CN117316065A - Display panel and display device - Google Patents

Display panel and display device Download PDF

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Publication number
CN117316065A
CN117316065A CN202311352772.7A CN202311352772A CN117316065A CN 117316065 A CN117316065 A CN 117316065A CN 202311352772 A CN202311352772 A CN 202311352772A CN 117316065 A CN117316065 A CN 117316065A
Authority
CN
China
Prior art keywords
display
display panel
connection portion
interface
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311352772.7A
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Chinese (zh)
Inventor
黄小霞
黄允晖
李传勇
孙浩
陈伟
姚孟亮
杨恩建
王永乐
吴易谦
曾国栋
曾乙伦
杨虎飞
孙舸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Chongqing BOE Display Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Chongqing BOE Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Chongqing BOE Display Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN202311352772.7A priority Critical patent/CN117316065A/en
Publication of CN117316065A publication Critical patent/CN117316065A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G09F9/335Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes being organic light emitting diodes [OLED]

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The present disclosure provides a display panel and display device, the display panel includes display area and frame area, the display panel still includes: the display driving board and the first circuit board comprise a first connecting part and a second connecting part; one end of the first connecting part is connected with the frame area, and the other end of the first connecting part is connected with the display driving plate; one end of the second connecting part is connected with the first connecting part, and the other end of the second connecting part is provided with a display interface. The display panel provided by the disclosure improves the reliability of the display interface.

