CN115311949A - Binding structure, display module and electronic equipment - Google Patents

Binding structure, display module and electronic equipment Download PDF

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Publication number
CN115311949A
CN115311949A CN202211058194.1A CN202211058194A CN115311949A CN 115311949 A CN115311949 A CN 115311949A CN 202211058194 A CN202211058194 A CN 202211058194A CN 115311949 A CN115311949 A CN 115311949A
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Prior art keywords
circuit board
binding
area
flexible circuit
region
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Granted
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CN202211058194.1A
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Chinese (zh)
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CN115311949B (en
Inventor
李娟�
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Kunshan Govisionox Optoelectronics Co Ltd
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Kunshan Govisionox Optoelectronics Co Ltd
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Priority to CN202211058194.1A priority Critical patent/CN115311949B/en
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G09F9/335—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The utility model provides a bind structure, display module assembly and electronic equipment. The display module assembly in this disclosure includes flexible circuit board, display panel and binds the layer. The flexible circuit board comprises a wiring area, a first binding area and a device area which are sequentially arranged. The display panel includes a second binding region. The binding layer comprises a third binding area and a fourth binding area, the third binding area is bound with the second binding area, and the fourth binding area is bound with the first binding area. In this display module assembly, through setting up the first district that binds between wiring district and device district, both can increase flexible circuit board length, can also avoid influencing flexible circuit board and mainboard equipment, therefore the problem that the installation space of flexible circuit board is limited has been solved to this kind of mode.

Description

Binding structure, display module and electronic equipment
Technical Field
The present disclosure relates to the field of display, and in particular, to a binding structure, a display module and an electronic device including the binding structure or the display module.
Background
In an electronic device provided with a display panel, a Flexible Printed Circuit (FPC) for connecting the display panel and other electronic components is bound to the display panel. Because the promotion of display panel's performance leads to the circuit wiring of flexible circuit board more and more complicated, and then the flexible circuit board size is also bigger and bigger, and the electronic equipment screen accounts for than higher and higher, and the frame is more and more narrow, and this equipment space that just leads to flexible circuit board among the electronic equipment is not enough.
Disclosure of Invention
The utility model provides a bind structure, display module assembly and electronic equipment, through setting up the district of binding with flexible circuit board in the middle zone to solve the not enough technical problem of equipment space of the flexible circuit board that binds with display panel among the electronic equipment.
The first aspect of the present disclosure provides a display module, which includes a flexible circuit board, a display panel, and a binding layer. The flexible circuit board comprises a wiring area, a first binding area and a device area which are sequentially arranged. The display panel includes a second binding region. The binding layer comprises a third binding area and a fourth binding area, the third binding area is bound with the second binding area, and the fourth binding area is bound with the first binding area.
In above-mentioned display module assembly, through setting up the first district that binds between wiring district and device district, both can increase flexible circuit board length, can also avoid influencing flexible circuit board and mainboard equipment, therefore the problem that the installation space of flexible circuit board is limited has been solved to this kind of mode.
In one specific implementation manner of the first aspect of the present disclosure, the first bonding region and the device region of the flexible circuit board can be bent to a side of the wiring region away from the display panel.
In one embodiment of the first aspect of the present disclosure, an orthogonal projection of the flexible circuit board on the light emitting surface of the display module in the bent state is at least partially located within an orthogonal projection of the display panel on the light emitting surface of the display module.
In the above embodiment, the size of the flexible circuit board in the assembled state is smaller than that of the display panel, which can ensure that the screen occupation ratio of the electronic device is not increased by the flexible circuit board after the flexible circuit board and the display panel are assembled in the electronic device.
In one specific embodiment of the first aspect of the present disclosure, the flexible circuit board and the display panel are located on the same side of the binding layer. The second binding area of the display panel is located between the third binding area and the wiring area.
In one embodiment of the first aspect of the present disclosure, a length of the flexible circuit board from the end far away from the wiring region to the end far away from the device region is greater than a length of the display panel from the end far away from the second bonding region to the second bonding region.
In a specific embodiment of the first aspect of the present disclosure, the wiring region further includes a bending region close to the first bonding region and a planar region far from the first bonding region.
For example, further, the inflection region is a single-sided wiring board, and/or the planar region is a double-sided wiring board or a multi-layer wiring board.
In a particular embodiment of the first aspect of the present disclosure, the binding layer further comprises a conductive layer connecting the third binding layer and the fourth binding layer.
For example, further, the conductive layer includes a plurality of conductive lines arranged in a single layer.
In the above embodiment, all set up flexible circuit board and binding layer into the individual layer, this kind of mode can improve flexible circuit board and bind the pliability on layer, avoids the internal conductor fracture, and then improves display module's reliability.
In a particular embodiment of the first aspect of the present disclosure, the flexible circuit board further includes a connector. The connector is arranged at one end of the device region of the display panel, which is far away from the binding region.
A second aspect of the present disclosure provides an electronic device including the display module as referred to in the first aspect.
A third aspect of the present disclosure provides a bonding structure including a flexible circuit board and a bonding layer. The flexible circuit board comprises a wiring area, a first binding area and a device area which are sequentially arranged. The binding layer is used for binding with the first binding region so as to enable the flexible circuit board to be electrically connected with the structure to be bound. The first binding area and the device area of the flexible circuit board are bent to one side, away from the structure to be bound, of the wiring area.
In this disclosure, through setting up the first district that binds between wiring district and device district, both can increase flexible circuit board length, can also avoid influencing flexible circuit board and mainboard equipment, therefore the problem that the installation space of flexible circuit board is limited has been solved to this kind of mode.
Drawings
Fig. 1 is a top view of a display module.
Fig. 2 is a front view of a display module in an assembled state.
Fig. 3 is a top view of a display module according to an embodiment of the disclosure.
Fig. 4 is a cross-sectional view of a display module according to an embodiment of the disclosure.
Fig. 5 is a top view of a display panel of a display module according to an embodiment of the disclosure.
Fig. 6 is a top view of a bonding layer of a display module according to an embodiment of the disclosure.
Fig. 7 is a front view of a display module according to an embodiment of the disclosure in an assembled state.
Fig. 8 is a front view of a display module according to an embodiment of the disclosure in an assembled state.
Fig. 9 is a top view of an electronic device according to an embodiment of the present disclosure.
Fig. 10 is a cross-sectional view of an electronic device according to an embodiment of the disclosure.
Detailed Description
The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the drawings in the embodiments of the present disclosure, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.
In the electronic device, the display panel is bound to the flexible circuit board electrically connected to the main board, so that the display panel is electrically connected to the main board of the electronic device. In order to improve the screen occupation ratio of the electronic device, as shown in fig. 1, a flexible circuit board 30' and a display panel 10' are respectively bound with a binding layer 20' so that the flexible circuit board 30' and the display panel 10' are electrically connected. Specifically, the display panel 10' includes a display area AA ' and a non-display area 11', taking a mobile phone as an example, the display area AA ' of the display panel 10' corresponds to an area where an image is displayed on the mobile phone, and the non-display area 11' of the display panel 10' is located in an area corresponding to a frame of the mobile phone. The bonding layer 20 'includes a first lead 21' bonded to the display panel 10 'and a second lead 22' for bonding to the flexible circuit board 30', the first lead 21' is bonded to the non-display region 11 'of the display panel 10', and the second lead 22 'is bonded to an end of the flexible circuit board 30'. An end of the flexible circuit board 30' remote from the second pin 22' is provided with a connector 32' for connection with a motherboard.
As shown in fig. 2, the bonding layer 20' is bent toward the backlight side of the display panel 10', and the second leads are bent toward the backlight side of the display panel 10 '. The flexible circuit board 30 'is disposed substantially in parallel on the backlight side of the display panel 10'. The connector 32' is located on a side of the flexible circuit board 30' away from the display panel 10 '.
As the performance of the display panel 10' is improved, for example, the resolution of the display panel is higher, the circuit wiring in the flexible circuit board 30' is more complicated, and the length L1 of the flexible circuit board 30' needs to be designed longer. However, as the consumer demands for the lightness and thinness of the mobile phone and the screen occupation ratio are higher and higher, the overall size of the mobile phone is unchanged or becomes smaller, which results in the length L1 of the flexible circuit board 30 'being greater than the length H' of the display panel 10', and thus the frame of the electronic device including the display module 100' needs to be designed to be larger, which results in the screen occupation ratio of the electronic device being reduced. However, if the end of the flexible circuit board 30 'close to the connector is bent in order to not increase the bezel of the electronic device, no matter the end of the flexible circuit board 30' located at the connector 32 'is bent toward the light-emitting side of the display panel 10' or bent toward the backlight side of the display panel 10', the mounting positions of the connector 32' and the motherboard are not matched, which affects the assembly of the connector 32 'and the motherboard, and the bending may cause a risk of wire breakage, resulting in a decrease in reliability of the display panel 10'.
