CN111752053A

CN111752053A - Screen module and electronic equipment

Info

Publication number: CN111752053A
Application number: CN201910238883.2A
Authority: CN
Inventors: 李健; 唐磊; 刘赛
Original assignee: Beijing Xiaomi Mobile Software Co Ltd
Current assignee: Beijing Xiaomi Mobile Software Co Ltd
Priority date: 2019-03-27
Filing date: 2019-03-27
Publication date: 2020-10-09

Abstract

The disclosure relates to a screen module and an electronic device. The screen module includes: the backlight module comprises a thin film transistor layer and a backlight layer group, wherein the backlight layer group and the thin film transistor layer are arranged in a laminated mode; the deformation film layer is connected to the first end of the thin film transistor layer and is bent towards the backlight layer group; the plurality of wires extend from the second end to the first end of the thin film transistor layer and are bent towards the backlight layer group along with the deformation film layer, the first end and the second end are arranged oppositely, one side of the thin film transistor layer far away from the backlight layer group is provided with the plurality of wires, and the plurality of wires are parallel to each other; and the backlight assembly is positioned between the chip assembly and the thin film transistor layer, and the chip assembly is connected with each wiring.

Description

Screen module and electronic equipment

Technical Field

The disclosure relates to the technical field of terminals, in particular to a screen module and electronic equipment.

Background

Currently, it has become a development trend in the industry to increase the screen occupation ratio and the aesthetic appearance of the electronic device by reducing the frame width of the electronic device. In the related art, the driving chip may be fixed on the glass substrate of the screen module by a cog (chip on glass) technology, and the glass substrate is connected to the thin film transistor layer of the screen module; alternatively, the driving Chip may be fixed by COF (Chip On Film) technology.

Disclosure of Invention

The present disclosure provides a screen module and an electronic device to solve the disadvantages in the related art.

According to a first aspect of the embodiments of the present disclosure, there is provided a screen module, including:

the backlight module comprises a thin film transistor layer and a backlight layer group, wherein the backlight layer group and the thin film transistor layer are arranged in a laminated mode;

the deformation film layer is connected to the first end of the thin film transistor layer and is bent towards the backlight layer group;

the plurality of wires extend from the second end to the first end of the thin film transistor layer and are bent towards the backlight layer group along with the deformation film layer, the first end and the second end are arranged oppositely, one side of the thin film transistor layer far away from the backlight layer group is provided with the plurality of wires, and the plurality of wires are parallel to each other;

and the backlight assembly is positioned between the chip assembly and the thin film transistor layer, and the chip assembly is connected with each wiring.

Optionally, the method further includes:

the flexible circuit board and the backlight layer group are arranged in a stacked mode, and the backlight layer group is located between the flexible circuit board and the thin film transistor layer;

the carrier plate, the carrier plate is used for bearing the chip subassembly, just the one end of carrier plate with be close to on the deformation rete the one end of group is connected in a poor light, the other end with flexible circuit board connects.

Optionally, one end of the deformed film layer after being bent is parallel to the backlight layer group.

Optionally, the plurality of wires are inwardly shrunk from two side edges on the carrier plate to be connected to the chip assembly.

Optionally, the chip assembly is located between the carrier plate and the backlight layer group.

Optionally, the chip assembly includes:

the integrated circuit board is connected to the carrier plate;

the isolating piece surrounds the integrated circuit board, and two ends of the isolating piece are connected with the backlight layer group and the carrier plate respectively.

Optionally, a surface of the carrier plate facing the backlight layer group is connected to a surface of the flexible circuit board away from the backlight layer group.

Optionally, the carrier plate is located between the chip assembly and the backlight layer group.

Optionally, the carrier plate is bonded to the backlight layer group, and the chip assembly is connected to the carrier plate.

Optionally, the chip module further comprises an adhesive layer, and the adhesive layer wraps the chip module and is connected with the carrier plate.

Optionally, the surface of the carrier plate far away from the backlight layer group is connected with the surface of the flexible circuit board close to the backlight layer group.

Optionally, the deformation film layer includes a flip chip film layer.

Optionally, the carrier plate is made of a glass material.

