CN220629950U - Display panel and display device - Google Patents

Abstract

The utility model discloses a display panel and a display device. The display panel includes: the device comprises a substrate, a flexible connecting piece, a shielding layer and a supporting layer; the flexible connecting piece is bonded and connected to the display side of the substrate, and is bent from the display side of the substrate to the non-display side, the part of the flexible connecting piece, which is positioned on the non-display side, is provided with a first preset area, the first preset area faces the non-display side, and the first preset area is used for fixing the driving chip; the shielding layer is positioned on the non-display side of the substrate, is opposite to the first preset area and is arranged at intervals, and the shielding layer is used for blocking signals of the driving chip; the supporting layer is adhered between the non-display side of the substrate and the flexible connecting piece and used for supporting the flexible connecting piece and the driving chip, the supporting layer is arranged around the first preset area and the shielding layer, and the surface, close to the substrate, of the supporting layer is separated from the shielding layer. According to the technical scheme, the adhesion between the flexible circuit board and the display panel is increased, so that the yield of the display panel production process is improved.

Description

Display panel and display device

Technical Field

The embodiment of the utility model relates to the technical field of display, in particular to a display panel and a display device.

Background

With the continuous development of display technology, performance requirements of display panels are increasing. The conventional packaging technology of the display panel includes various packaging technologies, wherein a Chip On Film (COF) packaging technology is to fix a display driving Chip On a flexible circuit board, bond and connect the flexible circuit board and the display panel, and bend the flexible circuit board to enable the display driving Chip to be located On a non-display side of the display panel so as to improve a screen occupation ratio. However, the conventional COF packaging technology has a problem of insufficient adhesion between the flexible circuit board and the display panel, which affects the yield of the display panel production process.

Disclosure of Invention

The embodiment of the utility model provides a display panel and a display device, which are used for increasing the adhesion between a flexible circuit board and the display panel, so that the yield of the production process of the display panel is improved.

In a first aspect, an embodiment of the present utility model provides a display panel, including:

a substrate having a display side and a non-display side;

the flexible connecting piece is bonded and connected to the display side of the substrate, and is bent from the display side of the substrate to the non-display side, a part of the flexible connecting piece, which is positioned on the non-display side, is provided with a first preset area, the first preset area faces the non-display side, and the first preset area is used for fixing the driving chip;

the shielding layer is positioned on the non-display side of the substrate, is opposite to the first preset area and is arranged at intervals, and is used for blocking signals of the driving chip;

and the supporting layer is adhered between the non-display side of the substrate and the flexible connecting piece and is used for supporting the flexible connecting piece and the driving chip, the supporting layer surrounds the first preset area and the shielding layer, and the surface of the supporting layer, which is close to the substrate, is separated from the shielding layer.

Optionally, the thickness of the supporting layer is greater than or equal to the sum of the thicknesses of the driving chip and the shielding layer.

Optionally, one end of the flexible connecting piece located on the non-display side is provided with a second preset area, the second preset area faces the non-display side, the second preset area is located on one side, away from the bending area of the flexible connecting piece, of the first preset area and the supporting layer, the second preset area is used for being connected with a circuit board, and the circuit board is arranged between the non-display side of the substrate and the second preset area of the flexible connecting piece.

Optionally, the thickness of the support layer is equal to the thickness of the circuit board.

Optionally, the thickness of the support layer is less than the thickness of the circuit board.

Optionally, the supporting layer includes a first adhesive layer, a supporting portion and a second adhesive layer that are sequentially disposed on the non-display side of the substrate, the first adhesive layer is adhered between the substrate and the supporting portion, and the second adhesive layer is adhered between the supporting portion and the flexible connecting member.

Optionally, the support portion and the second adhesive layer are both disposed around the first preset area, the first adhesive layer is disposed around the shielding layer, and the first adhesive layer is separated from the shielding layer.

Optionally, the total thickness of the first adhesive layer, the support portion, and the second adhesive layer is less than the thickness of the circuit board;

at least part of the side wall of the first adhesive layer, which is close to the circuit board, is retracted relative to the side wall of the supporting part, which is close to the circuit board, along the direction that the first adhesive layer is far away from the circuit board.