In view of this, at least one embodiment of the present disclosure provides a display module, in which a bonding area in a flexible circuit board is disposed between a wiring area and a device area of the flexible circuit board, so as to solve a problem that a mounting space of the flexible circuit board is limited.
The following describes a specific structure of a display module according to at least one embodiment of the present disclosure with reference to the accompanying drawings. In these drawings, a rectangular spatial coordinate system is established with reference to the surface of the display panel to illustrate the positions of the structures in the display module. In the space rectangular coordinate system, an X axis and a Y axis are parallel to the surface where the display panel is located, and a Z axis is perpendicular to the surface where the display panel is located.
Fig. 3 is a schematic diagram of a display module 100 according to an embodiment of the disclosure. Fig. 4 is a schematic view of a cross section along line AB in fig. 3. As shown in fig. 3 and 4, at least one embodiment of the present disclosure provides a display module 100, where the display module 100 includes a display panel 10, a binding layer 20, and a flexible circuit board 30.
The flexible circuit board 30 includes a wiring region 311, a first bonding region 312, and a device region 313, which are sequentially arranged. The display panel 10 includes a second binding region 12. The binding layer 20 includes a third binding region 21 and a fourth binding region 22. The third binding region 21 is bound with the second binding region 12, and the fourth binding region 22 is bound with the first binding region 312. Specifically, the third bonding region 21 and the second bonding region 12, and the fourth bonding region 22 and the first bonding region 312 may be bonded using a conductive paste.
In the embodiment of the disclosure, the first binding region is arranged between the wiring region and the device region, so that the length of the flexible circuit board can be increased, and the assembly of the flexible circuit board and the mainboard can be prevented from being influenced, therefore, the problem that the installation space of the flexible circuit board is limited is solved by the method.
In one implementation of at least one embodiment of the present disclosure, the Display panel 10 may be a Liquid Crystal Display (LCD). In one implementation of at least one embodiment of the present disclosure, the Display panel 10 may also be an Organic light emitting semiconductor Display (OLED).
The structure of the flexible circuit board 30 in at least one embodiment of the present disclosure will be described below with reference to the drawings.
As shown in fig. 5, the wiring region 311, the first binding region 312, and the device region 313 in the flexible circuit board 30 are arranged in order along the positive direction of the X-axis. The flexible circuit board 30 further includes an electronic component 33, and the electronic component 33 is disposed in the device region 313. The electronic components 33 include devices such as capacitors, resistors, and diodes, and the flexible circuit board 30 includes wiring layers therein, and these electronic components 33 are connected to form a predetermined circuit. The flexible circuit board 30 further includes a connector 32, and in particular, the structure of the connector 32 may refer to the connector 32' in fig. 1 and 2, and the connector 32 is disposed at an end of the device region 313 of the flexible circuit board 30 away from the first bonding region 312. The connector 32 is used for connecting with a main board of a mobile phone. Accordingly, the flexible circuit board 30 may electrically connect the display panel 10 and the main board.
In at least one implementation of at least one embodiment of the present disclosure, the total length of the flexible circuit board 30 along the X-axis direction is extended relative to the total length L1 of the flexible circuit board 30' in fig. 1, and the distance from the first binding region 312 to the connector 32 along the X-axis is smaller than or substantially equal to the distance from the second pin 22' to the connector 32' along the X-axis. That is, in a state where the position of the connector 32 is maintained to be connectable to the motherboard, the flexible circuit board 30 located on the side of the first binding region 312 away from the connector 32 is extended, and thus the overall length of the flexible circuit board 30 in the X-axis direction is extended, thereby solving the problem that the installation space of the flexible circuit board 30 is limited due to the increase in the overall length of the flexible circuit board 30 in the X-axis direction.
