CN111292614B - Display module and display device - Google Patents
Display module and display device Download PDFInfo
- Publication number
- CN111292614B CN111292614B CN202010043430.7A CN202010043430A CN111292614B CN 111292614 B CN111292614 B CN 111292614B CN 202010043430 A CN202010043430 A CN 202010043430A CN 111292614 B CN111292614 B CN 111292614B
- Authority
- CN
- China
- Prior art keywords
- chip
- circuit board
- printed circuit
- display
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
Abstract
The invention provides a display module and a display device, wherein the display module comprises a display substrate, a printed circuit board and a Chip On Film (COF) for connecting the display substrate and the printed circuit board, the COF comprises at least one bent part, and after the bent part is bent, the COF is bound with the printed circuit board; therefore, the chip on film and the printed circuit board are bound in the narrow frame.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display module and a display device.
Background
The Chip On Flex (or Chip On Film, COF) technology is a technology for bonding a pad On a driver Chip and a pin On a Chip On Film by thermocompression bonding.
In recent years, the display products are developed towards narrow frames and light and thin, so that the space of the frames is limited, and the binding position of the chip on film and the printed circuit board is limited. Because the integrated circuit needs to be bound on the chip on film, the internal wiring of the chip on film is complex, the length of the chip on film is long, and the length of the chip on film exceeds the length of the printed circuit board, so that the chip on film can not be bound with the printed circuit board in a narrow frame.
Disclosure of Invention
The technical problem to be solved by the embodiments of the present invention is to provide a display module and a display device, so as to bind a chip on film and a printed circuit board in a narrow frame.
In order to solve the above technical problem, an embodiment of the present invention provides a display module, which includes a display substrate, a printed circuit board, and a chip on film connecting the display substrate and the printed circuit board, where the chip on film includes at least one bending portion, and after the bending portion is bent, the chip on film is bound with the printed circuit board.
Optionally, the chip on film includes a non-bending portion and a bending portion connected to each other, the bending portion is folded back and then overlaps with the back of the non-bending portion, a first binding region is disposed on one side of the bending portion away from the non-bending portion, and the first binding region is bound with the printed circuit board.
Optionally, the non-bending portion is provided with a second binding region, and the second binding region is bound to the display substrate.
Optionally, the first bonding area includes a straight-type trace.
Optionally, an adhesive layer is disposed between the bent portion and the back portion of the non-bent portion.
Optionally, the adhesive layer is a double-sided adhesive layer.
Optionally, the display substrate includes a display area, the printed circuit board has a first side face facing the same direction as the display area and a second side face facing the opposite direction to the display area, the first side face is provided with a binding electrode, the binding electrode is bound with the chip on film, and the second side face is provided with a component.
Optionally, the display substrate includes a display area, the printed circuit board has a first side face with the same orientation as the display area and a second side face opposite to the orientation of the display area, the first side face is provided with a component, the second side face is provided with a binding electrode, and the binding electrode is bound with the flip chip film.
Optionally, the display device further comprises a frame surrounding the periphery of the display substrate, and the chip on film is bound with the printed circuit board in the frame.
Optionally, the chip on film is provided with an integrated circuit.
In order to solve the above technical problem, an embodiment of the present invention further provides a display device, including the display module.
The invention provides a display module and a display device, wherein the length of a chip on film is shortened by bending a bending part, the chip on film can be bound with a printed circuit board in a narrow frame under the condition of ensuring that the position of the printed circuit board is not changed, and the size of the frame is effectively reduced, so that the problem that the chip on film cannot be bound with the specified position of the printed circuit board due to overlong length is solved.
Of course, not all of the advantages described above need to be achieved at the same time in the practice of any one product or method of the invention. Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the embodiments of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the example serve to explain the principles of the invention and not to limit the invention. The shapes and sizes of the various elements in the drawings are not to scale and are merely intended to illustrate the invention.
FIG. 1 is a first schematic structural diagram of a display module;
FIG. 2 is a side view of FIG. 1;
FIG. 3 is a second schematic structural diagram of a display module;
FIG. 4 is a side view of FIG. 3;
FIG. 5 is a schematic structural diagram of a display module according to a first embodiment of the present invention;
FIG. 6 is a side view of a display module according to a first embodiment of the present invention;
FIG. 7 is a schematic structural diagram of a chip on film;
FIG. 8 is a schematic structural diagram of a chip on film in a first embodiment of a display module according to the present invention;
FIG. 9 is a side view of a display module according to a second embodiment of the invention.
Description of reference numerals:
10-a display substrate; 20-a printed circuit board; 30-chip on film;
40-an integrated circuit; 50-bending part; 60-a non-bent portion;
70-a tie layer; 80-components; 101-a display area;
102-a non-display area; 201-a first side; 202-a second side;
301-linear routing; 302-diagonal routing; 303-first binding area.
Detailed Description
The following detailed description of embodiments of the invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention. It should be noted that the embodiments and features of the embodiments in the present application may be arbitrarily combined with each other without conflict.
FIG. 1 is a first schematic view of a display module; fig. 2 is a side view of fig. 1. Fig. 1 and 2 illustrate a display module of a flexible screen, which is suitable for large-sized electronic products. As shown in fig. 1 and 2, the display module includes a display substrate 10, a printed circuit board 20, and a chip on film 30 connecting the display substrate 10 and the printed circuit board 20, wherein 3 chip on films 30 are bonded between the display substrate 10 and the printed circuit board 20 side by side, and an integrated circuit 40 is disposed on the chip on film 30. The integrated circuit 40 causes the COF 30 to have complicated routing, which makes the length of the COF 30 longer, and thus requires a large-sized frame to accommodate the COF 30, and a narrow frame cannot be used.
FIG. 3 is a second schematic structural diagram of a display module; fig. 4 is a side view of fig. 3. Fig. 3 and 4 illustrate another display module of a flexible screen, which is suitable for large-sized electronic products. As shown in fig. 3 and 4, the display module is suitable for large-sized electronic products. As shown in fig. 1 and fig. 2, the display module includes a display substrate 10, a printed circuit board 20, and a chip on film 30 connecting the display substrate 10 and the printed circuit board 20, wherein 3 chip on films 30 are bonded between the display substrate 10 and the printed circuit board 20 side by side, and an integrated circuit 40 is disposed on the chip on film 30. In the narrow bezel, since the space of the narrow bezel is limited, the position of the printed circuit board 20 may be limited. However, the integrated circuit 40 causes the routing of the flip-chip film 30 to be complicated, so that the length of the flip-chip film 30 is long, and one end of the flip-chip film 30 bound with the printed circuit board 20 exceeds the printed circuit board 20, so that the flip-chip film 30 cannot be bound with the printed circuit board 20 in a narrow frame.
The problem that the chip on film and the printed circuit board cannot be bound in a narrow frame is solved. The invention provides a display module, which comprises a display substrate, a printed circuit board and a chip on film, wherein the chip on film is used for connecting the display substrate and the printed circuit board and comprises at least one bent part, and after the bent part is bent, the chip on film is bound with the printed circuit board. Therefore, the chip on film and the printed circuit board are bound in the narrow frame.
The technical solution of the present invention will be described in detail by the following specific examples.
First embodiment
FIG. 5 is a schematic structural diagram of a display module according to a first embodiment of the present invention; FIG. 6 is a side view of a display module according to a first embodiment of the invention. As shown in fig. 5 and 6, an embodiment of the invention provides a display module suitable for large-sized electronic products. The display module comprises a display substrate 10, a printed circuit board 20 and a chip on film 30 for connecting the display substrate 10 and the printed circuit board 20, wherein 3 chip on films 30 are bound between the display substrate 10 and the printed circuit board 20 side by side, and an integrated circuit 40 is arranged on the chip on film 30. The flip chip 30 includes at least one bending portion 50, and after the bending portion 50 is bent, the flip chip 30 is bound with the printed circuit board 20. The bending portion 50 is used to shorten the length of the flip chip 30 during the bonding process, so that the flip chip 30 can be bonded to the printed circuit board 20 in a narrow frame.
As shown in fig. 5 and 6, the flip chip 30 includes a non-bending portion 60 and a bending portion 50 connected to each other, the bending portion 50 is located at a first end of the flip chip 30, and the bending portion 50 is folded back along a direction close to the back of the flip chip 30 and then overlaps the back of the non-bending portion 60 to shorten the length of the flip chip 30. A first binding region is disposed on a side of the bending portion 50 away from the non-bending portion 60, and the first binding region is bound to the printed circuit board 20. The non-bending portion 60 at the second end of the chip on film 30 is provided with a second bonding region, and the second bonding region is bonded to the display substrate 10. Thereby realizing the binding of the chip on film 30 and the printed circuit board 20 in a narrow frame.
In some embodiments, the bending portion may also adopt other structures. For example, the bending portion in the flip chip is located in the middle of the flip chip. Specifically, the chip on film comprises at least two non-bending parts and at least one bending part, the bending part is connected between the adjacent non-bending parts, and the bending part is folded to enable the adjacent non-bending parts to be at least partially overlapped so as to shorten the length of the chip on film, thereby enabling the chip on film to be bound with the printed circuit board in the narrow frame. This embodiment is not described herein.
In the embodiment, the length of the flip chip 30 after the bending portion 50 is bent is not limited, as long as the flip chip 30 and the printed circuit board 20 can be bound together in a narrow frame.
As shown in fig. 6, an adhesive layer 70 is provided between the back of the bent portion 50 and the non-bent portion 60. The adhesive layer 70 is used to adhere the bending portion 50 and the non-bending portion 60 together, so as to prevent the bending portion 50 from bending back in a direction away from the non-bending portion 60, which results in an increase in the length of the flip chip 30 and affects the bonding effect.
In the embodiment, since the thicknesses of the flip chip 30 and the adhesive layer 70 are very thin, the thickness of the bent portion 50 bonded to the non-bent portion 60 after being bent meets the requirement of the narrow frame on the thickness, and the size of the frame is not affected.
In the embodiment, the material of the adhesive layer 70 is not limited as long as the bent portion 50 and the non-bent portion 60 can be adhered to each other. For example, the adhesive layer 70 is a double-sided adhesive layer.
As shown in fig. 5 and 6, the display substrate 10 includes a display area 101 and a non-display area 102 surrounding the display area 101, and the flip-chip film 30 is bonded to the non-display area 102 of the display substrate 10. The printed circuit board 20 has a first side 201 facing the display area 101 and a second side 202 facing the display area 101, the first side 201 of the printed circuit board 20 is provided with a bonding electrode, the bonding electrode is bonded with the chip on film 30, and the second side 202 of the printed circuit board 20 is provided with the component 80.
In the embodiment, the bending direction of the bending portion 50 depends on the position of the component 80 on the printed circuit board 20. When the display area 101 of the display substrate 10 is different from the component 80, that is, the light-emitting side of the display substrate 10 is different from the component 80, the bonding position between the flip-chip 30 and the display substrate 10 and the bonding position between the flip-chip 30 and the printed circuit board 20 are both located on the light-emitting side of the display substrate 10, as shown in fig. 6.
FIG. 7 is a schematic diagram of a COF structure. Fig. 7 is a schematic structural diagram of a conventional chip on film. As shown in fig. 7, the chip on film 30 includes a wiring layer including a straight-line-type wiring 301 and a diagonal-line-type wiring 302 connected to each other, wherein the straight-line-type wiring 301 is shorter. When the flip-chip 30 is bent, the diagonal wires 302 of the flip-chip 30 are bonded to the printed circuit board, i.e. after the flip-chip 30 is bent, the wires of the first bonding area 303 of the flip-chip 30, which are bonded to the printed circuit board, are the diagonal wires 302, so that the vertical rule of the wires of the first bonding area 303 is violated.
FIG. 8 is a schematic structural diagram of a chip on film in a first embodiment of a display module according to the present invention. The problem that wires bound with a printed circuit board after a chip on film is bent are oblique wires is solved. As shown in fig. 8, the chip on film 30 according to the embodiment of the invention includes a wiring layer, which includes a straight-line-type wiring 301 and a diagonal-line-type wiring 302 connected to each other. The length of the linear trace 301 is extended so that after the flip-chip 30 is bent, the linear trace 301 of the flip-chip 30 is bound to the printed circuit board, i.e. after the flip-chip 30 is bent, the trace on the first binding area 303, which is used for binding the flip-chip 30 to the printed circuit board, is the linear trace 301, thereby conforming to the vertical rule of the trace in the first binding area 303. The extended length of the linear trace 301 is determined according to the position of the flip chip 30 bonded to the printed circuit board after bending and the trace inside the flip chip 30.
In an embodiment, the display module further comprises a frame surrounding the periphery of the display substrate, and the chip on film is bound with the printed circuit board in the frame. The bezel may be a narrow bezel.
The embodiment of the invention shortens the length of the chip on film by bending the bending part, ensures that the chip on film can be bound with the printed circuit board in the narrow frame under the condition of keeping the position of the printed circuit board unchanged, effectively reduces the size of the frame, and solves the problem that the chip on film cannot be bound with the specified position of the printed circuit board due to overlong length.
Second embodiment
FIG. 9 is a side view of a display module according to a second embodiment of the invention. As shown in fig. 9, the main structure of the display module of this embodiment is substantially the same as that of the first embodiment, except that the display substrate 10 includes a display area and a non-display area surrounding the display area, and the flip chip 30 is bonded to the non-display area of the display substrate 10. The printed circuit board 20 has a first side 201 facing the same direction as the display area and a second side 202 facing the opposite direction to the display area, the first side 201 of the printed circuit board 20 is provided with a component 80, the second side 202 of the printed circuit board 20 is provided with a binding electrode, and the flip-chip 30 passes through a gap between the display substrate 10 and the printed circuit board 20 from the light-emitting side of the display substrate 10, namely the flip-chip 30 from the display area side of the display substrate 10, and extends to the second side 202 side of the printed circuit board 20, so that the flip-chip 30 is bound with the binding electrode of the printed circuit board 20.
In the embodiment, the bending direction of the bending portion 50 depends on the position of the component 80 on the printed circuit board 20. When the display area of the display substrate 10 is on the same side as the component 80, that is, the light-emitting side of the display substrate 10 is on the same side as the component 80, the bonding position between the flip-chip 30 and the display substrate 10 is different from the bonding position between the flip-chip 30 and the printed circuit board 20, as shown in fig. 9.
The embodiment of the invention shortens the length of the chip on film by bending the bending part, ensures that the chip on film can be bound with the printed circuit board in the narrow frame under the condition of unchanging the position of the printed circuit board, and effectively reduces the size of the frame, thereby solving the problem that the chip on film cannot be bound with the specified position of the printed circuit board because of overlong length.
Third embodiment
Based on the technical concept of the foregoing embodiment, an embodiment of the present invention further provides a display device, including the foregoing display module. The display device can be any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.
In the description of the embodiments of the present invention, it should be understood that the terms "middle", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Although the embodiments of the present invention have been described above, the above description is only for the convenience of understanding the present invention, and is not intended to limit the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A display module comprises a display substrate, a printed circuit board and a chip on film connecting the display substrate and the printed circuit board, and is characterized in that the display substrate comprises a display area and a non-display area surrounding the periphery of the display area, the printed circuit board is arranged on one side of the non-display area far away from the display area, the chip on film comprises at least one bending part, the chip on film is bound with the printed circuit board after the bending part is bent, and the orthographic projection of the bending part on the printed circuit board is positioned in the area of the printed circuit board so as to shorten the length of the chip on film; the flip chip film comprises a non-bending part and a bending part which are mutually connected, the bending part is overlapped with the back part of the non-bending part after being folded reversely, a bonding layer is arranged between the bending part and the back part of the non-bending part, the orthographic projection of the bonding layer on the printed circuit board is positioned in the area where the printed circuit board is positioned, and the bonding layer is used for bonding the bending part and the non-bending part together so as to prevent the bending part from being bent back along the direction away from the non-bending part.
2. The display module assembly according to claim 1, wherein a first binding region is disposed on a side of the bending portion away from the non-bending portion, and the first binding region is bound to the printed circuit board.
3. The display module of claim 2, wherein the non-bending portion is provided with a second binding region, and the second binding region is bound with the display substrate.
4. The display module of claim 2, wherein the first bonding area comprises a linear trace.
5. The display module of claim 1, wherein the adhesive layer is a double-sided adhesive layer.
6. The display module assembly of claim 1, wherein the display substrate comprises a display area, the printed circuit board has a first side facing the same direction as the display area and a second side facing opposite to the display area, the first side is provided with a bonding electrode, the bonding electrode is bonded with the chip on film, and the second side is provided with a component.
7. The display module assembly of claim 1, wherein the display substrate comprises a display area, the printed circuit board has a first side facing the same direction as the display area and a second side facing opposite to the display area, the first side is provided with a device, the second side is provided with a bonding electrode, and the bonding electrode is bonded with the flip-chip film.
8. The display module of claim 1, further comprising a frame surrounding the periphery of the display substrate, wherein the flip-chip film is bonded to the printed circuit board in the frame.
9. The display module of claim 1, wherein the flip-chip is provided with an integrated circuit.
10. A display device, comprising the display module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010043430.7A CN111292614B (en) | 2020-01-15 | 2020-01-15 | Display module and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010043430.7A CN111292614B (en) | 2020-01-15 | 2020-01-15 | Display module and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111292614A CN111292614A (en) | 2020-06-16 |
| CN111292614B true CN111292614B (en) | 2022-07-12 |
Family
ID=71023395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010043430.7A Active CN111292614B (en) | 2020-01-15 | 2020-01-15 | Display module and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111292614B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111796463B (en) * | 2020-07-13 | 2023-11-28 | Tcl华星光电技术有限公司 | display module |
| CN113267918A (en) * | 2021-05-07 | 2021-08-17 | 惠州市华星光电技术有限公司 | Display panel and display device |
| CN113157138B (en) * | 2021-05-11 | 2022-04-22 | 业成科技（成都）有限公司 | Touch module, manufacturing method thereof and electronic equipment |
| CN113808494B (en) * | 2021-11-18 | 2022-02-22 | 广东中强精英电子科技有限公司 | Display device |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1316871A (en) * | 2000-01-26 | 2001-10-10 | 卡西欧计算机株式会社 | Flexible wiring board and making method thereof and display device with flexible wiring board |
| CN105826353A (en) * | 2016-03-25 | 2016-08-03 | 京东方科技集团股份有限公司 | Chip on film and display device |
| CN107481619A (en) * | 2017-09-29 | 2017-12-15 | 武汉天马微电子有限公司 | Display module and display device |
| CN107703664A (en) * | 2017-09-27 | 2018-02-16 | 武汉华星光电技术有限公司 | Embedded touch control panel |
| CN108008584A (en) * | 2017-12-29 | 2018-05-08 | 武汉华星光电技术有限公司 | Liquid crystal display device |
| CN108091263A (en) * | 2017-12-14 | 2018-05-29 | 武汉华星光电半导体显示技术有限公司 | Flexible display and its driving element |
| CN108962035A (en) * | 2018-08-02 | 2018-12-07 | 京东方科技集团股份有限公司 | Flexible display apparatus |
| KR20190076527A (en) * | 2017-12-22 | 2019-07-02 | 엘지디스플레이 주식회사 | Display device |
| CN110379312A (en) * | 2019-07-23 | 2019-10-25 | 昆山国显光电有限公司 | A kind of display device and display equipment |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006128429A (en) * | 2004-10-29 | 2006-05-18 | Seiko Epson Corp | Circuit board and semiconductor apparatus |
| JP5157602B2 (en) * | 2008-04-03 | 2013-03-06 | セイコーエプソン株式会社 | Electro-optical device and electronic apparatus |
| TWI434383B (en) * | 2010-12-13 | 2014-04-11 | Ili Technology Corp | Bonding pad structure and integrated cicruit comprise a pluirality of bonding pad structures |
| US20160205781A1 (en) * | 2012-11-26 | 2016-07-14 | E Ink Holdings Inc. | Flexible display apparatus and manufacturing method thereof |
| KR102235703B1 (en) * | 2014-02-12 | 2021-04-05 | 삼성디스플레이 주식회사 | Display device and method of manufacturing a display device |
| CN109212808A (en) * | 2018-11-23 | 2019-01-15 | 京东方科技集团股份有限公司 | The production method of liquid crystal display panel, display device and liquid crystal display panel |
| CN109377890B (en) * | 2018-12-21 | 2020-01-21 | 武汉华星光电半导体显示技术有限公司 | Flexible display device |
| CN109860254A (en) * | 2019-02-18 | 2019-06-07 | 京东方科技集团股份有限公司 | Display panel and preparation method thereof, display device |
| CN110619816A (en) * | 2019-08-19 | 2019-12-27 | 武汉华星光电半导体显示技术有限公司 | Display panel, preparation method thereof and display device |
-
2020
- 2020-01-15 CN CN202010043430.7A patent/CN111292614B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1316871A (en) * | 2000-01-26 | 2001-10-10 | 卡西欧计算机株式会社 | Flexible wiring board and making method thereof and display device with flexible wiring board |
| CN105826353A (en) * | 2016-03-25 | 2016-08-03 | 京东方科技集团股份有限公司 | Chip on film and display device |
| CN107703664A (en) * | 2017-09-27 | 2018-02-16 | 武汉华星光电技术有限公司 | Embedded touch control panel |
| CN107481619A (en) * | 2017-09-29 | 2017-12-15 | 武汉天马微电子有限公司 | Display module and display device |
| CN108091263A (en) * | 2017-12-14 | 2018-05-29 | 武汉华星光电半导体显示技术有限公司 | Flexible display and its driving element |
| KR20190076527A (en) * | 2017-12-22 | 2019-07-02 | 엘지디스플레이 주식회사 | Display device |
| CN108008584A (en) * | 2017-12-29 | 2018-05-08 | 武汉华星光电技术有限公司 | Liquid crystal display device |
| CN108962035A (en) * | 2018-08-02 | 2018-12-07 | 京东方科技集团股份有限公司 | Flexible display apparatus |
| CN110379312A (en) * | 2019-07-23 | 2019-10-25 | 昆山国显光电有限公司 | A kind of display device and display equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111292614A (en) | 2020-06-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111292614B (en) | Display module and display device | |
| CN108122497B (en) | Flexible array substrate, flexible display device and assembly method | |
| CN108762562B (en) | Display substrate, display panel, touch display device and manufacturing method thereof | |
| US11114632B2 (en) | Display panels and methods for manufacturing the same | |
| CN110597420B (en) | Touch control assembly and display device | |
| US20210104594A1 (en) | Display panel, preparation method thereof and display device | |
| WO2019223607A1 (en) | Liquid crystal display substrate and display device | |
| US6657606B2 (en) | Liquid crystal display device having a flexible circuit board | |
| CN105825773B (en) | Display device and method for manufacturing the same | |
| US9826627B2 (en) | Flexible circuit board and display apparatus | |
| US20130162929A1 (en) | Display Device | |
| CN111176037A (en) | Flip chip film set, flip chip film set binding method and display device | |
| CN108646457A (en) | Display panel and preparation method, display device | |
| US20070081117A1 (en) | Display device and a circuit thereon | |
| CN112071197A (en) | Display device and electronic equipment | |
| KR20080001512A (en) | Liquid crystal display device | |
| JP2006210809A (en) | Wiring board and mounting structure, and electro-optical device and electronic equipment | |
| CN217880696U (en) | Display module and display device | |
| CN113436531B (en) | Display module and display device | |
| CN102542941B (en) | Display device with system backboard | |
| CN113498293B (en) | Electronic device with a detachable cover | |
| CN114724463A (en) | Curved surface display panel and display device | |
| CN111752053A (en) | Screen module and electronic equipment | |
| CN111796446B (en) | Display apparatus | |
| KR20080001511A (en) | Liquid crystal display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |