CN117475896A - Display module - Google Patents

Display module Download PDF

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Publication number
CN117475896A
CN117475896A CN202310803298.9A CN202310803298A CN117475896A CN 117475896 A CN117475896 A CN 117475896A CN 202310803298 A CN202310803298 A CN 202310803298A CN 117475896 A CN117475896 A CN 117475896A
Authority
CN
China
Prior art keywords
layer
signal transmission
integrated circuit
display module
circuit chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310803298.9A
Other languages
Chinese (zh)
Inventor
赵建华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to CN202310803298.9A priority Critical patent/CN117475896A/en
Publication of CN117475896A publication Critical patent/CN117475896A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/03—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes specially adapted for displays having non-planar surfaces, e.g. curved displays
    • G09G3/035—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes specially adapted for displays having non-planar surfaces, e.g. curved displays for flexible display surfaces
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays

Abstract

The application provides a display module assembly, this display module assembly includes display panel, integrated circuit chip and flexible circuit board, display panel includes the display area and is located the terminal district of display area one side, be provided with a plurality of first terminals in the terminal district, flexible circuit board and first terminal electricity are connected, through extend the flexible circuit board by the one side that the integrated circuit chip is close to first portion to the one side that the integrated circuit chip kept away from first portion, with this increase flexible circuit board and terminal district overlapping part, reduce the flexible circuit board and buckle the module space that occupies behind display panel's the back, thereby can save more spaces and be used for placing the battery, improve display module assembly's continuation of journey.

Description

Display module
Technical Field
The application relates to the technical field of display, in particular to a display module.
Background
In recent years, with the technical development of smart terminal devices and wearable devices, the demands for flat panel displays are increasingly diversified. For example, organic Light-Emitting Diode (OLED) display technology has self-luminous characteristics, and is more energy-saving compared with a liquid crystal display technology in which a backlight module is omitted.
At present, an integrated circuit chip and a flexible circuit board are arranged on the lower frame of the existing organic light emitting diode display module, and when the lower frame, the integrated circuit chip and the flexible circuit board of the organic light emitting diode display module are bent to the back of the organic light emitting diode display module, the flexible circuit board occupies a larger module space.
Therefore, it is necessary to provide a display module to improve the defect.
Disclosure of Invention
The embodiment of the application provides a display module assembly, can increase the part that flexible circuit board and terminal district overlap, reduce the terminal district and buckle the module space that flexible circuit board occupy behind display panel's the back to can save more spaces and be used for placing the battery, improve display module assembly's continuation of journey.
The embodiment of the application provides a display module assembly, include:
the display panel comprises a display area and a terminal area positioned at one side of the display area, wherein a plurality of first terminals are arranged in the terminal area;
an integrated circuit chip disposed in the terminal region and located at a side of the first terminal near the display region; and
and the flexible circuit board is electrically connected with the first terminal and extends from one side of the integrated circuit chip close to the first terminal to one side of the integrated circuit chip far away from the first terminal.
According to an embodiment of the present application, the flexible circuit board includes:
a first portion having a plurality of second terminals electrically connected to the first terminals, the first portion being disposed on a side of the integrated circuit chip adjacent to the first terminals;
the second part is arranged on one side, far away from the integrated circuit chip, of the first part, the second part is connected with the first part, and the number of metal film layers of the second part is larger than that of the first part; and
and the third part is connected with the first part, extends from the first part to one side of the integrated circuit chip far away from the first terminal, and has the same number of metal film layers as the first part.
According to an embodiment of the present application, the second portion includes at least one first binding metal layer, at least one first signal transmission metal layer located above the first binding metal layer, and at least one second signal transmission metal layer located below the first binding metal layer;
the first part is provided with second binding metal layers with the same number as the first binding metal layers, each second binding metal layer is arranged on the same layer as a corresponding layer of the first binding metal layers, the third part is provided with third signal transmission metal layers with the same number as the second binding metal layers, and each third signal transmission metal layer is arranged on the same layer as a corresponding layer of the second binding metal layers.
According to an embodiment of the application, the flexible circuit board further comprises a switching portion with a corner, one end of the switching portion is connected with the second portion, the other end of the switching portion is connected with a switching piece used for being externally connected with other devices, and the number of metal film layers of the switching portion is the same as that of the metal film layers of the third portion.
According to an embodiment of the present application, the adaptor has at least one fourth signal transmission metal layer, and each of the fourth signal transmission metal layers and a corresponding one of the second signal transmission metal layers are disposed on the same layer.
According to an embodiment of the present application, the flexible circuit board further includes:
the fourth part is arranged on one side, far away from the first part, of the second part, the fourth part is connected with the second part, and the number of metal film layers of the fourth part is the same as that of the third part; and
the switching portion has the turning, the one end of switching portion with the fourth portion is connected, the other end of switching portion is connected with the adaptor that is used for external other devices, the metal coating layer quantity of switching portion with the metal coating layer quantity of fourth portion is the same.
According to an embodiment of the present application, the fourth portion has at least one fifth signal transmission metal layer, each of the fifth signal transmission metal layers is disposed on the same layer as a corresponding one of the second signal transmission metal layers, and the switching portion has fourth signal transmission metal layers having the same number as the fifth signal transmission metal layers, each of the fourth signal transmission metal layers is disposed on the same layer as a corresponding one of the fifth signal transmission metal layers.
According to an embodiment of the present application, the third portion has an opening thereon, the opening penetrates through the third portion in a thickness direction of the third portion, and the integrated circuit chip is located in the opening.
According to an embodiment of the application, the integrated circuit chip has a gap between the integrated circuit chip and an edge of the opening.
According to an embodiment of the present application, an adhesive layer is disposed between the third portion and the terminal area, and the adhesive layer is used for adhering the third portion to the terminal area.