The structure of the binding layer in at least one embodiment of the present disclosure is described below with reference to the drawings.
As shown in fig. 6, the binding layer 20 includes a third binding region 21 and a fourth binding region 22 sequentially arranged along a positive direction of the X-axis, and a Connecting Finger (Connecting Finger) is disposed in each of the third binding region 21 and the fourth binding region 22. The gold finger is actually covered with a layer of gold on the copper-clad plate through an electroplating process, because the gold has extremely strong oxidation resistance, an internal circuit can be protected from being corroded, the conductivity is very strong, signal loss can not be caused, and meanwhile, the gold has extremely strong ductility, so that the contact area between the contacts can be larger under proper pressure, the contact resistance is reduced, and the signal transmission efficiency is improved.
In an optional implementation manner of the embodiment of the present disclosure, the gold finger disposed in the third binding region 21 is used for binding with the display panel 10 to achieve electrical connection between the display panel 10 and the binding layer 20. The gold finger disposed in the fourth bonding region 22 is used for bonding with the flexible circuit board 30 to achieve electrical connection of the bonding layer 20 and the flexible circuit board 30.
In an optional implementation manner of the embodiment of the present disclosure, the binding layer 20 further includes a driving chip 23, and the driving chip 23 is used for controlling the brightness of the pixels (pixels) of the display panel 10. The driver chip 23 is located between the third and fourth binding regions 21 and 22.
In an optional implementation manner of the embodiment of the present disclosure, the bonding layer 20 includes a flexible carrier, gold fingers are respectively disposed in positions of the flexible carrier located in the third bonding area 21 and the fourth bonding area 22, and a driving chip 23 is disposed in a position of the flexible carrier located between the third bonding area 21 and the fourth bonding area 22. After the bonding layer 20 is bent, the driving chip 23 is located on the backlight side of the display panel 10, and the orthographic projection of the driving chip 23 on the light-emitting surface of the display module 100 is located in the orthographic projection of the display panel 10 on the light-emitting surface of the display module 100, which can reduce the size of the frame of the electronic device.
The structure of the display module 100 in at least one embodiment of the present disclosure in an assembled state will be described below with reference to the drawings.
Fig. 7 is a schematic view of a display module 100 according to an embodiment of the disclosure in an assembled state. As shown in fig. 7, in the assembled state, the first bonding region 312 and the device region 313 of the flexible circuit board 30 are bent to a side of the wiring region 311 away from the display panel 10. Specifically, in the Z-axis direction, the second binding region 12 is located between the third binding region 21 and the wiring region 311. In the present disclosure, the flexible circuit board 30 is disposed at the backlight side of the display panel 10 in the bent state, which can improve the flexibility of the flexible circuit board 30, and the length of the flexible circuit board 30 along the X axis in the unfolded state can be designed to be longer without affecting the assembly of the flexible circuit board 30 and the main board.
As shown in fig. 7, in order to increase the wiring space of the flexible circuit board 30, in one implementation of an embodiment of the present disclosure, the length of the flexible circuit board 30 along the X axis is greater than the length of the display panel 10 along the X axis. In the present implementation, the area of the flexible circuit board 30 is increased by increasing the length of the flexible circuit board 30, and thus the wiring space of the flexible circuit board 30 is increased. Therefore, this way can solve the problem of insufficient wiring space of the flexible circuit board 30.
Further, the length of the wiring region 311 of the flexible circuit board 30 along the X-axis direction can be extended adaptively according to design requirements, for example, the length of the wiring region 311 along the X-axis direction extends to the length of the flexible circuit board 30 along the X-axis direction is substantially equal to twice the length of the display panel 10 along the X-axis direction, and the flexible circuit board 30 is disposed on the backlight side of the display panel in a manner of being folded in half along the center line; for another example, the wiring region 311 may be further extended and disposed on the backlight side of the display panel in a manner of being folded for a plurality of times, and the specific length of the flexible circuit board 30 is not limited herein. The length of the device region 313 in the X-axis direction is smaller than the length of the flexible circuit board 30 in the X-axis direction.