Description

Display panel and display device
Technical Field
The disclosure relates to the technical field of display, in particular to a display panel and a display device.
Background
With the rapid development of the display industry, the medium-small size OLED (Organic Light-Emitting Diode) display technology is mature increasingly, and the OLED display technology gradually starts to advance to medium-large size products; in recent years, more and more terminal enterprises are actively seeking to co-develop medium-and large-sized OLED display projects in cooperation with panel factories.
The whole machine of the medium-and-large-size OLED product adopts a EDP (Embedded Display Port) interface, the EDP interface on the display panel at present is easy to cause the problems of module film printing, propping damage and the like in the actual production process, and the EDP interface or the plug is easy to damage when the whole machine of the display device is assembled.
It should be noted that the information disclosed in the above background section is only for enhancing understanding of the background of the present disclosure and thus may include information that does not constitute prior art known to those of ordinary skill in the art.
Disclosure of Invention
An object of an embodiment of the present disclosure is to provide a display panel and a display device, which improve reliability of a display interface of the display panel.
According to an aspect of the embodiments of the present disclosure, there is provided a display panel including a display area and a bezel area, the display panel further including:
a display driving board;
a first circuit board including a first connection portion and a second connection portion; one end of the first connecting part is connected with the frame area, and the other end of the first connecting part is connected with the display driving plate; one end of the second connecting part is connected with the first connecting part, and the other end of the second connecting part is provided with a display interface.
In one exemplary embodiment of the present disclosure, the display panel includes a plurality of the first circuit boards and a plurality of the second circuit boards including only the first connection portion.
In one exemplary embodiment of the present disclosure, the second connection parts of the plurality of first circuit boards are located at the same side of the first connection parts.
In an exemplary embodiment of the present disclosure, at least two of the plurality of first circuit boards are disposed adjacently, or the plurality of first circuit boards are disposed alternately with the plurality of second circuit boards.
In an exemplary embodiment of the disclosure, the first circuit board further includes a third connection portion, one end of the third connection portion is connected to the first connection portion, and the display interface is disposed on the other end of the third connection portion.
In an exemplary embodiment of the present disclosure, the third connection portion and the second connection portion are located at opposite sides of the first connection portion.
In an exemplary embodiment of the present disclosure, the third connection portion and the second connection portion are symmetrically disposed with respect to the first connection portion.
In an exemplary embodiment of the present disclosure, the display interface is a snap-in interface.
In one exemplary embodiment of the present disclosure, the first circuit board is a dual layer circuit board.
According to another aspect of the embodiments of the present disclosure, there is provided a display device including the display panel provided by any one of the embodiments.
The display panel provided by the disclosure has the advantages that the first circuit board comprises the first connecting part and the second connecting part, and the display interface (EDP interface) is arranged on the second connecting part of the first circuit board, so that the problems of module film printing, propping damage and the like caused by frequent plugging of the display interface on the display driving board (P board) are avoided, the problem of interface or plug damage easily caused during complete machine assembly is avoided, the problem of poor plugging is fundamentally solved, the yield is higher, and the reliability of the display panel is improved; in addition, the display structure is omitted from being arranged on the driving plate, the layout space of other parts of the driving plate is increased, wiring on the driving plate can be more reasonable, and power consumption is reduced.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure. It will be apparent to those of ordinary skill in the art that the drawings in the following description are merely examples of the disclosure and that other drawings may be derived from them without undue effort. In the drawings:
FIG. 1 is a schematic diagram of a large-sized display panel according to the related art;
FIG. 2 is a schematic diagram of the drive plate shown in FIG. 1;
FIG. 3 is a schematic diagram of a display panel according to an embodiment of the disclosure;
FIG. 4 is a schematic diagram of a first circuit board provided by an embodiment of the present disclosure;
FIG. 5 is a schematic diagram of a display panel according to another embodiment of the disclosure;
fig. 6 is a schematic diagram of a first circuit board according to another embodiment of the present disclosure;
fig. 7 is a schematic cross-sectional view of a dual-layer circuit board provided in an embodiment of the present disclosure.
Reference numerals illustrate:
10. a display panel;
110. a display area;
120. a border region; 121. binding area;
130. a driving chip;
141. a first circuit board; 1411. a first connection portion; 1412. a second connecting portion; 1413. a third connecting portion; 14140. a substrate; 14151. a first copper foil layer; 14152. a second copper foil layer; 14161. a first copper plating layer; 14162. a second copper plating layer; 14171. a first coverlay adhesive layer; 14172. a second coverlay adhesive layer; 14181. a first coverlay adhesive layer; 14182. a second coverlay adhesive layer; 14191. a first electromagnetic shielding film; 14192. a second electromagnetic shielding film;
142. a second circuit board;
150. a display driving board;
160. and displaying an interface.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments may be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art.
Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the disclosure. One skilled in the relevant art will recognize, however, that the disclosed aspects may be practiced without one or more of the specific details, or with other methods, components, devices, steps, etc. In other instances, well-known methods, devices, implementations, or operations are not shown or described in detail to avoid obscuring aspects of the disclosure. The block diagrams depicted in the figures are merely functional entities and do not necessarily correspond to physically separate entities. That is, the functional entities may be implemented in software, or in one or more hardware modules or integrated circuits, or in different networks and/or processor devices and/or microcontroller devices.
Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of an icon to another component, these terms are used in this specification for convenience only, such as in terms of the orientation of the examples described in the figures. It will be appreciated that if the device of the icon is flipped upside down, the recited "up" component will become the "down" component. When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure through another structure.
The terms "a," "an," "the," and "at least one" are used to indicate the presence of one or more elements/components/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. in addition to the listed elements/components/etc.; the terms "first," "second," and the like are used merely as labels, and are not intended to limit the number of their objects.
At present, the existing medium-large-size flexible OLED products adopt an EDP scheme due to the requirement of a client interface protocol; the display panel 10 'shown in fig. 1 has a configuration of an IC (driving chip) 100' +fpc (flexible circuit board) 200'+p board (display driving board) 300'; as shown in fig. 2, the EDP protocol P board adopts a plugging interface scheme, and a TP interface 310' and a telecommunication/complete machine interface 320' of complete machine connection are reserved on a P board 300', the interfaces are usually plugging interfaces, and the plugging interfaces are frequently plugged due to in-factory telecommunication detection in the actual production process, so that the problems of film printing, indentation, top damage and the like at the corresponding positions are easily caused, the plugging is difficult during the complete machine assembly, the damage to the interfaces or plugs is easily caused, and the whole module is scrapped, so that the reject ratio is high.
In view of the above technical problems, the present disclosure provides a display panel 10, as shown in fig. 3 to 6, the display panel 10 includes a display area 110 and a frame area 120, and the display panel 10 further includes: a display driving board 150 and a first circuit board 141, the first circuit board 141 including a first connection portion 1411 and a second connection portion 1412; one end of the first connection portion 1411 is connected to the frame area 120, and the other end of the first connection portion 1411 is connected to the display driving board 150; one end of the second connection portion 1412 is connected to the first connection portion 1411, and the other end of the second connection portion 1412 is connected to the display interface 160, where the display interface 160 includes a TP interface and a telecommunication/complete machine interface.
According to the display panel provided by the disclosure, the first circuit board 141 comprises the first connecting part 1411 and the second connecting part 1412, and the display interface (EDP interface) 160 is arranged on the second connecting part 1412 of the first circuit board 141, so that the problems of module film printing, propping damage and the like caused by frequent plugging of the display interface 160 on the display driving board (P board) 150 are avoided, the problem of interface or plug damage easily caused during complete machine assembly is avoided, the problem of poor plugging is fundamentally solved, the yield is higher, and the reliability of the display panel is improved; in addition, the display structure is omitted from being arranged on the driving plate, the layout space of other parts of the driving plate is increased, wiring on the driving plate can be more reasonable, and power consumption is reduced.
In one embodiment, as shown in fig. 3 and 5, the display panel 10 includes a display area 110 and a frame area 120, wherein a bending area and a binding area 121 are formed on the frame area 120 on one side of the display area 110, and the binding area 121 is folded back to the backlight side of the display panel 10 through the bending area; an IC (driving chip 130) is disposed on the bonding area 121, one end of an FPC (flexible circuit board) is bonded to the bonding area 121 through a predetermined pin, and the opposite end of the FPC (flexible circuit board) is connected to a P-board (display driving board 150). The FPC includes a first connection portion 1411 and a second connection portion 1412, one end of the first connection portion 1411 is connected with the bonding area 121, and the other end of the first connection portion 1411 is connected with the P-plate; one end of the second connecting portion 1412 is connected with the first connecting portion 1411, and the other end of the second connecting portion 1412 is connected with a display interface 160, namely, the FPC is an opposite FPC, so that an EDP interface on a P plate is arranged on the FPC, and the problems that the EDP interface on the P plate is easy to cause module film printing and propping damage in the actual production process and is easy to cause interface or plug damage in the whole machine assembly process are avoided.
In one embodiment, the display panel 10 includes a plurality of first circuit boards 141 and a plurality of second circuit boards 142, and the plurality of second circuit boards 142 include only the first connection portions 1411.
As shown in fig. 3, the display panel 10 includes two first circuit boards 141 and two second circuit boards 142, and when the display panel 10 is a medium-large size OLED display panel 10, the display panel 10 includes a plurality of display areas, and each display area is correspondingly provided with one driving chip 130 to drive the pixel units of the corresponding area. In this example, only one side of the real panel is provided with four driving chips 130 and corresponding four flexible circuit boards; of course, two, three, five or more driving chips 130 and corresponding flexible circuit boards may be provided as needed; the driving chip 130 and the corresponding flexible circuit board may also be disposed on other sides of the display panel 10 to drive the pixel units in different areas, which is not limited in the disclosure.
Wherein, two first circuit boards 141 may be disposed adjacent to each other, and two second circuit boards 142 may be disposed adjacent to each other; or alternatively, two first circuit boards 141 and two second circuit boards 142 are disposed. When more first circuit boards 141 and second circuit boards 142 are provided, the plurality of first circuit boards 141 may be disposed adjacent to each other, and the plurality of second circuit boards 142 may be disposed adjacent to each other; or alternatively disposing the plurality of first circuit boards 141 and the plurality of second circuit boards 142; or alternatively, a part of the first circuit board 141 and the second circuit board 142 are disposed, a part of the first circuit board 141 is disposed adjacent, and a part of the second circuit board 142 is disposed adjacent, which is not limited in this disclosure.
In one embodiment, the second connection portions 1412 of the plurality of first circuit boards 141 are located at the same side of the first connection portion 1411. As shown in fig. 3 and 4, each first circuit board 141 is provided with a second connection portion 1412, and the second connection portions 1412 are located on the same side of the first connection portion 1411 of each first circuit board 141. By enabling the second connection portions 1412 on the first circuit boards 141 to be located on the same side of the first connection portions 1411 of the first circuit boards 141, the shapes and the sizes of the first circuit boards 141 with different polarities can be consistent, the production and the manufacture of a plurality of first circuit boards 141 are facilitated, the production cost is reduced, and the production efficiency is improved.
Of course, the second connection portions 1412 of the plurality of first circuit boards 141 may be located at different sides of the first connection portion 1411; when the number of the first circuit boards 141 is three or more, the second connection portions 1412 of some of the first circuit boards 141 of the plurality of first circuit boards 141 may be located on the same side of the first connection portion 1411, and the second connection portions 1412 of at least one first circuit board 141 may be located on different sides of the first connection portion 1411 with respect to the other first circuit boards 141, which is not limited in the present disclosure.
As shown in fig. 4, the second connection portion 1412 is located at a lateral side of the first connection portion 1411 in the width direction, i.e., perpendicular to the direction connecting the P plate and the bonding area 121; the second connection portion 1412 directs the EDP interface to a position on the back side of the display panel 10 corresponding to the display area 110, i.e., a middle area on the back side of the display panel 10, by bending arrangement; when the external plug is plugged with the EPD interface, the DEP interface end of the first circuit board 141 can be fixed through external force, so that the plug is plugged with the EDP interface, the problem that the whole module is scrapped due to the fact that the film printing and indentation are easily formed in the corresponding position of the display panel 10 and the plugging socket are damaged due to frequent plugging in the factory is avoided, meanwhile, the problem that the interface or the plug is damaged during the whole machine assembly is avoided, the problem of poor plugging is fundamentally solved, the yield is high, and the reliability of the display panel 10 is improved.
In one embodiment, as shown in fig. 5 and 6, the first circuit board 141 further includes a third connection portion 1413, one end of the third connection portion 1413 is connected to the first connection portion 1411, and the other end of the third connection portion 1413 is also provided with the display interface 160. When two display interfaces 160 need to be provided on the display panel 10, the two display interfaces 160 may be provided on one circuit board, and the plurality of display interfaces 160 may be used as different functional interfaces, respectively; when the display panel 10 includes a plurality of display panels 10, only one circuit board is required to be specially designed; the problem of poor plugging is fundamentally solved, and the production cost is reduced under the condition of achieving the aim of higher yield.
As shown in fig. 6, the third connection portion 1413 and the second connection portion 1412 are located at opposite sides of the first connection portion 1411. By disposing the third connecting portion 1413 and the second connecting portion 1412 on opposite sides of the first connecting portion 1411, a sufficient distance is provided between the second connecting portion 1412 and the third connecting portion 1413, so that a sufficient distance is provided between the display interface 160 on the second connecting portion 1412 and the display interface 160 on the third connecting portion 1413, so that the display interface 160 on the second connecting portion 1412 and the display interface 160 on the third connecting portion 1413 are convenient to be connected with external plugs respectively.
The third connecting portion 1413 and the second connecting portion 1412 are symmetrically disposed with respect to the first connecting portion 1411, that is, the shapes and sizes of the third connecting portion 1413 and the second connecting portion 1412 are symmetrical with respect to the first connecting portion 1411. By symmetrically arranging the third connecting portion 1413 and the second connecting portion 1412 with respect to the first connecting portion 1411, the third connecting portion 1413 and the second connecting portion 1412 can be symmetrically identical in the special-shaped design, thereby reducing the design difficulty.
In one embodiment, the display interface 160 is a snap-in interface. The display interface 160 is set to be a buckle type plug connector through the buckle type plug connector (connector), so that the display interface 160 is convenient to plug with an external plug and relatively fixed with the external plug is realized, the connection stability and convenience are improved, and the display interface 160 or the external plug is prevented from being damaged when the whole machine is assembled.
Of course, the display interface 160 may also be a tension type interface, a screw type interface, or the like, and may be configured to achieve plugging and facing, which is not limited in this disclosure.
In one embodiment, the first circuit board 141 is a double-layer circuit board. By providing a double-layer circuit board, the first circuit board 141 connects the bonding area 121 and the circuit of the display driving board 150 to be provided on a single layer, and the circuit of the outgoing display interface 160 is provided on another single layer, so that the circuit of the outgoing display interface 160 and the circuit of the connection bonding area 121 and the display driving board 150 are separately provided.
In another embodiment, the first circuit board 141 can connect the bonding area 121 and the circuit of the display driving board 150 on two layers at the same time, so as to facilitate the connection between the bonding area 121 and the circuit of the display driving board 150.
Specifically, as shown in fig. 7, the double-layer circuit board includes a Base (Base PI) 14140 located in an intermediate layer, a first copper foil layer (Base CU) 14151, a second copper foil layer (Base CU) 14152, a first copper Plating layer (Plating CU) 14161, a second copper Plating layer (Plating CU) 14162, a first coverlay adhesive layer (CVL ADH) 14171, a second coverlay adhesive layer (CVL ADH) 14172, a first coverlay adhesive layer (CVL PI) 14181, a second coverlay adhesive layer (CVL PI) 14182, a first electromagnetic shielding film (EMI) 14191, and a second electromagnetic shielding film (EMI) 14192 provided on both sides of the Base.
Wherein the thickness of the substrate (Base PI) 14140 may be 20mm to 30mm, for example 25mm; the thickness of the first copper foil layer (Base CU) 14151 and the second copper foil layer (Base CU) 14152 may be 10mm to 15mm, for example 12mm; the thickness of the first copper Plating layer (Plating CU) 14161 and the second copper Plating layer (Plating CU) 14162 may be 5mm to 10mm, for example 8mm; the thickness of the first cover film adhesive layer (CVL ADH) 14171 and the second cover film adhesive layer (CVL ADH) 14172 may be 15mm to 20mm, for example 15mm; the thickness of the first cover film adhesive layer (CVL PI) 14181 and the second cover film adhesive layer (CVL PI) 14182 may be 10mm to 15mm, for example 12.5mm; the thickness of the first electromagnetic shielding film (EMI) 14191 and the second electromagnetic shielding film (EMI) 14192 may be 8mm to 12mm, for example, 10mm.
Of course, the first circuit board 141 may be a single-layer circuit board or a multi-layer circuit board with more than three layers, and the second circuit board 142 may be a single-layer circuit board or a multi-layer circuit board with more than two layers, which is not limited in the present disclosure.
In one embodiment, the second connection portion 1412 leads out the line of the display interface 160, which may be led out from the display driving board 150, that is, after the line of the display interface 160 on the display driving board 150 is bound to the first circuit board 141, the line is led out to the display interface 160 through the second connection portion 1412 of the first circuit board 141.
In another embodiment, the second connection portion 1412 leads out the line of the display interface 160, which may be led out from the binding area 121, that is, after binding with the binding area 121 through the first circuit board 141, the line of the display interface 160 is led out to the display interface 160 directly through the second connection portion 1412 of the first circuit board 141.
The embodiment of the application also provides a display device, which comprises the display panel. According to the display device provided by the disclosure, the first circuit board in the display panel comprises the first connecting part and the second connecting part, and the display interface is arranged on the second connecting part of the first circuit board, so that the problems of module film printing, propping damage and the like caused by frequent plugging of the display interface on the display driving board are avoided, the problem of interface or plug damage easily caused during the whole machine assembly is avoided, the problem of poor plugging is fundamentally solved, the yield is higher, and the reliability of the display device is improved; in addition, the display structure is canceled from being arranged on the driving plate, the layout space of other parts of the driving plate is increased, wiring on the driving plate can be more reasonable, power consumption is reduced, and the market competitiveness of the display device is improved. The display device has more beneficial effects, please refer to the related discussion in the embodiments of the display panel, and the description thereof is omitted herein.
Specifically, the display device may be, for example, a vehicle-mounted display device, a medium-and-large-sized advertisement screen, a display, a device having a display interface or an operation interface, etc., which are not specifically mentioned herein, and a display device having a display panel of the above embodiment is all within the scope of the present disclosure.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any adaptations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
It is to be understood that the present disclosure is not limited to the precise arrangements and instrumentalities shown in the drawings, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (10)

