially equal to twice the length of the display panel 10 along the X-axis direction, and the flexible circuit board 30 is disposed on the backlight side of the display panel in a manner of being folded in half substantially along the center line; for another example, the wiring region 311 may be further extended and provided on the backlight side of the display panel in a multi-fold manner, and the specific length of the flexible circuit board 30 is not limited herein. The length of the device region 313 in the X-axis direction is smaller than the length of the flexible circuit board 30 in the X-axis direction.
In the present embodiment, the first bonding region 312 is disposed at a position of the flexible circuit board 30 near the middle region, and bending is performed in the Z-axis direction at one position of the wiring region 311, and after bending, a part of the wiring region 311 is located between the display panel 10 and the first bonding region 312. By bending the flexible circuit board 30 so that the length in the X-axis direction in the unfolded state is greater than the flexible circuit board 30 of the display panel 10, the position for disposing the connector 32 in the assembled state can be ensured to be in a position that can be easily assembled with the main board without increasing the length in the X-axis direction in the assembled state of the display module 100. Thus, this approach solves the problem of limited installation space for the flexible circuit board 30.
In this embodiment, the first binding area 312 is located between the wiring area 311 and the device area 313 of the flexible circuit board 30, and the first binding area 312 and the device area 313 are bent to a side far away from the light emitting side of the display panel 10, which not only ensures the installation of the flexible circuit board 30 and the motherboard, but also can lengthen the length of the flexible circuit board 30, thereby solving the problem of insufficient installation space of the flexible circuit board 30.
In order to increase the screen ratio of an electronic device employing such a display module 100, in an alternative implementation of an embodiment of the present disclosure, as shown in fig. 8, the front projection of the flexible circuit board 30 on the light exit surface of the display module 100 in the bent state is located in the front projection of the display panel 10 on the light exit surface of the display module 100. The binding positions of the display panel 10 and the binding layer 20 are located in the non-display area 11 of the display panel 10, the binding positions of the binding layer 20 and the flexible circuit board 30 are located in the middle of the flexible circuit board 30, and in a bent state, the binding positions of the binding layer 20 and the flexible circuit board 30 are on the backlight side of the display panel 10. Specifically, the size of the flexible circuit board 30 after being bound with the display panel 10 is smaller than the size of the display panel 10 by controlling the length of the flexible circuit board 30, the bending position, and the position of the first binding region 312. This implementation can ensure that the flexible circuit board 30 fully utilizes the existing space on the backlight side of the display panel 10 after assembly, without increasing the size of the bezel of the electronic device, and thus can ensure that the screen ratio is not increased, and can further increase the screen ratio of the display device in the case where the size of the non-display area 11 of the display panel 10 is reduced.
In order to improve the reliability of the display module 100 in an assembled state, in one implementation of an embodiment of the present disclosure, the flexible circuit board 30 is a single-sided circuit board. The flexible circuit board 30 is set to be a single-sided circuit board, so that the flexibility of the flexible circuit board 30 can be improved, bending is facilitated, circuit breakage is not easy to occur, and the reliability of the display module 100 is ensured.
In order to further improve the reliability of the display module 100 in the assembled state, in one implementation of an embodiment of the present disclosure, the flexible carrier of the bonding layer 20 further includes a conductive layer connecting the third bonding region 21 and the fourth bonding layer 20. For example, the conductive layer includes a plurality of wires arranged in a single layer. That is to say, the flexible carrier board is a single-sided circuit board. The binding layer 20 is a single-layer wire layer, so that the flexibility of the binding layer 20 can be improved, wires are not easy to break, and the reliability of the display module 100 can be further improved.
In order to improve the reliability of the display module 100 in an assembled state and increase the wiring space of the flexible circuit board 30, in one implementation of an embodiment of the present disclosure, the wiring region 311 and the first bonding region 312 are single-sided wiring boards, and the device region 313 is a double-sided wiring board. The wiring region 311 and the first binding region 312 are a single-layer wire layer to facilitate bending. The device region 313 is a double sided wiring board in order to increase the wiring space of the flexible circuit board 30.
To further increase the wiring space of the flexible circuit board 30, the wiring region 311 includes a inflection region near the first bonding region 312 and a plane region distant from the first bonding region 312. The bending area can be a single-sided circuit board, and the plane area can be a double-sided circuit board or a multi-layer circuit board. The wiring space of the flexible circuit board 30 can be increased by providing the planar area as a double-sided wiring board or a multi-layered wiring board.
At least one embodiment of the present disclosure provides a binding structure including a flexible circuit board 30 and a binding layer 20.