In this embodiment, the first bonding region 312 is disposed at a position of the flexible circuit board 30 near the middle region, and is bent in the Z-axis direction at a position of the wiring region 311, and after bending, a portion of the wiring region 311 is located between the display panel 10 and the first bonding region 312. By bending the flexible circuit board 30 so that the length in the X-axis direction in the unfolded state is greater than the flexible circuit board 30 of the display panel 10, the position for setting the connector 32 in the assembled state can be ensured to be in a position that can facilitate assembly with the main board without increasing the length in the X-axis direction in the assembled state of the display module 100. Therefore, this way solves the problem of the limited installation space of the flexible circuit board 30.
In this embodiment, the first bonding region 312 is located between the wiring region 311 and the device region 313 of the flexible circuit board 30, and the first bonding region 312 and the device region 313 are bent to a side away from the light emitting side of the display panel 10, which can ensure the installation of the flexible circuit board 30 and the motherboard, and can also extend the length of the flexible circuit board 30, thereby solving the problem of insufficient installation space of the flexible circuit board 30.
In order to increase the screen occupation ratio of the electronic device using the display module 100, in an optional implementation manner of an embodiment of the disclosure, as shown in fig. 8, an orthogonal projection of the flexible circuit board 30 on the light emitting surface of the display module 100 in a bent state is located in an orthogonal projection of the display panel 10 on the light emitting surface of the display module 100. The binding position of the display panel 10 and the binding layer 20 is located in the non-display region 11 of the display panel 10, the binding position of the binding layer 20 and the flexible circuit board 30 is located in the middle of the flexible circuit board 30, and the binding position of the binding layer 20 and the flexible circuit board 30 is located on the backlight side of the display panel 10 in the bent state. Specifically, the size of the flexible circuit board 30 bound with the display panel 10 is smaller than the size of the display panel 10 by controlling the length and the bending position of the flexible circuit board 30 and the position of the first binding region 312. This implementation can ensure that, after assembly, the flexible circuit board 30 fully utilizes the existing space on the backlight side of the display panel 10, and does not increase the size of the bezel of the electronic device, thereby ensuring that the screen occupation ratio is not increased, and further improving the screen occupation ratio of the display device in the case that the size of the non-display area 11 of the display panel 10 is reduced.
In order to improve the reliability of the assembled display module 100, in one embodiment of the present disclosure, the flexible circuit board 30 is a single-sided circuit board. The flexible circuit board 30 is arranged as a single-sided circuit board, so that the flexibility of the flexible circuit board 30 can be improved, the flexible circuit board can be bent more conveniently, the circuit is not prone to fracture, and the reliability of the display module 100 is ensured.
In order to further improve the reliability of the assembled display module 100, in one implementation of an embodiment of the present disclosure, the flexible carrier of the bonding layer 20 further includes a conductive layer connecting the third bonding region 21 and the fourth bonding layer 20. For example, the conductive layer includes a plurality of conductive lines arranged in a single layer. That is to say, the flexible carrier board is a single-sided circuit board. The binding layer 20 is a single-layer wire layer, so that the flexibility of the binding layer 20 can be improved, the wire is not easy to break, and the reliability of the display module 100 can be further improved.
In order to improve the reliability of the assembled display module 100 and increase the wiring space of the flexible circuit board 30, in one implementation of an embodiment of the present disclosure, the wiring region 311 and the first bonding region 312 are single-sided circuit boards, and the device region 313 is a double-sided circuit board. The wiring region 311 and the first bonding region 312 are single-layer conductive layers to facilitate bending. The device region 313 is a double-sided wiring board so as to increase a wiring space of the flexible circuit board 30.
In order to further increase the wiring space of the flexible circuit board 30, the wiring region 311 includes a bending region close to the first bonding region 312 and a planar region far from the first bonding region 312. The bending area can be a single-sided circuit board, and the plane area can be a double-sided circuit board or a multilayer circuit board. By providing the planar area as a double-sided wiring board or a multilayer wiring board, the wiring space of the flexible circuit board 30 can be increased.
At least one embodiment of the present disclosure provides a binding structure including a flexible circuit board 30 and a binding layer 20.
The flexible circuit board 30 includes a wiring region 311, a first binding region 312, and a device region 313 sequentially arranged in a first direction in an unfolded state. The binding layer 20 is used to bind with the first binding region 312 so as to electrically connect the flexible circuit board 30 with the structure to be bound. The first bonding region 312 and the device region 313 of the flexible circuit board 30 may be bent to a side of the wiring region 311 away from the structure to be bonded.