In a second aspect, an embodiment of the present utility model provides a display device, including the display panel in the first aspect.

Optionally, the display device further includes a driving chip, and the driving chip is fixed to the first preset area of the flexible connection member.

According to the display panel and the display device provided by the embodiment of the utility model, the flexible connecting piece is bent from the display side to the non-display side of the substrate, and the driving chip is fixed in the first preset area of the flexible connecting piece positioned on the non-display side, so that the driving chip is positioned between the non-display side of the substrate and the flexible connecting piece, the frame area of the display panel is reduced, and the narrow frame design is facilitated. Through set up with the first shielding layer of predetermineeing regional opposition and mutual interval in the non-display side of base plate, can utilize the shielding layer to carry out the separation to the signal of driver chip to avoid the signal that driver chip transmitted to influence each other with the signal that transmits in the base plate. Through bonding the supporting layer between the non-display side of base plate and the flexible connection piece, can utilize the supporting layer to support flexible connection piece and drive chip, simultaneously, the supporting layer sets up with the shielding layer around first regional and the shielding layer of predetermineeing, and the supporting layer is close to the surface of base plate and separates with the shielding layer to avoid the supporting layer to attach on the shielding layer and make the shielding layer raise the supporting layer, thereby lead to the viscidity between supporting layer and the base plate not enough, be favorable to increasing the adhesion between flexible circuit board and the display panel, in order to promote the yield of display panel production technology.

It should be understood that the description in this section is not intended to identify key or critical features of the embodiments of the utility model or to delineate the scope of the utility model. Other features of the present utility model will become apparent from the description that follows.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural view of a display panel in the related art;

fig. 2 is a top view of a display panel according to an embodiment of the present utility model;

FIG. 3 is a top view of another display panel according to an embodiment of the present utility model;

FIG. 4 is a cross-sectional view of the display panel shown in FIG. 3 taken along line LL';

FIG. 5 is another cross-sectional view of the display panel shown in FIG. 3 taken along line LL';

FIG. 6 is another cross-sectional view of the display panel shown in FIG. 3 taken along line LL';

FIG. 7 is another cross-sectional view of the display panel shown in FIG. 3 taken along line LL';

fig. 8 is another cross-sectional view of the display panel shown in fig. 3 taken along the line LL'.

Detailed Description

In order that those skilled in the art will better understand the present utility model, a technical solution in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.

It should be noted that the terms "first," "second," and the like in the description and the claims of the present utility model and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the utility model described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

As described in the background art, the conventional COF packaging technology has the problem of insufficient adhesion between the flexible circuit board and the display panel, and the inventor has found that the reason for the problem is as follows: fig. 1 is a schematic structural view of a display panel in the related art. Referring to fig. 1, the display panel includes a substrate 101, a flexible wiring board 102, pads 103, and a shielding film 104. The flexible circuit board 102 is fixed with a display driving chip 105, one side of the flexible circuit board 102 is bonded with the substrate 101, and the other side is electrically connected with the printed circuit board 106. The display driving chip 105 may be located between the substrate 101 and the flexible circuit board 102, and in order to protect the display driving chip 105, a spacer 103 needs to be attached between the substrate 101 and the flexible circuit board 102 to support the display driving chip 105. However, the spacer 103 is generally directly attached to the shielding film 104, and the thickness of the shielding film 104 itself lifts the spacer 103, which results in insufficient adhesion between the spacer 103 and the substrate 101, thereby resulting in insufficient adhesion between the flexible circuit board 102 and the substrate 101. In addition, from the position where the flexible circuit board 10 is electrically connected with the printed circuit board 106 to the position where the flexible circuit board 10 is attached to the pad 103, there is a turning area on the flexible circuit board 10, and the arrangement of the pad 103 makes the flexible circuit board 10 easily broken or dead-folded in the turning area, thereby causing poor display.

In view of the above, the embodiment of the utility model provides a display panel. Fig. 2 is a top view of a display panel according to an embodiment of the present utility model; fig. 3 is a top view of another display panel according to an embodiment of the utility model. Fig. 2 shows a structure before bending the flexible connector 20 in the display panel, and fig. 3 shows a structure after bending the flexible connector 20. Fig. 4 is a cross-sectional view of the display panel shown in fig. 3 taken along a line LL'. Referring to fig. 2 to 4, the display panel includes: a substrate 10, a flexible connection 20, a shielding layer 40 and a support layer 50.

Wherein the substrate 10 has a display side and a non-display side. The flexible connecting piece 20 is bonded and connected to the display side of the substrate 10, and is bent from the display side to the non-display side of the substrate 10, and a portion of the flexible connecting piece 20 located on the non-display side is provided with a first preset area 21, the first preset area 21 faces the non-display side, and the first preset area 21 is used for fixing the driving chip 30. The shielding layer 40 is located on the non-display side of the substrate 10, the shielding layer 40 is opposite to the first preset area 21 and is disposed at a distance, and the shielding layer 40 is used for blocking signals of the driving chip 30. The supporting layer 50 is adhered between the non-display side of the substrate 10 and the flexible connection member 20 for supporting the flexible connection member 20 and the driving chip 30, the supporting layer 50 is disposed around the first preset area 21 and the shielding layer 40, and the surface of the supporting layer 50 near the substrate 10 is separated from the shielding layer 40.

Specifically, the substrate 10 may include a substrate, and a buffer layer, an array circuit layer, a light emitting function layer, and the like stacked over the substrate. The array circuit layer is provided with a plurality of pixel circuits, and a plurality of Light Emitting devices, such as Organic Light-Emitting diodes (OLEDs), may be formed in the Light Emitting function layer. Fig. 2 and 3 each show a display side of substrate 10, the display side of substrate 10 having a display region 11 and a bonding region 12, the non-display side of substrate 10 facing away from the display side. Referring to fig. 2, the flexible connection member 20 includes a flexible circuit board, one end of the flexible connection member 20 is bonded and connected to the bonding region 12 of the substrate 10, the driving chip 30 may be fixedly connected to the first preset region 21 of the flexible connection member 20 by adopting a chip on film COF technology, and by bending the flexible connection member 20 from the display side to the non-display side of the substrate 10 in conjunction with fig. 3 and fig. 4, the driving chip 30 is located between the non-display side of the substrate 10 and the flexible connection member 20.

The shielding layer 40 can shield the signal of the driving chip 30, referring to fig. 4, the front projection of the driving chip 30 on the substrate 10 and the front projection of the shielding layer 40 on the substrate 10 may overlap, or the front projection of the driving chip 30 on the substrate 10 is located in the front projection of the shielding layer 40 on the substrate 10, so as to avoid the mutual influence between the signal transmitted by the driving chip 30 and the signal transmitted in the substrate 10.

The supporting layer 50 is disposed around the first preset area 21 and the shielding layer 40, so that the driving chip 30 and the shielding layer 40 can be located in an area surrounded by the supporting layer 50, so that the flexible connecting piece 20 and the driving chip 30 are supported by the supporting layer 50, and meanwhile, the driving chip 30 and the shielding layer 40 are protected. The shape of the supporting layer 50 may include various shapes, but in this embodiment, the shape of the outer periphery of the supporting layer 50 may be a cuboid, and the center of the supporting layer 50 has an opening penetrating through itself along the direction perpendicular to the substrate 10, and the driving chip 30 and the shielding layer 40 are disposed in the opening, and in another embodiment, the supporting layer 50 may be annular, so that the supporting layer 50 surrounds the driving chip 30 and the shielding layer 40.

The surface of the supporting layer 50 near the substrate 10 is separated from the shielding layer 40, for example, the supporting layer 50 and the shielding layer 40 may be disposed away from each other, so that the surface of the supporting layer 50, which is adhered to the non-display side of the substrate 10, is separated from the shielding layer 40, and the supporting layer 50 is prevented from being adhered to the shielding layer 40, so that the supporting layer 50 is lifted by the shielding layer 40, and insufficient adhesion between the supporting layer 50 and the substrate 10 is caused.

In summary, according to the technical scheme of the embodiment, the flexible connecting piece is bent from the display side to the non-display side of the substrate, and the driving chip is fixed in the first preset area of the flexible connecting piece located at the non-display side, so that the driving chip is located between the non-display side of the substrate and the flexible connecting piece, the frame area of the display panel is reduced, and the narrow frame design is facilitated. Through set up with the first shielding layer of predetermineeing regional opposition and mutual interval in the non-display side of base plate, can utilize the shielding layer to carry out the separation to the signal of driver chip to avoid the signal that driver chip transmitted to influence each other with the signal that transmits in the base plate. Through bonding the supporting layer between the non-display side of base plate and the flexible connection piece, can utilize the supporting layer to support flexible connection piece and drive chip, simultaneously, the supporting layer sets up with the shielding layer around first regional and the shielding layer of predetermineeing, and the supporting layer is close to the surface of base plate and separates with the shielding layer to avoid the supporting layer to attach on the shielding layer and make the shielding layer raise the supporting layer, thereby lead to the viscidity between supporting layer and the base plate not enough, be favorable to increasing the adhesion between flexible circuit board and the display panel, in order to promote the yield of display panel production technology.

Referring to fig. 4, the thickness of the supporting layer 50 is optionally greater than or equal to the sum of the thicknesses of the driving chip 30 and the shielding layer 40, based on the above embodiment. The thickness of the driving chip 30, the shielding layer 40 and the supporting layer 50 refers to the dimension of the three along the direction perpendicular to the substrate 10. By setting the thickness of the support layer 50 to be greater than or equal to the sum of the thicknesses of the driving chip 30 and the shielding layer 40, the support layer 50 is enabled to support the flexible connection member 20 and the driving chip 30.

Fig. 5 is another cross-sectional view of the display panel shown in fig. 3 taken along the line LL'. Referring to fig. 2, 3 and 5, optionally, an end of the flexible connection unit 20 located on the non-display side has a second preset area 22, the second preset area 22 faces the non-display side, the second preset area 22 is located on a side of the first preset area 21 and the supporting layer 50 away from the bending area of the flexible connection unit 20, the second preset area 22 is used for connecting the circuit board 60, and the circuit board 60 is disposed between the non-display side of the substrate 10 and the second preset area 22 of the flexible connection unit 20.

In particular, the circuit board 60 may be a printed circuit board or a flexible circuit board. One end of the flexible connecting piece 20 located on the display side is connected with the base plate 10 in a bonding mode, one end of the flexible connecting piece 20 located on the non-display side is connected with the circuit board 60, and the driving chip 30 is fixed on the flexible connecting piece 20, so that signal transmission between the driving chip 30 and the base plate 10 and signal transmission between the circuit board 60 and the driving chip 30 are achieved through the flexible connecting piece 20.

Referring to fig. 2, 3 and 5, alternatively, in one embodiment, the thickness of the support layer 50 is equal to the thickness of the circuit board 60. The thickness of the support layer 50 and the thickness of the circuit board 60 refer to both dimensions in a direction perpendicular to the substrate 10. By setting the thickness of the supporting layer 50 equal to the thickness of the circuit board 60, the distance between the second preset area 22 of the flexible connecting piece 20 and the substrate 10 is equal to the distance between the area of the flexible connecting piece 20, where the supporting layer 50 is bonded, and the substrate 10, so that the flexible connecting piece 20 can be smoothly transited from the circuit board 60 to the supporting layer 50, and the flexible connecting piece 20 is prevented from being broken at the position of transiting from the circuit board 60 to the supporting layer 50, thereby preventing poor display.

Fig. 6 is another sectional view of the display panel shown in fig. 3, taken along the line LL'. Referring to fig. 6, alternatively, in another embodiment, the thickness of the support layer 50 may also be provided to be smaller than the thickness of the circuit board 60. By setting the thickness of the supporting layer 50 to be smaller than the thickness of the circuit board 60, the distance between the second preset area of the flexible connection unit 20 and the substrate 10 is greater than the distance between the area of the flexible connection unit 20 to which the supporting layer 50 is bonded and the substrate 10.

Fig. 7 is another sectional view of the display panel shown in fig. 3, taken along the line LL'. Referring to fig. 7, on the basis of the above embodiments, a support layer may be provided including a first adhesive layer 510, a support portion 520, and a second adhesive layer 530 sequentially provided on the non-display side of the substrate 10, the first adhesive layer 510 being adhered between the substrate 10 and the support portion 520, the second adhesive layer 530 being adhered between the support portion 520 and the flexible connection unit 20.

Specifically, the supporting portion 520 is used for supporting the driving chip 30 and the flexible connecting member 20, the first adhesive layer 510 and the second adhesive layer 530 may be adhesive layers, such as double sided adhesive, one side surface of the first adhesive layer 510 is adhered to the non-display side of the substrate 10, the other side surface of the first adhesive layer 510 is adhered to the surface of the supporting portion 520 near the substrate 10, one side surface of the second adhesive layer 530 is adhered to the surface of the supporting portion 520 near the flexible connecting member 20, and the other side surface of the second adhesive layer 530 is adhered to the flexible connecting member 20, so that the supporting portion 520 is adhered between the non-display side of the substrate 10 and the flexible connecting member 20.

Referring to fig. 7, alternatively, the supporting portion 520 and the second adhesive layer 530 are disposed around the first preset area, that is, around the driving chip 30, so as to protect the driving chip 30 through the supporting portion 520 and play a supporting role, the first adhesive layer 510 is disposed around the shielding layer 40, and the first adhesive layer 510 is separated from the shielding layer 40, that is, the first adhesive layer 510 and the shielding layer 40 are mutually disposed away from each other, so that the first adhesive layer 510 can be completely attached to the surface of the substrate 10, and the first adhesive layer 510 is prevented from being attached to the shielding layer 40, so that the shielding layer 40 lifts the first adhesive layer 510, thereby resulting in insufficient adhesion between the first adhesive layer 510 and the substrate 10, and being beneficial to improving the adhesion between the supporting portion 520 and the substrate 10.

With continued reference to fig. 7, optionally, in the case where the thickness of the supporting layer is smaller than the thickness of the circuit board 60, the total thickness of the first adhesive layer 510, the supporting portion 520, and the second adhesive layer 530 is smaller than the thickness of the circuit board 60, so that the area of the flexible connector 20 connected to the circuit board 60 slopes to the area connected to the first adhesive layer 510, and thus, a direction along which the first adhesive layer 510 is away from the circuit board 60 may be set, at least a portion of the side wall of the first adhesive layer 510 adjacent to the circuit board 60 is retracted relative to the side wall of the supporting portion 520 adjacent to the circuit board 60, for example, a distance between the side wall of the first adhesive layer 510 adjacent to the circuit board 60 and the circuit board 60 may be set to be greater than a distance between the side wall of the supporting portion 520 adjacent to the circuit board 60 and the circuit board 60, and compared with a solution (such as the solution shown in fig. 1) in which the distance between the first adhesive layer 510 and the circuit board 60 is equal to the distance between the supporting portion 520 and the circuit board 60, the technical solution of the embodiment is capable of smoothly transitioning the flexible connector 20 from the circuit board 60 to the first adhesive layer 510, so as to slow down the transition of the flexible connector 20 from the side wall of the first adhesive layer 20 to the first adhesive layer 60 to the area 510, and avoid the occurrence of poor connection from the failure.

Fig. 8 is another cross-sectional view of the display panel shown in fig. 3 taken along the line LL'. Referring to fig. 8, in another embodiment, the total thickness of the first adhesive layer 510, the supporting portion 520 and the second adhesive layer 530 may be equal to the thickness of the circuit board 60, so that the flexible connector 20 may be smoothly transferred from the circuit board 60 to the first adhesive layer 510, and thus, the flexible connector 20 may be prevented from being broken at the position where the flexible connector is transferred from the circuit board 60 to the first adhesive layer 510, thereby avoiding the problem of poor display. In this embodiment, a distance between the first adhesive layer 510 and the circuit board 60 may be set to be equal to a distance between the support 520 and the circuit board 60.

The shapes of the first adhesive layer 510, the supporting portion 520, and the second adhesive layer 530 may be adjusted according to the thickness of the circuit board 60, the structures and positions of the flexible connector 20, the driving chip 30, the shielding layer 40, and the circuit board 60, etc., based on the above embodiments, and the shapes of the first adhesive layer 510 and the second adhesive layer 530 may be determined by the shape of the supporting portion 520, which is not particularly limited in this embodiment. In an alternative embodiment, the outer periphery of the supporting part 520 may be rectangular parallelepiped in shape, and the center of the supporting part 520 has an opening penetrating through itself in a direction perpendicular to the substrate 10, the driving chip 30 is disposed in the opening, and in another alternative embodiment, the supporting part 520 may be ring-shaped so that the supporting part 520 surrounds the driving chip 30.

The embodiment of the utility model also provides a display device, which comprises the display panel in any embodiment, so that the display device has the corresponding functional structure and beneficial effects of the display panel, and the description is omitted herein. The display device may be a mobile phone or any electronic product with a display function, including but not limited to the following categories: television, notebook computer, desktop display, tablet computer, digital camera, smart bracelet, smart glasses, vehicle-mounted display, medical equipment, industrial control equipment, touch interactive terminal, etc., which are not particularly limited in this embodiment of the utility model.

With reference to fig. 2 to 4, the display device may further include a driving chip 30, where the driving chip 30 is fixed to the first preset area 21 of the flexible connector 20.

Referring to fig. 2, 3 and 5, optionally, the display device further includes a circuit board 60, and the circuit board 60 is connected to the second preset area 22 of the flexible connector 20 and disposed between the non-display side of the substrate 10 and the second preset area 22 of the flexible connector 20.

It should be appreciated that various forms of the flows shown above may be used to reorder, add, or delete steps. For example, the steps described in the present utility model may be performed in parallel, sequentially, or in a different order, so long as the desired results of the technical solution of the present utility model are achieved, and the present utility model is not limited herein.

The above embodiments do not limit the scope of the present utility model. It will be apparent to those skilled in the art that various modifications, combinations, sub-combinations and alternatives are possible, depending on design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included in the scope of the present utility model.

Claims (10)

1. A display panel, comprising:

a substrate having a display side and a non-display side;

the flexible connecting piece is bonded and connected to the display side of the substrate, and is bent from the display side of the substrate to the non-display side, a part of the flexible connecting piece, which is positioned on the non-display side, is provided with a first preset area, the first preset area faces the non-display side, and the first preset area is used for fixing the driving chip;

the shielding layer is positioned on the non-display side of the substrate, is opposite to the first preset area and is arranged at intervals, and is used for blocking signals of the driving chip;

and the supporting layer is adhered between the non-display side of the substrate and the flexible connecting piece and is used for supporting the flexible connecting piece and the driving chip, the supporting layer surrounds the first preset area and the shielding layer, and the surface of the supporting layer, which is close to the substrate, is separated from the shielding layer.

2. The display panel of claim 1, wherein a thickness of the support layer is greater than or equal to a sum of thicknesses of the driving chip and the shielding layer.

3. The display panel according to claim 1, wherein one end of the flexible connection member located on the non-display side has a second preset area, the second preset area faces the non-display side, the second preset area is located on one side of the first preset area and the support layer away from the bending area of the flexible connection member, the second preset area is used for connecting a circuit board, and the circuit board is disposed between the non-display side of the substrate and the second preset area of the flexible connection member.

4. A display panel according to claim 3, wherein the thickness of the supporting layer is equal to the thickness of the circuit board.

5. A display panel according to claim 3, wherein the thickness of the support layer is less than the thickness of the circuit board.

6. The display panel according to claim 4 or 5, wherein the support layer includes a first adhesive layer, a support portion, and a second adhesive layer sequentially disposed on a non-display side of the substrate, the first adhesive layer being adhered between the substrate and the support portion, the second adhesive layer being adhered between the support portion and the flexible connection member.

7. The display panel according to claim 6, wherein the support portion and the second adhesive layer are each disposed around the first preset region, the first adhesive layer is disposed around the shielding layer, and the first adhesive layer is separated from the shielding layer.

8. The display panel according to claim 6, wherein a total thickness of the first adhesive layer, the supporting portion, and the second adhesive layer is smaller than a thickness of the circuit board;

at least part of the side wall of the first adhesive layer, which is close to the circuit board, is retracted relative to the side wall of the supporting part, which is close to the circuit board, along the direction that the first adhesive layer is far away from the circuit board.

9. A display device comprising the display panel of any one of claims 1-8.

10. The display device of claim 9, further comprising a driver chip secured to the first predetermined area of the flexible connection.