CN214477458U - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
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- CN214477458U CN214477458U CN202120310935.5U CN202120310935U CN214477458U CN 214477458 U CN214477458 U CN 214477458U CN 202120310935 U CN202120310935 U CN 202120310935U CN 214477458 U CN214477458 U CN 214477458U
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- circuit board
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Abstract
The utility model relates to a display panel, which comprises a substrate, the base plate includes display area and non-display area, the non-display area is including being located the district of binding of display area one side, bind the district and include a plurality of pads of binding, still include first insulation protection rete, at least two bind and be provided with the detection pad between the pad, first insulation protection rete is located the detection pad is kept away from one side of base plate. The utility model discloses still relate to a display device.
Description
Technical Field
The utility model relates to a show product preparation technical field, especially relate to a display panel and display device.
Background
The flexible OLED module needs to be subjected to Aging in a cell state, and needs to be lit up for a long time to help the performance stability of the light emitting device. ET Pad (Electric Test Pad) is the connection Pin that lights up in the cell state. On a small-sized product, the ET Pad is arranged at the lower end of a bonding pin (a bonding pin) of a panel and a Chip On Film (COF), and is cut off by laser before the COF is bonded on the panel, so that the ET Pad is not left on the product finally. In order to prevent the cross section of the cut SD layer metal wire from being corroded, a gate layer wire which is not easy to corrode is used in the cutting area, but the resistance of the gate layer is about 10 times of that of the SD wire. On a large-size product, the current generated when the Aging is lightened is more than twice of that of a small-size product, and the gate layer wiring is burnt by large current during Aging to cause Aging failure. Therefore, the large-size product ET Pad needs to be placed on two sides of the bonding pin of the panel and the FPC or COF, but the ET Pad remains on the product and can be corroded in a high-temperature and high-humidity environment.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a display panel and display device effectively prevents ET Pad from being corroded.
In order to achieve the above object, the embodiment of the present invention adopts the following technical solutions: the utility model provides a display panel, includes the base plate, the base plate includes display area and non-display area, the non-display area is including being located the district of binding of display area one side, bind the district and include a plurality of pads of binding, still include first insulation protection rete, at least two it is provided with the detection pad to bind between the pad, first insulation protection rete is located the detection pad is kept away from one side of base plate.
Optionally, the display panel further includes a second insulating protection film layer located on one side of the chip on film, which is far away from the substrate.
Optionally, the first insulating protective film layer and the second insulating protective film layer are integrally arranged.
Optionally, the first insulating protection film layer and the second insulating protection film layer are separately disposed along a first direction, and the first direction is a direction from the binding pad to the detection pad.
Optionally, the display panel further includes a circuit board, the chip on film is bound to the circuit board, and the display panel further includes a third insulating protective film layer located on one side of the circuit board far away from the substrate.
Optionally, the circuit board is provided with at least one connector for connecting with an external device, the third insulating protective film layer includes at least two sub-insulating protective film layers, and two adjacent sub-insulating protective film layers are separated by the connector.
Optionally, the third insulating protection film layer includes at least two sub-insulating protection film layers along a second direction, the sub-insulating protection film layers adjacent to the second insulating protection film layer and the second insulating protection film layer are of an integral structure, and the second direction is a direction from the chip on film to the circuit board.
Optionally, the first insulating protection film layer, the second insulating protection film layer and the third insulating protection film layer are all made of insulating tapes.
Optionally, the substrate further comprises a first conductive film layer for guiding out static electricity, and the first conductive film layer is located on one side of the second insulating protection film layer, which is far away from the substrate.
Optionally, the substrate further comprises a second conductive film layer for guiding out static electricity, the second conductive film layer is located on one side of the third insulating protective film layer, which is far away from the substrate, and an opening is formed in the third insulating protective film layer, so that the second conductive film layer is connected to the ground.
Optionally, the first conductive film layer and the second conductive film layer are integrally disposed.
Optionally, the first conductive film layer and the second conductive film layer are integrally formed by using conductive cloth.
Optionally, the wave absorbing film further comprises a wave absorbing film layer for absorbing electromagnetic waves, an electronic element is arranged on the circuit board, the third insulating protection film layer comprises a first region located on one side, away from the substrate, of the electronic element, and the wave absorbing film layer is located between the first region and the second conductive film layer.
The wave-absorbing film layer is completely positioned on the circuit board in an orthographic projection in a direction perpendicular to the circuit board, and the orthographic projection of the wave-absorbing film layer on the circuit board is larger than that of the electronic element on the circuit board.