1. A display panel, the display panel comprising a display area and a bezel area, the display panel further comprising:
a display driving board;
a first circuit board including a first connection portion and a second connection portion; one end of the first connecting part is connected with the frame area, and the other end of the first connecting part is connected with the display driving plate; one end of the second connecting part is connected with the first connecting part, and the other end of the second connecting part is provided with a display interface.
2. The display panel of claim 1, wherein the display panel comprises a plurality of the first circuit boards and a plurality of second circuit boards, the plurality of second circuit boards comprising only the first connection portions.
3. The display panel of claim 2, wherein the second connection portions of the plurality of first circuit boards are located on the same side of the first connection portion.
4. The display panel of claim 2, wherein at least two of the plurality of first circuit boards are disposed adjacently or the plurality of first circuit boards are disposed alternately with the plurality of second circuit boards.
5. The display panel according to claim 1, wherein the first circuit board further comprises a third connection portion, one end of the third connection portion is connected to the first connection portion, and the other end of the third connection portion is provided with the display interface.
6. The display panel according to claim 5, wherein the third connection portion and the second connection portion are located at opposite sides of the first connection portion.
7. The display panel according to claim 6, wherein the third connection portion and the second connection portion are symmetrically disposed with respect to the first connection portion.
8. The display panel of claim 1, wherein the display interface is a snap-in interface.
9. The display panel of claim 1, wherein the first circuit board is a double-layer circuit board.
10. A display device comprising the display panel according to any one of claims 1 to 9.
CN202311352772.7A 2023-10-18 2023-10-18 Display panel and display device Pending CN117316065A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311352772.7A CN117316065A (en) 2023-10-18 2023-10-18 Display panel and display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311352772.7A CN117316065A (en) 2023-10-18 2023-10-18 Display panel and display device

Publications (1)

Publication Number Publication Date
CN117316065A true CN117316065A (en) 2023-12-29

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
CN (1) CN117316065A (en)

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