According to a second aspect of the embodiments of the present disclosure, there is provided an electronic device including the screen module according to any one of the embodiments.

The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects:

known from the above-mentioned embodiment, keep away from the one side of the group of backlight layers on thin film transistor layer in this disclosure, many walk the line and set up each other parallelly to for technical scheme among the correlation technique, because each is walked the line and all extends along the direction parallel with screen module edge, avoid inside shrink, can reduce the lower frame of screen module, reduce the area of the edge non-display area who disposes the electronic equipment of this screen module, be favorable to promoting the screen ratio.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.

Fig. 1 is a schematic structural diagram of a screen module in the related art.

Fig. 2 is a schematic top view of a screen module according to an exemplary embodiment.

Fig. 3 is a schematic bottom view of a screen module according to an exemplary embodiment.

Fig. 4 is a schematic cross-sectional view of a screen module according to an exemplary embodiment.

Fig. 5 is a schematic structural diagram of the screen module shown in fig. 4.

Fig. 6 is an expanded view of the screen module shown in fig. 4.

Fig. 7 is a schematic cross-sectional view of another screen module according to an example embodiment.

Fig. 8 is a schematic structural diagram of the screen module shown in fig. 7.

Fig. 9 is an expanded view of the screen module shown in fig. 7.

Fig. 10 is a schematic structural diagram of an electronic device according to an exemplary embodiment.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

It is to be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present application. The word "if" as used herein may be interpreted as "at … …" or "when … …" or "in response to a determination", depending on the context.

Fig. 1 is a schematic structural diagram of a screen module 100 in the related art. As shown in fig. 1, the screen module 100 may include a transistor layer 101, a chip 102, a flip chip 103, and a plurality of traces 104. In the screen module 100, a plurality of data lines 104 extending from a transistor layer 101 are all connected to a chip 102, and the chip 102 is connected to a flip-chip film 103. Between the transistor layer 101 and the flip chip 103, the data lines 104 are shrunk inward from the two side edges to connect with the chip 102, and the data lines 104 at the edges need to be shrunk inward, so that the data lines occupy a part of the area of the screen module 100 outside the transistor layer 101, and the area outside the transistor layer 101 cannot be used for displaying, so that the lower frame of the screen module 100 is wider, and the screen occupation ratio of the electronic device provided with the screen module 100 is affected.

Based on this, the present application provides a screen module 200 as shown in fig. 2-4, where the screen module 200 may include a thin film transistor layer 1, a backlight layer group 2, a deformation film layer 3, and a plurality of traces 4. Wherein, this thin film transistor layer 1 and the layer group 2 range upon range of setting in a poor light, and deformation rete 3 is connected in the first end on thin film transistor layer 1 to buckle towards layer group 2 in a poor light, many walk line 4 can extend to the first end from thin film transistor layer 2's second end, and buckle to layer group 2 in a poor light along with deformation rete 3. For example, as shown in fig. 2, the traces 4 extend along the direction indicated by the arrow a and extend to the area where the deformation film layer 3 is located, so as to bend therewith.

Further, the screen module 200 may further include a chip assembly 5, the backlight assembly 2 is located between the chip assembly 5 and the thin film transistor layer 1, and each trace is connected to the chip assembly 5, so that the display state of the screen module 200 can be controlled by the chip assembly 5. Wherein, keep away from the one side of backlight layer group 2 on thin-film transistor layer 1, this many walk line mutual parallel arrangement between the line, thereby for the technical scheme among the correlation technique of fig. 1, because each is walked the line and all extends along the direction (i.e. the extending direction of second end from the first end) parallel with screen module 200 edge, avoid inside shrink, can reduce the lower frame to screen module 200, reduce the area of the marginal non-reality region who disposes this screen module 200 electronic equipment, be favorable to promoting the screen ratio.

It should be noted that: the plurality of traces 4 may include one or more of gate lines, data lines, and input and output power lines of the screen module 200, and the disclosure is not limited thereto. In fact, the screen module 200 may further include some other structures, such as the filter 8 shown in fig. 4, or may further include structures such as a polarizer, an alignment film, and the like, which is not limited in this disclosure. The backlight layer group 2 may include one or more of a glass substrate, a backlight module and a lamp tube, and may also include other structures, which are not described in detail herein. The screen module 200 may include an LCD module, and when the screen module 200 is an LCD module, the screen module 200 may further include a liquid crystal layer.

In this embodiment, the screen module 200 may further include a flexible circuit board 6 and a carrier board 7, the flexible circuit board 6 is stacked with the backlight layer group 2, the backlight layer group 2 is located between the flexible circuit boards 6, the carrier board 7 may be used for carrying the chip component 5, and one end of the carrier board 7 may be connected to one end of the deformation film layer 3 close to the backlight layer group 2, and the other end is connected to the flexible circuit board 6. For example, on the side of the backlight layer group 2 away from the thin-film transistor layer 1, the flexible circuit board 6 and the chip assembly 5 may be arranged substantially in parallel, and further, the connection between the carrier board 7 and the flexible circuit board 6 is used for limiting.

Based on this, the deformation film layer 3 in the present disclosure only needs to be connected with the carrier plate 7 and the thin film transistor layer 1, and the chip assembly 5 is carried by the carrier plate 7, which can reduce the length requirement and the area requirement for the deformation film layer 3, thereby reducing the cost. Moreover, the technical difficulty of connection and fixation between the flip chip film 103 and the flexible circuit board in the related art is far greater than the connection and fixation between the deformation film layer 3 and the carrier plate 7 in the present disclosure, so that the yield in the manufacturing process can be improved by the scheme of the present disclosure, and the cost is further reduced.

In this embodiment, the deformable film layer 3 may include a flip-chip film layer, which may be formed by etching, sputtering, or other processes, which is not limited in this disclosure; the carrier plate 7 may be made of a non-deformable material, or made of a material having a hardness exceeding a certain threshold, for example, it may be made of glass, and the hardness of the carrier plate 7 may be used to protect the screen module 200 when the screen module 200 is externally impacted, thereby prolonging the service life of the screen module 200, and meanwhile, compared with a scheme of directly connecting the flip film 103 and a flexible printed circuit board in the related art, the method may avoid using a buffer material such as foam to limit the deformation of the flip film 103, prevent the increase of the thickness of the screen module due to the buffer material such as foam, and be beneficial to thinning the electronic device equipped with the screen module 200.

In the above embodiments, the bent end of the deformation film layer 3 is parallel to the backlight layer group 2, and the projection of the deformation film layer 3 in the thickness direction partially overlaps the projection of the backlight layer group 2 in the thickness direction, so that the support plate 7 can be basically parallel to the backlight layer group 2 after being connected to the end of the deformation film layer 3, and the support plate 7 can be made of a material with high hardness, thereby enhancing the protection of the chip assembly 5.

Furthermore, since the area of the chip module 5 is usually relatively small, the plurality of traces 4 arranged in parallel on the side of the thin-film transistor layer 1 away from the backlight layer group 2 can be folded and then shrunk on the side close to the backlight layer group 2. Specifically, the traces 4 can extend to the carrier 7 after being bent to a side close to the backlight layer group 2, and shrink inward from two side edges on the carrier 7 to connect to the chip components. Since the plurality of wires 4 are inwardly shrunk on the carrier 7, the length requirement for the deformation film layer 3 can be reduced, so as to further reduce the cost.

Based on the technical scheme of the present disclosure, when the relative position relationship between the chip assembly 5 and the carrier plate 7 is changed, various embodiments can be changed.

In an embodiment, as shown in fig. 4-6, when the deformation film layer 6 is bent, that is, the screen module 200 is switched from the state shown in fig. 6 to the state shown in fig. 4, the chip assembly 5 may be located between the carrier plate 7 and the backlight layer group 2, further, the chip assembly 5 may include an integrated circuit board 51 and a spacer 52, the spacer 52 may be disposed around the integrated circuit board 51, and two ends of the spacer 52 are respectively connected with the backlight layer group 2 and the carrier plate 7, so as to limit the integrated circuit board 52 in an accommodating space formed by the backlight layer group 2, the carrier plate 7 and the spacer 52, so as to prevent the integrated circuit board 52 from shaking or shifting, and facilitate limiting the integrated circuit board 52.

In the present embodiment, as also shown in fig. 4, a surface of the carrier board 7 disposed toward the backlight layer group 2 may be connected to a surface of the flexible circuit board 6 away from the backlight layer group 2. That is, the flexible circuit board 6 is located between the carrier plate 7 and the backlight layer group 2, so that a part of space is inevitably existed to accommodate the flexible circuit board 6 due to the thickness of the spacer 52, which is beneficial to realizing the compact structure, reasonable layout and effective utilization of the internal space of the screen module 100.

In another embodiment, as shown in fig. 7-9, the states shown in fig. 7 and 8 are normal states of the screen module 200 when the screen module 200 is inside the electronic device, and the unfolded state shown in fig. 9 is provided for clarity of illustration of the screen module 200. After the deformation film layer 6 is bent, that is, when the state is switched from the body shown in fig. 9 to the state shown in fig. 7, the carrier plate 7 is located between the chip assembly 5 and the backlight layer group 2, the carrier plate 7 and the backlight layer group 2 are bonded and fixed, and the chip assembly 5 is connected with the carrier plate 7, so that the carrier plate 7 and the chip assembly 5 are fixed, and shaking is avoided. Specifically, the surface of the carrier plate 7 far from the backlight group 2 may be connected to the surface of the flexible circuit board 6 near the backlight group 2, so that when the carrier plate 7 is bonded to the backlight group 2, the problem of the thickness of the flexible circuit board 6 does not need to be considered, and the problem that the thickness of the bonding colloid between the carrier plate 7 and the backlight group 2 is not uniform with the thickness of the flexible circuit board 6 does not exist.

Further, since the chip module 5 is located at a side away from the backlight layer group 2, when the screen module 200 is configured to the electronic device, the chip module 5 is disposed back to back with respect to the display area of the electronic device, in order to further fix the chip module 5, in this embodiment, the screen module 200 may further include an adhesive layer 9, and the adhesive layer 9 wraps the chip module 5 and is connected to the carrier plate 7, so that a receiving space for receiving the chip module 5 is formed by the adhesive layer 9 and the carrier plate 7, and the chip module 5 is limited.

Based on the technical solution of the present disclosure, as shown in fig. 10, the present disclosure further provides an electronic device 300, where the electronic device 300 may include the screen module 200 described in any embodiment, and the screen module 200 may form a display area on the electronic device 300. The electronic device 300 may include one or more of a mobile phone terminal, a tablet computer, and an e-reader, which is not limited by the present disclosure.

Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It will be understood that the present disclosure is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A screen module, comprising:

2. A screen module as recited in claim 1, further comprising:

3. The screen module as recited in claim 2, wherein the bent end of the deformation film layer is parallel to the backlight layer group.

4. The screen module as claimed in claim 2, wherein the traces are shrunk inwardly from two side edges on the carrier for connecting to the chip assembly.

5. The screen module as recited in claim 2, wherein the chip assembly is located between the carrier and the backlight layer set.

6. The screen module of claim 5, wherein the chip assembly comprises:

the integrated circuit board is connected to the carrier plate;

7. A screen module as recited in claim 5, wherein a surface of the carrier plate facing the set of backlight layers is connected to a surface of the flexible circuit board facing away from the set of backlight layers.

8. The screen module as recited in claim 2, wherein the carrier is located between the chip assembly and the backlight layer set.

9. The screen module as recited in claim 8, wherein the carrier is bonded to the backlight layer, and the chip assembly is connected to the carrier.

10. The screen module as claimed in claim 8 or 9, further comprising an adhesive layer wrapping the chip assembly and connected to the carrier board.

11. The screen module as recited in claim 8, wherein a surface of the carrier plate distal from the set of backlight layers is connected to a surface of the flexible circuit board proximal to the set of backlight layers.

12. The screen module of claim 1, wherein the deformable membrane layer comprises a flip-chip membrane layer.

13. The screen module as recited in claim 1, wherein the carrier is made of glass.

14. An electronic device comprising a screen module according to any one of claims 1 to 13.