CN210836909U - Display substrate and display device - Google Patents
Display substrate and display device Download PDFInfo
- Publication number
- CN210836909U CN210836909U CN202020187577.9U CN202020187577U CN210836909U CN 210836909 U CN210836909 U CN 210836909U CN 202020187577 U CN202020187577 U CN 202020187577U CN 210836909 U CN210836909 U CN 210836909U
- Authority
- CN
- China
- Prior art keywords
- chip
- circuit board
- display
- substrate
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The utility model relates to a display substrate, which comprises a display area and a non-display area surrounding the display area, and also comprises a chip packaging structure, a first flexible circuit board and a second flexible circuit board which are bound and connected with the two opposite sides of the chip packaging structure; one side of the first flexible circuit board, which is far away from the chip packaging structure, is bound and connected to the non-display area; the chip packaging structure comprises a base material and a chip arranged on the base material, the chip is connected with a connecting wire on the first flexible circuit board and used for driving the display substrate, and the orthographic projection of the chip in the direction vertical to the display substrate is positioned outside a non-display area; and one side of the second flexible circuit board, which is far away from the chip packaging structure, is bound and connected with a main circuit board for supplying power to the display substrate. The utility model discloses still relate to a display device and display substrate's manufacturing method.
Description
Technical Field
The utility model relates to a show product preparation technical field, especially relate to a display substrates, display device and display substrates's preparation method.
Background
The full screen is rapidly developed, so that the full screen project has higher and higher technical requirements, and the full screen has violent impact on an a-Si product. In the existing mobile phone a-Si product, because the number of channels is too large, a COF (chip on film) scheme cannot be adopted, the lower frame is too wide, the market competitiveness is insufficient, and because the COF product is adopted, the thickness of the frame is limited due to the limitation of the width of the COF product, and the product thinning cannot be further realized.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a display substrate, display device and display substrate's manufacturing method solves because the restriction of cover brilliant film width itself, the too wide problem of frame.
In order to achieve the above purpose, the utility model discloses a technical scheme is: a display substrate comprises a display area, a non-display area arranged on the periphery of the display area, a chip packaging structure, a first flexible circuit board and a second flexible circuit board, wherein the first flexible circuit board and the second flexible circuit board are bound and connected to two opposite sides of the chip packaging structure;
one side of the first flexible circuit board, which is far away from the chip packaging structure, is bound and connected to the non-display area;
the chip packaging structure comprises a base material and a chip arranged on the base material, the chip is connected with a connecting wire on the first flexible circuit board and used for driving the display substrate, the chip and the first flexible circuit board are positioned on the same side of the base material, and after bending, the base material is attached to the back side of the display substrate;
and one side of the second flexible circuit board, which is far away from the chip packaging structure, is bound and connected with a main circuit board for supplying power to the display substrate.
Optionally, the non-display area includes a first binding area, the first flexible printed circuit board includes a second binding area and a third binding area, the second binding area and the third binding area are disposed on two opposite sides of the first flexible printed circuit board along a first direction, the second binding area covers the first binding area, and an orthographic projection of the second binding area on the non-display area is located in the first binding area.
Optionally, the substrate of the chip packaging structure includes a fourth bonding region and a fifth bonding region, the fourth bonding region and the fifth bonding region are respectively located on two sides of the chip along the first direction, an orthographic projection of the third bonding region on the substrate is located in the fourth bonding region, and the first bonding region and the fourth bonding region are located on the same side of the first flexible printed circuit board.
Optionally, the base material is a hard transparent substrate.
Optionally, the fourth binding area is provided with a plurality of conductive contacts for binding and connecting the first pin of the chip with the connection line on the first flexible printed circuit board, and the fifth binding area is provided with a plurality of conductive contacts for connecting the second pin of the chip with the connection line on the second flexible printed circuit board. Optionally, the second flexible printed circuit board includes a sixth bonding region, an orthographic projection of the sixth bonding region on the substrate is located in the fifth bonding region, and the sixth bonding region, the third bonding region and the chip are located on the same side of the substrate.
Optionally, the chip packaging structure further includes a protective film covering the chip.
Optionally, the chip packaging structure further includes a heat dissipation layer disposed on a side of the protection film away from the chip.