The beneficial effects of the embodiment of the application are that: the embodiment of the application provides a display module assembly, this display module assembly includes display panel, integrated circuit chip and flexible circuit board, display panel includes the display area and is located the terminal district of display area one side, be provided with a plurality of first terminals in the terminal district, integrated circuit chip sets up in the terminal district and is located the one side that first terminal is close to the display area, flexible circuit board is connected with first terminal electricity, through extend the flexible circuit board by the one side that integrated circuit chip is close to first portion to one side that integrated circuit chip kept away from first portion, thereby increase the part that flexible circuit board overlaps with display panel's terminal district, reduce the module space that flexible circuit board buckled and occupy behind display panel's the back, thereby can save more spaces and be used for placing the battery, improve display module assembly's continuation of journey.
Drawings
Fig. 1 is a schematic structural diagram of a display module before bending according to a first embodiment of the present disclosure;
FIG. 2 is a cross-sectional view of the display module shown in FIG. 1 along the direction A-A';
FIG. 3 is a cross-sectional view of the display module shown in FIG. 1 along the direction B-B';
fig. 4 is a schematic structural diagram of a display module after bending according to the first embodiment of the present application;
FIG. 5 is a cross-sectional view of the display module shown in FIG. 4 along the direction C-C';
fig. 6 is a schematic diagram of a film structure of a flexible circuit board according to a first embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of a display module before bending according to a second embodiment of the present application
FIG. 8 is a cross-sectional view of the display module shown in FIG. 7 along the direction D-D';
fig. 9 is a schematic structural diagram of a display module after bending according to a second embodiment of the present disclosure;
fig. 10 is a schematic diagram of a film structure of a flexible circuit board according to a second embodiment of the present disclosure;
fig. 11 is a schematic structural diagram of a display module before bending according to a third embodiment of the present disclosure;
FIG. 12 is a cross-sectional view of the display module shown in FIG. 11 along the E-E' direction.
Detailed Description
The following description of the embodiments refers to the accompanying drawings, which illustrate specific embodiments that can be used to practice the present application. The directional terms mentioned in this application, such as [ upper ], [ lower ], [ front ], [ rear ], [ left ], [ right ], [ inner ], [ outer ], [ side ], etc., are only referring to the directions of the attached drawings. Accordingly, directional terminology is used to describe and understand the application and is not intended to be limiting of the application. In the drawings, like elements are designated by like reference numerals.
The present application is further described below with reference to the drawings and specific examples.
The embodiment of the application provides a display module assembly, can increase the part that flexible circuit board and terminal district overlap, reduce the terminal district and buckle the module space that flexible circuit board occupy behind display panel's the back to can save more spaces and be used for placing the battery, improve display module assembly's continuation of journey.
Referring to fig. 1, a display module 100 includes a display panel 1, an integrated circuit chip 2 and a flexible circuit board 3, where the display panel 1 may include a display area AA and a non-display area NA on a front surface, and the front surface is a display surface of the display panel. The display area AA is provided with a plurality of pixels distributed in an array, and the non-display area NA may be an area where no pixels are arranged, or the non-display area NA may also be arranged with virtual pixels (i.e., pixels that are not turned on when the display panel is in operation). The non-display area NA may be arranged with a driving circuit and a signal line.
The non-display area NA may include a terminal area PA disposed at one side of the display area AA, and the terminal area PA may have a plurality of terminals therein, and the integrated circuit chip 2 and the flexible circuit board 3 may be respectively bonded to the corresponding terminals in the terminal area PA.
In this embodiment, referring to fig. 1, before the terminal area PA of the display panel is not bent to the back of the display panel, the terminal area PA is disposed below the display area AA, and the area where the terminal area PA is located can be regarded as the lower frame of the display panel. In the final product structure of the display panel, the terminal area PA may be bent to the rear surface of the display panel 1, so that the width of the lower frame of the display panel may be reduced, and the effect of the narrow frame may be achieved. The rear surface is a non-display surface of the display panel disposed opposite to the display surface, and may also be referred to as a back surface of the display panel.
In this embodiment, the display panel 1 is a flexible organic light emitting diode display panel, the display panel 1 may be bent, and the display panel 1 has a bending area BA, and the bending area BA is located between the display area AA and the terminal area PA.
As shown in conjunction with fig. 4 and 5, when the display panel 1 is in a bent state, the bending region BA may have a predetermined curvature, and the terminal region PA may be bent from the front surface of the display panel 1 to the rear surface of the display panel 1.
The integrated circuit chip 2 is disposed in the terminal area PA. The terminal area PA may have a plurality of terminals therein, and the integrated circuit chip 2 is connected to the terminals in the terminal area PA in a binding manner.
Referring to fig. 2, the terminal area PA may have a plurality of first terminals 11, and the integrated circuit chip 2 is located on a side of the first terminals 11 near the display area AA.
It should be noted that, the side of the integrated circuit chip 2 near the display area AA of the first terminal 11 refers to the relative positional relationship between the integrated circuit chip 2 and the first terminal 11 and the display area AA when the display module is in the unbent state as shown in fig. 1.
The flexible circuit board 3 is electrically connected to the first terminal 11, and the flexible circuit board 3 extends from a side of the integrated circuit chip 2 near the first terminal 11 to a side of the integrated circuit chip 2 far from the first terminal 11. Under this structure, can increase the part that flexible circuit board 3 and terminal area PA overlap, reduce the module space that flexible circuit board 3 after buckling to display panel's the back occupied to can save more spaces and be used for placing the battery, improve the continuation of journey of display module.
Further, the flexible circuit board 3 includes a first portion 31, the first portion 31 being provided on a side of the integrated circuit chip 2 close to the first terminal 11, the first portion 31 partially overlapping the terminal area PA in the thickness direction of the display panel. The first portion 31 has a plurality of second terminals 310, and the second terminals 310 are disposed opposite to the first terminals 11 and connected to the first terminals 11.
Referring to fig. 2, the side of the terminal area PA near the flexible circuit board 3 has a plurality of first terminals 11, the side of the first portion 31 of the flexible circuit board 3 near the terminal area PA has a plurality of second terminals 310, the first terminals 11 and the second terminals 310 overlap in the thickness direction of the display panel, and the first terminals 11 and the second terminals 310 can be connected by soldering.
It should be noted that, herein, the first direction X may refer to a lateral direction in the view angle shown in fig. 1, the second direction Y may refer to a vertical direction in the view angle shown in fig. 1, the third direction Z may refer to a direction perpendicular to a plane in which the first direction X and the second direction Y are located, and the third direction Z may also be regarded as a thickness direction of the display panel.
The flexible circuit board 3 further includes a second portion 32, the second portion 32 is disposed on a side of the first portion 31 away from the integrated circuit chip 2, the second portion 32 is connected to the first portion 31, and the second portion 32 and the terminal area PA do not overlap in a thickness direction of the display panel. The second portion 32 has a device region 320, and one or more components may be disposed in the device region 320, and other signal transmission lines may be disposed in the device region 320, where the components may be, but are not limited to, electrical devices such as capacitors and resistors.
The flexible circuit board 3 further includes a third portion 33, the third portion 33 is disposed on a side of the first portion 31 close to the integrated circuit chip 2, the third portion 33 is connected to the first portion 31, the third portion 33 extends from the first portion 31 (i.e., a side of the integrated circuit chip 2 close to the first portion 31) to a side of the integrated circuit chip 2 away from the first portion 31, and the third portion 33 overlaps the terminal area PA in a thickness direction of the display panel.
As shown in fig. 1, the dashed box below the second portion 32 is the area where the third portion 33 is originally located, in this embodiment, the third portion is moved to the side of the first portion 31 near the integrated circuit chip 2, and the third portion 33 is distributed between the side of the integrated circuit chip 2 near the first portion 31 and the side of the integrated circuit chip 2 far from the first portion 31, so that the overlapping portion of the flexible circuit board 3 and the terminal area PA of the display panel is increased, and thus the space occupied by the flexible circuit board 3 along the second direction Y can be reduced, and the reduced space is the area shown by the dashed box below the second portion 32 in fig. 1.
As shown in connection with fig. 5, when the terminal area PA is bent to the rear surface of the display panel 1, the reduced space of the flexible circuit board 3 (i.e., the area of the dotted line frame shown to the right of the second portion 32 in fig. 5) can be used for placing a battery or other components. For example, if the space reduced by the flexible circuit board 3 is used for placing the battery without changing the overall size of the display module, the display module may have a larger space for placing a larger volume of battery, thereby improving the cruising ability of the display module.
It should be noted that fig. 1 to 5 only illustrate the structure of the flexible circuit board 3 and the relative positional relationship between the flexible circuit board 3 and the display panel 1, and do not represent the structure of the flexible circuit board 3 in practical use, and the area shown by the dashed line box below the second portion 32 or on the right side in fig. 1 to 5 only illustrates the space occupied by the flexible circuit board 3 in a reduced manner, and is not the structure actually possessed by the flexible circuit board 3.
Further, referring to fig. 1, the flexible circuit board 3 further includes a switching portion 35 having a corner, the switching portion 35 is in an "L" shape, one end of the switching portion 35 is connected to the second portion 32, and the other end of the switching portion 35 is connected to a switching member 36 for connecting with other devices, where the switching member 36 may be a switching member, and the other devices may be a control motherboard or a power supply.
Further, the number of metal layers of the second portion 32 is different from the number of metal layers of the first portion 31, and the number of metal layers of the third portion 33 is different from the number of metal layers of the second portion 32.
In this embodiment, the number of metal layers in the first portion 31 refers to the number of metal layers in the first portion 31.
Further, the number of metal layers of the first portion 31 is smaller than the number of metal layers of the second portion 32, the number of metal layers of the third portion 33 is smaller than the number of metal layers of the second portion 32, and the number of metal layers of the first portion 31 is the same as the number of metal layers of the third portion 33.
As shown in fig. 2, the first portion 31 and the terminal area PA of the display panel are partially overlapped in the third direction Z, the second portion 32 and the terminal area PA are overlapped in the third direction Z, and by making the number of metal film layers of the first portion 31 smaller than the number of metal film layers of the second portion 32 and the number of metal film layers of the third portion 33 smaller than the number of metal film layers of the second portion 32, the number of film layers and the thickness of the first portion 31 and the second portion 32 are reduced, so that the thickness of the display module in the terminal area PA is reduced, and the bending process of the terminal area of the display module is prevented from being influenced by the fact that the number of metal film layers of the first portion 31 and the second portion 32 is larger and the thickness is larger.