The flexible circuit board 30 includes a wiring region 311, a first binding region 312, and a device region 313, which are sequentially arranged in the first direction in the unfolded state. The binding layer 20 is used for binding with the first binding region 312 to electrically connect the flexible circuit board 30 with the structure to be bound. Wherein, the first bonding region 312 and the device region 313 of the flexible circuit board 30 may be bent to a side of the wiring region 311 away from the structure to be bonded.
Specifically, the specific structure of the flexible circuit board 30 and the binding layer 20 in the binding structure may be referred to the flexible circuit board 30 and the binding layer 20 in the display module 100, which will not be described herein.
The structure to be bound may be the display panel 10 in the display module 100, or may be an electronic device such as a circuit board.
Fig. 9 is a top view of an electronic device according to an embodiment of the present disclosure. Fig. 10 is a cross-sectional view taken along line CD in fig. 9. At least one embodiment of the present disclosure provides an electronic device, as shown in fig. 9 and 10, where the electronic device 200 includes the display module 100 as in the above embodiment. The electronic device 200 further includes a housing 201 and a cover 202, where the housing 201 and the cover 202 form an accommodating space, and the display module 100 is disposed in the accommodating space and located on the light emitting side of the display panel 10. The cover 202 is a transparent structure, for example, the cover 202 is made of glass.
The electronic device further includes electronic components such as a main board (not shown), a battery (not shown), and a camera (not shown). The case 201 and the cover 202 are used for protecting electronic components such as the display module 100, the main board, the battery, and the camera, which are disposed therein.
Specifically, the electronic device may be an electronic product such as a smart phone, a computer display, a game machine, and a television. For example, the electronic device may be a smart phone.
The embodiment of the disclosure provides an electronic device, and the embodiment of the disclosure solves the problem of insufficient installation space of a flexible circuit board by arranging a first binding area for binding between a wiring area and a device area of the flexible circuit board of a display module.
The electronic equipment provided by the embodiment of the disclosure and the display module provided by the embodiment of the disclosure belong to the same inventive concept, and have corresponding film layer structures and beneficial effects. Details not described in detail in the embodiment of the electronic device can be found in the embodiment section of the display module, and are not described here again.
The foregoing description of the preferred embodiments of the present disclosure is not intended to limit the disclosure, but rather to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the present disclosure.
Claims (11)
1. A display module, comprising:
the flexible circuit board comprises a wiring area, a first binding area and a device area which are sequentially arranged;
a display panel including a second binding region; and
the binding layer comprises a third binding area and a fourth binding area, wherein the third binding area is bound with the second binding area, and the fourth binding area is bound with the first binding area;
wherein the first bonding region and the device region of the flexible circuit board can be bent to a side of the wiring region away from the display panel.
2. The display module of claim 1, wherein the orthographic projection of the flexible circuit board on the light exit surface of the display module in the bent state is at least partially located in the orthographic projection of the display panel on the light exit surface of the display module.
3. The display module of claim 1, wherein the flexible circuit board and the display panel are located on the same side of the bonding layer, and the second bonding region of the display panel is located between the third bonding region and the routing region.
4. The display module of claim 1, wherein a length of the flexible circuit board from an end away from the device region to an end away from the routing region is greater than a length of the display panel from an end away from the second bonding region to the second bonding region.
5. The display module of claim 1, wherein the routing region further comprises a inflection region proximate to the first binding region and a planar region distal to the first binding region.
6. The display module assembly of claim 5, wherein the bending region is a single-sided circuit board and/or the planar region is a double-sided circuit board or a multi-layer circuit board.
7. The display module of any one of claims 1-5, wherein the bonding layer further comprises a conductive layer connecting the third bonding region and the fourth bonding region.
8. The display module of claim 7, wherein the conductive layer comprises a plurality of wires arranged in a single layer.
9. The display module of any one of claims 1-5, wherein the flexible circuit board further comprises:
and the connector is arranged at one end of the device area of the display panel, which is far away from the first binding area.
10. An electronic device comprising a display module according to any one of claims 1 to 9.
11. A binding structure, comprising:
the flexible circuit board comprises a wiring area, a first binding area and a device area which are sequentially arranged; and
the binding layer is used for binding with the first binding area so as to electrically connect the flexible circuit board with the structure to be bound;
the first binding area and the device area of the flexible circuit board are bent to one side of the wiring area, which is far away from the structure to be bound.
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| CN202211058194.1A CN115311949B (en) | 2022-08-31 | 2022-08-31 | Binding structure, display module assembly and electronic equipment |
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| CN202211058194.1A CN115311949B (en) | 2022-08-31 | 2022-08-31 | Binding structure, display module assembly and electronic equipment |
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| CN115311949B true CN115311949B (en) | 2023-11-28 |
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| CN115311949A (en) | 2022-11-08 |
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