The utility model also provides a display device, including foretell display substrate.
Optionally, the display substrate is an array substrate.
The utility model has the advantages that: through the arrangement of the chip packaging structure and the first flexible circuit board, the chip packaging structure replaces a chip on film, and compared with the traditional structure that the chip on film is directly bound and connected to a non-display area of the display substrate, the chip packaging structure reduces the thickness of a frame and realizes the thinning of a product.
Drawings
FIG. 1 is a first schematic view of a related art display substrate;
FIG. 2 is a schematic diagram of a display substrate structure in the related art;
FIG. 3 is a schematic diagram of a chip on film structure in the related art;
FIG. 4 is a schematic diagram of a first embodiment of a display substrate;
FIG. 5 is a schematic diagram of a second embodiment of a display substrate according to the present invention;
fig. 6 is a schematic diagram of a third embodiment of a display substrate according to the present invention;
fig. 7 is a schematic structural diagram of a display module according to an embodiment of the present invention;
fig. 8 is a schematic diagram of a chip package structure according to an embodiment of the present invention;
fig. 9 is a schematic diagram of a chip package structure according to an embodiment of the present invention.
Detailed Description
In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined below to clearly and completely describe the technical solution of the embodiments of the present invention. It is to be understood that the embodiments described are only some of the embodiments of the present invention, and not all of them. All other embodiments, which can be derived from the description of the embodiments of the present invention by a person skilled in the art, are within the scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In order to realize a narrow frame, more and more products adopt COF (Chip On Film), which is a flexible circuit board provided with a driving Chip, as shown in fig. 1 and 2, a general display substrate includes a display area 1 and a non-display area 2, the display area 1 is provided with a pixel unit, the non-display area 2 is provided with a binding area, a flip-Chip Film 3 is bound and connected to the binding area of the non-display area 2, the binding area is provided with an outgoing line electrically connected with the flip-Chip Film, the flip-Chip Film 3 is connected to a signal line through the outgoing line of the binding area and provides a display signal for the pixel unit On the signal line, and the flip-Chip Film 3 is bound and connected with a flexible circuit board 5 to be connected with a main circuit board (not shown) for supplying power, the main circuit board is generally arranged On a backlight module of the display substrate, the flip-Chip Film 3 needs to be bent to connect the flexible circuit board with the main, like this, chip 4 on the cover brilliant film and its own part flexible line way board have buckled the dorsal part of display substrate, the thickness of frame has included cover brilliant film's thickness, cover brilliant film's flexible line way board itself and the thickness of chip 4 on it promptly, in order to prevent that chip 4 from buckling, cover brilliant film's flexible line way board has still set up reinforcing plate 20 on the one side that does not set up the chip, be provided with on reinforcing plate 20 and be used for radiating graphite flake 30 these structures all increase the thickness of frame to a certain extent, fig. 2 shows the state after cover brilliant film buckles, chip 4 sets up towards the display substrate dorsal part, in order to protect chip 4, still have the gap between chip 4 and the display substrate dorsal part, the existence of this gap has also increased the thickness of frame undoubtedly. Further product thinning cannot be realized.
In order to solve the above technical problem, the present embodiment provides a display substrate, referring to fig. 4 to 6, including a display area 1 and a non-display area 2 disposed at the periphery of the display area 1, further including a chip package structure 10, and a first flexible circuit board 3 and a second flexible circuit board 6 bound and connected to two opposite sides of the chip package structure 10;
one side of the first flexible circuit board 3, which is far away from the chip packaging structure 10, is bound and connected to the non-display area 2;
the chip packaging structure 10 comprises a base material 4 and a chip 5 arranged on the base material 4, wherein the chip 5 is connected with a connecting wire on the first flexible circuit board 3 to drive a display substrate to display, the chip 5 and the first flexible circuit board 3 are positioned on the same side of the base material 4, and after bending, the base material 4 is attached to the back side of the display substrate;
and one side of the second flexible circuit board 6, which is far away from the chip packaging structure 10, is bound and connected with a main circuit board for supplying power to the display substrate.