In some embodiments, the second portion 32 includes at least one first bonding metal layer 323, at least one first signal transmission metal layer 321 located above the first bonding metal layer 323, and at least one second signal transmission metal layer 322 located below the first bonding metal layer 323, the first portion 31 has the same number of second bonding metal layers 311 as the first bonding metal layer 323, each second bonding metal layer 311 is disposed in the same layer as the corresponding one of the first bonding metal layers 323, the third portion 33 has the same number of third signal transmission metal layers 331 as the second bonding metal layers 311, and each third signal transmission metal layer 331 is disposed in the same layer as the corresponding one of the second bonding metal layers 311.
In one embodiment, as shown in fig. 6, the first portion 31 has two second bonding metal layers 311, a plurality of first base materials 312 and a plurality of first adhesive layers 313, wherein the second bonding metal layers 311 can be used to form the second terminals 310 and signal traces connected with the second terminals 310, the first base materials 312 are disposed on two opposite side surfaces of the first conductive layers 311, and the first adhesive base layers 313 are disposed between the first base materials 312 and the first conductive layers 311 for attaching the first base materials 312 to the surfaces of the first conductive layers 311.
The second part 32 has two first bonding metal layers 323, one first signal transmission metal layer 321 located above the first bonding metal layer 323, and three second signal transmission layers 322 located below the first bonding metal layer 323, and a second substrate 324 and a second adhesive layer 325 may be disposed between adjacent metal layers of the second part 32. Each first binding metal layer 323 and a corresponding second binding metal layer 311 are arranged in the same layer, the first binding metal layer 323 is provided with a plurality of signal wires, and the signal wires in the first binding metal layer 323 are used for being electrically connected with the second terminals 310 in the second binding metal layer 311. The first signal transmission metal layer 321 and the second signal transmission layer 322 are respectively provided with a plurality of signal wires, the signal wires in the first signal transmission metal layer 321 and the second signal transmission layer 322 can be used for transmitting display signals or touch signals, and the signal wires in the first signal transmission metal layer 321 and/or the second signal transmission layer 322 can be electrically connected with the signal wires in the first binding metal layer 323 through the through holes between the film layers. .
The third portion 33 has two third signal transmission metal layers 331, a plurality of third base materials 332 and a plurality of third adhesive layers 333, the third base materials 332 are disposed on two opposite side surfaces of the third conductive layer 331, and the third adhesive layers 333 are disposed between the third base materials 332 and the third conductive layer 331 for attaching the third base materials 332 to the surface of the third conductive layer 331. Each third signal transmission metal layer 331 is arranged in the same layer as the corresponding second binding metal layer 311, a plurality of signal wires can be arranged in the third signal transmission metal layer 331, and the signal wires in the third signal transmission metal layer 331 can be electrically connected with the second terminals 310 or the signal wires in the first part.
It should be noted that, if the second bonding metal layer 311 of the first portion 31 and the third signal transmission metal layer 331 of the third portion 33 are arranged in the same layer as the second signal transmission layer 322 of the second portion 32 located below, that is, the bottoms of the first portion 31 and the third portion 33 are flush with the bottom of the first portion 31, the bottom surface of the second portion 32 exceeds the surface of the terminal area PA more when the third portion 33 is adhered to the terminal area PA by the adhesive, so that the bottom surface of the second portion 32 lacks support, and the flatness of the flexible circuit board is affected; if the second bonding metal layer 311 of the first portion 31 and the third signal transmission metal layer 331 of the third portion 33 are disposed on the same layer as the first signal transmission layer 321 of the second portion 32, that is, the top of the first portion 31 and the top of the third portion 33 are flush with the top of the first portion 31, the step between the bottom of the first portion 31 and the bottom of the second portion 32 is large, which also affects the flatness of the flexible circuit board.
In this embodiment, the second bonding metal layer 311 of the first portion 31 and the third signal transmission metal layer 331 of the third portion 33 are arranged on the same layer as the first bonding metal layer 323 of the second portion 32, which is located in the middle, so that the thickness of the display module in the terminal area PA can be reduced, the bending process of the terminal area of the display module, which is affected by the greater number of layers and greater thickness of the first portion 31 and the third portion 33, is avoided, the bottom surface of the second portion 32 is prevented from exceeding the surface of the terminal area PA, and the second portion 32 can be supported by the back surface of the display panel, thereby ensuring the flatness of the flexible circuit board.
In this embodiment, the first portion 31 and the third portion 33 may be an integral structure, that is, any one layer of substrate in the first portion 31 and the third portion 33 may be a complete substrate instead of two layers of substrates being spliced, and the second bonding metal layer 311 in the first portion 31 and the third signal transmission metal layer 331 in the third portion 33 may be etched by the same layer of copper foil instead of two layers of copper foil being spliced.
In this embodiment, the second bonding metal layer 311 in the first portion 31 and the third signal transmission layer 331 in the third portion 33 may be led out from the first bonding metal layer 323 in the second portion 32 and arranged in the same layer as the second bonding metal layer 311, that is, the second bonding metal layer 311, the third signal transmission layer 331 and the first bonding metal layer 323 in the second portion 32 and arranged in the same layer as the first conductive layer 311 may be etched by the same layer of copper foil, other adjacent film layers in the first portion 31 and the second portion 32 may be fixed into a whole by a pressing manner, and the first bonding metal layer 323 and the first signal transmission metal layer 321 and the second signal transmission metal layer 322 located in different layers may be electrically connected by the conductive pillars 324 formed in the vias.
In practical applications, the number of metal layers in the first portion 31, the second portion 32, and the third portion 33 may be set according to practical requirements, if the resolution of the display panel is higher, the number of circuits in the flexible circuit board is more, the number of second binding metal layers 311 in the first portion 31 may be 2, and the number of metal layers in the second portion 32 may be 6 or 8 or more; if the resolution of the display panel is low, the number of the second bonding metal layers 311 in the first portion 31 may be 1, and the number of the metal layers in the second portion 32 may be 2 or 4.
In some embodiments, the adaptor 35 has at least one fourth signal transmission metal layer 350, and each fourth signal transmission metal layer 350 is disposed on the same layer as a corresponding second signal transmission metal layer 322.
In one embodiment, as shown in fig. 6, the adaptor portion 35 has two fourth signal transmission metal layers 350, and the two fourth signal transmission metal layers 350 and the second signal transmission metal layer 322 at the lowest are arranged in the same layer, that is, the bottom of the adaptor portion 35 is flush with the bottom of the second portion 32, and neither the adaptor portion 35 nor the second portion 32 overlaps the terminal area PA, so that the flatness of the bottom of the portion of the flexible circuit board that does not overlap the terminal area PA can be ensured.
Further, the flexible circuit board 3 further includes a plurality of conductive plating layers 301, and the conductive plating layers 301 are disposed between the adhesive layer and the conductive layer.
As shown in fig. 6, taking the second portion 32 as an example, the second portion 32 includes four conductive plating layers 301, and the conductive plating layers 301 are disposed between adjacent metal layers and the second adhesive layer 323.
In this embodiment, the conductive layers in the flexible circuit board are copper, which is the same as the conductive plating 301 and the conductive posts 324.
Further, the flexible circuit board 3 further includes an electromagnetic shielding layer 302, and the electromagnetic shielding layer 302 is provided on opposite side surfaces of the first portion 31, the second portion 32, and the third portion 33.
In one embodiment, as shown in fig. 1, the third portion 33 has an opening 334, and the opening 334 penetrates the third portion 33 in the thickness direction of the third portion 33, and the thickness direction of the third portion 33 is the third direction Z. The integrated circuit chip 2 is located in the opening 334, and the third portion 33 does not cover the integrated circuit chip 2, so that not only can the heat dissipation of the integrated circuit chip 2 be facilitated, but also the signal interference of the flexible circuit board 3 to the integrated circuit chip 2 can be reduced.
The shape and size of the opening 334 are adapted to the shape of the integrated circuit chip 2. For example, the shape of the orthographic projection of the integrated circuit chip 2 on the terminal area PA is rectangular, and the shape of the orthographic projection of the opening 334 on the third direction Z is also rectangular.
Further, there is a gap between the integrated circuit chip 2 and the edge of the opening 334.
As shown in fig. 1, in the first direction X and the second direction Y, gaps are formed between the integrated circuit chip 2 and the edges of the opening 334, so that interference with the integrated circuit chip 2 during the binding process of the flexible circuit board 3 can be avoided, and damage to the integrated circuit chip 2 caused by water vapor and salt mist entering the integrated circuit chip 2 during the binding process of the flexible circuit board 3 due to too small distance between the flexible circuit board 3 and the integrated circuit chip 2 can be avoided.
Further, the distance between the integrated circuit chip 2 and the edge of the opening 334 is greater than or equal to 0.5 mm and less than or equal to 1 mm.
As shown in fig. 1, in the first direction X, the distance between the edge of the opening 334 and the integrated circuit chip 2 is 0.5 mm; in the second direction Y, the distance between the edge of the opening 334 and the integrated circuit chip 2 is 0.5 mm.
In practical applications, the distance between the edge of the opening 334 and the integrated circuit chip 2 in the first direction X is not limited to 0.5 mm in the above-described embodiment, but may be 0.6, 0.8 or 1 mm, and the distance between the edge of the opening 334 and the integrated circuit chip 2 in the second direction Y is not limited to 0.5 mm in the above-described embodiment, but may be 0.6, 0.8 or 1 mm. The distance between the edge of the opening 334 and the integrated circuit chip 2 in the first direction X and the distance between the edge of the opening 334 and the integrated circuit chip 2 in the second direction Y may be equal or different, and are not limited herein.
Further, an adhesive layer 4 is provided between the third portion 33 and the terminal area PA, and the adhesive layer 4 is used for bonding the third portion 33 and the terminal area PA.
As shown in fig. 2, the adhesive layer 4 is disposed on a side of the integrated circuit chip 2 remote from the first terminals 11, and the third portion 33 is fixed on the terminal area PA of the display panel 1 through the adhesive layer 4.
In one embodiment, the adhesive layer 4 is double-sided adhesive, both the upper and lower surfaces of the adhesive layer 4 have adhesiveness, one surface of the adhesive layer 4 is adhered to the surface of the terminal area PA of the integrated circuit chip 2 near the display area AA, the other surface of the adhesive layer 4 is adhered to the surface of the third portion 33 of the flexible circuit board 3 near the terminal area PA, and the third portion 33 is fixed to the terminal area PA of the display panel 1 through the adhesive layer 4. In practical applications, the adhesive layer 4 may be, but is not limited to, a pressure sensitive adhesive.
Referring to fig. 7 and 8, fig. 7 is a schematic structural diagram of a display module before bending according to a second embodiment of the present application, and the display module structure of the second embodiment shown in fig. 7 is substantially the same as that of the display module of the first embodiment shown in fig. 1, except that: the flexible circuit board 3 further includes a fourth portion 34, where the fourth portion 34 is disposed on a side of the second portion 32 away from the first portion 31 and is connected to the second portion 32, one end of the adapting portion 35 is connected to the fourth portion 34, and the number of film layers of the fourth portion 34 is smaller than that of the second portion 32.
For the display module with insufficient space of the terminal area PA along the second direction Y, the part of the circuit under the second portion 32 (i.e. the third portion 33) can be moved to the side of the first portion 31 near the integrated circuit chip 2, and the part of the circuit under the second portion 32 (i.e. the fourth portion 34) can be reserved, so that the module space occupied by the flexible circuit board can be reduced to a certain extent, and the reduced space is the area shown by the dashed line box under the fourth portion 34 in fig. 7. In some embodiments, the number of metal layers of the fourth portion 34 and the number of metal layers of the transition portion 35 are the same as the number of metal layers of the first portion 31 and/or the second portion 32, i.e., the fourth portion 34 and the transition portion 35 each comprise 2 metal layers. In other embodiments, when the number of layers of the first portion 31 and the second portion 32 is the same, the number of layers of the fourth portion 34 is the same as the number of layers of the first portion 31 and the second portion 32; when the number of film layers of the first portion 31 and the second portion 32 is different, the fourth portion 34 may be the same as the number of film layers of any one of the first portion 31 and the second portion 32.
In some embodiments, the fourth portion 34 has at least one fifth signal transmission metal layer 340, each fifth signal transmission metal layer 340 is disposed in the same layer as a corresponding one of the second signal transmission metal layers 322, and the through-connection portion 35 has the same number of fourth signal transmission metal layers 350 as the fifth signal transmission metal layers 340, each fourth signal transmission metal layer 350 is disposed in the same layer as a corresponding one of the fifth signal transmission metal layers 340.
In one embodiment, referring to fig. 10, the fourth portion 34 has two fifth signal transmission metal layers 340, the switching portion 35 has two fourth signal transmission metal layers 350, the two fifth signal transmission metal layers 340 and the two fourth signal transmission layers 350 are disposed at the same level as the second signal transmission metal layer 322 at the lowest level, that is, the bottoms of the fourth portion 34 and the switching portion 35 are flush with the bottom of the second portion 32, and none of the fourth portion 34, the switching portion 35 and the second portion 32 overlaps with the terminal area PA, so that the flatness of the bottom of the portion of the flexible circuit board that does not overlap with the terminal area PA can be ensured.
As shown in fig. 9, when the terminal area PA is bent to the back surface of the display panel, the whole flexible circuit board 3 may be bent to the back surface of the display panel along with the terminal area PA, and the first portion 31, the second portion 32, the third portion 33, the fourth portion 34, the switching portion 35 and the connecting portion 36 of the flexible circuit board 3 may not be bent. The area shown by box Fang Xuxian on the fourth portion 34 in fig. 9 is the reduced space occupied by the flexible circuit board 3, which can be used for placing the battery.
Referring to fig. 11, fig. 11 is a schematic diagram of a display module before bending according to a third embodiment of the present application, and the structure of the display module of the third embodiment shown in fig. 11 is substantially the same as that of the display module of the first embodiment shown in fig. 1, and the difference is that: the third portion 33 of the flexible circuit board 3 is not provided with an opening 334, and the third portion 33 of the flexible circuit board 3 covers the integrated circuit chip 2 in the thickness direction of the display panel on the front surface of the display panel, and a portion indicated by a broken line frame in the third portion 33 in fig. 11 is the integrated circuit chip 2.
As shown in fig. 12, the area of the third portion 33, which is close to the side of the terminal area PA and faces the integrated circuit chip 2, has a groove 335 formed concave toward the third portion 33, the groove 335 does not penetrate the third portion 33 in the thickness direction of the third portion 33, the shape and size of the groove 335 are adapted to the shape and size of the integrated circuit chip 2, and the integrated circuit chip 2 is located in the groove 335.
In one embodiment, the gaps are formed between the integrated circuit chip 2 and the walls and bottoms of the grooves 335, so that interference between the flexible circuit board 3 and the integrated circuit chip 2 can be avoided, and direct contact between the third portion 33 of the flexible circuit board 3 and the integrated circuit chip 2 to influence heat dissipation of the integrated circuit chip 2 can be avoided, and signal interference of the flexible circuit board 3 to the integrated circuit chip 2 can be reduced.
The beneficial effects of the embodiment of the application are that: the embodiment of the application provides a display module assembly, this display module assembly includes display panel, integrated circuit chip and flexible circuit board, display panel includes the display area and is located the terminal district of display area one side, be provided with a plurality of first terminals in the terminal district, integrated circuit chip sets up in the terminal district and is located the one side that first terminal is close to the display area, flexible circuit board is connected with first terminal electricity, through extend the flexible circuit board by the one side that integrated circuit chip is close to first portion to one side that integrated circuit chip kept away from first portion, thereby increase the part that flexible circuit board overlaps with display panel's terminal district, reduce the module space that flexible circuit board buckled and occupy behind display panel's the back, thereby can save more spaces and be used for placing the battery, improve display module assembly's continuation of journey.
In summary, although the present application discloses the preferred embodiments, the preferred embodiments are not intended to limit the application, and those skilled in the art can make various modifications and alterations without departing from the spirit and scope of the application, so the scope of the application is defined by the claims.

Claims (10)

1. A display module, comprising:
the display panel comprises a display area and a terminal area positioned at one side of the display area, wherein a plurality of first terminals are arranged in the terminal area;
an integrated circuit chip disposed in the terminal region and located at a side of the first terminal near the display region; and
and the flexible circuit board is electrically connected with the first terminal, and extends from one side of the integrated circuit chip close to the first terminal to one side of the integrated circuit chip far away from the first terminal.
2. The display module of claim 1, wherein the flexible circuit board comprises:
a first portion having a plurality of second terminals electrically connected to the first terminals, the first portion being disposed on a side of the integrated circuit chip adjacent to the first terminals;
the second part is arranged on one side, far away from the integrated circuit chip, of the first part, the second part is connected with the first part, and the number of metal film layers of the second part is larger than that of the first part; and
and the third part is connected with the first part, extends from the first part to one side of the integrated circuit chip far away from the first terminal, and has the same number of metal film layers as the first part.
3. The display module of claim 2, wherein the second portion includes at least one first binding metal layer, at least one first signal transmitting metal layer above the first binding metal layer, and at least one second signal transmitting metal layer below the first binding metal layer;
the first part is provided with second binding metal layers with the same number as the first binding metal layers, each second binding metal layer is arranged on the same layer as a corresponding layer of the first binding metal layers, the third part is provided with third signal transmission metal layers with the same number as the second binding metal layers, and each third signal transmission metal layer is arranged on the same layer as a corresponding layer of the second binding metal layers.
4. The display module of claim 3, wherein the flexible circuit board further comprises a transfer portion having a corner, one end of the transfer portion is connected to the second portion, the other end of the transfer portion is connected to a transfer member for connecting with other devices, and the number of metal film layers of the transfer portion is the same as the number of metal film layers of the third portion.
5. The display module of claim 4, wherein the adapter has at least one fourth signal transmission metal layer, each of the fourth signal transmission metal layers being disposed on the same layer as a corresponding one of the second signal transmission metal layers.
6. The display module of claim 3, wherein the flexible circuit board further comprises:
the fourth part is arranged on one side, far away from the first part, of the second part, the fourth part is connected with the second part, and the number of metal film layers of the fourth part is the same as that of the third part; and
the switching portion has the turning, the one end of switching portion with the fourth portion is connected, the other end of switching portion is connected with the adaptor that is used for external other devices, the metal coating layer quantity of switching portion with the metal coating layer quantity of fourth portion is the same.
7. The display module of claim 6, wherein the fourth portion has at least one fifth signal transmission metal layer, each of the fifth signal transmission metal layers is disposed on the same layer as a corresponding one of the second signal transmission metal layers, the switching portion has the same number of fourth signal transmission metal layers as the fifth signal transmission metal layers, and each of the fourth signal transmission metal layers is disposed on the same layer as a corresponding one of the fifth signal transmission metal layers.
8. The display module of claim 2, wherein the third portion has an opening therein, the opening extending through the third portion in a thickness direction of the third portion, the integrated circuit chip being located within the opening.
9. The display module of claim 8, wherein a gap is provided between the integrated circuit chip and an edge of the opening.
10. The display module of claim 2, wherein an adhesive layer is disposed between the third portion and the terminal area, the adhesive layer being for adhering the third portion to the terminal area.
CN202310803298.9A 2023-06-30 2023-06-30 Display module Pending CN117475896A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310803298.9A CN117475896A (en) 2023-06-30 2023-06-30 Display module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310803298.9A CN117475896A (en) 2023-06-30 2023-06-30 Display module

Publications (1)

Publication Number Publication Date
CN117475896A true CN117475896A (en) 2024-01-30

Family

ID=89635392

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310803298.9A Pending CN117475896A (en) 2023-06-30 2023-06-30 Display module

Country Status (1)

Country Link
CN (1) CN117475896A (en)

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