The embodiment of the utility model provides a still provide a display device, including foretell display panel.
The utility model has the advantages that: through the setting of first insulation protection rete, protect the detection pad, prevent that the detection pad from being corroded.
Drawings
FIG. 1 is a schematic view of a display panel without a protective film attached thereto according to an embodiment of the present invention;
fig. 2 is a schematic view of a display panel according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a display panel structure according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a display panel structure according to an embodiment of the present invention.
Detailed Description
In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined below to clearly and completely describe the technical solution of the embodiments of the present invention. It is to be understood that the embodiments described are only some of the embodiments of the present invention, and not all of them. All other embodiments, which can be derived from the description of the embodiments of the present invention by a person skilled in the art, are within the scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
As shown in fig. 1 to 4, this embodiment provides a display panel, which includes a substrate, the substrate includes a display area and a non-display area 10 surrounding the display area, the non-display area 10 includes a bonding area located on one side of the display area, the bonding area includes a plurality of bonding pads and further includes a first insulating protection film layer 411, at least two detection pads 1 are disposed between the bonding pads, and the first insulating protection film layer 411 is located on one side of the detection pads 1 away from the substrate.
The arrangement of the first insulating protection film 411 can effectively prevent the detection pad 1 from being corroded.
In this embodiment, the display panel further includes a chip on film 2 connected to the bonding pad, and the display panel further includes a second insulating protection film 412 located on a side of the chip on film 2 away from the substrate.
The second insulating protection film layer 412 is disposed to protect the chip on film 2.
In this embodiment, the first insulating and protecting film 411 and the second insulating and protecting film 412 are integrally disposed. This simplifies the process steps.
In this embodiment, exemplarily, the first insulating protective film layer 411 and the second insulating protective film layer 412 are separately disposed along a first direction (refer to an X direction in fig. 1) which is a direction from the bonding pad to the inspection pad 1, and referring to fig. 3, the first insulating protective film layer 411 and the second insulating protective film layer 412 are separated at a dotted line position.
The first insulating and protecting film layer 411 and the second insulating and protecting film layer 412 are separately disposed along the first direction, and the first insulating and protecting film layer 411 and the second insulating and protecting film layer 412 can be flexibly disposed as required.
In this embodiment, the display panel further includes a circuit board 3, the chip on film 2 is bound to the circuit board 3, and the display panel further includes a third insulating protection film 413 located on a side of the circuit board 3 away from the substrate.
Fig. 2 shows that the display panel is in an unbent state, fig. 4 shows that the display panel is in a bent state, one side of the substrate on which the bonding pad is disposed is a front side, and the other side opposite to the front side is a back side, when the display panel is in the unbent state, the third insulating protection film layer 413 is located on one side away from the front side of the substrate, when the display panel is in the bent state, the circuit board 3 is located on the back side of the substrate, and the third insulating protection film layer 413 is located on one side away from the back side of the substrate.
In this embodiment, the third insulating protection film layer 413 is integrally disposed with the second insulating protection film layer 412. That is, the first insulating protection film layer 411, the second insulating protection film layer 412 and the third insulating protection film layer 413 are integrally arranged, and the protection of the detection pad 1, the chip on film 2 and the circuit board 3 can be completed through one-time attaching process, so that the operation is simple and easy. And when making insulating protection rete, first insulating protection rete 411, second insulating protection rete 412 with third insulating protection rete 413 integrative setting improves production efficiency. In practical use, however, at least one connector connected to an external device (e.g., a host) is disposed on the circuit board 3, and the connector cannot be covered by the third insulating protection film layer 413, so that, in order to avoid interference, the third insulating protection film layer 413 includes at least two sub-insulating protection film layers, and adjacent two sub-insulating protection film layers are separated by the connector.
The number of the sub insulating protective film layers is determined according to the number of the connectors, for example, two connectors are provided on the circuit board 3, and the third insulating protective film layer 413 includes three sub insulating protective film layers, and two adjacent sub insulating protective film layers are separated by the corresponding connectors.
In this embodiment, the third insulating protection film 413 includes at least two sub-insulating protection films along a second direction, the sub-insulating protection film adjacent to the second insulating protection film 412 and the second insulating protection film 412 are an integral structure, and the second direction is a direction from the chip on film 2 to the circuit board 3, which is referred to as a Y direction in fig. 2.
In practical use, the circuit board 3 further includes a connecting device (i.e., a connector that needs to be connected to a device other than the circuit board 3) connected to a device such as a touch structure, and in this embodiment, the sub-insulating protective film layer is further provided with an opening for avoiding the connection.
In this embodiment, the first insulating protection film layer 411, the second insulating protection film layer 412 and the third insulating protection film layer 413 are made of insulating tapes, but not limited thereto.
For COF (chip on film 2) products, ESD (electrostatic discharge) risks exist in the bonding area of COF and panel; and the circuit of the COF bending area has electromagnetic interference on the whole machine.
In this embodiment, the display panel further includes a first conductive film 421 for guiding out static electricity, and the first conductive film 421 is located on a side of the second insulating protection film 412 away from the substrate.
The first conductive film 421 increases the electrostatic protection on the chip on film 2, and plays a role in electromagnetic protection on the bending region of the chip on film 2.
In this embodiment, the display panel further includes a second conductive film 422 for guiding out static electricity, the second conductive film 422 is located on a side of the third insulating protection film 413 away from the substrate, and an opening is provided on the third insulating protection film 413, so that the second conductive film is connected to ground.
The second conductive film layer 422 is connected to the ground line on the circuit board 3 through the opening of the third insulating protective film layer 413, so as to lead out static electricity, thereby preventing static electricity from occurring on the circuit board 3.
In this embodiment, the first conductive film layer 421 and the second conductive film layer 422 are integrally disposed.
In this embodiment, the first conductive film 421 and the second conductive film 422 are integrally formed by a conductive cloth, but not limited thereto.
First electrically conductive rete 421 with the electrically conductive rete 422 of second is integrative to be set up, can simplify the process step, will integrative setting first electrically conductive rete 421 with the electrically conductive rete 422 of second sets up with an organic whole first insulation protection rete 411 the second insulation protection rete 412 with the laminating back of third insulation protection rete 413 is carried out whole subsides with display panel corresponding region again, and is simple easy to operate.
In this embodiment, the display panel further includes a wave-absorbing film layer 43 for absorbing electromagnetic waves, the circuit board 3 is provided with an electronic element 31, the third insulating protection film layer 413 includes a first region located on one side of the electronic element 31 far away from the substrate, and the wave-absorbing film layer 43 is located between the first region and the second conductive film layer 422.
The jumbo size product has a large amount of electronic component 31 including IC on PCB, makes in work and can produce a large amount of electromagnetic clutter, can produce radio frequency interference to the whole machine, inhale the clutter that the setting of ripples rete 43 can the high-efficient electronic component 31 work produced on the absorption circuit board 3, and then can reduce the radio frequency interference that the component work produced to the whole machine, just inhale ripples rete 43 set up in third insulation protection rete 413 with between the electrically conductive rete 422 of second, can effectively prevent to inhale the ripples material and fall the powder.
In this embodiment, for example, an orthographic projection of the wave-absorbing film layer 43 in a direction perpendicular to the circuit board 3 is completely located on the circuit board 3, and the orthographic projection of the wave-absorbing film layer 43 on the circuit board 3 is greater than an orthographic projection of the electronic element 31 on the circuit board 3. Noise generated by the operation of the electronic components 31 on the circuit board 3 can be absorbed efficiently.
In this embodiment, the first insulating protection film layer 411, the second insulating protection film layer 412 and the third insulating protection film layer 413 are integrally named as insulating layers, the first conductive film layer 421 and the second conductive film layer 422 are of an integral structure (integrally named as a conductive layer 42), in actual operation, the insulating layer, the wave-absorbing film layer 43 and the conductive layer are now attached to form an integral structure, and then the insulating layer, the wave-absorbing film layer 43 and the conductive layer which are attached to each other are integrally attached to corresponding areas of the display panel.
Fig. 2 is a schematic diagram showing a state before the flip chip is bent, fig. 4 is a schematic diagram showing a state after the flip chip is bent, and after the flip chip 2 is bent, the circuit board 3 is located on the backlight side of the display panel.
Specifically, in this embodiment, the display panel includes a protective film, and the protective film includes an insulating layer 41, a wave-absorbing film layer 43, and a conductive layer 42, which are sequentially stacked;
the insulating layer 41 is made of an insulating tape and includes a first insulating protection film layer 411, a second insulating protection film layer 412 and a third insulating protection film layer 413, the first insulating protection film layer 411 is used for being attached to a detection area on the display panel, the second insulating protection film layer 412 is used for being attached to the flip chip film 2 on the display panel, and the third insulating protection film layer 413 is used for being attached to the circuit board 3 of the display panel;
the conductive layer 42 is made of conductive cloth and includes a first conductive film layer 421 and a second conductive film layer 422, the first conductive film layer 421 is attached to the second insulating protection film layer 412 at a side far from the flip chip film 2, and the second conductive film layer 422 is attached to the third insulating protection film layer 413 at a side far from the circuit board 3;
the circuit board 3 includes an electronic element 31, the third insulating protection film 413 includes a first region located on the electronic element 31, and the wave-absorbing film 43 is located between the first region and the second conductive film 422.
The embodiment of the utility model provides a still provide a display device, including foretell display panel.
The display device may be: the display device comprises any product or component with a display function, such as a liquid crystal television, a liquid crystal display, a digital photo frame, a mobile phone, a tablet personal computer and the like, wherein the display device further comprises a flexible circuit board 3, a printed circuit board 3 and a back plate.
The above description is a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.
Claims (15)
1. The utility model provides a display panel, includes the base plate, the base plate includes display area and non-display area, the non-display area is including being located the district of binding of display area one side, bind the district and include a plurality of pads of binding, its characterized in that still includes first insulation protection rete, at least two it is provided with the detection pad to bind between the pad, first insulation protection rete is located the detection pad is kept away from one side of base plate.
2. The display panel of claim 1, further comprising a chip on film connected to the bonding pads, wherein the display panel further comprises a second insulating protective film layer on a side of the chip on film away from the substrate.
3. The display panel according to claim 2, wherein the first insulating protective film layer and the second insulating protective film layer are integrally provided.
4. The display panel according to claim 2, wherein the first insulating protective film layer and the second insulating protective film layer are provided separately in a first direction, the first direction being a direction from the bonding pad to the detection pad.
5. The display panel according to claim 3 or 4, further comprising a circuit board, wherein the flip chip film is bonded to the circuit board, and the display panel further comprises a third insulating protection film layer located on a side of the circuit board away from the substrate.
6. The display panel according to claim 5, wherein the circuit board is provided with at least one connector for connecting with an external device, and the third insulating protective film layer comprises at least two sub-insulating protective film layers, and adjacent two sub-insulating protective film layers are separated by the connector.
7. The display panel according to claim 6, wherein the third insulating protection film layer comprises at least two sub-insulating protection film layers along a second direction, the sub-insulating protection film layer adjacent to the second insulating protection film layer and the second insulating protection film layer are in an integral structure, and the second direction is a direction from the flip chip to the circuit board.
8. The display panel according to claim 5, wherein the first insulating protective film layer, the second insulating protective film layer, and the third insulating protective film layer are made of insulating tapes.
9. The display panel according to claim 5, further comprising a first conductive film layer for discharging static electricity, the first conductive film layer being located on a side of the second insulating protective film layer away from the substrate.
10. The display panel according to claim 9, further comprising a second conductive film layer for conducting static electricity, wherein the second conductive film layer is located on a side of the third insulating protective film layer away from the substrate, and an opening is provided in the third insulating protective film layer, so that the second conductive film layer is connected to ground.
11. The display panel according to claim 10, wherein the first conductive film layer and the second conductive film layer are integrally provided.
12. The display panel according to claim 11, wherein the first conductive film layer and the second conductive film layer are integrally formed using a conductive cloth.
13. The display panel according to claim 11, further comprising a wave-absorbing film layer for absorbing electromagnetic waves, wherein an electronic element is disposed on the circuit board, the third insulating protective film layer comprises a first region located on a side of the electronic element away from the substrate, and the wave-absorbing film layer is located between the first region and the second conductive film layer.
14. The display panel of claim 13, wherein an orthographic projection of the wave-absorbing film layer in a direction perpendicular to the circuit board is completely on the circuit board, and the orthographic projection of the wave-absorbing film layer on the circuit board is larger than that of the electronic element on the circuit board.
15. A display device characterized by comprising the display panel according to any one of claims 1 to 14.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120310935.5U CN214477458U (en) | 2021-02-03 | 2021-02-03 | Display panel and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120310935.5U CN214477458U (en) | 2021-02-03 | 2021-02-03 | Display panel and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214477458U true CN214477458U (en) | 2021-10-22 |
Family
ID=78142772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120310935.5U Active CN214477458U (en) | 2021-02-03 | 2021-02-03 | Display panel and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214477458U (en) |
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2021
- 2021-02-03 CN CN202120310935.5U patent/CN214477458U/en active Active
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