By adopting the technical scheme, the chip packaging structure 10 is connected with the non-display area 2 through the first flexible circuit board 3, so as to realize the driving of the display substrate, the chip packaging structure 10 comprises the substrate 4 and the chip 5 arranged on the substrate 4, compared with the prior art, the flip-chip film is directly bonded and connected with the non-display area 2 of the display substrate, the limitation of the frame thickness caused by the flip-chip film is broken, the display substrate can be obtained by comparing the figure 6 with the figure 2, the figure 2 shows the state of the flip-chip film after being bent in the prior art, the thickness of the frame (the thickness in the direction vertical to the display substrate) comprises the thickness of the flexible circuit board 3 of the flip-chip film and the thickness of the chip 4 on the flexible circuit board, in the prior art, the chip 4 faces the back side of the display substrate after being bent, in order to protect the chip 4, a gap is, the flip-chip film is relatively flexible, and in order to prevent the chip 4 from bending, the surface of the chip 4 is provided with a reinforcing plate 20, referring to fig. 3, and the existence of the reinforcing plate 20 and the gap both increase the width of the frame of the display substrate in the direction perpendicular to the display substrate. Fig. 6 shows a state of the first flexible printed circuit board 3, the chip package structure 10, and the second flexible printed circuit board 6 after being bent in this embodiment, a thickness of a frame (a width in a direction perpendicular to the display substrate) includes a thickness of the first flexible printed circuit board 3 and a thickness of the substrate 4 of the chip package structure 10, since the chip 5 is disposed opposite to the display substrate, and the substrate 4 is disposed facing the display substrate, a gap does not need to be disposed between the substrate 4 and the display substrate, and the substrate 4 can be attached to a back side of the display substrate, thereby achieving product thinning in the direction perpendicular to the display substrate.
In this embodiment, the non-display area 2 includes a first binding area 21, the first flexible printed circuit board 3 includes a second binding area 31 and a third binding area 32, the second binding area 31 and the third binding area 32 are disposed on two opposite sides of the first flexible printed circuit board 3 along a first direction (Y direction in fig. 4), the second binding area 31 covers the first binding area 21, and an orthographic projection of the second binding area 31 on the non-display area 2 is located in the first binding area 21.
As shown in fig. 4 to 6, the non-display area 2 includes four side edges, signal lines connected to the display area 1 are distributed on one side edge of the non-display area 2, a first binding area 21 is disposed on the side edge, the second binding area 31 of the first flexible printed circuit board 3 is bound to the first binding area 21, a connection line for connecting the second binding area 31 and the third binding area 32 is disposed on the first flexible printed circuit board 3, and after the third binding area 32 is bound to the chip package structure 10, the chip 5 on the chip package structure 10 is connected to the signal lines of the display area 1, so as to be used for display driving of the display substrate.
The first direction is a direction away from the first binding region 21, which is referred to as a Y direction in fig. 3.
The specific structural form of the chip package structure 10 may be set according to actual needs, and is not limited herein. In a specific implementation manner of this embodiment, as shown in fig. 5 to 8, the substrate 4 of the chip package structure 10 includes a fourth bonding region 41 and a fifth bonding region 42, the fourth bonding region 41 and the fifth bonding region 42 are respectively located on two sides of the chip 5 along the first direction (Y direction), the third bonding region 32 covers the fourth bonding region 41, an orthogonal projection of the third bonding region 32 on the substrate 4 is located in the fourth bonding region 41, and the first bonding region 21 and the fourth bonding region 41 are located on the same side of the first flexible circuit board 3.
In a specific implementation manner of this embodiment, the substrate 4 in the chip package structure 10 is a hard transparent substrate, and the hard transparent substrate includes a carrying region for fixing the chip 5, and a binding region (a fourth binding region 41 and a fifth binding region 42) connected to pins of the chip 5, so that the chip 5 is bound and connected to the first flexible printed circuit board 3 and the second flexible printed circuit board 6, and in order to further reduce the thickness of the frame, the first binding region and the fourth binding region 41 are located on the same side of the first flexible printed circuit board 3, so that in a bent state, one side of the chip 5 is kept away from the substrate 4 and the back side of the display substrate is attached to each other.