Specifically, the specific structures of the flexible circuit board 30 and the binding layer 20 in the binding structure can be referred to as the flexible circuit board 30 and the binding layer 20 in the display module 100, and are not described herein again.
The structure to be bonded may be, for example, the display panel 10 in the display module 100, or an electronic device such as a circuit board.
Fig. 9 is a top view of an electronic device according to an embodiment of the present disclosure. Fig. 10 is a cross-sectional view taken along the line CD in fig. 9. At least one embodiment of the present disclosure provides an electronic device, as shown in fig. 9 and 10, the electronic device 200 includes the display module 100 in the above embodiment. The electronic device 200 further includes a housing 201 and a cover plate 202, the housing 201 and the cover plate 202 form an accommodating space, and the display module 100 is disposed in the accommodating space and located on the light emitting side of the display panel 10. The cover plate 202 is a transparent structure, for example, the cover plate 202 is made of glass.
The electronic device further includes electronic components such as a main board (not shown), a battery (not shown), and a camera (not shown). The case 201 and the cover 202 protect electronic components such as the display module 100, a main board, a battery, and a camera provided therein.
Specifically, the electronic device may be an electronic product such as a smart phone, a computer monitor, a game machine, and a television. For example, the electronic device may be a smartphone.
The embodiment of the disclosure provides an electronic device, and the embodiment of the disclosure solves the problem of insufficient installation space of a flexible circuit board by arranging a first binding area for binding between a wiring area and a device area of the flexible circuit board of a display module.
The electronic equipment provided by the embodiment of the disclosure and the display module provided by the embodiment of the disclosure belong to the same inventive concept, and have corresponding film layer structures and beneficial effects. Details that are not described in detail in the embodiment of the electronic device may refer to the embodiment portion of the display module, and are not described herein again.
The above description is only exemplary of the present disclosure and should not be taken as limiting the disclosure, as any modification, equivalent replacement, etc. made within the spirit and principle of the present disclosure should be included in the scope of protection of the present disclosure.

Claims (10)

1. A display module, comprising:
the flexible circuit board comprises a wiring area, a first binding area and a device area which are sequentially distributed;
a display panel including a second binding region; and
and the binding layer comprises a third binding area and a fourth binding area, the third binding area is bound with the second binding area, and the fourth binding area is bound with the first binding area.
2. The display module assembly according to claim 1, wherein the first bonding region and the device region of the flexible circuit board are capable of being bent to a side of the wiring region away from the display panel.
3. The display module as claimed in claim 2, wherein an orthogonal projection of the flexible printed circuit board on the light exit surface of the display module in the bent state is at least partially located within an orthogonal projection of the display panel on the light exit surface of the display module.
4. The display module of claim 2, wherein the flexible circuit board and the display panel are on a same side of the bonding layer,
the second binding area of the display panel is located between the third binding area and the wiring area.
5. The display module of claim 1, wherein a length of the flexible circuit board from an end away from the device region to an end away from the wiring region is greater than a length of the display panel from an end away from the second bonding region to the second bonding region.
6. The display module of claim 1, wherein the wiring area further comprises a bending area close to the first binding area and a plane area far away from the first binding area;
preferably, the bending area is a single-sided circuit board, and/or the plane area is a double-sided circuit board or a multilayer circuit board.
7. The display module according to any one of claims 1 to 5, wherein the binding layer further comprises a conductive layer connecting the third binding region and the fourth binding region;
preferably, the conductive layer includes a plurality of conductive lines arranged in a single layer.
8. The display module according to any one of claims 1 to 5, wherein the flexible circuit board further comprises:
and the connector is arranged at one end, far away from the first binding region, of the device region of the display panel.
9. An electronic device comprising the display module according to any one of claims 1 to 8.
10. A binding structure, comprising:
the flexible circuit board comprises a wiring area, a first binding area and a device area which are sequentially distributed; and
and the binding layer is used for binding with the first binding region so as to electrically connect the flexible circuit board with the structure to be bound.
CN202211058194.1A 2022-08-31 2022-08-31 Binding structure, display module assembly and electronic equipment Active CN115311949B (en)

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