The base material 4 adopts a hard transparent substrate, and compared with the prior art, a reinforcing plate is not required to be arranged to prevent the chip from being bent, so that the arrangement of the reinforcing plate is reduced, and the thickness of a frame of the display substrate is also reduced in the direction perpendicular to the display substrate.
Moreover, since the base material 4 is a hard transparent substrate, the thickness of the chip 5 itself is also reduced, in the conventional technology, the thickness of the chip is 0.2mm, and the thickness of the chip in this embodiment may be 0.15 mm.
In a specific embodiment of this embodiment, the substrate 4 is a glass substrate, but not limited thereto.
In a specific implementation manner of this embodiment, the fourth bonding area 41 is provided with a plurality of conductive contacts (also known as gold fingers, the first conductive contacts 401 in fig. 8) for bonding and connecting the first pins of the chip 5 and the connection lines on the first flexible printed circuit board 3, and the fifth bonding area is provided with a plurality of conductive contacts (the second conductive contacts 402 in fig. 8) for connecting the second pins of the chip 5 and the connection lines on the second flexible printed circuit board 6.
Since the fourth bonding region 41 is bonded to the third bonding region 32 of the first flexible printed circuit board 3 and is used for connecting signal lines on the non-display region 2 through the first flexible printed circuit board 3 to realize display driving of the display substrate, and the number of signal lines on the non-display region 2 is large, the number of the first conductive contacts 401 in the fourth bonding region 41 is large, and the sixth bonding region 61 bonded to the second flexible printed circuit board 6 and used for connecting with the main printed circuit board to supply power to the display substrate is small, and the number of the corresponding power supply lines is small, so that the number of the second conductive contacts 402 is small, however, the length of the substrate 4 in the direction perpendicular to the Y direction (Z direction shown in fig. 8) is constant, so that the size of the first conductive contacts 401 shown in fig. 8 is relatively small, and the gap between two adjacent first conductive contacts 401 is relatively small, while the size of the second conductive contacts 402 is relatively large and the gap between two adjacent second conductive contacts 402 is large.
In order to solve the problem that the gap between two adjacent first conductive contact pieces 401 is small, and the misalignment is likely to occur during the binding connection, in this embodiment, the first conductive contact pieces 401 are obliquely arranged, and a plurality of the first conductive contact pieces 401 are symmetrically distributed with the midpoint of one edge of the substrate 4 in the Z direction as the center, and the plurality of the first conductive contact pieces 401 are in an outer eight shape, so that the occurrence of the misalignment is reduced.
In this embodiment, the second flexible printed circuit 6 includes a sixth bonding region 61, an orthogonal projection of the sixth bonding region 61 on the substrate 4 is located in the fifth bonding region 42, and the sixth bonding region 61, the third bonding region 32 and the chip 5 are located on the same side of the substrate 4, referring to fig. 5.
Compared with the sixth bonding region 61, the third bonding region 32 and the chip 5 which are located on different sides of the substrate 4, in this embodiment, the sixth bonding region 61, the third bonding region 32 and the chip 5 are located on the same side of the substrate 4, so that the thickness of the frame is reduced.
In this embodiment, the chip package structure 10 further includes a protection film 7 covering the chip 5, referring to fig. 7.
The protective film 7 is disposed to protect the chip 5 and prevent the chip 5 from being corroded by water and oxygen, and in a specific embodiment, the protective film 7 may be a packaging adhesive.
In this embodiment, the chip package structure 10 further includes a heat dissipation layer 8 disposed on a side of the protection film 7 away from the chip 5, referring to fig. 7.
The heat dissipation layer 8 is disposed to facilitate heat dissipation of the chip 5 and prolong a service life of the chip 5, and in a specific embodiment, the heat dissipation layer 8 may be a graphite sheet.
By adopting the structure of the first flexible printed circuit board 3, the chip package structure 10, and the second flexible printed circuit board 6 in this embodiment, in a bending state, the positional relationship between the chip 5 and the display substrate is changed from the conventional one toward the back side of the display substrate to one away from the back side of the display substrate, and the substrate 4 is attached to the back side of the display substrate, so that, compared with the conventional structure, a gap between the chip package structure 10 and the back side of the display substrate is eliminated (the gap serves as a chip protection in the conventional structure), in the specific implementation manner of this embodiment, the substrate 4 is a hard transparent substrate, which plays a role in protecting the chip 5, and compared with the conventional structure, a reinforcing plate for preventing the chip 5 from being bent is eliminated, and the thickness of the chip 5 is also reduced.
As is apparent, the arrangement of the first flexible wiring board 3, the chip packaging structure 10, and the second flexible wiring board 6 in the present embodiment reduces the thickness of the display substrate in the direction perpendicular to the display substrate.
It should be noted that, in this embodiment, the technical scheme that the first flexible circuit board 3 and the chip package structure 10 are directly bonded and connected to the non-display area 2 through the flip chip film is replaced by the arrangement of the first flexible circuit board 3 and the chip package structure 10, so that the limitation caused by the thickness of the flip chip film is broken, the product is further thinned, the cost is reduced, the application range is expanded, and the display substrate of this embodiment can also be used for low-end a-Si products.
The embodiment also provides a display device, which comprises the display substrate.
In this embodiment, the display substrate is an array substrate.
In this embodiment, through first flexible line way board 3 binding connection is in display substrate's non-display area 2, through chip packaging structure as a bridging chip structure binding connection in on first flexible line way board 3 to be connected to the drive of display area 1 in order to realize display area 1 with the first pin of chip 5, and with second flexible line way board 6 binding connection in chip packaging structure, thereby will the second pin of chip packaging structure is connected to on the owner's circuit board, in order to realize display substrate's power supply, refer to fig. 5, first flexible line way board 3, chip 5 and second flexible line way board 6 are located the same one side of substrate 4, and are buckling the state, and chip 5 is located the one side of keeping away from display substrate's light-emitting side.
After the first flexible printed circuit board 3, the chip package structure, and the second flexible printed circuit board 6 are bound and connected, the backlight module 200 and the cover plate 100 are assembled.
As shown in fig. 9, the display substrate includes a color filter substrate 400 and an array substrate 500, which are oppositely disposed, the first flexible printed circuit board 3 is bound and connected to the array substrate 500, the array substrate 500 includes a first region and a second region, an orthographic projection of the color filter substrate 400 on the array substrate 500 is located in the first region, the second region is distributed on a periphery of the first region, and the first flexible printed circuit board 3 is bound and connected to the second region.
A first polarizer 300 is disposed on one side of the color film substrate 400 away from the array substrate 500, and a second polarizer 600 is disposed on one side of the array substrate 500 away from the color film substrate.
By adopting the technical scheme, the problem that the width of the chip on film per se limits the width of the frame in the related technology is solved, the narrow frame is further realized, and the main advantages are as follows:
in the conventional technology, the a-Si product belongs to a low-end product, and the cost of the chip on film is high, so the a-Si product generally does not adopt the scheme of the chip on film, but the chip packaging structure in the embodiment reduces the cost relative to the chip on film, and the a-Si product can also be adopted, that is, the a-Si/LTPS (single crystal silicon/low temperature polycrystalline silicon) product can realize narrow frame and expand the application range;
the first flexible circuit board 3 can adopt COF Film, namely, a chip on Film of the chip 5 is removed, and the chip 5 is not arranged on the first flexible circuit board, so that the size can be reduced compared with the chip on Film in the traditional technology, and the chip packaging structure has simple structure and reduces the cost;
the whole size is smaller, and the structure of the whole machine is more compact;
the IC (integrated circuit chip 5) can adopt a COG IC (chip on glass IC), namely the chip 5 is directly bound on the hard transparent substrate, the universality is good, and the COF capacity is less in occupation; and the dependence on an IC factory is reduced.
The display device may be: the display device comprises any product or component with a display function, such as a liquid crystal television, a liquid crystal display, a digital photo frame, a mobile phone, a tablet personal computer and the like, wherein the display device further comprises a flexible circuit board, a printed circuit board and a back plate.
The following describes the process of the method for manufacturing the display substrate in this embodiment.
The manufacturing method of the display substrate comprises the following steps:
arranging a chip 5 on a substrate 4 to form a chip packaging structure;
binding and connecting the first flexible circuit board 3 to the first side of the chip packaging structure;
binding and connecting a second flexible circuit board 6 to a second side of the chip packaging structure opposite to the first side;
and binding and connecting one side of the first flexible circuit board 3, which is far away from the chip packaging structure, to the non-display area 2 of the display substrate.
In this embodiment, the chip is disposed on the substrate to form a chip package structure, which includes:
providing a substrate and a chip;
binding and connecting the chip on the substrate;
and coating frame sealing glue outside the chip to form a protective film.
In this embodiment, the chip is disposed on the substrate to form a chip package structure, which further includes:
and forming a heat dissipation layer on one side of the protective film, which is far away from the chip.
In this embodiment, bind chip package structure, first flexible line way board 3, second flexible line way board 6 and connect the back, wholly bind again and connect in the non-display area 2 of display substrate, the equipment of being convenient for like this reduces the degree of difficulty, and all bind the process and all can adopt automation equipment to bind the connection automatically, improve and bind the accuracy.
In this embodiment, the process of the manufacturing method of the display module including the display substrate is as follows:
respectively attaching polaroids (pol) to two sides of the display substrate through automatic equipment;
bonding and connecting a chip (IC) on a Glass film (Single Glass) by using automatic equipment to form a chip packaging structure;
binding and connecting the first flexible circuit board to the first side of the chip packaging structure through automation equipment;
the second flexible circuit board is bound and connected to a second side, opposite to the first side, of the chip packaging structure, and the step can be realized through automatic equipment and can also be manually bound;
binding and connecting the first flexible circuit board to a non-display area of the display substrate attached with the polaroid so as to integrally bind and connect the bound and connected first flexible circuit board, the chip packaging structure and the second flexible circuit board to the display substrate;
attaching the cover plate through automatic equipment;
and the backlight module is attached through automatic equipment.
The above is a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations should be considered as the protection scope of the present invention.
Claims (10)
1. A display substrate comprises a display area and a non-display area arranged on the periphery of the display area, and is characterized by further comprising a chip packaging structure, a first flexible circuit board and a second flexible circuit board, wherein the first flexible circuit board and the second flexible circuit board are fixedly connected to two opposite sides of the chip packaging structure;
one side of the first flexible circuit board, which is far away from the chip packaging structure, is bound and connected to the non-display area;
the chip packaging structure comprises a base material and a chip arranged on the base material, the chip is connected with a connecting wire on the first flexible circuit board and used for driving the display substrate, the chip and the first flexible circuit board are positioned on the same side of the base material, and after bending, the base material is attached to the back side of the display substrate;
and one side of the second flexible circuit board, which is far away from the chip packaging structure, is bound and connected with a main circuit board for supplying power to the display substrate.
2. The display substrate according to claim 1, wherein the non-display area comprises a first bonding area, the first flexible circuit board comprises a second bonding area and a third bonding area, the second bonding area and the third bonding area are disposed on two opposite sides of the first flexible circuit board along a first direction, the second bonding area covers the first bonding area, and an orthographic projection of the second bonding area on the non-display area is located in the first bonding area.
3. The display substrate according to claim 2, wherein the substrate of the chip package structure includes a fourth bonding region and a fifth bonding region, the fourth bonding region and the fifth bonding region are respectively located on two sides of the chip along the first direction, an orthogonal projection of the third bonding region on the substrate is located in the fourth bonding region, and the first bonding region and the fourth bonding region are located on the same side of the first flexible circuit board.
4. The display substrate of claim 3, wherein the base material is a rigid transparent substrate.
5. The display substrate of claim 3, wherein the fourth bonding area is provided with a plurality of conductive contacts for bonding and connecting the first pins of the chip with the connection lines on the first flexible circuit board, and the fifth bonding area is provided with a plurality of conductive contacts for connecting the second pins of the chip with the connection lines on the second flexible circuit board.
6. The display substrate according to claim 3, wherein the second flexible circuit board comprises a sixth bonding region, an orthographic projection of the sixth bonding region on the substrate is located in the fifth bonding region, and the sixth bonding region, the third bonding region and the chip are located on the same side of the substrate.
7. The display substrate of claim 1, wherein the chip package structure further comprises a protective film covering the chip.
8. The display substrate of claim 7, wherein the chip package structure further comprises a heat dissipation layer disposed on a side of the protection film away from the chip.
9. A display device comprising the display substrate according to any one of claims 1 to 8.
10. The display device according to claim 9, wherein the display substrate is an array substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020187577.9U CN210836909U (en) | 2020-02-20 | 2020-02-20 | Display substrate and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020187577.9U CN210836909U (en) | 2020-02-20 | 2020-02-20 | Display substrate and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210836909U true CN210836909U (en) | 2020-06-23 |
Family
ID=71263017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020187577.9U Active CN210836909U (en) | 2020-02-20 | 2020-02-20 | Display substrate and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210836909U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114093243A (en) * | 2021-11-11 | 2022-02-25 | 昆山工研院新型平板显示技术中心有限公司 | Display module and preparation method thereof |
| WO2022143075A1 (en) * | 2020-12-29 | 2022-07-07 | 华为技术有限公司 | Flexible substrate, chip on film and display screen |
| CN114783291A (en) * | 2022-04-18 | 2022-07-22 | 京东方科技集团股份有限公司 | Display substrate, flexible circuit board and display device |
| CN115311949A (en) * | 2022-08-31 | 2022-11-08 | 昆山国显光电有限公司 | Binding structure, display module and electronic equipment |
| WO2023272595A1 (en) * | 2021-06-30 | 2023-01-05 | 京东方科技集团股份有限公司 | Display module and display device |
-
2020
- 2020-02-20 CN CN202020187577.9U patent/CN210836909U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022143075A1 (en) * | 2020-12-29 | 2022-07-07 | 华为技术有限公司 | Flexible substrate, chip on film and display screen |
| WO2023272595A1 (en) * | 2021-06-30 | 2023-01-05 | 京东方科技集团股份有限公司 | Display module and display device |
| CN114093243A (en) * | 2021-11-11 | 2022-02-25 | 昆山工研院新型平板显示技术中心有限公司 | Display module and preparation method thereof |
| CN114783291A (en) * | 2022-04-18 | 2022-07-22 | 京东方科技集团股份有限公司 | Display substrate, flexible circuit board and display device |
| CN114783291B (en) * | 2022-04-18 | 2023-12-22 | 京东方科技集团股份有限公司 | Display substrate, flexible circuit board and display device |
| CN115311949A (en) * | 2022-08-31 | 2022-11-08 | 昆山国显光电有限公司 | Binding structure, display module and electronic equipment |
| CN115311949B (en) * | 2022-08-31 | 2023-11-28 | 昆山国显光电有限公司 | Binding structure, display module assembly and electronic equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210836909U (en) | Display substrate and display device | |
| US20220231260A1 (en) | Display device and method of manufacturing display device | |
| CN110570764A (en) | display panel and manufacturing method thereof | |
| CN112086495B (en) | Display device | |
| US20210104594A1 (en) | Display panel, preparation method thereof and display device | |
| CN111176037A (en) | Flip chip film set, flip chip film set binding method and display device | |
| CN111292614B (en) | Display module and display device | |
| CN113946077B (en) | Display panel and display device | |
| CN110806658B (en) | Backlight module and display device | |
| CN207037286U (en) | A kind of backlight module, display panel and display device | |
| TWI326373B (en) | Liquid crystal display with cascade design and a circuit pattern thereon | |
| KR20110064287A (en) | Borderless liquid crystal display device | |
| CN110275355B (en) | Curved surface display panel and curved surface display device | |
| CN108254971A (en) | The installation method of backlight module, electronic device and backlight module | |
| US11856741B2 (en) | Display module and display device | |
| CN110764302A (en) | Display panel, preparation method thereof and alignment system | |
| CN113223411B (en) | Display panel and display device | |
| CN116075172A (en) | Display module and display device | |
| KR20220075554A (en) | Display apparatus | |
| CN115171539B (en) | Display panel, preparation method thereof and display device | |
| CN217880696U (en) | Display module and display device | |
| CN217156996U (en) | Display panel and display device | |
| CN111752053A (en) | Screen module and electronic equipment | |
| JP3653981B2 (en) | Mounting structure of liquid crystal device and electronic device | |
| CN112086418B (en) | Drive chip, preparation method thereof and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |